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TW200514176A - Light-emitting diode chip package and its packaging method - Google Patents

Light-emitting diode chip package and its packaging method

Info

Publication number
TW200514176A
TW200514176A TW093101125A TW93101125A TW200514176A TW 200514176 A TW200514176 A TW 200514176A TW 093101125 A TW093101125 A TW 093101125A TW 93101125 A TW93101125 A TW 93101125A TW 200514176 A TW200514176 A TW 200514176A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
diode chip
bonding pad
chip package
Prior art date
Application number
TW093101125A
Other languages
Chinese (zh)
Other versions
TWI244705B (en
Inventor
Yu-Nung Shen
Original Assignee
Yu-Nung Shen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yu-Nung Shen filed Critical Yu-Nung Shen
Priority to TW93101125A priority Critical patent/TWI244705B/en
Priority to US11/004,910 priority patent/US7339198B2/en
Publication of TW200514176A publication Critical patent/TW200514176A/en
Application granted granted Critical
Publication of TWI244705B publication Critical patent/TWI244705B/en
Priority to US12/007,278 priority patent/US7838895B2/en
Priority to US12/007,285 priority patent/US7943403B2/en
Priority to US12/007,279 priority patent/US7576366B2/en
Priority to US12/007,280 priority patent/US7897984B2/en
Priority to US12/007,276 priority patent/US7989817B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Landscapes

  • Led Device Packages (AREA)

Abstract

A light-emitting diode chip package and its packaging method is provided. The light-emitting diode chip package includes: a light-emitting diode chip having a mounting surface of bonding pad, plural solder pads mounted on the mounting surface of bonding pad and a rear surface opposite to the mounting surface of bonding pad; a reflective coating layer formed on the mounting surface of bonding pad of the light-emitting diode chip, and having an exposing hole of bonding pad for exposing a corresponding bonding pad of the light-emitting diode chip; a light-penetrating element formed on the rear surface of the light-emitting diode chip; and plural conductive bumps, each formed on a corresponding bonding pad of the light-emitting diode chip.
TW93101125A 2003-10-14 2004-01-16 Light-emitting diode chip package body and packaging method thereof TWI244705B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
TW93101125A TWI244705B (en) 2003-10-14 2004-01-16 Light-emitting diode chip package body and packaging method thereof
US11/004,910 US7339198B2 (en) 2004-01-16 2004-12-07 Light-emitting diode chip package body and packaging method thereof
US12/007,278 US7838895B2 (en) 2004-01-16 2008-01-09 Light-emitting diode chip package body and packaging method thereof
US12/007,285 US7943403B2 (en) 2004-01-16 2008-01-09 Light-emitting diode chip package body and packaging method thereof
US12/007,279 US7576366B2 (en) 2004-01-16 2008-01-09 Light-emitting diode chip package body and packaging method thereof
US12/007,280 US7897984B2 (en) 2004-01-16 2008-01-09 Light-emitting diode chip package body and packaging method thereof
US12/007,276 US7989817B2 (en) 2004-01-16 2008-01-09 Light-emitting diode chip package body and packaging method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW92128459 2003-10-14
TW93101125A TWI244705B (en) 2003-10-14 2004-01-16 Light-emitting diode chip package body and packaging method thereof

Publications (2)

Publication Number Publication Date
TW200514176A true TW200514176A (en) 2005-04-16
TWI244705B TWI244705B (en) 2005-12-01

Family

ID=37154868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93101125A TWI244705B (en) 2003-10-14 2004-01-16 Light-emitting diode chip package body and packaging method thereof

Country Status (1)

Country Link
TW (1) TWI244705B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460801B (en) * 2010-10-22 2014-11-11 王琮淇 A wafer-level semiconductor wafer packaging method and a semiconductor wafer package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513041B (en) * 2010-07-30 2015-12-11 Advanced Optoelectronic Tech Light emitting diode package and light emitting diode module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460801B (en) * 2010-10-22 2014-11-11 王琮淇 A wafer-level semiconductor wafer packaging method and a semiconductor wafer package

Also Published As

Publication number Publication date
TWI244705B (en) 2005-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees