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TW200516347A - Radiation-sensitive resin composition, interlayer insulating film and microlens - Google Patents

Radiation-sensitive resin composition, interlayer insulating film and microlens

Info

Publication number
TW200516347A
TW200516347A TW093132623A TW93132623A TW200516347A TW 200516347 A TW200516347 A TW 200516347A TW 093132623 A TW093132623 A TW 093132623A TW 93132623 A TW93132623 A TW 93132623A TW 200516347 A TW200516347 A TW 200516347A
Authority
TW
Taiwan
Prior art keywords
radiation
insulating film
interlayer insulating
microlens
forming
Prior art date
Application number
TW093132623A
Other languages
Chinese (zh)
Other versions
TWI338190B (en
Inventor
Kimiyasu Sano
Michinori Nishikawa
Takaki Minowa
Eiji Takamoto
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200516347A publication Critical patent/TW200516347A/en
Application granted granted Critical
Publication of TWI338190B publication Critical patent/TWI338190B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)

Abstract

The present invention provides a radiation-sensitive resin composition which is safe for a living body, which has favorable coating property even for a large substrate, high sensitivity, sufficient development margin, high solvent resistance, high heat resistance and high transmittance, and in particular, which is useful for forming an interlayer insulating film and a microlens, and to provide an interlayer insulating film and a microlens formed from the composition, and a method for forming them. The radiation-sensitive resin composition contains (A) an alkali-soluble resin, (B) a radiation-sensitive acid generating agent and (C) an organic solvent represented by 1-methoxy-2-(2-methoxypropoxy)propane, 1-methyl-2-methoxyethyl propionate, 2-n-propoxypropyl acetate or the like. The method for forming an interlayer insulating film and a microlens includes the steps of: (i) forming a coating film of the above composition on a substrate; (ii) exposing to radiation; (iii) developing; and (iv) heating.
TW093132623A 2003-10-28 2004-10-27 Radiation-sensitive resin composition, interlayer insulating film and microlens TW200516347A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003367211A JP4363161B2 (en) 2003-10-28 2003-10-28 Radiation-sensitive resin composition, and method for forming interlayer insulating film and microlens

Publications (2)

Publication Number Publication Date
TW200516347A true TW200516347A (en) 2005-05-16
TWI338190B TWI338190B (en) 2011-03-01

Family

ID=34645279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132623A TW200516347A (en) 2003-10-28 2004-10-27 Radiation-sensitive resin composition, interlayer insulating film and microlens

Country Status (3)

Country Link
JP (1) JP4363161B2 (en)
KR (1) KR101057883B1 (en)
TW (1) TW200516347A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050113351A (en) * 2004-05-27 2005-12-02 주식회사 동진쎄미켐 Photosensitive resin composition
CN1904736B (en) * 2005-07-25 2012-06-13 日产化学工业株式会社 Positive-type photosensitive resin composition and cured film manufactured therefrom
JP4696761B2 (en) * 2005-08-02 2011-06-08 住友化学株式会社 Radiation sensitive resin composition
JP2008105999A (en) 2006-10-25 2008-05-08 Idemitsu Kosan Co Ltd Adamantane derivative, process for producing the same, resin composition and cured product thereof
US8168371B2 (en) 2007-01-22 2012-05-01 Nissan Chemical Industries, Ltd. Positive photosensitive resin composition
JP4905700B2 (en) * 2007-05-16 2012-03-28 Ｊｓｒ株式会社 Radiation-sensitive resin composition, interlayer insulating film, microlens and method for forming them
KR102069746B1 (en) * 2012-11-30 2020-01-23 롬엔드하스전자재료코리아유한회사 Positive-type photosensitive resin composition and cured film prepared therefrom
US20140240645A1 (en) * 2013-02-27 2014-08-28 Samsung Display Co., Ltd. Photosensitive resin composition, display device using the same and method of manufacturing the display device
JP6218393B2 (en) * 2013-02-28 2017-10-25 東京応化工業株式会社 Photosensitive resin composition for interlayer insulation film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919597A (en) * 1997-10-30 1999-07-06 Ibm Corporation Of Armonk Methods for preparing photoresist compositions
JP4524944B2 (en) * 2001-03-28 2010-08-18 Ｊｓｒ株式会社 Radiation sensitive resin composition, its use for forming interlayer insulating film and microlens, and interlayer insulating film and microlens
JP3838626B2 (en) * 2001-09-07 2006-10-25 東京応化工業株式会社 Photosensitive resin composition and pattern forming method using the same

Also Published As

Publication number Publication date
JP2005134440A (en) 2005-05-26
KR101057883B1 (en) 2011-08-19
JP4363161B2 (en) 2009-11-11
TWI338190B (en) 2011-03-01
KR20050040747A (en) 2005-05-03

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Legal Events

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