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TW200513131A - Micro single-chip microphone and manufacturing method thereof - Google Patents

Micro single-chip microphone and manufacturing method thereof

Info

Publication number
TW200513131A
TW200513131A TW092126877A TW92126877A TW200513131A TW 200513131 A TW200513131 A TW 200513131A TW 092126877 A TW092126877 A TW 092126877A TW 92126877 A TW92126877 A TW 92126877A TW 200513131 A TW200513131 A TW 200513131A
Authority
TW
Taiwan
Prior art keywords
microphone
chip
micro
base
sensing portion
Prior art date
Application number
TW092126877A
Other languages
Chinese (zh)
Other versions
TWI235010B (en
Inventor
zhao-zhi Zhang
Original Assignee
Taiwan Carol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Carol Electronics Co Ltd filed Critical Taiwan Carol Electronics Co Ltd
Priority to TW92126877A priority Critical patent/TWI235010B/en
Publication of TW200513131A publication Critical patent/TW200513131A/en
Application granted granted Critical
Publication of TWI235010B publication Critical patent/TWI235010B/en

Links

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

The present invention provides a micro single-chip microphone, and a method for producing the micro chip microphone with micro-electro-mechanical technology. The micro single-chip microphone comprises a base electrically connected to a circuit board, and a microphone chip packaged in the base. The microphone chip comprises a substrate connecting to the base, and a sensing portion for sensing sound energy. When sound energy acts on the sensing portion, a membrane of the sensing portion is deformed correspondingly, and a capacitor composed of two separate electrode layers of the sensing portion is changed correspondingly; and an air flow caused by the deformation of membrane freely flows from a clearance between two electrode layers to a space surrounded by the base through a plurality of clearances between separation blocks separating the two electrode layers, so that the micro single-chip microphone has a predetermined frequency response.
TW92126877A 2003-09-29 2003-09-29 Micro-type single-chip microphone and its manufacturing method TWI235010B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92126877A TWI235010B (en) 2003-09-29 2003-09-29 Micro-type single-chip microphone and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92126877A TWI235010B (en) 2003-09-29 2003-09-29 Micro-type single-chip microphone and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200513131A true TW200513131A (en) 2005-04-01
TWI235010B TWI235010B (en) 2005-06-21

Family

ID=36598027

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92126877A TWI235010B (en) 2003-09-29 2003-09-29 Micro-type single-chip microphone and its manufacturing method

Country Status (1)

Country Link
TW (1) TWI235010B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7560857B2 (en) 2006-08-29 2009-07-14 Industrial Technology Research Institute Package structure of MEMS microphone
CN106331965A (en) * 2015-06-30 2017-01-11 意法半导体股份有限公司 MEMS Microphone
CN108933151A (en) * 2018-07-26 2018-12-04 苏州晶方半导体科技股份有限公司 A kind of encapsulating structure and packaging method of image sensing chip

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2481643C (en) 2002-04-15 2012-09-11 Epos Technologies Limited Method and system for obtaining positioning data
KR101309778B1 (en) 2005-03-23 2013-09-23 에포스 디벨롭먼트 리미티드 Method and system for digital pen assembly
TWI293500B (en) 2006-03-03 2008-02-11 Advanced Semiconductor Eng Microelectromechanical microphone packaging system
TWI319690B (en) 2006-09-08 2010-01-11 Ind Tech Res Inst Structure and manufacturing method of inversed microphone module and microphone chip component
EP2271133B1 (en) * 2007-03-14 2014-07-23 QUALCOMM Incorporated Acoustic positioning system with MEMS microphones
GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
GB2453104B (en) * 2007-09-19 2012-04-25 Wolfson Microelectronics Plc Mems device and process
TWI336770B (en) 2007-11-05 2011-02-01 Ind Tech Res Inst Sensor
TWI401774B (en) * 2010-01-18 2013-07-11 南茂科技股份有限公司 Microelectromechanical chip package structure and manufacturing method thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7560857B2 (en) 2006-08-29 2009-07-14 Industrial Technology Research Institute Package structure of MEMS microphone
CN106331965A (en) * 2015-06-30 2017-01-11 意法半导体股份有限公司 MEMS Microphone
US10225635B2 (en) 2015-06-30 2019-03-05 Stmicroelectronics S.R.L. Microelectromechanical microphone
CN106331965B (en) * 2015-06-30 2019-09-13 意法半导体股份有限公司 MEMS Microphone
US11032629B2 (en) 2015-06-30 2021-06-08 Stmicroelectronics S.R.L. Microelectromechanical microphone
US11622183B2 (en) 2015-06-30 2023-04-04 Stmicroelectronics S.R.L. Microelectromechanical microphone
CN108933151A (en) * 2018-07-26 2018-12-04 苏州晶方半导体科技股份有限公司 A kind of encapsulating structure and packaging method of image sensing chip
CN108933151B (en) * 2018-07-26 2024-02-13 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method of image sensing chip

Also Published As

Publication number Publication date
TWI235010B (en) 2005-06-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees