TW200606620A - Heat dissipation module - Google Patents
Heat dissipation moduleInfo
- Publication number
- TW200606620A TW200606620A TW093124344A TW93124344A TW200606620A TW 200606620 A TW200606620 A TW 200606620A TW 093124344 A TW093124344 A TW 093124344A TW 93124344 A TW93124344 A TW 93124344A TW 200606620 A TW200606620 A TW 200606620A
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- heat source
- heat dissipation
- dissipation module
- thermal interface
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 4
- 239000000463 material Substances 0.000 abstract 3
- 239000012528 membrane Substances 0.000 abstract 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 239000002041 carbon nanotube Substances 0.000 abstract 1
- 229910021393 carbon nanotube Inorganic materials 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation module includes a heat source; a heat dissipation device which comprise a base and a number of heat fins extending therefrom; a thermal interface material positioned between the heat source and the base, and a layer of porous membrane which is positioned between the heat source and the base and is set around the thermal interface material. The thermal interface material is sealed between the heat source and the base by the porous membrane. Therefore evaporation and spillage of the thermal interface is prevented efficiently, and the thermal resistant between the base and the heat source is kept stable. In addition, carbon nanotubes are grown inside holes of the porous membrane to further reduce the thermal resistant. A method of making the heat dissipation module is also provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93124344A TWI322940B (en) | 2004-08-13 | 2004-08-13 | Method for manufacturing heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93124344A TWI322940B (en) | 2004-08-13 | 2004-08-13 | Method for manufacturing heat dissipation module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200606620A true TW200606620A (en) | 2006-02-16 |
| TWI322940B TWI322940B (en) | 2010-04-01 |
Family
ID=45074004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93124344A TWI322940B (en) | 2004-08-13 | 2004-08-13 | Method for manufacturing heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI322940B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI442014B (en) | 2010-11-24 | 2014-06-21 | 財團法人工業技術研究院 | Heat dissipating component and heat dissipating component processing method |
-
2004
- 2004-08-13 TW TW93124344A patent/TWI322940B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI322940B (en) | 2010-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |