TW200511347A - Chip-like solid electrolytic capacitor - Google Patents
Chip-like solid electrolytic capacitorInfo
- Publication number
- TW200511347A TW200511347A TW093105398A TW93105398A TW200511347A TW 200511347 A TW200511347 A TW 200511347A TW 093105398 A TW093105398 A TW 093105398A TW 93105398 A TW93105398 A TW 93105398A TW 200511347 A TW200511347 A TW 200511347A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- solid electrolytic
- electrolytic capacitor
- anode plate
- portions
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 7
- 239000007787 solid Substances 0.000 title abstract 5
- 239000002184 metal Substances 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
This invention is to provide a chip like solid electrolytic capacitor which has a low ESR and a low initial failure rate and an electronic device using the chip like solid electrolytic capacitor. This capacitor is the chip like solid electrolytic capacitor such that a plurality of solid electrolytic capacitor elements of which the cathode portions are formed by laminating a dielectric oxide film layer, a semiconductor layer, and a conductor layer in order on a remnant surfaces except anode plate portions on one end of the anode plate bases comprising sintered bodies of valve action metal or conductive oxide, or connecting members of the sintered bodies and metal wires, are horizontally parallelly tightly placed and held, and joined so as to contact the anode plate portions or metal wire portions and the cathode portions to the lead frames on points of a pair of lead frames which are opposed to each other, and such that they are then sealed by a resin except external terminals of the lead frames. In the capacitor, the volume ratio of one of sintered bodies except the anode plate portions to the chip volume is constituted to be in 0.042-0.110.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003056237 | 2003-03-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200511347A true TW200511347A (en) | 2005-03-16 |
| TWI327329B TWI327329B (en) | 2010-07-11 |
Family
ID=36689409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093105398A TW200511347A (en) | 2003-03-03 | 2004-03-02 | Chip-like solid electrolytic capacitor |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101052215B1 (en) |
| CN (1) | CN1757083B (en) |
| TW (1) | TW200511347A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100778549B1 (en) * | 2006-10-02 | 2007-11-22 | 주식회사 디지털텍 | Carbonization Method of Aluminum Polymer Capacitor |
| CN101174508B (en) * | 2006-10-31 | 2011-11-23 | Nec东金株式会社 | Lead frame, upside-down mounted terminal solid electrolyte capacitor and its manufacturing method using lead frame |
| JP5330191B2 (en) * | 2009-10-27 | 2013-10-30 | サン電子工業株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| CN104599848A (en) * | 2013-10-30 | 2015-05-06 | 张彩欣 | Hybrid capacitor and manufacturing method thereof |
| CN104599849A (en) * | 2013-10-30 | 2015-05-06 | 张彩欣 | Hybrid capacitor and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW479262B (en) * | 1999-06-09 | 2002-03-11 | Showa Denko Kk | Electrode material for capacitor and capacitor using the same |
-
2004
- 2004-03-02 CN CN2004800058350A patent/CN1757083B/en not_active Expired - Lifetime
- 2004-03-02 TW TW093105398A patent/TW200511347A/en not_active IP Right Cessation
- 2004-03-02 KR KR1020057016249A patent/KR101052215B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| TWI327329B (en) | 2010-07-11 |
| KR20050113628A (en) | 2005-12-02 |
| KR101052215B1 (en) | 2011-07-29 |
| CN1757083B (en) | 2010-06-09 |
| CN1757083A (en) | 2006-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6791822B2 (en) | Solid electrolytic capacitor | |
| TW200503021A (en) | Chip-type solid electrolytic capacitor having a terminal of a unique shape and method of producing the same | |
| KR20080029203A (en) | Tantalum Capacitor | |
| CN103295786B (en) | Solid electrolytic capacitor | |
| US8634180B2 (en) | Multi-layered ceramic capacitor having dual layer-electrode structure | |
| TW200519995A (en) | Solid electrolytic capacitor | |
| KR100706454B1 (en) | Chip type solid electrolyte capacitor and method of manufacturing the same | |
| KR100962926B1 (en) | Solid electrolytic capacitor | |
| US20150077905A1 (en) | Solid electrolytic capacitor | |
| US6785147B2 (en) | Circuit module | |
| JPH0817686A (en) | Structure of packaged solid electrolytic capacitor | |
| US10321571B2 (en) | Composite electronic component and board having the same | |
| TW200511347A (en) | Chip-like solid electrolytic capacitor | |
| KR20170009599A (en) | Composite electronic component and board having the same mounted thereon | |
| JP5571753B2 (en) | Socket and jig for manufacturing capacitor element using the socket | |
| KR101548865B1 (en) | Tantalum capacitor | |
| US20140307365A1 (en) | Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same | |
| KR101983177B1 (en) | Composite electronic component and board having the same mounted thereon | |
| CN105047642B (en) | A port protection circuit integrated package | |
| JP2019075582A (en) | Solid-state electrolytic capacitor | |
| JP4489054B2 (en) | Organic solid electrolytic capacitor | |
| KR101792407B1 (en) | Composite electronic component and board having the same mounted thereon | |
| KR102089698B1 (en) | Tantalum capacitor | |
| JP2009295604A (en) | Solid electrolytic capacitor | |
| CN101740235A (en) | Packaging structure of energy storage element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |