200521055 (1) 玖、發明說明 【發明所屬之技術領域】 本發明’是有關將基板搬送至處理裝置的基板搬送系 統。 【先前技術】 習知’已知將基板朝處理裝置搬送的基板搬送系統。 特別是，將複數基板容納於被稱作FOUP的卡匣，由卡匣 單位搬送的系統是已知（例如，日本特開2 0 0 1 · 〇 7 6 9 9 8號 公報參照）。 但是，以卡匣單位使複數基板的一起搬送的習知的系 統中’基板的尺寸大的情況的搬送中的事故的風險是變 大。且’也有系統規模大型化，不適合多品種小量生産的 問題。 且’對於需要調製盤的處理裝置搬送基板的情況，習 知因爲是與調製盤的搬送路及基板的搬送路不同，整體系 統的規模會變大。 且’一方面，對於由卡匣單位搬送的系統，因爲保管 卡厘的貯藏庫是完全固定，或者是只有單純的動作，對於 將卡匣移載至貯藏庫的移載手段所要求的功能很多，其結 果移載手段是非常地大。 本發明是爲了解決上述習知技術的課題，其目的，是 提供一種可縮小系統規模的基板搬送系統。 200521055 (2) 【發明內容】 爲了達成上述目的，本發明的系統，其特徵爲··具備 在供處理基板用的複數處理裝置間將基板及調製盤搬送的 隧道、及控制前述隧道內的基板及調製盤的搬送的控制手 段。 在此’更具備貯藏搬送於前述隧道內的基板或是調製 盤的貯藏庫，前述控制手段，也控制：從前述貯藏庫朝前 述隧道的基板或是調製盤的搬出、及從前述隧道朝前述貯 藏庫的基板或是調製盤的搬入。 且，更具備貯藏搬送於前述隧道內的基板及調製盤的 貯藏庫將，前述控制手段，也控制：從前述貯藏庫朝前述 隧道的基板及調製盤的搬出、及從前述隧道朝前述貯藏庫 的基板及調製盤的搬入。進一步，前述貯藏庫，是具備讀 取隨附於調製盤或是基板的資訊的資訊讀取手段。且，前 述貯藏庫，是具備：載置調製盤或是基板的複數段的載置 台、及各別獨立於該載置台的旋轉旋轉手段。 且，本發明的貯藏庫，其特徵爲，具備··載置基板或 是調製盤或是基板收納卡匣的複數段的載置台、及前述載 置台各段可分別旋轉的旋轉手段。進一步本發明的其他的 基板搬送系統，其特徵爲，具有：將如申請專利範圍第6 項的貯藏庫、及載置於前述載置台的基板或是調製盤或是 基板收納卡匣，取出並移動於搬送路，且，將搬送於搬送 路的基板或是調製盤或是基板收納卡匣，載置於前述載置 台的移載手段。 200521055 (3) 本發明的其他的u 知徵及優點，是藉由參照添付圖面及 以下的說明可明顯了鮭。# π ^ 〜、解 然而，在添付圖面，是相同或是 同樣的結構中，附加相同參照符號。 【實施方式】 在以下’参照圖面，詳細說明此發明的最佳的實施 例。但是，揭不於此實施例的構成要素的相對配置等，若 無特別揭不，並不限定此發明的範圍。 <第1實施例> (結構） 第1圖Α ’是本發明的第1實施例的基板搬送系統 1 0 0的一部分的設計的槪略圖。 在弟1圖A ’ 1 〇 1是隧道，i 〇2是對於基板施加處理 的處理裝置’ 103是在隧道1〇ι及處理裝置1〇2之間進行 基板的收受的介面裝置。 險道1 0 1 ’是連複數處理裝置1 〇 2間地設計。且， 險道101處理的裝置1〇2未直接連接，介面裝置1〇3是位 在其間。即’隧道101是對於其下面與介面裝置1〇3連 接’介面裝置103是對於其側面與處理裝置1〇2連接。 險道101’是介面裝置103的寬及同程度的寬各被元 件化’使各元件取下維修可能的結構。且，隧道1 〇 ][及介 面裝置1 0 3的組合是作爲丨元件處理也可以。在此，介面 裝置1 〇 3 ’是對於的複數處理裝置〗〇2的1個1個地設 -6 - 200521055 (4) 置。 在隧道1 01內部中，是設置供搬送基板（晶圓）用的 搬送機構，搬送至隧道內的基板，是送到介面裝置1〇3 後，進一步從介面裝置103搬送至處理裝置1〇2。 第1圖B，是將本基板搬送系統1 〇〇的設計從別的角 度顯示的圖。第1圖B的上側的圖，是將本基板搬送系統 1 〇 〇從上方所見的圖，第1圖B的下側的圖，是從隧道的 長度方向所見的槪略剖面圖。 例如，蝕刻、拋光、加濕、飛濺、CMP (化學性機械 硏磨）、曝光等的完成晶圓所需要的一連的處理裝置 1 〇 2，是如第1圖B的上側的圖沿著隧道1 01配置的情 況’各處理裝置102，是需考慮基板受渡部102a的高度 不同情況。隧道1 0 1的高度因基本上是固定的，所以將隧 道101及介面裝置103之間的連通部104的長度，依據處 理裝置102改變，在對應處理裝置1〇2的高度設置介面裝 置103。具體上，基板受渡部l〇2a是對於比較低的處理 裝置1 02，是如第1圖b的下側的左圖所示，降低介面裝 ® 103設置，基板受渡部i〇2a是對於比較高的處理裝置 1 0 2 ’是如第1圖B的下側的右圖所示，提高介面裝置 1 03設置。由此，介面裝置，是成爲對應複數種類的處理 裝置可能的結構。然而，在此，雖將基板的搬送特別化說 明’但是本系統1 〇〇的搬送機構是不限定於通常的晶圓， 調製盤或監控晶圓、假晶圓等的其他種類的晶圓的混合搬 送是可能。該情況，具備將隧道內的基板及調製盤的搬送 200521055 (5) 總合地控制的控制器最佳。此控制器，是例如，對於要製 造的晶圓的種類改變時或晶圓的處理條件改變時，在需要 交換曝光等調製盤的預定的處理裝置，從調製盤保管部將 符合條件的調製盤載置至搬送車地搬送，使其調製盤搬入 需要調製盤的預定的處理裝置地，將基板搬送車的搬送及 介面裝置總合地控制。 第2圖A’是顯不隧道1〇1及介面裝置1〇3的內部的 槪略圖。且，第2圖B ’是從第丨圖a的a側箭頭方向 所見的情況的隧道1 0 1及介面裝置i 〇 3的外觀圖。 如第2圖A所示，在隧道1 〇 1的內部側壁中，二條 的軌道201a、201b是呈上下方向平行設置。這些二條的 軌道20la、201b，是可分別支撐複數基板搬送車2〇2，基 板搬送車202，是藉由馬達的驅動沿著軌道201a或是軌 道201b自走。由此隧道1〇1，是在其內部，具有：搬送 «板的第1搬送路、及在第1搬送路的上方搬送基板的第 2搬送路。 基板搬送車202，是具備：可載置基板S的C型狀的 托盤202a、及支撐托盤202a且沿著軌道201行走的推車 202b 〇 然而，第2圖A的C，是軌道2 0 1的根本附近的擴大 圖°如其所示，在隧道1 0 1的內側面中，部分地設置供電 元件2 03。供電元件2 03，是配置在當基板搬送車202將 S @ ^ A或是搬出處理裝置1 02用的停止位置，基板搬送 車202 ’停止中，是藉由與供電元件203接觸，對於基板 -8- 200521055 (6) 搬送車2 0 2內的下圖示的電池供給電力。而且，使用蓄電 於電池內的電力將馬達驅動’行走於軌道上。 且，在隱道1 〇 1內，是設置具備空热淸淨過濃器 (ULPA ( Ultra Low Penetration Air)過濾器）的淸淨元 件3 0 1。在淸淨元件3 0 1中，是連接配管3 0 2，從配管 3 0 2流入的空氣，是通過淸淨元件3 0 1的空氣淸淨過濾器 被淨化，如箭頭所示地經過隧道1 〇 1的內部，從排氣導管 3 0 3送出至空氣排出元件 3 04。對於本實施例的配管 3 02，是如第2B圖所示，橫跨於隧道101的各元件地連 接。即，本基板搬送系統1 〇〇，是具備大型的空氣供給元 件（不圖示），配管3 0 2，是從其空氣供給元件沿著隧道 1 0 1舖設，途中分枝，與設置於隧道1 〇 1的各元件的淸淨 元件3 0 1連接。 由此，隧道1 〇 1的內部是隨時充滿淸淨空氣，防止鏖 挨或灰塵等附著搬送基板。且，淸淨元件3 0 1是取下維修 可能地構成。然而，在此，在淸淨元件301雖具有ULP A 過濾器，但是本發明不限定於此，配合預定的淸淨度 HEPA ( High Efficiency Particulate Air)設置過濾器等的 淸淨過濾器也可以。 在隧道101的底面，對於介面裝置103將基板搬出， 是設置供將基板從介面裝置103搬入用的開口部l〇la。 而且，設置供開閉開口部1 0 1 a用的檔板204。 在連通部104中，在隧道101及介面裝置1〇3之間將 基板傳送時，爲了在基板無塵挨或灰塵等附著並確保固定 -9- 200521055 (7) 的密閉性的目的’是設置有遮蔽壁7 〇 i。此遮蔽壁7 〇 i， 是使不會有由隧道1 0 1及介面裝置丨〇 3所振動的傳達地具 備緩衝功能也可以。該情況，遮蔽壁7 0 1 ,可考慮例如可 自由伸縮的波紋構件。 且，遮蔽壁701，是不限定連通隧道ι〇1及介面裝置 1 0 3之間的結構。例如，如第3圖a、第3圖B所示，在 隧道1 0 1的下部及介面裝置1 〇 3的上部，包圍基板的受收 開口部地，設置分別相互不接觸的凸壁7 〇丨a、7 〇丨b，作 爲迷宮構造也可以。此時，隧道1〇1及介面裝置1〇3之間 的內部氣壓’是藉由比外部高就可使麈挨或灰麈等不會附 著於基板。 一方面’介面裝置103，是在隧道ιοί的下方，配置 在對應於處理裝置102的基板收取口的高度。介面裝置 1 0 3 ’疋具丨厢·形成始閉空間可能的室5 〇 1、及在室5 0 1 內搬送基板的滑動元件4 0 1、及從基板搬送車2 0 2朝滑動 元件4 0 1將基板移換的基板昇降元件6 〇 1。基板昇降元件 601，換言之，具有對於隧道1〇1使基板可上下方向收受 的功能。 室5 0 1，是在隧道1 〇丨側及處理側具有開口部5 〇 i a 及開口部501b，分別由作爲開閉門的閘門閥5〇2、5 03成 爲可開閉自如。 且，滑動元件 401，是包含滑動臂 401a及滑動台 4 0 1 b及滑件驅動4 0 1 c，滑件驅動4 0 1 c是藉由將動力傳達 至滑動台401b，使安裝於滑動台401b的滑動臂401a，是 -10- 200521055 位在處理裝置1 〇2方向的前後。由此，載置於滑動臂 401a的基板是朝第2圖A的左方向滑動，搬送至處理裝 置102內部。 第3圖C，是顯示隧道1 〇 1的內部的立體圖。如第3 圖C所示，淸淨元件3 0 1，是取下交換或維修可能。且， 在隧道1 0 1的頂棚及側面中，是設置了嵌入有透明板的窗 1 0 1 a、1 0 1 b，隧道1 0 1內部的樣子是目視確認可能。由 此，隧道內的基板的狀態或隧道內所發生的問題可以瞬間 發現。 第4圖A、第4圖B，是顯示基板搬送車202的內部 構造的槪略結構圖。 第4圖A，是顯示將基板搬送車202從上方所見的情 況的內部結構。第4圖B，是顯示從第4圖A的圖中下方 所見的基板搬送車202的情況的內部結構。如第4圖 A 所示，托盤202a，是C形狀，在外周的一部分具有間隔 G。且，在托盤202 a的上面，吸著保持基板用的挾持口 2 1 1是設置3個，這些的挾持口 2 1 1是連接全部的推車 202b內的泵元件212。在將基板載置於托盤202a上的狀 態下驅動泵元件2 1 2，藉由從挾持口 2 1 1吸氣，使基板吸 附於托盤202a。 且，在托盤202 a中是設置供載置基板用的溝3 1 7， 在此溝3 1 7是嵌入基板，且藉由由挾持口 2 1 1所吸引，使 基板不會在搬送中偏離落下地固定。 且，推車202b，泵元件212之外，是具備：讓推車 -11 - 200521055 (9) 2 0 2 b行走的驅動元件2 1 3、及控制泵元件2 1 2或驅動元件 2 1 3的控制元件2 1 4。 驅動元件2 1 3，是在其內部具備：馬達2 1 3 a、及齒輪 213b、213c、及驅動滾子213d，馬達213a的旋轉力，是 藉由通過齒輪2 1 3 b、2 1 3 c傳達至驅動滾子2 1 3 d，使滑接 於軌道2 0 1的驅動滾子2 1 3 d旋轉，使推車2 0 2 b行走於軌 道201上。 推車202b，是在驅動滾子213d以外，具備：以上下 方向挾持軌道2 0 1用的導引滾子2 1 5、及在驅動滾子2 1 3 d 之間呈水平方向將軌道20 1挾持用的導引滾子2 1 6。藉由 這些的導引滾子，使推車202b可在軌道201上安定行 走。 (基板收受動作） 使用第5圖及第6圖，說明基板的收受動作。第5圖 的a、e，是顯示隧道1〇1內的基板搬送車2 02的位置， 顯示從隧道上方透過隧道1 01的頂棚部分。第5圖的b、 第6圖的b、f，是顯示將介面裝置103從隧道1〇1側所 見的情況的部分地的外觀。第5圖的c、d、f、g、第6圖 的a、c、d、e、g，是與第2圖A同樣’顯示隧道ιοί及 介面裝置103的內部。 首先，如第5圖的a所示’載置基板S的基板搬送車 2 0 2 ’是沿著軌道2 G 1行走，在介面裝置1 0 3的上部停 止0 -12- 200521055 (10) 接著，如第5圖的b及c所示，隧道1 ο 1下部的檔板 2 0 4及介面上部的閘門閥5 0 2是打開。使設置於介面裝置 103的上面的支軸及圓盤狀的閘門閥5 02的中心軸由腕連 結。而且，以支軸爲中心，藉由進行轉動腕的開動作，閘 門閥5 0 2是從關閉開口部5 0 1 a的位置，朝開放的位置移 動。 閘門閥5 02及檔板204是打開的話，接著，如d所 示，基板昇降元件6 0 1會動作，使突起桿6 0 1 a上昇讓托 盤202a上的基板S突起。 基板S的突起完成的話’如e所示使基板搬送車2 0 2 朝無間隔 G的方向（圖中下方向）移動。即，突起桿 601a是通過間隔G地移動基板搬送車202。 基板搬送車2 0 2是從基板收受位置完全退避的話，如 f所示，基板昇降元件601會動作，使突起桿601a在載置 基板S的狀態下降。 而且，如g所示，在介面裝置103的天板附近一旦停 止’旋轉突起桿601a進行基板S的裂痕定向 (orientation fracture )配合。在此裂痕定向配合，是使 設置於基板S的一部分的切斷部分朝向預定的方向。依據 處理裝置102的種類，會要求基板是向特定的方向搬入。 因此，將基板搬入那樣的處理裝置1 〇 2的情況時，基板昇 降兀件6 0 1是作爲調整基板的方向的方向調整手段的功 能。具體上’藉由設置於介面裝置103的天板的上面的不 圖示的光檢測器，檢測基板S的切斷部分。 -13- 200521055 (11) 裂痕定向配合是終了的話，如第6圖的 步下降突起桿6 01 a，將基板載置在滑動臂 且，在該狀態下，如b及c所示，隧道1 ( 2〇4及介面裝置103上部的閘門閥5 02是移 且，依據處理裝置1 02的種類，確認介面裝 閥502是完全地關閉後，減壓介面裝置1〇3 即’處理裝置1 0 2是在低壓下進行處理的種 配合其使室5 0 1內的氣壓下降。例如，處理 高真空下進行處理的裝置的情況時，爲了使 高真空狀態，如第7圖A、第7圖B所示 103更連接低真空泵801及高真空泵802。 置1 〇2是要求低真空的情況時，是在介面裝 低真空泵8 0 1即可。 室5 0 1內的減壓是完成的話，如第6圖 設置於介面裝置的處理側的側面的閘門閥 且’使滑件驅動4 01 c動作，如e所示，將 401b的滑動臂401a，朝處理裝置1〇2的方向 在該狀態下，處理裝置1 02，是收取被 4 0 1 a的叉狀的先端部分的基板S，成爲f及 後，使滑動臂4 0 1 a後退至室5 0 1內部，〇 置。而且，在處理裝置102完成基板的處理 滑動滑動臂4 0 1 a，在f及g的狀態待機。接 置1 02側使基板S朝滑動臂40丨a載置，成 話，狀態是以第6圖的d —第6圖的b & c a所示，進一 4 0 1 a上。而 )1下部的檔板 動至閉位置。 置1 0 3的閘門 的室5 0 1內。 類情況時，是 裝置102是在 室501內成爲 ，在介面裝置 當然，處理裝 置103只連接 的d所示，將 5 03 打開。而 安裝於滑動台 1滑動。 載置於滑動臂 g的狀態。之 g復至d的位 的話，再度， 著，在處理裝 爲e的狀態的 第6圖的 -14- 200521055 (12) 第5圖的f->第5圖的d—第5圖的c的順序依序變 具體上’滑動臂401a後退，將基板S取入室 (第6圖的d )，關閉閘門閥5 0 3，使室5 01內的 復至大氣壓（第6圖的c )。之後，對於基板搬送 發出基板取出要求，使基板搬送車202待機於介 103上方的基板收取位置前方，使檔板204及閘門 打開（第6圖的a )。接著，突起桿60 1 a上昇使 40 la上的基板S突起，進一步上昇停止（第5圖的 而且，待機於待機位置的基板搬送車202，是 桿6 0 1 a通過間隔G地移動，在收取位置待機（第 d )。突起桿60 1 a下降，將基板S送至基板搬送車 托盤202a。突起桿601a下降完成後，基板搬送車 將基板S朝接著的處理裝置搬送，同時，關閉檔板 及閘門閥5 02。 (整體地的設計） 接著，對於基板搬送系統1 00的整體的設計使 圖A、第8圖B及第9圖A〜第9圖E說明。 第8圖A，是顯示主搬送路及副搬送路的關係 基板搬送系統100，是包含主搬送路 901及副 902、及主搬送路901的隧道101及副搬送路902 101，是由移載裝置903連接。移載裝置903，是 至主搬送路901的隧道101內的基板移載至副搬送 的隧道1 〇 1的裝置。含於副搬送路902的隧道1 0 1 化。 5 0 1內 氣壓回 車202 面裝置 閥502 滑動臂 f) 〇 使突起 5圖的 2 02的 202是 2 04、 用第8 的圖。 搬送路 的隧道 將搬送 路902 是直線 -15- 200521055 (13) 且因爲端部無法進行，所以從主搬送路9〇 1移載至副搬送 路9 0 2的基板’是一邊往復副搬送路9 〇 2的隧道i 〇丨，一 邊在處理裝置1 〇 2施加處理。此時，從隧道1 〇丨朝處理的 裝置102是藉由介面裝置ι〇3搬送。 在副搬送路9 0 2的處理終了的基板，是再度移載至主 搬送路901，朝接著的過程送出。 第8圖B，是進一步顯示整體的基板搬送系統的設計 例的圖。如第8圖B所示的系統中，主搬送路9 0 1是二 條’在各主搬送路是分別連接副搬送路9〇2、90 5。在主 搬送路 901的端部，是連接容器倉庫9〇4。容器倉庫 9 0 4 ’疋：貞丁臧從基板製造工場送出的存有基板的容器，從 其容器將基板1枚1枚地取出並搬入主搬送路901。 副搬送路902，雖是與第8圖A同樣是直線的設計， 但是副搬送路905，是具有無端的隧道1 〇 1，藉由在副搬 送路9 0 5內朝上方向搬送基板，使同樣的處理不斷地返覆 進行可能。且，在主搬送路9 0 1中，不通過副搬送路而直 接連接其基板是被搬的運處理裝置群906。由主搬送路 90 1搬送並施加一連的處理的基板，是被收集於容器收容 裝置907，各以預定枚數收容於容器中，並搬送至其他的 工場或是後繪過程。 接著，說明搬送路的隧道101的形狀及處理裝置102 的配置。第9圖A〜第9圖E，是顯示隧道101及處理裝 置1 02的各式各樣的設計圖案的圖。 其中，第9圖A，是對於含有直線狀的1條的隧道 -16- 200521055 (14) 1 〇 1，將搬送路在其兩側配置處理裝置丨02的設計。爲了 實現此設計，是在從隧道1 0 1朝處理裝置1 〇 2搬送的基板 介面裝置103 (在此不圖示）’需要具有朝隧道的兩側搬 送基板的能力。如此兩側配置的話，複數處理裝置的設置 面積是整體變小，基板處理工場內的空間可有効活用，工 場的成本下降可能。 第9圖B，是對於含有環狀的隧道101的搬送路，在 其兩側配置處理裝置1 02的設計。搬送路是一部分具有移 載裝置903。移載裝置903，是可將已終了 一連的處理而 回復的基板，再度搬送至搬送路，或貯藏於移載裝置903 內。第9圖C，是對於含有直線狀的二條的隧道1 〇 1的搬 送路，在其兩側配置處理裝置1 02的設計。在此搬送路也 一部分具有移載裝置903。移載裝置903，可以將在一方 的隧道1 0 1已終了一連的處理而回復的基板，搬送至他方 的隧道101。而且使各處理裝置102的維修也可以從被挾 持於隧道1 〇 1的通路側容易進行。第9圖D，是對於含有 直線狀的1條的隧道1 〇 1的搬送路，其片側配置處理裝置 1 02的設計。第9圖E，是對於含有直線狀的隧道1 0 1的 搬送路，挟持隧道1 〇 1且相互不同地使處理裝置1 鋸齒 配置的設計。 (移載裝置的結構） 接著，對於第8圖A所示的移載裝置9 0 3的內部結 構，使用第1 0圖〜第12圖B說明。 •17- 200521055 (15) 第10圖，是不具有貯藏基板功能的移載裝置90 3的 內部結構的俯視圖。此移載裝置903，是在主搬送路 901、及副搬送路902a或是副搬送路902b之間移載基板 S用的裝置。在第10圖，在移載裝置90 3的內部中，是 設置從主搬送路901的隧道101內連續的軌道201a、及 從副搬送路902a，902b的隧道101內連續的軌道201b、 2〇lc。由此移載裝置903，使分別行走於搬送路901的隧 道101內的基板搬送車202可以出入的結構。 且，在移載裝置903的內部中，進一步，是設置：與 軌道的數同數的突起載置台l〇〇la、100 1b、1001c、及移 載至機械手臂1002。搬送各軌道201a、201b、201c的基 板搬送車202，是在突起載置台1001a、1001b、1001c的 上部停止的話，突起載置台 l〇〇la、1001b、1001c，是由 基板搬送車202搬送的基板S從下方突起。 在該狀態下，基板搬送車202是後退的話，使移載機 械手臂1 002的U字狀的手臂是進入被留在突起載置台 1001a、1001b、1001c的基板的下方，藉由使突起載置台 1001a、1001b、1001c下降，使基板送至移載機械手臂 1 002 ° 而且，藉由旋轉移載機械手臂1〇〇2，基板S是被送 至其他的突起載置台，進一步移載至不同軌道上的基板搬 送車202。爲了使這種移載處理平順地進行，在移載機械 手臂1 002的臂中，至少有2處的關節部分，可以非常自 由地移動基板S。 •18- 200521055 (16) 接著，對於具有基板貯藏功能的移載裝置9〇3，使 第11圖A〜第11圖D及第12圖A及第12圖b說明。 第1 1圖A，是具有基板貯藏功能的移載裝置9 〇 3的內咅 結構的俯視圖。第1 1圖B，是其側剖面圖。此移載裝置 9 0 3，是可將基板移載於：主搬送路9 0 1、及副搬送路 902a或是副搬送路902b之間的同時，貯藏基板用的裝 置。如此藉由將基板S 1枚1枚地保管，使副搬送路及主 搬送路所搬送的基板的數量調整可能，可作爲處理負荷變 大的情況時的緩衝器功能。 如第1 1圖A、第1 1圖B所示的移載裝置9 〇 3，貯藏 庫1 101之外，是設置具有2個臂1 102a、1 l〇2b的移載機 械手臂1 1 0 2。其他的結構，因爲與第1 〇圖所示的移載裝 置9 0 3同樣，在相同機構中附加相同符號省略說明。具備 貯藏庫1 1 0 1的移載裝置的情況時，基板S的移載處理枚 數因爲變多，如此移載機械手臂1 1 02是希望具備2個臂 1 102a、1 102b，當然使用只有1個臂的第1〇圖的型式的 移載機械手臂1 00 2也可以。然而，因爲由此移載機械手 臂1102的各臂i1〇2a、1102b也與第10圖所說明的移載 機械手臂1 002的臂同樣的動作，在此省略說明。 在此，貯藏庫1 1 01的形狀是8角柱，藉由如箭頭旋 轉’基板可從8個面對於8個棚1 1 0 1 d插入可能。第1 1 圖A，是顯示8個棚之中4個棚，有貯藏基板的狀態。將 基板S對於棚插入時，如圖使門1 1 〇 1 a打開。在8個棚的 上面中央，設有淸淨元件1 1 0 1 b且朝向下方如箭頭地吹出 -19- 200521055 (17) 淸淨空氣。然而，淸淨元件，是更設置在移載裝置903的 上部。 如第1 1圖B所示，8個棚1 1 〇 1 d是使各複數基板保 管室1 1 〇 1 e是呈上下方向堆積重疊的形狀。在8個棚的下 部中，是設置貯藏庫旋轉裝置1 1 0 1 c，使貯藏庫1 1 0 1的 整體，朝順時針方向或逆時針方向旋轉。 然而’爲了將基板各別搬送至上下方向連續的基板保 管室llOle，移載機械手臂n 〇2，也是上下方向移動可 能。此情況，可取代突起載置台1 00 1而使用上下移動不 可能的載置台也可以。且，或是讓移載機械手臂1102直 接從基板搬送車202收取基板S的結構也可能。但是，爲 了從基板搬送車202直接收取基板S，需要將設置在移載 機械手臂1 102的臂1 i〇2a、1 l〇2b的先端的手臂形成配合 基板搬送車202的托盤形狀的形狀。 然而，如第1 1圖B所示的主搬送路901及副搬送路 9〇2 ’希望是軌道相互不接觸地上下方向偏離。 進一步’貯藏庫的形狀是不限定於8角柱，圓柱也可 以。且，移載機械手臂1102是具有上下左右移動的機構 的話’將時旋轉的平面棚作爲貯藏庫使用也可以。 第1 1圖C ’是說明貯藏庫丨】〇 i的其他的例用的俯視 圖’第U圖D是由第11圖c的X-X所切斷的部分剖面 圖。第1圖1C ’如第1 1 D圖所示的例中，複數基板保管 室Η 〇 1 e是形成於甜甜圈狀的載置台i丨〇 1 f上，載置台 1 1 〇 1 f是由中心部分支撐中空馬達。由此，基板保管室 -20- 200521055 (18) 1 1 0 1 e是成爲每1段成爲一體地旋轉可能。貯藏庫i丨〇 ][整 體，是使這些的載置台llOlf及中空馬達成爲上下方向堆 積重疊的多層構造。詳細說明的話，中空馬達，是包含甜 甜圈狀的旋轉部1 1 〇 1 g及甜甜圈狀的固定部1 1 〇 1 h，旋轉 部1 1 0 1 9是成爲對於固定部1 1 〇 1 h旋轉可能。而且，載置 台1 1 0 1 f的下面是固定於旋轉部1 1 〇 1 g的上面，固定部 llOlh的下面，是固定於固定構件ii〇ii的上面。且，各 段的固定構件1 1 〇 1 i彼此，是分別由圓柱狀的複數支撐構 件1 1 〇 U連接，整體成爲中空的塔狀。在位置於貯藏庫 1 1 0 1的中心的中空部分上方，是設置淸淨元件（不圖 示）且朝向下方如箭頭吹出淸淨空氣。 如此因爲在各段設有馬達，所以可減輕對於各馬達的 負荷且可高速且高精度旋轉·停止可能。而且，對於貯藏 庫11 0 1的調製盤或是基板等的保管·替換動作可以有效 率進行。且，可在各段使調製盤或是基板等分開收納，使 那些的管理容易。進一步，因爲機械手臂所要求的動作可 減少，所以機械手臂小型化可能，進一步可以縮小系統整 體的規模。 然而’以上說明的貯藏庫，是可取代基板，使用保管 調製盤者也可以。且，將基板及調製盤保管於同一的貯藏 庫也可以。進一步，此貯藏庫，也可以應用於不以單片搬 送爲前提的系統。即，將收納基板的卡匣（例如FOUP : Front Opening Unified Pod)作爲一時地保管地變形也可 能。將第1 1圖C所示的貯藏庫作爲收容卡匣的貯藏庫應 -21 - 200521055 (19) 用的話’相比於習知的機械手臂所要求的動作，因爲還是 減少，所以機械手臂小型化可能，進一步可以縮小系統整 體的規模° 第1 2圖A、B，是具備讀取基板的資訊的讀取裝置 1201的移載裝置903的說明圖。如第12圖A、第12圖B 所示的移載裝置903，是將讀取調製盤或是基板等所隨附 的資訊用的讀取裝置1 201，分別具備於突起載置台 1001a、l〇〇lb、1001c的上方。其他的結構，因爲是與第 1 1圖A、第1 1圖B所示的移載裝置903同樣，所以在相 同機構中附加相同符號省略其說明。 讀取裝置1 2 0 1，是讀取調製盤或是基板等所隨附的 資訊，並將保管於貯藏庫Π 0 1的調製盤或是基板等的保 管資訊，發訊至不圖示的資訊管理裝置。由此，可管理貯 藏庫1 1 0 1內的基板或調製盤的數量。 而且，依據資訊管理裝置的資訊，將對應各處理裝置 1 〇 2的要求的調製盤或是基板等’從貯藏庫1 1 〇 1取出朝 目的處理裝置搬送。然而在此，讀取裝置1 2 0 1是配置於 突起載置台l〇〇la、1001b、1001c的上方’但是各配置在 貯藏庫1 1 0 1的基板保管室1 1 〇 1 e內也可以。且，進行供 使用無線通訊用1C記憶體（無線IC標簽）用的資訊的管 理的話，一次進行複數調製盤或是基板等的資訊通訊是可 能的，可以將貯藏庫1 1 〇 1內的調製盤或基板等的資訊即 時地管理。 且，含於移載裝置的貯藏庫的數量雖是以一台說明， -22- 200521055 (20) 但是複數設置也可以。 (本實施例的效果） 說明如上，依據本實施例，因爲在隧道內將基板等由 單片搬送，所以基板等的周邊環境可高精度淸淨化，其結 果基板處理精度會提高。因爲讓介面裝置可以適合各式各 樣的處理裝置地汎用化，所以不需要分別配合處理裝置準 備多種的介面裝置，系統整體可以削減設備費。且，藉由 將介面裝置配置於隧道的下方，對於基板搬入口的高度不 同的各式各樣的處理裝置，只要改變介面裝置的設置位置 就可對應，進一步系統的汎用化可達成。且，因爲使作爲 搬送通路的隧道及介面裝置的基板受收由突起機構實現， 所以只要改變突起的行程，就可將基板對於由設置成任一 高度的介面裝置送出，更可以達成汎用化。且，藉由在突 起機構組裝裂痕定向配合功能就可達成裝置的小型化。 且’因爲在介面裝置可具備真空對應的室，所以不需要另 外設置氣壓切換用的氣壓切換裝置，可有効使用設備設置 面積’設備費用的大幅的削減成爲可能。 且’因爲是在1個隧道內使複數基板搬送車多重行走 的結構，所以各基板搬送車是可朝雙方向獨立行走，因爲 進行超越等也可以，所以可無停滯地進行基板的搬送。 <第2實施例> 接著’對於本發明的第2實施例的介面裝置使用第 -23- 200521055 (21) 1 3圖〜第1 8圖說明。本實施例的介面裝置，是在其室 1 3 0 2內部具有機械手臂的點是與上述第1實施例不同。 對於其他的結構，是因爲與上述第1實施例同樣，在此對 於相同結構是附加相同符號省略說明。 第13圖〜第18圖，是本實施例的介面裝置103的室 1302的內部的樣子的圖，第13圖〜第18圖的a是室 1 3 02內部的平面圖，b是室1 3 02內部的前視圖。且，第 1 3圖的c是室1 3 0 2內部的左側視圖。然而，爲了說明容 易，對於這些的圖的室1 3 0 2的壁面部分是由剖面所顯 示。在室1302內部，是設置2個機械手臂1303、1304, 藉由設置於室1 3 02的底部的臂台1 3 0 5可轉動地被支撐。 機械手臂1303、1 3 04，是各別具有載置基板的手臂 1 3 0 3 a、1 3 04a。手臂1 3 0 3 a、1 3 04a，是相似於基板搬送車 的托盤202a，具有叉狀的先端部，其開口部的間隔，是 比突起桿601a的外徑寬。 手臂1 3 03 a、1 3 04a，是分別可轉動地與第1腕部 1 3 0 3 b、1 3 04b的一端連接，第1腕部1 3 03 b、1 3 04b的他 端，是可轉動地與第 2腕部1 3 0 3 c、1 3 04c連接。進一 步，第2腕部1 3 0 3 c、1 3 04c的他端是可轉動地與臂台 1 3 0 5連接。且，如第1 3的c圖所示，在第1腕部1 3 0 3 b 及1 3 0 3 c的連接部分，因爲設置圓筒狀的隔片1303d，第 1腕部1 3 0 3 b及第1腕部1304b，其高度相異，因此，手 臂1 3 0 3 a及手臂1 3 04a，不會相互碰撞可朝水平方向自由 移動。 -24- 200521055 (22) 第13圖，是顯示機械手臂1 3 0 3及機械手臂1 3 04 一 起待機於基本位置的狀態。在此基本位置中那些的手臂 1303a、1304a，是因爲位置在水平方向同一的位置，所以 在第1 3圖的a中，只有顯示上側的手臂1 3 0 3 a。 第14圖，是顯示本實施例的介面裝置103是從收取 隧道1 〇 1收取基板S的狀態的圖。從行走於隧道1 〇 1的基 板搬送車202收取基板，載置於手臂1303a的爲止的處 理，是與上述第1實施例幾乎同樣。即，載置基板S的基 板搬送車202，是沿著軌道201行走，停止於介面裝置 103的上部。接著，隧道101下部的檔板2〇4及介面上部 的閘門閥5 0 2打開，基板昇降元件6 01動作，突起桿 601a上昇使基板搬送車2 02的托盤202a上的基板S突 起。 基板S的突起完成的話，使突起桿601a通過托盤 202a的間隔G地移動基板搬送車202。基板搬送車202是 從基板收受位置完全退避的話，基板昇降元件6 〇 1會動 作，突起桿601a是載置著基板s下降。且，與此同時， 驅動機械手臂1 3 0 3的各關節，使突起桿6 0 1 a插入設置於 手臂1 j 0 ：> a的先觸的叉狀的開口部地移動手臂1 3 〇 3 a。 一方面’載置基板S的突起桿601a，是當基板S到 達手臂1 3 0 3 a之前一旦停止，在其位置旋轉基板s進行裂 痕定向（orientation fracture)配合。裂痕定向配合終了 的話’進一步下降突起桿6 0 1 a，如第1 4圖所示，將基板 S載置在手臂1 3 03 a上。而且，關閉隧道〗〇丨下部的檔板 -25- 200521055 (23) 2 04及介面上部的閘門閥5 02。之後，使介面裝置103的 內部氣壓與處理裝置1 02的氣壓一致。 接著，打開處理裝置1 02側的閘門閥5 03，如第1 5 圖所示，使機械手臂1303朝處理裝置102側突出。處理 裝置102，是收取載置於機械手臂1 3 0 3的手臂1 3 0 3 a的 基板S的話，使機械手臂1 3 0 3後退至第1 3圖所示的基本 位置。接著，關閉閘門閥5 03，讓室501內的氣壓回復至 大氣壓。 接著，以與上述說明的程序完全相同的程序再度從基 板搬送車202收取基板S，移行至第14圖的狀態爲止。 接著，從第1 4圖的狀態，使下側的機械手臂1 3 04朝處理 裝置1 02側延伸，移行至第1 6圖的狀態並從處理裝置 1 02收取處理過的基板S 1。在第1 6圖中，載置於上側的 機械手臂1 3 03的未處理的基板是作爲基板S2。 進一步，退避下側的機械手臂1 3 04，並使上側的機 械手臂1 3 0 3朝處理裝置102側延伸地移行至第17圖的狀 態。處理裝置102，是收取被載置於機械手臂1 3 0 3的手 臂1303a的未處理的基板S2的話，如第18圖所示地使機 械手臂1 3 03後退至基本位置爲止，關閉閘門閥5 03讓室 501內的氣壓回復至大氣壓。之後，對於基板搬送車202 發出基板取出要求，使基板搬送車2 02待機於介面裝置 103上方的基板收取位置前方，使檔板204及閘門閥502 打開。 接著，突起桿601a上昇使手臂1 3 04 a上的基板S1突 200521055 (24) 起，進一步上昇停止。而且，使在待機位置待機的基板搬 送車2 02的間隔G通過突起桿601a地移動基板搬送車 202。在該狀態下突起桿601a下降，讓基板S1載置於基 板搬送車202的托盤202a上。突起桿601a下降完成後， 基板搬送車202是將基板S1朝接著的處理裝置搬送，同 時，關閉檔板204、及閘門閥5 02。 之後，再度將機械手臂1 3 04，，回復至如第1 3圖所 示的基本位置，之後，反覆第14圖—第16圖-第17圖 —第 1 8圖—第 1 3圖的一連的狀態變化，使機械手臂 1303、1304、突起桿601a、基板搬送車202、檔板204、 閘門閥5 0 2、5 0 3、泵8 0 1等動作。 如以上，因爲藉由使用2段的機械手臂，使朝處理裝 置102的未處理基板的搬入及從處理裝置102的處理過基 板的搬出可以同時進行，所以與將處理過的基板放置於基 板搬送車後，搬入接著的未處理的基板的情況相比，基板 的處理可以更高速進行。 本實施例的變形例如第1 9圖所示。第1 9圖，是與第 13圖同樣的介面裝置1〇3的室1 902的內部的樣子的圖， 第19圖的a是室1902內部的平面圖，b是室1902內部 的前視圖，第1 3圖c是室1 902內部的左側視圖。然而， 爲了說明容易，對於這些的圖的室1 9 0 2的壁面部分是由 剖面顯示。 在室1902內部中，是設置具備2個滑動臂1903a、 1 9 0 3 b的滑動元件1 903。且，滑動元件1 9 0 3，是包含滑 -27- 200521055 (25) 動台1 903 c及滑件驅動1 903 d，藉由來自滑件驅動1 903 d 的動力，使安裝於滑動台 1903c的滑動臂 1903a、 1 9 0 3 b，是朝箭頭方向水平往復移動。 滑動臂1 903 a、1 903 b，是與上述的機械手臂同樣， 具有叉狀的先端部，其開口部的間隔，是比突起桿60 1 a 的外徑寬。且，滑動臂1903a、1903b，是可與滑動於滑 動台1 9 0 3 c的兩側面連接，如第1 9圖的c所示，藉由使 高度不同地分別由不同形狀的腕所支撐。因此，滑動臂 1 9 03 a及滑動的臂1 903 b，是成爲不會相互碰撞地朝水平 方向自由滑動可能。第19圖，是顯示滑動臂1 903 a及滑 動臂1 90 3 b —起待機於基本位置的狀態。在此基本位置 中，滑動臂1 9 0 3 a、1 9 0 3 b的先端，是朝與第1實施例同 樣的處理裝置102逆的方向退避並使載置於基板的突起桿 6 〇 1 a，成爲可以上下自由的狀態。 即使這種第1 9圖的介面裝置1 03，藉由進行與使用 第1 3圖〜第1 8圖的說明處理同樣的處理，一邊由一方的 滑動臂將處理過的基板搬出，一邊由他方的滑動臂搬入未 處理的基板，對於處理裝置1 〇2，也可與上述同樣達成基 板處理速度的提局。 且，進一步，在第19圖所示的滑動臂1 903 a、1 90 3 b 組入多階段滑動機構也可以。該情況，因爲滑動臂不只是 滑動，且可伸縮自如，所以使介面裝置1〇3在如第19圖 的寬方向的小型化成爲可能。 200521055 (26) <第3實施例> 接著，對於本發明的第3實施例的隧道1 0 1 20圖A、第20圖B說明。本實施例的隧道1〇1， 讀取隨附於基板的資訊用的讀取裝置將點是與上述 施例不同。其他的結構及動作，因爲是與上述第1 同樣’所以對於相同結構是附加相同符號省略其說 第20圖A、第20圖B，是只有顯示抽出隧道 內部結構的槪略結構圖，該當於第2圖A的隧道 在此，第20圖A，是將讀取裝置20〇1設在隧道1 棚部分，第20圖B，是將讀取裝置2002設在隧道 側壁。讀取裝置200 1、2002，是讀取被記錄於被 基板S上的資訊用的讀取裝置，例如，在基板S上 碼的情況中，是條碼讀取裝置即可。 且’在基板S埋入或是隨附無線通訊用1C (無線1C標簽），或是隨附ID標簽的情況中，是 從其無線通訊用1C記憶體（無線IC標簽）或ID 訊的資料用的收訊裝置即可。進一步，讀取裝置 2 0 0 2 ’是讀取記錄於基板s的表面的文字的文字認 器也可以。在此’無線通訊用1C記憶體（無線 簽）’是使進行資料的送收訊用的天線具備於超 1C晶圓的記憶機器，藉由從讀取裝置發訊的預定 的電波進行動作資料的送收訊。 然而，在此’說明從IC標簽或ID標簽讀取資 取裝置是設置於隧道的情況，此讀取裝置，是對於 使用第 是具有 第1實 實施例 明。 101的 部分。 〇 1的頂 101的 搬送的 印刷條 記億體 供收訊 標簽發 200卜 識檢測 1C標 小型的 的頻率 料的讀 隨附於 -29- 200521055 (27) S板的1C標簽等具有資料寫入功能也可以。 該情況’在基板中，例如，記錄在那的處理裝置的處 理是終了等’以其處理資訊基礎進行反饋控制或是前饋控 制來搬送基板，進一步基板搬送控制容易。進一步，可取 代_h述的讀取裝置而設置可對於隨附於基板IC標簽等寫 入資料的寫入裝置也可以。且，在此，雖說明使用從基板 以非接觸讀寫資料的裝置，但是當然可取代其而使用接觸 式的讀取或是寫入裝置也可以。 <第4實施例> 接著，對於本發明的第4實施例的隧道ίο〗使用第 2 1圖的說明。本實施例的隧道1 0 1，其進行自己循環型的 空氣淸潔的點是更上述第1實施例不同。其他的結構及動 作’因爲是與作爲上述第1實施例同樣，對於相同結構是 附加相同符號省略其說明。 第21圖，是顯示險道101及介面裝置1〇3的內部的 槪略圖。如圖，在本系統1 0 0中，在空氣排出元件3 0 4是 組入泵功能。而且從空氣排出元件3 〇 4排出的空氣，是透 過配管2101再度送出至淸淨兀件3〇1。由此，可實現自 己循環型的空氣淸潔，與沿著隧道1 0 1舖設配管的情況相 比的話，因爲整體的設備可簡略化，險道1 〇 1的各元件的 獨立性增加，所以維修也容易。 <第5實施例> -30· 200521055 (28) 接著，對於本發明的第5實施例的隧道1 〇 1使用第 22圖A〜第23圖B說明。本實施例的系統1〇〇，是在隧 道內，具有切換搬送路的手段。具體上將隧道101作爲J 元件，其具備具有軌道的切換機構的隧道元件的點是與上 述第1貫施例不同。其他的結構及動作，因爲是與上述第 1實施例同樣，所以對於相同結構是附加相同符號省略其 說明。 第2 2圖A〜第2 2圖E，是供說明軌道的切換動作用 的圖。 首先，將行走於下側的軌道2 0 1 b的基板搬送車 2 2 0 2 a移送至上側的軌道2 0 1 a的情況，如第2 2圖a所 示，內具有軌道切換功能的隧道元件2 2 0 1，使基板搬送 車2202a停止。接著’如第22圖B所示，在隧道元件 2 2 0 1內使軌道朝上方滑動。而且，如第2 2 C圖所示，使 基板搬送車2 2 0 2 a行走。且’將行走於上側的軌道2 〇 1 a 基板搬送車2202b移送至下側的軌道201b的情況時，在 如第2 2圖C的狀態下，使基板搬送車2 2 0 2 b停止於隧道 元件2 2 0 1內，如第2 2 D圖所示，使軌道朝下方滑動後， 如第22E圖所示，使基板搬送車2202b行走。 第23圖A、第23圖B，是隧道元件2201內的軌道 的滑動機構的說明圖。第2 3圖A，是從隧道的長度方向 所見的槪略結構圖，第2 3圖B，是從第2 3圖A的圖中左 側所見的情況的槪略結構圖。在第2 3圖A、第2 3圖B， 軌道201a、20]b，皆是固定於軌道支撐構件2301。軌道 -31 - 200521055 (29) 支撐構件23 0 1，是通過導引構件2 3 02的溝2 3 02 a，固定 於皮帶2303。皮帶2303，是藉由馬達2304成爲往復上下 滑動可能。且，軌道2 0 1 a、2 0 1 b，是在支撐構件2 3 0 1的 兩側，固定於補助支撐構件2 3 0 5 a、2 3 0 5 b。而且，補助 支撐構件 2 3 0 5 a、23 0 5b，是分別沿著補助導引構件 2306a、2306b的溝滑動可能。 在此結構，驅動馬達2 3 04的話，與皮帶23 03 —起使 軌道支撐構件23 0 1上下滑動，軌道201a及軌道2〇 lb， 是保持其間隔地上下滑動。 然而，在此，雖使用馬達2304及皮帶2303用使軌道 對滑動的結構，但是本發明不限定於此，例如，藉由拉線 捲取機構或壓力汽缸等的其他的機構使軌道對滑動也可 以。 (其他的實施例） 在上述貫施例中’雖說明在隨道內設置二條的軌道的 情況，但是隧道內的軌道的條數是不限定於此，3條以上 也可以，1條也可以。 且，隧道內的設計，是不限定於上述第1實施例。例 如，如第2 4圖A所示，不同於行走於上側的軌道2 0 1 a的 基板搬送車2 4 0 1、及行走於下側的軌道2 0 1 b的基板搬送 車4 02的結構也可以。即，將行走於上側的軌道20 1 a的 基板搬送車2 4 0 1的托盤2 4 0 1 a形成L字型，縮小與下側 的基板搬送車2 402的托盤240 2a的距離也可以。如此的 -32- 200521055 (30) 話，可降低隧道的頂棚’整體可使隧道的結構小型化。 且，如第24圖B所示，將軌道201a、201b舖設於隧 道的底部也可以。該情況’行走於軌道2 0 1 a的基板搬送 車2401、及行走於軌道2〇lb的基板搬送車402’爲了使 各托盤是上下隔有間隙地行走’是需要不同結構。如此的 話，與將軌道設置於隧道側壁的情況相比’軌道的彎曲應 力不易發生，可比較地安定讓基板搬送車行走。 且，如第24圖C所示，將軌道201a、201b舖設於隧 道的外部，只有基板搬送車的托盤收容於隧道內部的結構 也可以。如此的話，不會因基板搬送車的行走而使捲上的 灰塵或塵挨附著於基板，使基板的行走環境可非常淸淨。 其他，如第24圖D所示，將軌道201a舖設於隧道側壁， 或將軌道201b舖設於隧道底部也可以。然而，在此，雖 將空氣淸淨元件設置隧道頂棚部，但是設置於任一的隧道 側壁也可以。 在上述實施例中，雖說明滑動元件是在室內將基板只 朝水平方向移動的結構，但是本案發明不限定於此。例 如，進一步具備由機械手臂或滑動元件使基板垂直方向移 動的昇降機構也可以。該情況，可配合複數種類的處理裝 置的基板搬入口使基板垂直方向移動。且，待機於處理裝 置的收受位置的處理裝置雖是進行基板的收受，但是將基 板送至處理裝置的無圖示載置台也可以。 在上述實施例中，在介面裝置內，搬送基板至處理裝 置的臂，雖是在先端具備U字型的叉狀手臂，但是本發 -33- 200521055 (31) 明不限定於此。例如，如第2 5圖A〜第2 5圖C所示的各 式各樣的手臂是適用可能。即，第2 5圖A，是先端外周 爲圓形的C字型的手臂，第25圖B，是具有突起桿插入 孔的〇字型的手臂，第2 5圖C，是顯示朝向處理裝置橫 方向在開口的Π字型的手臂。且，可裝卸這些的手臂部 分，可以依據於處理裝置的種類進行替換也可以。 且，在隧道的兩側配置處理裝置的情況，是在介面裝 置的兩側面設置開口部，對於兩側的處理裝置使1個搬送 手段移動可能的結構也可以。特別是使用機械手臂將基板 搬送至兩側的處理裝置的結構的話，進一步，設備設置空 間的有効活用也可能。 然而，在上述實施例中，雖說明從供電元件2 03供給 電力至基板搬送車202，由基板搬送車202內的馬達在軌 道上將進行搬送的結構，但是本發明是不限定於此。由空 氣或磁性使基板搬送車浮上、搬送的結構也包含於本發 明。 依據本發明，可以提供對應各式各樣的處理裝置的自 由度高且汎用性佳的基板搬送系統的本發明是不制限於上 述實施例，未脫離本發明的精神及範圍的各式各樣的變更 及變形是可能的。因此，爲了明確本發明的範圍，添付以 下的申請專利範圍。 【圖式簡單說明】 添付圖面是包含說明書，構成其一部分，顯示本發明 -34- 200521055 (32) 的實施例，與其記載同時說明本發明的原理。 第1圖A，是本發明的第1實施例的基板搬送系統的 外觀的立體圖。 第1圖B，是本發明的第1實施例的介面裝置的配置 的圖。 第2圖A及第2圖B，是本發明的第1實施例的隧道 及介面裝置的內部結構的圖。 第3圖A及第3圖B，是本發明的第1實施例的隧道 及介面裝置之間的連接部分的圖。 第3圖C，是本發明的第1實施例的隧道的內部結構 的立體圖。 第4圖A及第4圖B，是本發明的第1實施例的基板 搬送車的結構的圖。 第5圖，是本發明的第1實施例的基板搬送裝置的基 板的收受動作的說明圖。 第6圖，是本發明的第1實施例的基板搬送裝置的基 板的收受動作的說明圖。 第7圖A及第7圖B，是本發明在有關介面裝置的其 他的例的圖。 第8圖A，是對於本發明的第1實施例的基板搬送系 統的整體地的設計說明用的圖。 第8圖B ’是對於本發明的第丨實施例的基板搬送系 統的整體地的設計說明用的圖。 第9圖A乃至第9圖E，是本發明的第1實施例的隧 - 35- 200521055 (33) 道及處理裝置的各式各樣的設計圖案的圖。 第1 0圖，是不具有基板將貯藏功能的移載裝置的內 部結構的俯視圖。 第1 1圖A，是具有基板將貯藏功能的移載裝置的內 部結構的俯視圖。 第1 1圖B，是具有基板將貯藏功能的移載裝置的內 部結構的側剖面圖。 第1 1圖C及第1 1圖D，是具有基板將貯藏功能的移 載裝置的其他的例的圖。 第1 2圖 A，是具備讀取裝置的移載裝置的內部結構 的俯視圖。 第12圖B，是具備讀取裝置的移載裝置的內部結構 的側剖面圖。 第1 3圖，是說明本發明的第2實施例的介面裝置的 結構及動作用的圖。 第1 4圖，是說明本發明的第2實施例的介面裝置的 結構及動作用的圖。 第1 5圖，是說明本發明的第2實施例的介面裝置的 結構及動作用的圖。 第1 6圖，是說明本發明的第2實施例的介面裝置的 結構及動作用的圖。 第1 7圖，是說明本發明的第2實施例的介面裝置的 結構及動作用的圖。 桌1 8圖，是說明本發明的第2實施例的介面裝置的 -36- 200521055 (34) 結構及動作用的圖。 第1 9圖，是本發明的第2實施例的介面裝置的變形 例的圖。 第20圖A及第20圖B’是本發明的第3實施例的隧 道的內部結構的槪略圖。 第2 1圖，是本發明的第4實施例的隧道及介面裝置 的內部結構的槪略圖。 第22圖A乃至第22圖E，是說明本發明的第5實施 例的隧道的軌道的切換動作用的圖。 第23圖A及第23圖B’是說明本發明的第5實施例 的隧道的軌道的滑動機構的圖。 第24圖A乃至第24圖D，是本發明的其他的實施例 的隧道內的設計的圖。 第25圖A乃至第25圖C，是本發明的其他的實施例 的臂的先端形狀例的圖。 [主要元件符號說明] G間隔 S基板 S 1基板 S2基板 1 0 0基板搬送系統 1 0 1隧道 101a 、 l〇lb 窗 -37- 200521055 (35) 1 0 2處理裝置 1 0 2 a基板受渡部 1 03介面裝置 1 0 4連通部 201軌道 201a、 201b、 201c 軌道 202基板搬送車 202a托盤 修 202b 推車 203 供電元件 204檔板 2 1 1 挾持口 2 1 2 栗兀件 2 1 3 驅動元件 2 1 3 a 馬達 213b、213c 齒輪 φ 2 1 3 d驅動滾子 2 1 4控制元件 215 導引滾子 2 1 6導引滾子 3 0 1淸淨元件 3 02配管 3 0 3排氣導管 3〇4空氣排出元件 -38- 200521055 (36) 3 17 溝 401 滑動元件 4 0 1a 滑動臂 40 1 b 滑動台 401c 滑件驅動 402 基板搬送車 501 室 501a 開口部 501b 開口部 5 02、 5 03閘門閥 601 基板昇降元件 601a 突提高桿 70 1 遮蔽壁 7 01a 、7 0 1 b 凸壁 80 1 低真空泵 802 高真空泵 90 1 主搬送路 902 副搬送路 902a ' 902b副搬送路 903 移載至裝置 904 容器倉庫 905 副搬送路 906 處理裝置群 907 容器收容裝置 200521055 (37) 1001突提高載置台 1 0 0 1 a、1 0 0 1 b、1 0 01 c 突提高載置台 1 002移載至機械手臂 1 1 0 1貯藏庫 1 1 0 1 a 門 1 1 0 1 b淸淨元件 I 1 0 1 c貯藏庫旋轉裝置200521055 (1) 发明. Description of the invention [Technical field to which the invention belongs] The present invention is a substrate transfer system for transferring a substrate to a processing apparatus. [Prior Art] Conventionally, a substrate transfer system for transferring a substrate to a processing apparatus is known. In particular, a system in which a plurality of substrates are housed in a cassette called a FOUP and is transported by a cassette unit is known (for example, refer to Japanese Patent Application Laid-Open No. 2000 1 · 07 6 9 98). However, in a conventional system in which a plurality of substrates are transported together in a cassette unit, the risk of an accident during transportation is increased when the size of the substrate is large. Moreover, there is a problem that the scale of the system is large and it is not suitable for multi-variety and small-volume production. In addition, in the case where a substrate is transferred by a processing device that requires a modulation disc, it is known that the scale of the entire system is larger because it is different from the modulation disc transfer path and the substrate transfer path. And 'on the one hand, for the system transported by the cassette unit, because the storage of the caliper is completely fixed or has only a simple operation, there are many functions required for the transfer means for transferring the cassette to the storage. As a result, the transfer method is very large. The present invention has been made to solve the problems of the conventional technology, and an object thereof is to provide a substrate transfer system capable of reducing the system scale. 200521055 (2) [Summary of the Invention] In order to achieve the above object, the system of the present invention is characterized by including a tunnel for transporting a substrate and a modulation disc between a plurality of processing devices for processing the substrate, and a substrate for controlling the substrate in the tunnel. And the control method of the transfer of the modulation disc. Here, it further includes a storage room for storing substrates or modulation discs transported in the tunnel, and the control means also controls: removal of substrates or modulation discs from the storage tank to the tunnel, and from the tunnel toward the foregoing Carry in the substrate or storage tray of the storage. In addition, the storage means for storing the substrate and the modulation disc transported in the tunnel, and the control means also control the removal of the substrate and the modulation disc from the storage repository to the tunnel and the storage pan from the tunnel to the storage repository. Of the substrate and modulation disc. Furthermore, the storage means is provided with an information reading means for reading information attached to the modulation disc or the substrate. In addition, the aforementioned storage includes a mounting table on which a plurality of modulation plates or substrates are mounted, and a rotation and rotation means independently of the mounting table. Furthermore, the storage of the present invention is characterized by including: a mounting table on which a plurality of stages of substrates, modulation discs, or substrate storage cassettes are placed, and a rotating means capable of rotating each stage of the mounting stage. Further, another substrate transfer system according to the present invention is characterized in that it includes a storage room such as item 6 of the scope of patent application, and a substrate or a modulation disk or a substrate storage cassette placed on the mounting table, taken out and It moves on a conveyance path, and the board | substrate or modulation disc or board | substrate storage cassette which conveyed on the conveyance path is mounted on the said transfer stage. 200521055 (3) Other u-characteristics and advantages of the present invention are obvious by referring to the drawings and the following description. # π ^ ～ 、 解 However, the same reference numerals are attached to the drawings with the same or the same structure. [Embodiment] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings. However, the relative arrangement of the constituent elements in this embodiment is not disclosed, and unless specifically disclosed, the scope of the invention is not limited. < First Embodiment > (Structure) FIG. 1A is a schematic diagram showing the design of a part of the substrate transfer system 100 according to the first embodiment of the present invention. In FIG. 1, A ′ 1 〇 1 is a tunnel, and 〇 2 is a processing device for processing substrates ′ 103 is an interface device for receiving and receiving substrates between the tunnel 10 ′ and the processing device 102. The danger track 1 0 1 ′ is designed between a plurality of processing units 102. Moreover, the device 102 handled by the danger channel 101 is not directly connected, and the interface device 103 is located in between. That is, the "tunnel 101 is connected to the interface device 103 for the lower surface" and the interface device 103 is connected to the processing device 102 for the side surface. The danger path 101 'is a structure in which the width of the interface device 103 and the width of the same degree are each elementized' so that each element can be removed for maintenance. The combination of the tunnel 10] and the interface device 103 may be handled as a component. Here, the interface device 1 0 3 ′ is provided for each of the plural processing devices 0 2-6-200521055 (4). Inside the tunnel 101, a transfer mechanism for transferring substrates (wafers) is provided. The substrates transferred to the tunnel are transferred to the interface device 103 and then transferred from the interface device 103 to the processing device 102. . Fig. 1B is a diagram showing the design of the substrate transfer system 100 from another angle. The upper view of FIG. 1B is a view of the substrate transfer system 100 from above, and the lower view of FIG. 1B is a schematic cross-sectional view of the tunnel from the longitudinal direction. For example, etching, polishing, humidification, spattering, CMP (chemical mechanical honing), exposure, and the like are necessary to complete a series of processing devices, such as wafers, along the tunnel. 1 01 Arrangement 'Each processing device 102 needs to consider different heights of the substrate transfer section 102a. Since the height of the tunnel 101 is basically fixed, the length of the communication portion 104 between the tunnel 101 and the interface device 103 is changed according to the processing device 102, and the interface device 103 is set at a height corresponding to the processing device 102. Specifically, the substrate transfer unit 102a is for a relatively low processing device 102, as shown in the lower left of the first figure b. The interface mount® 103 is lowered, and the substrate transfer unit 102a is for comparison. The high processing device 10 2 ′ is provided as shown in the lower right figure of FIG. Therefore, the interface device has a possible configuration corresponding to plural types of processing devices. However, although the substrate transfer is specifically described here, the transfer mechanism of the system 1000 is not limited to ordinary wafers, modulation disks, monitoring wafers, and other types of wafers such as dummy wafers. Mixed transfer is possible. In this case, it is best to have a controller that controls the transfer of substrates and modulation discs in the tunnel 200521055 (5). For example, when the type of wafer to be manufactured is changed or the processing conditions of the wafer are changed, the controller is a predetermined processing device that needs to exchange modulation discs such as exposure. It is placed on the conveyance truck, and its modulation disc is transferred to a predetermined processing device where the modulation disc is required, and the substrate transfer vehicle and the interface device are collectively controlled. Fig. 2A 'is a schematic view of the interior of the display tunnel 101 and the interface device 103. Fig. 2B 'is an external view of the tunnel 101 and the interface device i03 when viewed from the direction of the arrow on the a side of Fig. A. As shown in Fig. 2A, two rails 201a, 201b are arranged in parallel in the vertical direction on the inner side wall of the tunnel 101. These two tracks 20la, 201b can support a plurality of substrate transfer vehicles 202, respectively, and the substrate transfer vehicle 202 is driven by the motor along the track 201a or 201b. As a result, the tunnel 101 is provided with a first conveying path for conveying the board and a second conveying path for conveying the substrate above the first conveying path. The substrate transfer vehicle 202 includes a C-shaped tray 202a on which the substrate S can be placed, and a cart 202b that supports the tray 202a and travels along the rail 201. However, C in FIG. 2A is the rail 2 0 1 An enlarged view of the vicinity of the base. As shown therein, in the inner side surface of the tunnel 101, a power supply element 203 is partially provided. The power supply element 203 is placed at a stop position when the substrate transfer vehicle 202 will remove S @ ^ A or the processing device 102, and the substrate transfer vehicle 202 'is stopped by contacting the power supply element 203. For the substrate- 8- 200521055 (6) The battery shown below in the transport vehicle 2 0 2 supplies power. Furthermore, the motor is driven on a track by using electric power stored in a battery. In addition, in the hidden path 101, a cleaning element 301 equipped with an ultra-low-penetration air (ULPA) filter is provided. The cleaning element 3 0 1 is connected to the piping 3 0 2, and the air flowing from the piping 3 0 2 is purified through the air cleaning filter of the cleaning element 3 0 1 and passes through the tunnel 1 as shown by the arrow. The inside of 〇1 is sent from the exhaust duct 3 0 3 to the air exhaust element 30 4. As shown in Fig. 2B, the piping 302 of this embodiment is connected to the grounds of the respective elements across the tunnel 101. That is, this substrate transfer system 100 is equipped with a large-scale air supply element (not shown), and the pipe 302 is laid along the tunnel 101 from the air supply element, branched on the way, and installed in the tunnel. The net element 3 0 1 of each element is connected. As a result, the inside of the tunnel 101 is filled with clean air at any time, and it is possible to prevent the substrate from being transported due to contact or dust. In addition, the cleaning element 301 is configured to be removed for maintenance. However, although the cleaning element 301 has a ULP A filter, the present invention is not limited to this, and a cleaning filter such as a filter may be provided in accordance with a predetermined cleaning degree HEPA (High Efficiency Particulate Air). On the bottom surface of the tunnel 101, an opening 101a is provided for carrying the substrate out of the interface device 103, for carrying the substrate from the interface device 103. A stopper 204 is provided for opening and closing the opening portion 1 0 1 a. In the communication section 104, when the substrate is transferred between the tunnel 101 and the interface device 103, it is installed to ensure that the substrate is free from dust or dust, etc., and secures the sealing. 9-200521055 (7) is installed There is a shielding wall 70i. The shielding wall 70i may have a buffering function so that the vibration is not transmitted by the tunnel 101 and the interface device 03. In this case, the shielding wall 7 0 1 may be, for example, a bellows member which can be freely expanded and contracted. The shielding wall 701 is not limited to a structure between the communication tunnel ι01 and the interface device 103. For example, as shown in FIG. 3A and FIG. 3B, convex walls 7 are provided at the lower part of the tunnel 101 and the upper part of the interface device 103 to surround the receiving opening of the substrate, respectively, so as not to contact each other.丨 a, 7 〇 丨 b, as a labyrinth structure. At this time, the internal air pressure 'between the tunnel 101 and the interface device 103 is higher than the outside so that the substrate can not be touched or dusty. On the one hand, the 'interface device 103' is disposed below the tunnel, and is arranged at a height corresponding to the substrate receiving opening of the processing device 102. Interface device 1 0 3 'Tools · Chamber · Chamber 5 that can form a starting and closing space, and a slide element 4 0 1 for transporting a substrate in the chamber 5 0 1, and a transport vehicle 2 0 2 from the substrate toward the slide element 4 0 1 The substrate lifting element 6 01 for changing the substrate. In other words, the substrate elevating element 601 has a function of allowing the substrate to be received vertically in the tunnel 101. The chamber 501 has an opening portion 50a and an opening portion 501b on the side of the tunnel 1〇 丨 and the processing side, and the gate valve 502 and 503 as opening and closing doors can be opened and closed freely, respectively. The slide element 401 includes a slide arm 401a, a slide table 4 0 1 b, and a slide drive 4 0 1 c. The slide drive 4 0 1 c is mounted on the slide table by transmitting power to the slide table 401 b. The sliding arm 401a of the 401b is -10- 200521055 in front and rear of the processing device in the direction of 102. As a result, the substrate placed on the slide arm 401a is slid in the left direction in FIG. 2A and is transported into the processing device 102. Fig. 3C is a perspective view showing the inside of the tunnel 101. As shown in Figure 3C, the cleaning element 3 0 1 is removable or repairable. In addition, in the ceiling and side surfaces of the tunnel 101, windows 1 0a and 1 0b with embedded transparent plates are provided, and the appearance inside the tunnel 1 01 is visually confirmed. As a result, the state of the substrate in the tunnel or problems occurring in the tunnel can be discovered instantly. 4A and 4B are schematic structural diagrams showing the internal structure of the substrate transfer vehicle 202. Fig. 4A shows the internal structure of the substrate transfer vehicle 202 as viewed from above. Fig. 4B shows the internal structure of the substrate transfer cart 202 as viewed from the bottom of the figure in Fig. 4A. As shown in Fig. 4A, the tray 202a is C-shaped and has a gap G at a part of the outer periphery. In addition, three gripping ports 2 1 1 for sucking and holding a substrate are provided on the upper surface of the tray 202 a, and these gripping ports 2 1 1 are pump elements 212 connected to all the carts 202 b. The pump element 2 1 2 is driven with the substrate placed on the tray 202a, and the substrate is attracted to the tray 202a by sucking air from the holding port 2 1 1. Furthermore, a groove 3 1 7 for mounting a substrate is provided in the tray 202 a. Here, the groove 3 1 7 is embedded in the substrate and is attracted by the holding opening 2 1 1 so that the substrate does not deviate during transportation. Fall down to fix. In addition, the cart 202b, in addition to the pump element 212, includes: a driving element 2 1 3 that allows the cart 11-200521055 (9) 2 0 2 b to travel, and a control pump element 2 1 2 or a driving element 2 1 3 Of control elements 2 1 4. The driving element 2 1 3 includes a motor 2 1 3 a, gears 213 b and 213 c, and a driving roller 213 d. The rotational force of the motor 213 a is passed through the gears 2 1 3 b and 2 1 3 c. It is transmitted to the driving roller 2 1 3 d, and the driving roller 2 1 3 d slidingly connected to the track 2 0 1 is rotated, so that the cart 2 0 2 b walks on the track 201. The cart 202b includes, in addition to the driving roller 213d, a guide roller 2 1 5 for holding the rail 2 0 1 in the up-down direction, and a rail 20 1 horizontally between the driving rollers 2 1 3 d. Holding guide roller 2 1 6. With these guide rollers, the cart 202b can stably travel on the rail 201. (Substrate receiving operation) The substrate receiving operation will be described using FIGS. 5 and 6. A and e in FIG. 5 show the positions of the substrate transfer vehicle 202 in the tunnel 101, and show the ceiling portion passing through the tunnel 101 from above the tunnel. B in FIG. 5 and b and f in FIG. 6 are partial appearances showing how the interface device 103 is viewed from the tunnel 101 side. The c, d, f, and g of FIG. 5 and the a, c, d, e, and g of FIG. 6 are the same as those of FIG. 2A, and show the inside of the tunnel and the interface device 103. First, as shown in a of FIG. 5, the “substrate transfer vehicle 2 0 2 on which the substrate S is placed” travels along the track 2 G 1 and stops on the interface device 1 0 3 0 -12- 200521055 (10) Next As shown in b and c of FIG. 5, the baffle plate 2 0 4 at the lower portion of the tunnel 1 ο 1 and the gate valve 5 2 at the upper portion of the interface are open. The support shaft provided on the upper surface of the interface device 103 and the center axis of the disc-shaped gate valve 502 are connected by a wrist. Further, the gate valve 5 2 is moved from the position where the opening portion 50 1 a is closed to the open position by performing the opening operation of the turning wrist with the support shaft as the center. When the gate valve 502 and the baffle plate 204 are opened, as shown by d, the substrate raising and lowering element 601 will move to raise the protrusion lever 601a to allow the substrate S on the tray 202a to protrude. When the protrusion of the substrate S is completed, 'as shown in e, the substrate transport vehicle 2 2 is moved in the direction without a gap G (the lower direction in the figure). That is, the protruding lever 601a moves the substrate transfer cart 202 through the interval G. If the substrate transfer vehicle 2 0 2 is completely retracted from the substrate receiving position, as shown by f, the substrate lifting element 601 will operate, and the protruding lever 601a will be lowered while the substrate S is being placed. Furthermore, as shown in g, once the vicinity of the top plate of the interface device 103 is stopped, the rotation of the protruding rod 601a is performed to perform orientation fracture fitting of the substrate S. Here, the cracks are oriented in such a manner that a cut portion provided on a part of the substrate S is oriented in a predetermined direction. Depending on the type of processing device 102, the substrate may be required to be carried in a specific direction. Therefore, when the substrate is carried into such a processing device 102, the substrate lifting member 601 is a function as a direction adjustment means for adjusting the direction of the substrate. Specifically, a photodetector (not shown) provided on the top surface of the top plate of the interface device 103 detects the cut portion of the substrate S. -13- 200521055 (11) If the crack directional fit is over, lower the protruding rod 6 01 a as shown in Figure 6 and place the substrate on the slide arm. In this state, as shown in b and c, tunnel 1 (200 and the gate valve 502 on the upper surface of the interface device 103 are moved. According to the type of the processing device 102, after confirming that the interface installation valve 502 is completely closed, the pressure reducing interface device 103 is the processing device 1 0. 2 is a kind of treatment performed under a low pressure to reduce the air pressure in the chamber 501. For example, in the case of a device that performs a treatment under a high vacuum, in order to make a high vacuum state, as shown in FIG. 7A, FIG. 7 The 103 shown in B is further connected to the low vacuum pump 801 and the high vacuum pump 802. When a low vacuum is required, the low vacuum pump 8 0 1 can be installed on the interface. If the decompression in the chamber 5 0 1 is completed, As shown in FIG. 6, the gate valve is disposed on the side of the processing side of the interface device and 'actuates the slider drive 4 01 c. As shown in e, the slide arm 401a of 401b is in the state toward the processing device 102 Next, the processing device 102 receives a substrate S with a fork-shaped tip portion of 4 0 1 a. After f and later, the slide arm 4 0 1 a is retracted to the inside of the chamber 501, and is set to zero. Furthermore, the processing device 102 finishes processing the substrate, and the slide arm 4 0 1 a is in a state of f and g to stand by. On the 02 side, the substrate S is placed toward the slide arm 40 丨 a. Then, the state is as shown in d in FIG. 6-b & ca in FIG. The baffle moves to the closed position. Set the gate of 103 gate in chamber 501. In this case, the device 102 is in the room 501, and of course, the interface device is connected to the processing device 103 as shown by d, and the 03 is opened. And mounted on the sliding table 1 to slide. Placed on the slide arm g. If g is returned to the position of d, again, we are in the process of -14-200521055 (12) Fig. 5 f- > Fig. 5 d-5 The order of c is changed in sequence. The sliding arm 401a moves backward, takes the substrate S into the chamber (d in FIG. 6), closes the gate valve 5 0 3, and returns the atmosphere in the chamber 51 to atmospheric pressure (c in FIG. 6). . After that, a substrate removal request is issued for the substrate transfer, and the substrate transfer cart 202 stands by in front of the substrate receiving position above the substrate 103, and the baffle 204 and the shutter are opened (a in FIG. 6). Next, the protrusion lever 60 1 a rises to cause the substrate S on 40 la to protrude, and further rises to a halt. (The substrate transfer cart 202 shown in FIG. 5 is in the standby position. The lever 6 0 1 a moves through the gap G, and The take-up position is on standby (d). The protruding rod 60 1 a is lowered, and the substrate S is transferred to the substrate transfer cart tray 202a. After the protruding rod 601a is lowered, the substrate transfer cart transfers the substrate S to the subsequent processing device, and at the same time, close the position Plate and gate valve 502. (Integral design) Next, the overall design of the substrate transfer system 100 will be described with reference to Figs. A, 8B, and 9A to 9E. Fig. 8A, The substrate transfer system 100 shows the relationship between the main transfer path and the sub transfer path. The substrate transfer system 100 is a tunnel 101 and a sub transfer path 902 101 including the main transfer path 901 and the sub 902, and the main transfer path 901, and is connected by a transfer device 903. The carrier device 903 is a device that transfers the substrates in the tunnel 101 of the main conveyance path 901 to the tunnel 101 of the sub conveyance. The tunnel included in the sub conveyance path 902 is converted into a tunnel 101. The inside air pressure enters 202 Surface device valve 502 slide arm f) 〇 make protrusion 5 2 202 202 Yes 2 04. Use the 8th figure. The tunnel of the transport path will be straight -15- 200521055 (13) and because the end is not accessible, the substrate transferred from the main transport path 901 to the sub transport path 902 is a side reciprocating sub transport path In the tunnel 〇 丨 of 〇2, processing is applied to the processing device 1 〇2. At this time, the processing device 102 is transported from the tunnel 100 to the processing device 102 via the interface device ι03. The substrate that has been processed in the secondary transfer path 9202 is again transferred to the main transfer path 901 and is sent out in the subsequent process. Fig. 8B is a diagram further showing a design example of the entire substrate transfer system. In the system shown in FIG. 8B, there are two main conveyance paths 901, and the main conveyance paths are respectively connected to the auxiliary conveyance paths 902 and 905. At the end of the main transfer path 901, there is a container storage container 904. Container warehouse 9 0 4 ′ 疋: Zhen Dingzang sent the substrate-containing container from the substrate manufacturing factory, and took out the substrates one by one from the container and carried them into the main conveyance path 901. Although the auxiliary conveying path 902 has a straight line design similar to that in FIG. 8A, the auxiliary conveying path 905 has an endless tunnel 1 010, and the substrate is conveyed upward in the auxiliary conveying path 905, so that The same process is continuously repeated. In addition, in the main transport path 901, the transport processing device group 906 whose substrate is directly transported without passing through the sub transport path is directly connected. The substrates transferred and applied by the main transfer path 90 1 are collected in a container storage device 907, each of which is stored in a container in a predetermined number, and transferred to other workshops or post-painting processes. Next, the shape of the tunnel 101 on the transport path and the arrangement of the processing device 102 will be described. 9A to 9E are diagrams showing various design patterns of the tunnel 101 and the processing device 102. Among them, FIG. 9A is a design in which a processing tunnel 丨 02 is arranged on both sides of a tunnel including a straight tunnel -16- 200521055 (14) 1 01. In order to realize this design, the substrate device 103 (not shown here) that is being transferred from the tunnel 101 to the processing device 102 needs to have the ability to transfer substrates to both sides of the tunnel. If it is arranged on both sides in this way, the installation area of the plurality of processing devices is reduced as a whole, the space in the substrate processing plant can be effectively utilized, and the cost of the plant may be reduced. Fig. 9B shows a design in which processing devices 102 are arranged on both sides of the transport path including the ring-shaped tunnel 101. The transport path is partially provided with a transfer device 903. The transfer device 903 is a substrate that can be recovered after a series of processes have been completed and returned to the transfer path or stored in the transfer device 903. Fig. 9C shows a design in which processing devices 102 are arranged on both sides of a transport path including two linear tunnels 101. A part of the conveyance path also has a transfer device 903 here. The transfer device 903 can transfer the substrates that have been processed in one tunnel 1 to the other and return them to the tunnel 101 on the other side. In addition, maintenance of each processing device 102 can be easily performed from the access side held in the tunnel 101. Fig. 9D shows a design in which a processing device 102 is arranged on the sheet side of a transport path including one straight tunnel 101. Fig. 9E is a design for a transport path including a straight tunnel 101, holding the tunnel 101, and disposing the processing device 1 differently from each other. (Structure of Transfer Device) Next, the internal structure of the transfer device 903 shown in Fig. 8A will be described with reference to Figs. 10 to 12B. • 17- 200521055 (15) Figure 10 is a plan view of the internal structure of the transfer device 90 3 without a storage substrate function. This transfer device 903 is a device for transferring the substrate S between the main transfer path 901 and the sub transfer path 902a or the sub transfer path 902b. In FIG. 10, inside the transfer device 903, there are provided continuous rails 201a in the tunnel 101 from the main transfer path 901, and continuous rails 201b, 2o in the tunnel 101 from the secondary transfer paths 902a, 902b. lc. Thus, the transfer device 903 has a structure in which the substrate conveyance vehicle 202 can walk in and out of the tunnel 101 of the conveyance path 901. Further, inside the transfer device 903, there are further provided projection protrusions 100a, 1001b, 1001c and the robot arm 1002, which have the same number as the number of rails. When the substrate transfer cart 202 for transporting each of the rails 201a, 201b, and 201c is stopped at the upper portion of the projection placement tables 1001a, 1001b, and 1001c, the projection placement tables 100a, 1001b, and 1001c are substrates transferred by the substrate transportation cart 202. S protrudes from below. In this state, when the substrate transfer vehicle 202 is retracted, the U-shaped arm of the transfer robot 1 002 is brought under the substrates left on the projection mounting tables 1001a, 1001b, and 1001c, and the projection mounting table is moved. 1001a, 1001b, and 1001c are lowered, so that the substrate is transferred to the transfer robot arm 1 002 °. Furthermore, by rotating the transfer robot arm 1002, the substrate S is transferred to other protruding mounting platforms and further transferred to different orbits. On the substrate transfer cart 202. In order to smoothly carry out such a transfer process, at least two joint parts of the arm of the transfer robot arm 1 002 can move the substrate S very freely. • 18- 200521055 (16) Next, the transfer device 903 having a substrate storage function will be described with reference to FIGS. 11A to 11D and 12A and 12B. FIG. 11A is a plan view of the internal structure of the transfer device 903 having a substrate storage function. FIG. 11B is a side sectional view thereof. This transfer device 903 is a device for storing substrates while transferring substrates between the main transfer path 901 and the sub transfer path 902a or the sub transfer path 902b. As described above, by storing the substrates one by one, the number of substrates to be transported in the sub transport path and the main transport path can be adjusted, and it can be used as a buffer function when the processing load becomes large. As shown in FIG. 11A and FIG. 11B, the transfer device 9 〇3, in addition to the storage 1101, is provided with a transfer manipulator 1 2 0 having two arms 1 102a and 1 102b. 2. The other structures are the same as those of the transfer device 903 shown in FIG. In the case where a transfer device of the storage 1 1 0 1 is provided, the number of transfer processing of the substrate S is increased. Therefore, it is desirable to transfer the robot arm 1 1 02 to include two arms 1 102a and 1 102b. The transfer robot 1 00 2 of the type shown in Fig. 10 of one arm is also possible. However, since the respective arms i102a, 1102b of the transfer robot arm 1102 thus perform the same operations as the arms of the transfer robot arm 1 002 described with reference to Fig. 10, the description is omitted here. Here, the shape of the storage 1 1 01 is an 8-corner column, and the substrate can be inserted from 8 sides to 8 sheds 1 1 0 1 d by rotating the substrate as an arrow. FIG. 11A shows a state in which four of the eight sheds have a storage substrate. When the substrate S is inserted into the shed, the door 1 1 0 1 a is opened as shown in the figure. At the center of the upper surface of the eight sheds, a cleaning element 1 1 0 1 b is provided and blows downward as an arrow. -19- 200521055 (17) Cleaning air. However, the cleaning element is further provided on the upper portion of the transfer device 903. As shown in FIG. 11B, the eight sheds 1 1 0 1 d are formed in such a manner that the plurality of substrate holding chambers 1 1 0 1 e are stacked in a vertical direction. In the lower part of the eight sheds, a storage rotating device 1 1 0 1 c is provided to rotate the entire storage 1 1 0 1 clockwise or counterclockwise. However, in order to transfer the substrates to the substrate holding chambers 110e that are continuous in the vertical direction, it is also possible to move the robot arm n 02 in the vertical direction. In this case, it is also possible to use a mounting table which is not possible to move up and down instead of the protruding mounting table 001. Furthermore, a configuration in which the transfer robot 1102 directly receives the substrate S from the substrate transfer vehicle 202 is also possible. However, in order to directly pick up the substrate S from the substrate transfer cart 202, it is necessary to form the shape of the shape of the pallet that fits the substrate transfer cart 202 with the arms provided at the tips of the arms 1 102a and 110b of the transfer robot arm 1102. However, as shown in FIG. 11B, the main conveyance path 901 and the auxiliary conveyance path 902 'are desirably shifted in the vertical direction without contacting the tracks. Further, the shape of the 'storage' is not limited to an 8-corner column, and a column may be used. In addition, if the transfer robot 1102 has a mechanism that moves up, down, left, and right, it is also possible to use a flat shed that rotates as a storehouse. FIG. 11C 'is a plan view illustrating another example of the storage container]] Ui Figure D is a partial cross-sectional view cut along X-X in Fig. 11c. Fig. 1C 'Fig. 1C' shows an example shown in Fig. 1 DD, in which a plurality of substrate storage rooms Η 〇1 e are formed on a donut-shaped mounting table i 丨 〇1 f, and the mounting table 1 1 〇1 f is The hollow motor is supported by the center section. Thereby, the substrate storage room -20- 200521055 (18) 1 1 0 1 e becomes possible to rotate integrally every step. As a whole, the storeroom i is a multi-layered structure in which these mounting stages 110f and the hollow motor are stacked in a vertical direction. In detail, the hollow motor includes a donut-shaped rotating portion 1 1 〇1 g and a donut-shaped fixed portion 1 1 〇1 h, and the rotating portion 1 1 0 1 9 becomes a fixed portion 1 1 〇 1 h rotation possible. The lower surface of the mounting table 1 1 0 1 f is the upper surface fixed to the rotating portion 1 10 1 g, and the lower surface of the fixed portion 110 lh is the upper surface fixed to the fixing member ii〇ii. In addition, the fixed members 1 1 0 1 i of each stage are connected to each other by a plurality of cylindrical supporting members 1 10 U, and the entire shape becomes a hollow tower. Above the hollow portion located at the center of the storage 1 1 0 1, a cleaning element (not shown) is provided and the cleaning air is blown downward as indicated by an arrow. In this way, since the motors are provided in each stage, the load on each motor can be reduced, and high-speed and high-precision rotation and stopping are possible. In addition, the storage and replacement operations of the modulation discs and substrates in the storage tank 101 can be performed efficiently. In addition, a modulation disk, a substrate, or the like can be stored separately in each stage, which makes it easy to manage those. Furthermore, since the required motion of the robot arm can be reduced, miniaturization of the robot arm is possible, which can further reduce the overall scale of the system. However, the above-mentioned storage is a substrate that can be used instead of a substrate, and a storage tray can also be used. In addition, the substrate and the modulation disc may be stored in the same storage. Furthermore, this storage can also be applied to a system that does not require single-chip transfer. That is, the cassette (for example, FOUP: Front Opening Unified Pod) that stores the substrate may be deformed as it is temporarily stored. If the storage shown in FIG. 11C is used as the storage for the cassette, use -21-200521055 (19). 'Compared with the movement required by the conventional robot arm, the robot arm is smaller, so the robot arm is smaller. It is possible to reduce the size of the entire system. Figs. 12A and 12B are diagrams illustrating a transfer device 903 including a reading device 1201 for reading information on a substrate. The transfer device 903 shown in FIGS. 12A and 12B is a reading device 1 201 for reading information accompanying modulation discs or substrates, and is provided on the protruding mounting tables 1001a and 1b, respectively. 〇〇lb, 1001c above. The other structures are the same as those of the transfer device 903 shown in FIG. 11A and FIG. 11B, and therefore the same components are denoted by the same reference numerals and their descriptions are omitted. The reading device 1 2 0 1 reads the information attached to the modulation disk or the substrate, and sends the storage information of the modulation disk or the substrate stored in the storage warehouse Π 0 1 to the unillustrated information. Information Management Device. Thereby, the number of substrates or modulation disks in the storage bank 1 110 can be managed. Then, according to the information of the information management device, a modulation disk or a substrate corresponding to the request of each processing device 102 is taken out from the storage 1101 and transferred to the destination processing device. However, here, the reading devices 1210 are arranged above the projection mounting tables 100a, 1001b, and 1001c. However, each of the reading devices 1201 may be arranged in the substrate storage room 1 1 〇1 e of the storage 1 1 0 1. . In addition, if information management for the use of 1C memory (wireless IC tag) for wireless communication is performed, it is possible to perform information communication such as a complex modulation disk or a substrate at a time, and the modulation in the storage 1 1 〇1 can be performed. Information such as disks or substrates is managed in real time. In addition, although the number of storage tanks included in the transfer device is described as one unit, -22-200521055 (20), a plurality of storage units may be provided. (Effects of this embodiment) As described above, according to this embodiment, substrates and the like are transported from a single piece in a tunnel, so that the surrounding environment of the substrates and the like can be cleaned with high precision, and as a result, substrate processing accuracy can be improved. Since the interface device can be used in a wide variety of processing devices, there is no need to prepare a variety of interface devices with the processing devices, and the overall system can reduce equipment costs. Moreover, by arranging the interface device under the tunnel, for various processing devices with different heights of the substrate carrying inlet, as long as the position of the interface device is changed, it can correspond, and further generalization of the system can be achieved. In addition, since the substrate receiving and receiving of the tunnel and the interface device as the conveying path is realized by the protrusion mechanism, the substrate can be sent out from the interface device provided at any height as long as the stroke of the protrusion is changed. In addition, the device can be miniaturized by assembling a crack directional fitting function in the protruding mechanism. Furthermore, because the interface device can be provided with a vacuum-compatible chamber, there is no need to install an additional air pressure switching device for air pressure switching, and the equipment installation area can be effectively used. A significant reduction in equipment costs is possible. Furthermore, since a plurality of substrate transport vehicles are configured to walk multiple times in one tunnel, each substrate transport vehicle can independently travel in both directions, and it is also possible to carry out the substrate transportation without stagnation because it can be overridden or the like. < Second embodiment > Next, -23-200521055 (21) 1 to 18 are used for the interface device of the second embodiment of the present invention. The interface device of this embodiment is different from the first embodiment in that the point of having a robot arm inside the chamber 1 3 2 is. The other configurations are the same as the first embodiment described above, and the same configurations are denoted by the same reference numerals and description thereof will be omitted. 13 to 18 are views showing the inside of the chamber 1302 of the interface device 103 of the present embodiment. In FIGS. 13 to 18, a is a plan view of the interior of the chamber 1 3 02, and b is a chamber 1 3 02. Front view of the interior. In addition, c in FIG. 13 is a left side view of the inside of the chamber 1 3 2. However, for ease of explanation, the wall surface portion of the chamber 1 3 2 for these figures is shown by a cross section. Inside the chamber 1302, two robot arms 1303 and 1304 are provided, and are supported rotatably by an armrest 1 3 0 5 provided at the bottom of the chamber 1 3 02. The robotic arms 1303 and 1 3 04 are arms 1 3 0 3 a and 1 3 04 a each having a substrate on which they are placed. The arms 1 3 0 3 a and 1 3 04a are similar to the tray 202a of a substrate transfer vehicle, and have fork-like tip portions, and the interval between the openings is wider than the outer diameter of the protruding rod 601a. The arms 1 3 03 a, 1 3 04a are rotatably connected to one end of the first wrist 1 3 0 3 b, 1 3 04b, and the other ends of the first wrist 1 3 03 b, 1 3 04b are It is rotatably connected to the second wrists 1 3 0 3 c and 1 3 04c. Further, the other ends of the second wrists 1 3 0 3 c and 1 3 04 c are rotatably connected to the arm rest 1 3 0 5. Moreover, as shown in FIG. 13c, the cylindrical portion 1303d is provided at the connection portion of the first wrist portions 1 3 0 3 b and 1 3 0 3 c, and the first wrist portion 1 3 0 3 b and the first wrist portion 1304b have different heights. Therefore, the arms 1 3 0 3 a and the arms 1 3 04 a can move freely in a horizontal direction without colliding with each other. -24- 200521055 (22) Figure 13 shows the state where the robot arm 1 3 0 3 and the robot arm 1 3 04 are waiting in the basic position together. The arms 1303a and 1304a in this basic position are in the same position in the horizontal direction. Therefore, in a of FIG. 13, only the upper arm 1 3 0 3 a is displayed. Fig. 14 is a diagram showing a state in which the interface device 103 of the present embodiment is collecting the substrate S from the collecting tunnel 101. The process of collecting the substrate from the substrate transport vehicle 202 walking in the tunnel 101 and placing it on the arm 1303a is almost the same as that of the first embodiment. That is, the substrate transfer vehicle 202 on which the substrate S is placed travels along the rail 201 and stops at the upper portion of the interface device 103. Next, the baffle plate 204 at the lower portion of the tunnel 101 and the gate valve 502 at the upper portion of the interface surface are opened, the substrate lifting element 601 is actuated, and the protruding lever 601a is raised to raise the substrate S on the tray 202a of the substrate transfer vehicle 202. When the projection of the substrate S is completed, the substrate transfer cart 202 is moved by passing the projection lever 601a through the interval G of the tray 202a. When the substrate transfer vehicle 202 is completely retracted from the substrate receiving position, the substrate lifting element 601 will operate, and the protruding lever 601a will lower the substrate s. At the same time, the joints of the robotic arm 1 3 0 3 are driven, and the protruding rod 6 0 1 a is inserted into the arm 1 j 0 provided at the arm 1 j 0: > a and the arm 1 3 is moved. 3 a. On the one hand, the protruding bar 601a on which the substrate S is placed is once the substrate S has stopped before reaching the arm 1 3 0 3a, the substrate s is rotated at its position to perform orientation fracture cooperation. When the directional mating of the crack is completed, the projection rod 6 0 1 a is further lowered, and as shown in FIG. 14, the substrate S is placed on the arm 1 3 03 a. In addition, close the tunnel. The lower baffle -25- 200521055 (23) 2 04 and the gate valve 502 on the interface. After that, the internal pressure of the interface device 103 is made equal to that of the processing device 102. Next, the gate valve 503 on the processing device 102 side is opened, and as shown in FIG. 15, the robot arm 1303 is protruded toward the processing device 102 side. The processing device 102 receives the substrate S placed on the arm 1 3 0 3 a of the robot arm 1 3 0 3 and moves the robot arm 1 3 3 to the basic position shown in FIG. 13. Next, the gate valve 503 is closed to return the air pressure in the chamber 501 to atmospheric pressure. Next, the substrate S is picked up again from the substrate transfer cart 202 using the procedure exactly the same as the procedure described above, and the process proceeds to the state shown in FIG. 14. Next, from the state shown in FIG. 14, the lower robot arm 1 3 04 is extended toward the processing device 102 side, and it moves to the state shown in FIG. 16 to collect the processed substrate S 1 from the processing device 102. In FIG. 16, the unprocessed substrate placed on the upper robot arm 1 03 is the substrate S2. Further, the robot arm 1 3 04 on the lower side is retracted, and the robot arm 1 3 3 on the upper side is extended toward the processing device 102 to the state shown in FIG. 17. When the processing device 102 receives the unprocessed substrate S2 placed on the arm 1303a of the robot arm 1 3 0 3, as shown in FIG. 18, the robot arm 1 3 03 is retracted to the basic position, and the gate valve 5 is closed. 03 Return the air pressure in the chamber 501 to atmospheric pressure. After that, the substrate transfer cart 202 issues a substrate take-out request, and the substrate transfer cart 202 waits in front of the substrate pickup position above the interface device 103 to open the baffle 204 and the gate valve 502. Next, the protruding lever 601a rises to raise the substrate S1 on the arm 1 3 04 a by 200521055 (24), and stops further rising. Then, the substrate transfer cart 202 is moved by the interval G of the substrate transfer cart 202 waiting in the standby position with the protruding lever 601a. In this state, the protruding lever 601a is lowered, and the substrate S1 is placed on the tray 202a of the substrate transfer cart 202. After the lowering of the protruding lever 601a, the substrate transfer vehicle 202 transfers the substrate S1 to the subsequent processing device, and at the same time, the shutter 204 and the gate valve 502 are closed. After that, return the robotic arm 1 3 04 to the basic position shown in Fig. 13 again. After that, repeat the sequence of Fig. 14-Fig. 16-Fig. 17-Fig. 18-Fig. 13 The state change causes the robotic arms 1303, 1304, the protruding rod 601a, the substrate transfer vehicle 202, the baffle 204, the gate valve 5 0 2, 5 0 3, and the pump 801 to act. As described above, the use of a two-stage robotic arm enables simultaneous loading of unprocessed substrates to and from the processed substrates of the processing device 102, so it is possible to place the processed substrates on the substrate and transfer them. Compared with the case of carrying in the next unprocessed substrate after the vehicle, the processing of the substrate can be performed at a higher speed. A modification of this embodiment is shown in FIG. 19. FIG. 19 is a diagram showing the inside of the chamber 1 902 of the interface device 103 which is the same as that of FIG. 13. FIG. 19 a is a plan view of the interior of the chamber 1902, and b is a front view of the interior of the chamber 1902. FIG. 3 c is a left side view of the interior of the chamber 1 902. However, for ease of explanation, the wall surface portion of the chamber 1902 for these figures is shown in cross section. Inside the chamber 1902, a slide element 1903 having two slide arms 1903a and 1903b is provided. In addition, the sliding element 19 0 3 includes a slide -27- 200521055 (25) moving table 1 903 c and a slide drive 1 903 d, and is mounted on the slide table 1903c by the power from the slide drive 1 903 d. The sliding arms 1903a, 1903b move back and forth horizontally in the direction of the arrow. The slide arms 1 903 a and 1 903 b are similar to the above-mentioned robot arms, and have fork-like tip ends, and the interval between the openings is wider than the outer diameter of the protruding rod 60 1 a. In addition, the sliding arms 1903a and 1903b can be connected to both sides of the sliding table 1903c, as shown in c of FIG. 19, and are supported by wrists having different shapes, respectively, at different heights. Therefore, the sliding arm 1 9 03 a and the sliding arm 1 903 b are free to slide in the horizontal direction without colliding with each other. Fig. 19 shows a state in which the slide arm 1 903 a and the slide arm 1 90 3 b stand by at the basic positions. In this basic position, the tips of the sliding arms 19 0 3 a and 19 0 3 b are retracted toward the processing device 102 in the same direction as in the first embodiment, and the protruding rod 6 placed on the substrate is retracted. a, it can be freely moved up and down. Even with such an interface device 103 of FIG. 19, the same processing as described using FIGS. 13 to 18 is performed, while the processed substrate is carried out by one of the slide arms, and the other The unloaded substrate is carried into the sliding arm of the device, and the substrate processing speed can be improved in the same manner as described above for the processing device 102. Furthermore, a multi-stage sliding mechanism may be incorporated in the sliding arms 1 903 a and 1 90 3 b shown in FIG. 19. In this case, since the sliding arm is not only slidable, but also retractable, it is possible to reduce the size of the interface device 103 in the width direction as shown in FIG. 19. 200521055 (26) < Third embodiment > Next, a tunnel 1 0 1 20 of a third embodiment of the present invention will be described with reference to Figs. A and 20B. In the tunnel 101 of this embodiment, the reading device for reading information attached to the substrate is different from the above-mentioned embodiment. The other structures and operations are the same as the first one above, so the same symbols are attached to the same structures and omitted. Figures 20A and 20B are schematic structural diagrams showing only the internal structure of the extracted tunnel. The tunnel in FIG. 2A is here, and in FIG. 20A, the reading device 2001 is installed in the tunnel 1 shed, and in FIG. 20B, the reading device 2002 is installed on the side wall of the tunnel. The reading devices 200 1 and 2002 are reading devices for reading information recorded on the substrate S. For example, in the case where the substrate S is coded, it may be a bar code reading device. Moreover, in the case where the substrate S is embedded or attached with a 1C for wireless communication (wireless 1C tag) or an ID tag is attached, the data is from the 1C memory (wireless IC tag) or ID signal for wireless communication You can use the receiving device. Further, the reading device 2 0 2 'may be a character reader that reads characters recorded on the surface of the substrate s. Here, the "1C memory (wireless tag) for wireless communication" is a memory device having an antenna for transmitting and receiving data on a super 1C wafer, and operates data by a predetermined radio wave transmitted from a reading device. Send and receive. However, here, a description is given of a case where the reading device from the IC tag or the ID tag is installed in a tunnel, and this reading device has a first embodiment for using the first device. Section 101. 〇1 The top 101 of the printed bar is printed with 100 million for the receiving label and sent 200. The 1C standard small frequency material is read. Attached to -29- 200521055 (27) The 1C label of the S board has data to write. Entry function is also available. In this case, 'in the substrate, for example, the processing of the processing device recorded there is finished, etc.' The substrate is conveyed by feedback control or feedforward control based on its processing information, and further substrate conveyance control is easy. Further, it may be provided in place of the reading device described in _h, and a writing device may be provided for writing data attached to a substrate IC tag or the like. In addition, although a device that reads and writes data from a substrate without contact is described here, it is of course possible to use a contact-type reading or writing device instead. < Fourth embodiment > Next, a description will be given with reference to Fig. 21 for a tunnel of the fourth embodiment of the present invention. The tunnel 101 of this embodiment is different from the first embodiment in that the self-circulating air purging is performed. The other structures and operations are the same as those in the first embodiment described above, and the same components are denoted by the same reference numerals and descriptions thereof will be omitted. Fig. 21 is a schematic view showing the interior of the danger path 101 and the interface device 103. As shown in the figure, in this system 100, the air exhaust element 300 is incorporated into the pump function. The air exhausted from the air exhaust element 304 is again sent to the cleaning element 301 through the pipe 2101. As a result, self-circulating air cleaning can be achieved. Compared with the case where pipes are laid along the tunnel 101, the overall equipment can be simplified, and the independence of each element of the road 101 is increased. Maintenance is also easy. < Fifth Embodiment > -30 · 200521055 (28) Next, the tunnel 1 0 1 of the fifth embodiment of the present invention will be described using FIGS. 22A to 23B. The system 100 of this embodiment has a means for switching the transport path in the tunnel. Specifically, the tunnel 101 is used as the J element, and the point that the tunnel 101 is provided with a tunnel element having a track switching mechanism is different from the first embodiment described above. The other structures and operations are the same as those of the first embodiment described above, and therefore the same components are denoted by the same reference numerals and description thereof will be omitted. 22A to 22E are diagrams for explaining the switching operation of the track. First, when a substrate transfer vehicle 2 2 0 2 a running on the lower track 2 0 1 b is moved to the upper track 2 0 1 a, as shown in FIG. 2 2 a, a tunnel with a track switching function is included therein. The element 2 2 0 1 stops the substrate transfer cart 2202 a. Next, as shown in FIG. 22B, the rail is slid upward in the tunnel element 2 2 0 1. Then, as shown in FIG. 2C, the substrate transfer vehicle 2 2 0 2 a is caused to run. In the case of 'moving the upper track 2 〇1 a substrate transfer vehicle 2202b to the lower track 201b, the substrate transfer vehicle 2 2 0 2 b is stopped in the tunnel as shown in FIG. 2 2C. In the element 2 2 0 1, as shown in FIG. 2 D, the rail is slid downward, and then the substrate transfer vehicle 2202 b is allowed to travel as shown in FIG. 22E. Fig. 23A and Fig. 23B are explanatory diagrams of the slide mechanism of the track in the tunnel element 2201. Fig. 23A is a schematic structural diagram seen from the longitudinal direction of the tunnel, and Fig. 23B is a schematic structural diagram of the case seen from the left side of the diagram in Fig. 23A. In FIGS. 23A and 23B, the rails 201a and 20] b are fixed to the rail support member 2301. Rail -31-200521055 (29) The support member 23 0 1 is fixed to the belt 2303 through the groove 2 3 02 a of the guide member 2 3 02. The belt 2303 is capable of sliding up and down by the motor 2304. The rails 2 0 1 a and 2 0 1 b are fixed to the auxiliary support members 2 3 0 5 a and 2 3 0 5 b on both sides of the support member 2 3 0 1. In addition, the auxiliary support members 2 3 0 5 a and 23 0 5b may slide along the grooves of the auxiliary guide members 2306 a and 2306 b, respectively. In this configuration, when the drive motor 2 3 04 is driven, the rail supporting member 23 01 is slid up and down together with the belt 23 03, and the rail 201 a and the rail 20 lb are slid up and down at an interval. However, although the motor 2304 and the belt 2303 are used to slide the rail pair here, the present invention is not limited to this. For example, the rail pair may be slid by another mechanism such as a wire take-up mechanism or a pressure cylinder. can. (Other Embodiments) In the above-mentioned embodiment, although the description is given of the case where two tracks are installed in the accompanying track, the number of tracks in the tunnel is not limited to this, three or more may be used, and one may be . The design in the tunnel is not limited to the first embodiment. For example, as shown in FIG. 24A, the structure differs from the structure of the substrate transfer vehicle 2 4 0 1 running on the upper track 2 0 1 a and the substrate transfer vehicle 4 02 running on the lower track 2 0 1 b. Yes. That is, the tray 2 4 0 1 a of the substrate transfer vehicle 2 4 0 1 running on the upper rail 20 1 a may be formed in an L shape, and the distance from the tray 240 2a of the substrate transfer vehicle 2 402 on the lower side may be reduced. In this case, -32- 200521055 (30), the ceiling of the tunnel can be lowered as a whole, and the structure of the tunnel can be miniaturized. Furthermore, as shown in FIG. 24B, the rails 201a and 201b may be laid on the bottom of the tunnel. In this case, the substrate transfer vehicle 2401 running on the track 2 0a and the substrate transfer vehicle 402 running on the track 20lb need different structures in order to allow each pallet to travel with a gap between the top and bottom. In this case, compared with the case where the rail is provided on the side wall of the tunnel, the bending stress of the rail is less likely to occur, and the substrate transport vehicle can be relatively stably moved. Furthermore, as shown in Fig. 24C, the rails 201a and 201b may be laid outside the tunnel, and only the pallet of the substrate transfer vehicle may be housed inside the tunnel. In this way, dust or dust on the roll does not adhere to the substrate due to the walking of the substrate transport vehicle, and the running environment of the substrate can be very clean. Alternatively, as shown in FIG. 24D, the rail 201a may be laid on the side wall of the tunnel, or the rail 201b may be laid on the bottom of the tunnel. However, although the air cleaning element is provided in the tunnel ceiling portion here, it may be provided in any one of the tunnel side walls. In the above embodiment, the slide element has been described as a structure in which the substrate is moved only horizontally in the room, but the present invention is not limited to this. For example, it may be further provided with a lifting mechanism that vertically moves the substrate by a robot arm or a sliding element. In this case, the substrate can be moved in the vertical direction in accordance with the substrate transfer openings of a plurality of types of processing apparatuses. In addition, although the processing device waiting at the receiving position of the processing device receives the substrate, the substrate may be transferred to the unillustrated mounting table of the processing device. In the above-mentioned embodiment, although the arm that transports the substrate to the processing device in the interface device is a U-shaped fork-shaped arm at the tip, the present invention is not limited to this. For example, various arms as shown in Figs. 25A to 25C are applicable. That is, Fig. 25A is a C-shaped arm with a rounded tip periphery, Fig. 25B is a 0-shaped arm with a protruding rod insertion hole, and Fig. 25C is a display orientation processing device. Opened Π-shaped arm in the horizontal direction. In addition, these arm portions that can be attached and detached may be replaced depending on the type of the processing device. In addition, when processing devices are arranged on both sides of the tunnel, openings are provided on both sides of the interface device, and a configuration in which one processing means can be moved for the processing devices on both sides may be used. In particular, in the case of a structure that uses a robotic arm to transfer substrates to the processing devices on both sides, further effective utilization of the equipment installation space is possible. However, in the above-mentioned embodiment, although the configuration in which the electric power is supplied from the power supply element 203 to the substrate transfer cart 202 and the motor in the substrate transfer cart 202 is transported on the track is described, the present invention is not limited to this. The present invention also includes a structure in which a substrate transport vehicle is floated and transported by air or magnetism. According to the present invention, the present invention can provide various substrate processing systems with a high degree of freedom and versatility corresponding to various processing apparatuses. The present invention is not limited to the above embodiments, and does not depart from the spirit and scope of the present invention Changes and deformations are possible. Therefore, in order to clarify the scope of the present invention, the following patent application scope is added. [Brief description of the drawings] The supplementary drawing contains a description and forms part of it, showing an embodiment of the present invention -34- 200521055 (32), and describing the principle of the present invention together with its description. Fig. 1A is a perspective view of the appearance of a substrate transfer system according to a first embodiment of the present invention. Fig. 1B is a diagram showing the arrangement of an interface device according to a first embodiment of the present invention. Figures 2A and 2B are diagrams showing the internal structure of the tunnel and interface device according to the first embodiment of the present invention. Figures 3A and 3B are diagrams showing the connection between the tunnel and the interface device according to the first embodiment of the present invention. Fig. 3C is a perspective view of the internal structure of the tunnel according to the first embodiment of the present invention. Fig. 4A and Fig. 4B are diagrams showing the structure of a substrate transfer cart according to the first embodiment of the present invention. Fig. 5 is an explanatory diagram of a receiving operation of a substrate by the substrate transfer apparatus according to the first embodiment of the present invention. Fig. 6 is an explanatory diagram of a receiving operation of a substrate by the substrate transfer apparatus according to the first embodiment of the present invention. 7A and 7B are diagrams showing other examples of the interface device according to the present invention. Fig. 8A is a diagram for explaining the overall design of the substrate transfer system according to the first embodiment of the present invention. Fig. 8B 'is a diagram for explaining the overall design of the substrate transfer system according to the first embodiment of the present invention. 9A to 9E are diagrams showing various design patterns of the tunnel and the processing device of the first embodiment of the present invention. Fig. 10 is a plan view of the internal structure of a transfer device which does not have a storage function for a substrate. Fig. 11A is a plan view of the internal structure of a transfer device having a function of storing a substrate. FIG. 11B is a side cross-sectional view of the internal structure of a transfer device having a function of storing a substrate. 11C and 11D are diagrams showing other examples of a transfer device having a function of storing a substrate. Fig. 12A is a plan view of the internal structure of a transfer device including a reading device. Fig. 12B is a side sectional view of the internal structure of a transfer device including a reading device. Fig. 13 is a diagram for explaining the structure and operation of an interface device according to a second embodiment of the present invention. Fig. 14 is a diagram for explaining the structure and operation of an interface device according to a second embodiment of the present invention. Fig. 15 is a diagram for explaining the structure and operation of an interface device according to a second embodiment of the present invention. Fig. 16 is a diagram for explaining the structure and operation of an interface device according to a second embodiment of the present invention. Fig. 17 is a diagram for explaining the structure and operation of an interface device according to a second embodiment of the present invention. Fig. 18 is a diagram illustrating the structure and operation of an interface device according to a second embodiment of the present invention. Fig. 19 is a diagram showing a modification of the interface device according to the second embodiment of the present invention. Figures 20A and 20B 'are schematic diagrams of the internal structure of a tunnel according to a third embodiment of the present invention. Fig. 21 is a schematic diagram showing the internal structure of a tunnel and an interface device according to a fourth embodiment of the present invention. Figures 22A to 22E are diagrams for explaining the switching operation of the track of the tunnel in the fifth embodiment of the present invention. Figs. 23A and 23B 'are diagrams illustrating a sliding mechanism of a track of a tunnel according to a fifth embodiment of the present invention. Fig. 24A to Fig. 24D are diagrams showing a design in a tunnel according to another embodiment of the present invention. 25A to 25C are diagrams showing examples of the shape of the tip of an arm according to another embodiment of the present invention. [Description of main component symbols] G interval S substrate S 1 substrate S2 substrate 1 0 0 substrate transfer system 1 0 1 tunnel 101a, 10 lb window-37- 200521055 (35) 1 0 2 processing device 1 0 2 a substrate transfer department 1 03 interface device 1 0 4 communication unit 201 rail 201a, 201b, 201c rail 202 substrate transfer car 202a pallet repair 202b cart 203 power supply element 204 baffle 2 1 1 holding port 2 1 2 pump element 2 1 3 drive element 2 1 3 a Motor 213b, 213c Gear φ 2 1 3 d Drive roller 2 1 4 Control element 215 Guide roller 2 1 6 Guide roller 3 0 1 Clean element 3 02 Piping 3 0 3 Exhaust duct 3 4 Air exhaust element-38- 200521055 (36) 3 17 Groove 401 Slide element 4 0 1a Slide arm 40 1 b Slide table 401c Slider drive 402 Substrate transfer vehicle 501 Room 501a Opening part 501b Opening part 5 02, 5 03 Gate valve 601 Substrate lifting element 601a Raising rod 70 1 Shielding wall 7 01a, 7 0 1 b Convex wall 80 1 Low vacuum pump 802 High vacuum pump 90 1 Main conveying path 902 Sub conveying path 902a '902b Sub conveying path 903 Transfer to device 904 container Warehouse 905 Sub-conveyor 906 Processing unit 907 Container storage device 200521055 (37) 1001 Raising the mounting table 1 0 0 1 a, 1 0 0 1 b, 1 0 01 c Raising the mounting table 1 002 Transfer to the robot arm 1 1 0 1 Storage 1 1 0 1 a Door 1 1 0 1 b Net element I 1 0 1 c Storage rotating device
II Old 棚II Old Shed
1 1 〇 1 e基板保管室 1 l〇lf載置台 1 1 〇 1 g旋轉部 1 1 0 1 h 固定部 1 1 0 1 i固定構件 1 l〇lj支撐構件 1102移載機械手臂 1102a、 1102b 臂 1 2 0 1讀取裝置 1 3 02 室 1 3 0 3機械手臂 1303a 、 1304a 手臂 1 3 03 b、1 3 04b 第 1 腕部 1 3 0 3 c、1 3 0 4 c 第 2 腕部 1 3 0 3 d隔片 1 3 04機械手臂 -40- 200521055 (38) 1 3 0 5 臂台 1 902 室 1 9 0 3 滑動元件 1903a、1903b 滑動臂 1 9 0 3 c滑動台 1 9 0 3 d滑件驅動 200 1、2002讀取裝置 2 1 0 1配管 2 2 0 1 隧道元件 2202a基板搬送車 2202b基板搬送車 2 3 0 1軌道支撐構件 2 3 0 1支撐構件 2 3 0 2導引構件 2 3 0 2 a 溝 2 3 0 3 皮帶 2 3 0 4 馬達 2 3 0 5 a、2 3 0 5 b補助支撐構件 2 3 0 6a、23 06b補助導引構件 2 4 0 1基板搬送車 2 4 0 1 a托盤 240 2基板搬送車 2402a托盤1 1 〇1 e substrate storage room 1 lolf mounting table 1 1 〇1 g rotating part 1 1 0 1 h fixed part 1 1 0 1 i fixed member 1 l0lj support member 1102 transfer robot arm 1102a, 1102b arm 1 2 0 1 Reading device 1 3 02 Room 1 3 0 3 Robotic arm 1303a, 1304a Arm 1 3 03 b, 1 3 04b 1st wrist 1 3 0 3 c, 1 3 0 4 c 2nd wrist 1 3 0 3 d Separator 1 3 04 Robotic arm -40- 200521055 (38) 1 3 0 5 Arm platform 1 902 Room 1 9 0 3 Slide element 1903a, 1903b Slide arm 1 9 0 3 c Slide table 1 9 0 3 d slide Drive 200 1, 2002 reading device 2 1 0 1 piping 2 2 0 1 tunnel element 2202a substrate transfer vehicle 2202b substrate transfer vehicle 2 3 0 1 rail support member 2 3 0 1 support member 2 3 0 2 guide member 2 3 0 2 a Ditch 2 3 0 3 Belt 2 3 0 4 Motor 2 3 0 5 a, 2 3 0 5 b Supporting support member 2 3 0 6a, 23 06b Supporting guide member 2 4 0 1 Substrate transfer vehicle 2 4 0 1 a pallet 240 2 substrate transfer cart 2402a pallet