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TW200616758A - Polishing tape and polishing method thereof - Google Patents

Polishing tape and polishing method thereof

Info

Publication number
TW200616758A
TW200616758A TW094126972A TW94126972A TW200616758A TW 200616758 A TW200616758 A TW 200616758A TW 094126972 A TW094126972 A TW 094126972A TW 94126972 A TW94126972 A TW 94126972A TW 200616758 A TW200616758 A TW 200616758A
Authority
TW
Taiwan
Prior art keywords
polishing
work piece
tape
surface part
mum
Prior art date
Application number
TW094126972A
Other languages
English (en)
Inventor
Noriyuki Kumasaka
Original Assignee
Nippon Micro Coating Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micro Coating Kk filed Critical Nippon Micro Coating Kk
Publication of TW200616758A publication Critical patent/TW200616758A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H10P90/128—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW094126972A 2004-11-16 2005-08-09 Polishing tape and polishing method thereof TW200616758A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004331407A JP2006142388A (ja) 2004-11-16 2004-11-16 研磨テープ及び方法

Publications (1)

Publication Number Publication Date
TW200616758A true TW200616758A (en) 2006-06-01

Family

ID=36406924

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126972A TW200616758A (en) 2004-11-16 2005-08-09 Polishing tape and polishing method thereof

Country Status (6)

Country Link
US (1) US20060252355A1 (zh)
EP (1) EP1813388A4 (zh)
JP (1) JP2006142388A (zh)
KR (1) KR20070085030A (zh)
TW (1) TW200616758A (zh)
WO (1) WO2006054378A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567814B (zh) * 2013-12-03 2017-01-21 信越半導體股份有限公司 Method for manufacturing chamfering device and without incision wafers
TWI761463B (zh) * 2017-03-27 2022-04-21 日商荏原製作所股份有限公司 基板處理方法及裝置

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US20070131653A1 (en) * 2005-12-09 2007-06-14 Ettinger Gary C Methods and apparatus for processing a substrate
US7993485B2 (en) * 2005-12-09 2011-08-09 Applied Materials, Inc. Methods and apparatus for processing a substrate
US20070238393A1 (en) * 2006-03-30 2007-10-11 Shin Ho S Methods and apparatus for polishing an edge of a substrate
JP2008036784A (ja) * 2006-08-08 2008-02-21 Sony Corp 研磨方法および研磨装置
JP5019203B2 (ja) * 2006-11-14 2012-09-05 株式会社東芝 半導体ウェハの研磨方法及び半導体ウェハの研磨装置
WO2008106221A1 (en) * 2007-02-28 2008-09-04 Applied Materials, Inc. Methods and apparatus for cleaning a substrate edge using chemical and mechanical polishing
JP2008221399A (ja) * 2007-03-13 2008-09-25 Tomoegawa Paper Co Ltd 研磨シート
JP2008306180A (ja) * 2007-05-21 2008-12-18 Applied Materials Inc 膜の基板斜面及び縁部の研磨プロファイルを制御する方法及び装置
JP2008290233A (ja) * 2007-05-21 2008-12-04 Applied Materials Inc 半導体製造における基板斜面及び縁部の研磨用の高性能及び低価格の研磨テープのための方法及び装置
JP2008288600A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の縁部除外領域の大きさを制御する方法及び装置
US8142260B2 (en) 2007-05-21 2012-03-27 Applied Materials, Inc. Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
JP2008284683A (ja) * 2007-05-21 2008-11-27 Applied Materials Inc 基板の振動により基板のノッチを研磨する方法及び装置
JP2009004765A (ja) * 2007-05-21 2009-01-08 Applied Materials Inc 基板研磨のためにローリングバッキングパッドを使用する方法及び装置
US7976361B2 (en) * 2007-06-29 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
DE102007056122A1 (de) 2007-11-15 2009-05-28 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante
JP4463326B2 (ja) 2008-02-22 2010-05-19 日本ミクロコーティング株式会社 半導体ウェーハ外周端部の研削方法及び研削装置
US20100105291A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate
US20100105299A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Methods and apparatus for polishing an edge and/or notch of a substrate
DE102009030294B4 (de) * 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
DE102010014874A1 (de) * 2010-04-14 2011-10-20 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
JP2011224680A (ja) * 2010-04-16 2011-11-10 Ebara Corp 研磨方法及び研磨装置
WO2012013227A1 (en) * 2010-07-28 2012-02-02 Carl Zeiss Smt Gmbh Facet mirror device
JP5831974B2 (ja) * 2011-11-08 2015-12-16 Ｍｉｐｏｘ株式会社 端縁部を研磨テープにより研磨仕上げした板ガラス並びに板ガラス端縁部の研磨方法及び研磨装置
US9492910B2 (en) 2012-07-25 2016-11-15 Ebara Corporation Polishing method
JP2016046341A (ja) 2014-08-21 2016-04-04 株式会社荏原製作所 研磨方法
US9339912B2 (en) 2013-01-31 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer polishing tool using abrasive tape
JP6071611B2 (ja) * 2013-02-13 2017-02-01 Ｍｉｐｏｘ株式会社 オリエンテーションフラット等切り欠き部を有する、結晶材料から成るウエハの周縁を、研磨テープを使用して研磨することにより円形ウエハを製造する方法
JP5700264B2 (ja) * 2013-10-28 2015-04-15 株式会社東京精密 ウエハエッジ加工装置及びそのエッジ加工方法
DE102015221939B4 (de) * 2015-11-09 2018-10-31 Supfina Grieshaber Gmbh & Co. Kg Finishbandvorrichtung und Verfahren zur finishenden Bearbeitung eines Werkstücks
JP2018195853A (ja) * 2018-08-31 2018-12-06 株式会社荏原製作所 研磨方法

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US5611826A (en) * 1994-03-01 1997-03-18 Fuji Photo Film Co., Ltd. Abrasive tape
JPH08112769A (ja) * 1994-10-14 1996-05-07 Fuji Photo Film Co Ltd 研磨テープ
JPH0985632A (ja) * 1995-09-21 1997-03-31 Fuji Photo Film Co Ltd 研磨フィルム
JPH1199458A (ja) * 1997-09-29 1999-04-13 Sanshin:Kk 板状部材角縁面取装置
JP4519970B2 (ja) * 1999-12-21 2010-08-04 スリーエム イノベイティブ プロパティズ カンパニー 研磨層が立体構造を有する研磨材料
JP2001205549A (ja) * 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
US6629875B2 (en) * 2000-01-28 2003-10-07 Accretech Usa, Inc. Machine for grinding-polishing of a water edge
JP3467483B2 (ja) * 2001-06-06 2003-11-17 株式会社コバックス 精密研磨のための固定砥粒構造体
JP2003145433A (ja) * 2001-11-16 2003-05-20 Dainippon Printing Co Ltd 研磨シート、およびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI567814B (zh) * 2013-12-03 2017-01-21 信越半導體股份有限公司 Method for manufacturing chamfering device and without incision wafers
US10002753B2 (en) 2013-12-03 2018-06-19 Shin-Etsu Handotai Co., Ltd. Chamfering apparatus and method for manufacturing notchless wafer
TWI761463B (zh) * 2017-03-27 2022-04-21 日商荏原製作所股份有限公司 基板處理方法及裝置

Also Published As

Publication number Publication date
EP1813388A4 (en) 2008-01-16
EP1813388A1 (en) 2007-08-01
WO2006054378A1 (ja) 2006-05-26
JP2006142388A (ja) 2006-06-08
US20060252355A1 (en) 2006-11-09
KR20070085030A (ko) 2007-08-27

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