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Priority to TW92124381ApriorityCriticalpatent/TWI220566B/en
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Publication of TW200511540ApublicationCriticalpatent/TW200511540A/en
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Abstract
A flip chip package includes a substrate, a semiconductor chip with a plurality of bumps formed thereon and electrically and mechanically connected to the substrate, and an underfill. The semiconductor chip has two opposing edges. The present invention is characterized by that the bumps are arranged in a trapezoid pattern. Specifically, the trapezoid pattern has one pair of parallel sides that are substantially parallel to the two opposing edges of the semiconductor chip. The bumps are arranged symmetrically with respect to a line through the middle points of the two opposing edges of the semiconductor chip. The present invention further provides a method for producing the flip chip package.
TW92124381A2003-09-032003-09-03Flip chip package and method for producing the same
TWI220566B
(en)
Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
Semiconductor device featured with using micro bumps to connect the first semiconductor chip and the second semiconductor chip when stacking the first semiconductor chip and the second semiconductor chip together