JP2002060719A - Adhesive silicone rubber composition and semiconductor device - Google Patents

Abstract

(57) Abstract: (1) An organopolysiloxane containing two or more alkenyl groups bonded to a silicon atom in one molecule, and (2) Two hydrogen atoms bonded to a silicon atom in one molecule. In an adhesive silicone rubber composition containing at least one organohydrogenpolysiloxane, (3) an adhesion-imparting agent, and (4) an addition reaction catalyst, a cyclic or linear low-molecular compound having 11 to 50 silicon atoms. An adhesive silicone rubber composition having a nonfunctional siloxane content of 3% by weight or less. According to the present invention, since the adhesiveness between the semiconductor chip and the mounting member is good and the adhesive performance does not decrease over time, the connection between the semiconductor chip / bonding wire or the bonding wire / lead frame is achieved. Adhesives for attaching semiconductor chips (without problems such as a decrease in reliability, a decrease in adhesion of the sealing material to the semiconductor chip, the mounting portion, and the lead frame, and a decrease in moisture resistance of the device) do not occur. (A die bonding agent).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive silicone rubber composition, and more particularly to an adhesive silicone rubber composition used for bonding between a semiconductor chip and a mounting member, and a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, a silicone rubber-based adhesive having a stress relaxing effect between a semiconductor chip and a mounting member such as a tab has been used for bonding a semiconductor chip. They are,
It is an addition-curable type, and as the adhesive component, an organosilicon compound containing at least one alkoxy group bonded to a silicon atom and at least one silicon-bonded alkenyl group or silicon-bonded hydrogen atom in the molecule has been used. (Japanese Patent Laid-Open No. 61-5530, Patent No. 288282)
No. 3).

[0003]

In these methods, after bonding a semiconductor chip to a mounting portion, the semiconductor chip and circuit wiring such as a lead frame are connected by bonding wires, and the whole is sealed with a sealing material. However, the connection reliability between the semiconductor chip / bonding wire or the bonding wire / lead frame is reduced during use, or the adhesiveness of the sealing material to the semiconductor chip, the mounting portion, and the lead frame is deteriorated. However, there was a problem that the moisture resistance of the sample was reduced.

Accordingly, an object of the present invention is to provide an adhesive silicone rubber composition and a semiconductor device which have good adhesiveness between a semiconductor chip and a mounting member and do not deteriorate the reliability of the semiconductor device over time. With the goal.

[0005]

Means for Solving the Problems and Embodiments of the Invention The present inventors have made intensive studies to achieve the above object, and as a result, have found that the alkenyl group, alkoxy group, methacryloxy group contained in the silicone rubber composition. A cyclic or linear low-molecular-weight siloxane having 11 to 50 silicon atoms, which does not contain a reactive functional group such as an alkyl group, a mercapto group, a silicon-bonded hydrogen atom, a hydroxyl group, an amino group, or an epoxy group in the molecule. Even after the vulcanization and curing of the semiconductor chip, it gradually bleeds from the bonding portion of the semiconductor chip without being incorporated into the crosslinked structure by a chemical bond, and between the semiconductor chip / bonding wire or the bonding wire / lead frame.
Penetration of the sealing material between the semiconductor chip, the mounting part, and the lead frame, and the bonding part, and the release effect is exerted, which has the effect of lowering the connection reliability and deteriorating the adhesiveness. Heading, these siloxane content 3% by weight
The inventors have found that the above-mentioned adverse effects can be prevented by reducing the amount as described below, and completed the present invention.

Accordingly, the present invention provides (1) an organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule, and (2) two hydrogen atoms bonded to silicon atoms in one molecule. In the adhesive silicone rubber composition containing the above-mentioned organohydrogenpolysiloxane, (3) an adhesion-imparting agent, and (4) an addition reaction catalyst, a cyclic or linear low-molecular-weight compound having 11 to 50 silicon atoms is used. Provided is an adhesive silicone rubber composition having a functional siloxane content of 3% by weight or less. The present invention also provides a semiconductor device in which a semiconductor chip is bonded to a mounting member such as a tab with a cured product of the adhesive silicone rubber composition.

Hereinafter, the present invention will be described in more detail.
The organopolysiloxane having two or more alkenyl groups bonded to a silicon atom in one molecule, which is the first component of the adhesive silicone rubber composition of the present invention, is the main component (base polymer) of the composition of the present invention. Yes, those represented by the following average composition formula (1) are used. R ¹ _a SiO _{(4-a) / 2} (1) (wherein, R ¹ is the same or different and has 1 to 10 carbon atoms;
It is preferably 1 to 8 unsubstituted or substituted monovalent hydrocarbon groups, and a is 1.5 to 2.8, preferably 1.8 to 2.
5, more preferably 1.95 to 2.05, even more preferably 1.98 to 2.02. )

Examples of the unsubstituted or substituted monovalent hydrocarbon group bonded to the silicon atom represented by R ¹ include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group and a tert-butyl group. , Pentyl group,
Alkyl groups such as neopentyl group, hexyl group, cyclohexyl group, octyl group, nonyl group, decyl group, phenyl group, tolyl group, xylyl group, aryl group such as naphthyl group, benzyl group, phenylethyl group, phenylpropyl group, etc. Aralkyl groups, vinyl groups, allyl groups, propenyl groups, isopropenyl groups, butenyl groups, hexenyl groups, cyclohexenyl groups, alkenyl groups such as octenyl groups,
Some or all of the hydrogen atoms of these groups are fluorine, bromine,
Those substituted with a halogen atom such as chlorine, a cyano group, and the like, for example, a chloromethyl group, a chloropropyl group, a bromoethyl group, a 3,3,3-trifluoropropyl group, a 2-cyanoethyl group, and the like can be given.

In this case, at least two of R ¹ must be an alkenyl group (especially those having 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms). The content of the alkenyl group is 0.01 to 0.01 in all the organic groups bonded to the silicon atom (that is, in the unsubstituted or substituted monovalent hydrocarbon group as R ¹ in the above average composition formula (1)).
It is preferably 20 mol%, particularly preferably 0.1 to 10 mol%. This alkenyl group may be bonded to a silicon atom at the molecular chain end, may be bonded to a silicon atom in the middle of the molecular chain, or may be bonded to both, but the curing rate of the composition, From the viewpoint of physical properties and the like, the organopolysiloxane used in the present invention preferably contains at least an alkenyl group bonded to a silicon atom at a molecular chain terminal. In addition, as R < ¹ > other than an alkenyl group, a methyl group, a phenyl group, and a 3,3,3-trifluoropropyl group are preferable.

The structure of the above-mentioned organopolysiloxane is usually such that the main chain is composed of repeating diorganosiloxane units, and both ends of the molecular chain are trimethylsiloxy, dimethylphenylsiloxy, dimethylhydroxysiloxy,
It is a diorganopolysiloxane basically having a linear structure blocked by a triorganosiloxy group such as a dimethylvinylsiloxy group and a trivinylsiloxy group, but partially has a branched structure or a cyclic structure. You may. The average degree of polymerization (weight average degree of polymerization) is 100 to 100,000,
It is particularly preferably from 200 to 10,000, and the viscosity at 25 ° C is from 100 to 100,000,000.
cSt (centistokes), especially 1,000 to 1,0
It is preferably 00,000 cSt.

The alkenyl group-containing organopolysiloxane preferably has a low molecular weight nonfunctional siloxane having 11 to 50 silicon atoms in an amount of 3% by weight or less, particularly preferably 2% by weight or less.

The organohydrogenpolysiloxane of the second component is reacted with the first component in the presence of an addition reaction catalyst of the fourth component.
It acts as a crosslinking agent to cure the composition by an addition reaction (hydrosilylation reaction) with the alkenyl group-containing organopolysiloxane of the component, and has the following average composition formula (2): R ² _b H _c SiO _{(4-bc ) / 2 represented by} (2), and at least two, preferably 2
It is necessary to have 200, more preferably 3 to 100 silicon-bonded hydrogen atoms (i.e. Si-H groups).

[0013] In the above formula (2), R ² is an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, examples of this R ^2, exemplified as R ¹ in the above formula (1) The same groups as those described above, preferably the same groups as those excluding the alkenyl group can be mentioned, and in particular, a methyl group,
A phenyl group and a 3,3,3-trifluoropropyl group are preferred. B is 0.7 to 2.1, c is 0.001 to
1.0 and b + c is a positive number satisfying 0.8 to 3.0, preferably b is 1.0 to 2.0, and c is 0.01
1.0 and b + c are 1.5 to 2.5.

At least two, preferably three, in one molecule
The Si-H groups contained in the molecule may be located at the terminal of the molecular chain, at the middle of the molecular chain, or at both of them. The molecular structure of the organohydrogenpolysiloxane may be any of linear, cyclic, branched, and three-dimensional network structures, but the number of silicon atoms (or degree of polymerization) in one molecule is usually 2 to 300
And preferably about 4 to 150 pieces at room temperature (25 ° C.).

As the organohydrogenpolysiloxane of the formula (2), specifically, for example, 1,1,3,3-
Tetramethyldisiloxane, methyl hydrogen cyclopolysiloxane, methyl hydrogen siloxane
Dimethylsiloxane cyclic copolymer, both ends trimethylsiloxy group-blocked methylhydrogenpolysiloxane, both ends trimethylsiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer, both ends dimethylhydrogensiloxy group-blocked dimethylpolysiloxane, both ends Dimethyl hydrogen siloxy group-blocked dimethyl siloxane / methyl hydrogen siloxane copolymer, both ends trimethyl siloxy group-blocked methyl hydrogen siloxane / diphenyl siloxane copolymer, both ends trimethyl siloxy group-blocked methyl hydrogen siloxane / diphenyl siloxane / dimethyl siloxane Copolymer, both ends dimethylhydrogensiloxy group-blocked methylhydrogensiloxane, dimethylsiloxane, diphenylsilane Hexane copolymer, (CH _{3) 2} HSi
A copolymer composed of O _1/2 units, (CH ₃ ) ₃ SiO _1/2 units and SiO _4/2 units, (CH ₃ ) ₂ HSiO _1/2 units and S
a copolymer composed of iO _4/2 units, (CH ₃ ) ₂ HSiO
Such as _1/2 units and SiO _4/2 units, and the (C ₆ H _{5) 3} consisting of SiO _1/2 units copolymers.

The amount of the organohydrogenpolysiloxane to be used is as follows.
The amount is preferably 0.1 to 50 parts, particularly 0.3 to 20 parts with respect to 0 parts (parts by weight, hereinafter the same). Further, the organohydrogenpolysiloxane of the second component has a hydrogen atom (Si) bonded to a silicon atom in the second component per mole of an alkenyl group bonded to a silicon atom in the first component.
-H group) in an amount of 0.5 to 3 mol, particularly about 0.8 to 2.5 mol.

The adhesion-imparting agent of the third component includes an alkoxy group and / or an alkenyloxy group bonded to a silicon atom in the molecule, a Si-H group, an alkenyl group, an acryl group, a methacryl group, an epoxy group, and a mercapto group. , Ester group,
An organosilane or an organosiloxane oligomer having 2 to 50, preferably about 4 to 20 silicon atoms, containing at least one reactive functional group selected from an anhydrous carboxy group, an amino group and an amide group. Are preferably used. This organosilicon compound is used for imparting adhesiveness to a semiconductor chip, a mounting portion, a lead frame and the like to the silicone rubber composition, and a known one can be used, which inhibits the addition vulcanization of the silicone rubber composition. Anything that does not need to be used.

Examples of such organosilicon compounds include γ-glycidoxypropyltrimethoxysilane,
Epoxy functional group-containing alkoxysilanes such as β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, alkenyl group-containing alkoxysilanes such as vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri (methoxyethoxy) silane, and γ- Aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropylmethyldimethoxysilane, N-phenyl- γ
Amino-containing alkoxysilanes such as aminopropyltrimethoxysilane, acrylic or methacrylic-containing alkoxysilanes such as γ-methacryloxypropyltrimethoxysilane and γ-acryloxypropyltrimethoxysilane, and mercapto such as mercaptopropyltrimethoxysilane. In addition to alkoxysilanes such as group-containing alkoxysilanes, the following compounds may be mentioned as organosiloxane oligomers.

[0019]

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[0020]

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The compounding amount of the adhesiveness-imparting agent is preferably 0.1 to 10 parts, more preferably 0.3 to 3 parts, per 100 parts of the first component alkenyl group-containing organopolysiloxane.

Examples of the fourth component addition reaction catalyst include platinum black, chloroplatinic acid, chloroplatinic acid, a reaction product of chloroplatinic acid with a monohydric alcohol, a complex of chloroplatinic acid with an olefin, platinum bisacetate. Platinum group metal catalysts such as platinum catalysts such as acetate, palladium catalysts, and rhodium catalysts are exemplified. The amount of the addition reaction catalyst can be a catalytic amount, and is usually 0.5 to 1, as a platinum group metal.
000 ppm, preferably about 1 to 500 ppm.

In the present invention, a filler may be further compounded.
preferable. The filler reinforces the silicone rubber composition,
In addition to providing the necessary rubber strength,
It is for keeping, and as filler, reinforcing silica type
Fillers and / or silicone resins are used. Reinforcement
Silica-based fillers include fumed silica and calcined silica.
Mosquito, precipitated silica, etc., whose specific surface area is 50-4
00m^Two/ G, especially 100-300 m^Two/ G is preferred
New As silicone resin, R_ThreeSiO _1/2unit,
SiO_TwoUnit, RSiO_3/2Unit, R_TwoSiO_2/2Unit (R
Is a hydrogen atom, a hydroxyl group, or the same or different
Or unsaturated monovalent hydrocarbon groups, of which 90% or more
Is composed of a monovalent hydrocarbon group)_ThreeSiO_1/2Unit is 2
0-70 mol%, SiO_TwoThe unit is 20-70 mol%, R
SiO_3/2The unit is 0 to 70 mol%, R_TwoSiO_2/2Units
Those which are present at a ratio of 0 to 50 mol% are exemplified. What
The monovalent hydrocarbon group in R includes the above R¹so
The same ones as described above, but especially methyl
Group, vinyl group and phenyl group.

The amount of the filler is 0 to 400 parts, especially 5 parts, per 100 parts of the first component organopolysiloxane.
It is preferable to set it to 100 parts.

In addition to the above-mentioned components, the silicone rubber composition may contain a dispersing aid such as a silanol group-containing silane or an alkoxy group-containing silane, an acetylene alcohol or other additive vulcanization control agent, or a titanium, aluminum or zirconium or the like. Metal chelate compounds or alkoxides,
Diatomaceous earth, quartz powder, fused quartz powder, clay, alumina,
Aluminum hydroxide, calcium hydroxide, inorganic fillers such as talc, cerium or cerium-based compounds, titanium oxide, red red iron oxide, black red iron oxide, ferrite, zinc oxide,
Heat and oil resistance improvers such as zinc carbonate, manganese carbonate, magnesium carbonate and magnesium oxide, carbon black,
Pigments for coloring, such as ultramarine blue, release agents, and other additives that are added to conventional addition-vulcanized silicone rubber compositions can be appropriately compounded.

In the present invention, the total content of the cyclic and linear low-molecular-weight nonfunctional siloxanes having 11 to 50 silicon atoms contained in the silicone rubber composition is 3% by weight or less based on the whole composition. , Especially 2% by weight or less. In this case, the content of the low-molecular-weight non-functional siloxane is preferably as small as possible, but is not significantly affected if it is about 1,000 ppm. The number of silicon atoms is 11 to 50.
As a method for quantifying cyclic and linear low-molecular-weight nonfunctional siloxanes, gel permeation chromatography (G
PC) and supercritical fluid chromatography.

Here, the non-functional siloxane includes an alkoxy group, a Si—H group (silicon-bonded hydrogen atom), an alkenyl group, an acryl group, a methacryl group, an epoxy group,
A mercapto group, an ester group, an anhydrous carboxy group, an amino group, an amide group, etc., the alkenyl group-containing organopolysiloxane or organohydrogenpolysiloxane,
Furthermore, cyclic and linear diorganosiloxanes having no reactive functional group that reacts with the substrate to which the silicone rubber composition is adhered, typically dimethylpolysiloxane, methylphenylpolysiloxane, methyl (3,3,
(3-trifluoropropyl) polysiloxane.

The low-molecular-weight nonfunctional siloxane having 11 to 50 silicon atoms is obtained, for example, by using the above alkenyl group-containing organopolysiloxane as a starting material, using a cyclic diorganopolysiloxane having 3 to 6 silicon atoms as a raw material, and catalyzing an acid or alkali. When produced by an equilibrium polymerization reaction, a certain amount is produced as a by-product, but in the present invention,
The content of the low-molecular-weight nonfunctional siloxane having 11 to 50 silicon atoms is set to 3% by weight or less. Alkenyl group,
Alkoxy group, (meth) acryloxyalkyl group, mercapto group, silicon-bonded hydrogen atom (SiH group), hydroxyl group,
If it is a low-molecular siloxane containing a reactive functional group such as an amino group or an epoxy group, the reactive functional group also reacts during vulcanization of the silicone rubber composition, and an organopolysiloxane,
Bonding between the organohydrogenpolysiloxane, the filler, the semiconductor chip, the mounting portion, the lead frame, and other adherends hinders movement in the cured silicone rubber matrix. Since there is no bleeding, there is no effect such as a decrease in connection reliability or deterioration in adhesiveness.However, in the case of a low-molecular siloxane having no reactive functional group, vulcanization of the silicone rubber composition At the time of (or curing), there is no bond that hinders the movement, so that even after vulcanization, the low-molecular-weight siloxane can move freely in the rubber, and eventually bleeds from the adhesive portion, causing an adverse effect. Will be.

As a method for reducing the content of such a low-molecular-weight nonfunctional siloxane to 3% by weight or less, the above-mentioned alkenyl group-containing organopolysiloxane of the first component is 0.1 mm in thickness.
A method of distilling off the low-molecular-weight nonfunctional siloxane by heating to 200 ° C. or higher under a reduced pressure of Hg or less, and washing the low-molecular-weight non-functional siloxane by washing the alkenyl group-containing organopolysiloxane of the first component with ethanol. As a method for removing, and as a method for producing the first component alkenyl group-containing organopolysiloxane, instead of using an equilibrium polymerization reaction in which a cyclic siloxane having 3 to 6 silicon atoms is used as a raw material and an acid or alkali is used as a catalyst, A method using a ring-opening polymerization reaction in the presence of a lithium silanolate catalyst using a cyclic siloxane having 3 silicon atoms as a raw material, and the like can be mentioned.

The adhesive silicone rubber composition thus obtained can be used as an adhesive (die bonding agent) for bonding between the semiconductor chip and a mounting member such as a tab. As is generally practiced, an adhesive is applied to one or both of the bonding surfaces, and the semiconductor chip and the mounting member are brought into close contact with each other, and then heat-treated (usually at 100 to 250 ° C.).
The surface of the bonded surface may be subjected to surface treatment, coating, or the like in advance to further improve the adhesiveness.

[0031]

According to the present invention, a reactive functional group such as an alkenyl group, an alkoxy group, a (meth) acryloxyalkyl group, a mercapto group, a silicon-bonded hydrogen atom (SiH group), a hydroxyl group, an amino group or an epoxy group is used. An addition-curable adhesive silicone rubber composition having a cyclic and linear low-molecular-weight nonfunctional siloxane having 11 to 50 silicon atoms not containing 3% by weight or less in a molecule comprises a semiconductor chip and a mounting member. And the bonding performance between the semiconductor chip and the bonding wire or between the bonding wire and the lead frame is reduced, or the sealing material of the semiconductor chip,
Adhesion to the mounting portion and the lead frame is not deteriorated, and there is no problem that the moisture resistance of the device is deteriorated, and the device can be favorably used as an adhesive (die bonding agent) for mounting a semiconductor chip.

[0032]

EXAMPLES The present invention will be described below in detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. In addition, in the following examples, a part shows a weight part.

Example 1 A cyclic siloxane represented by the following formula (a) was polymerized using a lithium silanolate catalyst represented by the following formula (b), and then neutralized with vinyldimethylchlorosilane to give a molecule. An organopolysiloxane (1) having a viscosity of 10,000 centistokes in which both chain ends were blocked with a dimethylvinylsiloxy group was obtained. 100 parts of this organopolysiloxane (1) and 30 fumed silica (trade name Erosil 200, manufactured by Nippon Aerosil Co., Ltd.)
, 5 parts of an organohydrogenpolysiloxane having a Si-H content of 0.0050 mol / g and a degree of polymerization of 100, 0.8 part of cyclic methylvinylsiloxane, 1 part of an organosilicon compound represented by the following formula (c), platinum chloride 0.08 parts of a 2-ethylhexanol acid solution (platinum content: 2%) was uniformly mixed to obtain a liquid silicone rubber composition (1). Cyclic and linear low-molecular dimethylsiloxane containing no reactive functional group having 11 to 50 silicon atoms (by GPC measurement,
The same applies hereinafter) was 1.2% by weight.

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Comparative Example 1 Instead of the organopolysiloxane (1), a cyclic dimethylsiloxane having 3 to 6 silicon atoms and divinyltetramethyldisiloxane were polymerized using potassium silanolate, and then epichlorohydrin was used. The same operation as in Example 1 was carried out except that the organopolysiloxane (2) having a viscosity of 9,800 centistokes in which both ends of the molecular chain obtained by neutralization were blocked with dimethylvinylsiloxy groups was used. A liquid silicone rubber composition (2) was obtained. The content of the cyclic functional group-free low-molecular dimethylsiloxane having 11 to 50 silicon atoms and containing no reactive functional group was 5.5% by weight.

Example 2 The organopolysiloxane (2) was mixed with 5-fold weight of ethanol, stirred, allowed to stand, and separated to remove ethanol three times.
Stripping operation was performed for 3 hours under the conditions of 0 mmHg and 150 ° C. to obtain an organopolysiloxane (3).

A liquid silicone rubber composition (3) was obtained in the same manner as in Example 1 except that the organopolysiloxane (3) was used instead of the organopolysiloxane (1). The content of cyclic and linear low-molecular-weight dimethylsiloxane containing no reactive functional group having 11 to 50 silicon atoms was 0.8% by weight.

Comparative Example 2 To 100 parts of the liquid silicone rubber composition (1), 5.0 parts of a cyclic dimethylsiloxane having 11 to 50 silicon atoms was added and mixed to obtain a liquid silicone rubber composition (4). . The content of the cyclic and linear low-molecular-weight dimethylsiloxane containing no reactive functional group having 11 to 50 silicon atoms was 5.9% by weight.

Next, the above composition was subjected to a connection reliability test by the following method. Table 1 shows the results. [Connection Reliability Test] A semiconductor pellet of 10 mm × 10 mm was adhered to a metal mounting tab by using the above liquid silicone rubber composition by heating at 200 ° C. for 60 seconds. The lead frames were connected by ultrasonic thermocompression bonding using gold wires. This was sealed with an epoxy resin to produce a semiconductor device.

The semiconductor device manufactured as described above, and the semiconductor device after leaving it in an oven at 150 ° C. for a certain period of time, and this semiconductor device was left in a pressure cooker at 121 ° C. and a humidity of 85% RH for a certain period of time. The latter one,
In addition, the semiconductor device was subjected to a certain number of temperature cycles in which a thermal load of -65 to 150 ° C. was periodically repeated. For each of the test pieces, 10 tests were performed.

[0040]

[Table 1]

From the above results, the content of the cyclic or linear low-molecular-weight siloxane containing no reactive functional group having 11 to 50 silicon atoms exceeding 3% by weight is contained in the adhesion of the semiconductor pellet to the mounting tab. When the adhesive silicone rubber composition is used, the adhesiveness between the semiconductor chip / bonding wire or the bonding wire / lead frame, the semiconductor chip, the mounting portion, and the lead frame of the sealing material is deteriorated, and a defect occurs.

On the other hand, it was confirmed that when the adhesive silicone rubber composition of the present invention was used, there was no decrease in connection reliability over time, and a semiconductor device having excellent reliability was provided.

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Claims (3)

[Claims] 1. An organopolysiloxane containing two or more alkenyl groups bonded to silicon atoms in one molecule, and (2) an organopolysiloxane containing two or more hydrogen atoms bonded to silicon atoms in one molecule. In an adhesive silicone rubber composition containing a hydrogen polysiloxane, (3) an adhesion-imparting agent, and (4) an addition reaction catalyst, a cyclic and linear low-molecular-weight nonfunctional siloxane having 11 to 50 silicon atoms is contained. An adhesive silicone rubber composition having an amount of 3% by weight or less. 2. The composition according to claim 1, which is used for bonding a semiconductor chip to a mounting portion. 3. A semiconductor device comprising a semiconductor chip bonded to a mounting portion via a cured product of the composition according to claim 2.