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TW200617104A - Self-adhesive addition reaction-curable silicone composition - Google Patents

Self-adhesive addition reaction-curable silicone composition

Info

Publication number
TW200617104A
TW200617104A TW094127360A TW94127360A TW200617104A TW 200617104 A TW200617104 A TW 200617104A TW 094127360 A TW094127360 A TW 094127360A TW 94127360 A TW94127360 A TW 94127360A TW 200617104 A TW200617104 A TW 200617104A
Authority
TW
Taiwan
Prior art keywords
addition reaction
self
silicone composition
curable silicone
adhesive
Prior art date
Application number
TW094127360A
Other languages
Chinese (zh)
Other versions
TWI372166B (en
Inventor
Kei Miyoshi
Tomoyuki Goto
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200617104A publication Critical patent/TW200617104A/en
Application granted granted Critical
Publication of TWI372166B publication Critical patent/TWI372166B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention provides a self-adhesive addition reaction-curable silicone composition which has excellent adhesiveness and is useful as an adhesive for optical devices or optical parts. This self-adhesive addition reaction-curable silicone composition comprises (A) 100 pts. Mass of a liquid or solid organopolysiloxane having a viscosity of ≥ 10 mPa·sec at 25 DEG C, (B) 2 to 100 pts. Mass of an organohydrogenpolysiloxane which has at least two SiH groups, has a viscosity of ≤ 1,000 mPa·sec at 25 DEG C, and has a SiH group-containing bifunctional siloxane unit number rate of ≤ 50% based on the total number of the bifunctional siloxane units contained in one molecule, (C) a straight chain or cyclic organohydrogenpolysiloxane main component having the above-mentioned rate of < 50% in a contained SiH group molar ratio of 0.05 to 1 to the SiH groups contained in the component (B), and (D) an effective amount of an addition reaction catalyst.
TW094127360A 2004-08-12 2005-08-11 Self-adhesive addition reaction-curable silicone composition TW200617104A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004235217A JP4455218B2 (en) 2004-08-12 2004-08-12 Self-adhesive addition reaction curable silicone composition

Publications (2)

Publication Number Publication Date
TW200617104A true TW200617104A (en) 2006-06-01
TWI372166B TWI372166B (en) 2012-09-11

Family

ID=36030007

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127360A TW200617104A (en) 2004-08-12 2005-08-11 Self-adhesive addition reaction-curable silicone composition

Country Status (3)

Country Link
JP (1) JP4455218B2 (en)
KR (1) KR101153551B1 (en)
TW (1) TW200617104A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI898385B (en) * 2023-01-17 2025-09-21 德商瓦克化學公司 Thermally conductive silicone composition and method for producing same

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4636242B2 (en) * 2005-04-21 2011-02-23 信越化学工業株式会社 Optical semiconductor element sealing material and optical semiconductor element
KR101351815B1 (en) * 2005-07-28 2014-01-15 다우 코닝 코포레이션 Release coating compositions having improved release force profiles
JP2009527622A (en) * 2006-02-24 2009-07-30 ダウ・コーニング・コーポレイション Light emitting device encapsulated with silicone and curable silicone composition for preparing said silicone
DE102006022097A1 (en) * 2006-05-11 2007-11-15 Wacker Chemie Ag Self-adhesive addition-curing silicone compositions
JP5117033B2 (en) * 2006-11-08 2013-01-09 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Silicone adhesive composition for optical semiconductor and optical semiconductor device using the same
JP5138924B2 (en) * 2006-12-14 2013-02-06 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Silicone rubber composition for optical semiconductor sealing and optical semiconductor device
CN101230245A (en) * 2007-12-20 2008-07-30 宁波安迪光电科技有限公司 Glue for Encapsulation of Light Emitting Diode and Its Application
JP2009275196A (en) * 2008-05-19 2009-11-26 Sony Corp Curable resin material composition, optical material, light emitting device, method for producing the same, and electronic device
JP5499774B2 (en) * 2009-03-04 2014-05-21 信越化学工業株式会社 Composition for sealing optical semiconductor and optical semiconductor device using the same
JP2011016968A (en) * 2009-07-10 2011-01-27 Kaneka Corp Polyhedron-structured polysiloxane modified product, producing method of the same and composition containing the same modified product
JP5505991B2 (en) * 2010-04-30 2014-05-28 信越化学工業株式会社 High adhesion silicone resin composition and optical semiconductor device using the composition
JP5646932B2 (en) * 2010-09-17 2014-12-24 株式会社カネカ Optical adhesive and display device including the same
PT2657301E (en) 2010-12-22 2015-03-25 Momentive Performance Mat Jp Ultraviolet-curable silicone resin composition and image display device using same
PT2657300E (en) * 2010-12-22 2016-01-20 Momentive Performance Mat Jp Heat-curable polyorganosiloxane composition and use thereof
JP5522111B2 (en) * 2011-04-08 2014-06-18 信越化学工業株式会社 Silicone resin composition and optical semiconductor device using the composition
JP6468115B2 (en) * 2015-08-05 2019-02-13 信越化学工業株式会社 Addition-curable silicone rubber composition and cured product
JP6861125B2 (en) * 2017-08-18 2021-04-21 信越ポリマー株式会社 Protective cover structure
KR102298513B1 (en) * 2020-05-29 2021-09-07 주식회사 케이씨씨실리콘 Moisture-curable siloxanes composition
WO2024247071A1 (en) * 2023-05-29 2024-12-05 信越化学工業株式会社 Silicone adhesive composition, adhesive article, and adhesion improver

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739571B2 (en) * 1989-11-22 1995-05-01 信越化学工業株式会社 Adhesive organopolysiloxane composition
JP2527081B2 (en) * 1990-07-16 1996-08-21 信越化学工業株式会社 Organopolysiloxane composition
JP2970311B2 (en) * 1993-05-06 1999-11-02 信越化学工業株式会社 One-piece molding of fluororesin film and silicone rubber
JP2002060719A (en) 2000-08-21 2002-02-26 Shin Etsu Chem Co Ltd Adhesive silicone rubber composition and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI898385B (en) * 2023-01-17 2025-09-21 德商瓦克化學公司 Thermally conductive silicone composition and method for producing same

Also Published As

Publication number Publication date
JP2006052331A (en) 2006-02-23
KR101153551B1 (en) 2012-06-11
TWI372166B (en) 2012-09-11
JP4455218B2 (en) 2010-04-21
KR20060050396A (en) 2006-05-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees