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TW200502184A - Scribing method and device for brittle material substrate - Google Patents

Scribing method and device for brittle material substrate

Info

Publication number
TW200502184A
TW200502184A TW093111824A TW93111824A TW200502184A TW 200502184 A TW200502184 A TW 200502184A TW 093111824 A TW093111824 A TW 093111824A TW 93111824 A TW93111824 A TW 93111824A TW 200502184 A TW200502184 A TW 200502184A
Authority
TW
Taiwan
Prior art keywords
material substrate
brittle material
scribe
lines
scribing method
Prior art date
Application number
TW093111824A
Other languages
Chinese (zh)
Other versions
TWI300766B (en
Inventor
Kazuya Maekawa
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200502184A publication Critical patent/TW200502184A/en
Application granted granted Critical
Publication of TWI300766B publication Critical patent/TWI300766B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/17—Hygienic or sanitary devices on telephone equipment
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45C—PURSES; LUGGAGE; HAND CARRIED BAGS
    • A45C13/00—Details; Accessories
    • A45C13/30—Straps; Bands
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Signal Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)

Abstract

This invention is to provide a scribing method and an apparatus for the same, by which scribe-lines crossing mutually are formed without causing a failure at the intersection points. When forming a plurality of scribe-lines on the surface of a brittle material substrate 90 in directions crossing mutually, island-like protective films Q are formed on the intersection points of the scribe-lines to relieve the load stress of a cutter wheel. Next, spot-stroking impacts of a short cycle are given along a first dividing line and a second dividing line of the brittle material substrate 90 by the cutter wheel.
TW093111824A 2003-06-05 2004-04-28 Scribing method and device for brittle material substrate TW200502184A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003160564A JP4256724B2 (en) 2003-06-05 2003-06-05 Method and apparatus for scribing brittle material substrate

Publications (2)

Publication Number Publication Date
TW200502184A true TW200502184A (en) 2005-01-16
TWI300766B TWI300766B (en) 2008-09-11

Family

ID=34053310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111824A TW200502184A (en) 2003-06-05 2004-04-28 Scribing method and device for brittle material substrate

Country Status (4)

Country Link
JP (1) JP4256724B2 (en)
KR (1) KR20040108556A (en)
CN (1) CN100358818C (en)
TW (1) TW200502184A (en)

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JP4323149B2 (en) 2002-09-30 2009-09-02 オリンパス株式会社 Electric bending endoscope
TWI380868B (en) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
KR100863438B1 (en) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 Scribing device using multi-axis synchronous control and its method
JP5173885B2 (en) * 2009-02-24 2013-04-03 三星ダイヤモンド工業株式会社 Scribing apparatus and scribing method
US8289388B2 (en) * 2009-05-14 2012-10-16 Asm Assembly Automation Ltd Alignment method for singulation system
JP5210356B2 (en) * 2010-06-14 2013-06-12 三星ダイヤモンド工業株式会社 Method for scribing a brittle material substrate
KR101247571B1 (en) 2010-06-14 2013-03-26 미쓰보시 다이야몬도 고교 가부시키가이샤 Method for scribing brittle material substrate
TWI408112B (en) * 2010-08-31 2013-09-11 Liefco Optical Inc A Modified Glass Cutting Method for Preset Paths
JP5156080B2 (en) 2010-11-05 2013-03-06 三星ダイヤモンド工業株式会社 Method for scribing bonded substrates
TWI474983B (en) * 2011-10-04 2015-03-01 Mitsuboshi Diamond Ind Co Ltd Scoring Method and Breaking Method of Mother Substrate
JP2013079170A (en) 2011-10-04 2013-05-02 Mitsuboshi Diamond Industrial Co Ltd Scribing method
WO2013094059A1 (en) * 2011-12-22 2013-06-27 三星ダイヤモンド工業株式会社 Method for fracturing brittle material substrate
CN102530841B (en) * 2012-01-17 2014-09-03 西安交通大学 Processing method of high depth-width ratio microstructure of optical glass
JP5639634B2 (en) * 2012-12-11 2014-12-10 三星ダイヤモンド工業株式会社 Substrate cutting system
JP6248401B2 (en) * 2013-03-19 2017-12-20 富士電機株式会社 Semiconductor device manufacturing method and exposure mask used therefor
US10351461B2 (en) * 2014-05-30 2019-07-16 MITSUBOSHI DIAMOND INDUSTRlAL CO., LTD. Method for dividing brittle substrate
JP2016003165A (en) * 2014-06-18 2016-01-12 日本電気硝子株式会社 Production method of glass article, and glass article with film
CN106795035B (en) * 2014-09-25 2019-08-27 三星钻石工业股份有限公司 Breaking methods for brittle substrates
CN104280922B (en) * 2014-10-27 2017-05-03 京东方科技集团股份有限公司 Method and device for cutting glass of liquid crystal display screen
CN107001103B (en) * 2014-11-25 2019-09-27 三星钻石工业股份有限公司 Breaking methods for brittle substrates
JP6563728B2 (en) * 2015-07-29 2019-08-21 株式会社ディスコ Laser processing method
CN105259109B (en) * 2015-10-28 2018-06-22 环维电子(上海)有限公司 Coating adhesion measurement jig
CN108548777B (en) * 2018-04-13 2020-10-20 安徽协诚实业股份有限公司 Automatic hundred check testing arrangement of corrosion-resistant work piece
JP7385908B2 (en) * 2019-10-30 2023-11-24 三星ダイヤモンド工業株式会社 Method for dividing bonded substrates and method for dividing stressed substrates
CN110981175A (en) * 2019-12-27 2020-04-10 黄石瑞视光电技术股份有限公司 Ultrathin ITO glass cutting process of touch screen
JP2021154502A (en) * 2020-03-25 2021-10-07 三星ダイヤモンド工業株式会社 Breaking method of brittle material substrate and substrate processing device
CN114354049B (en) * 2022-03-18 2022-05-20 深圳市三江名创电子科技有限公司 Stress detection device for mobile phone protective film

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124206A (en) * 1983-12-10 1985-07-03 有限会社宝寿窯 Gypsum mold
JPS6270241A (en) * 1985-09-20 1987-03-31 Nikou Kogaku Kk Method of processing piece printed with pattern
JPS63295454A (en) * 1987-05-27 1988-12-01 Mitsuboshi Daiyamondo Kogyo Kk Method for cutting glass
JPS6481335A (en) * 1987-09-24 1989-03-27 Seiko Epson Corp Scribing line for dicing
JP3271691B2 (en) * 1996-02-29 2002-04-02 セイコーインスツルメンツ株式会社 Display device manufacturing method
KR970067832A (en) * 1996-03-12 1997-10-13 김광호 A wafer on which an electrostatic protection metal pattern is formed
JP2000280234A (en) * 1999-01-28 2000-10-10 Canon Inc Substrate cutting method
JP2001058317A (en) * 1999-08-20 2001-03-06 Berudekkusu:Kk Method and apparatus for scribing
DE19955824A1 (en) * 1999-11-20 2001-06-13 Schott Spezialglas Gmbh Method and device for cutting a workpiece made of brittle material
TW536527B (en) * 2000-08-11 2003-06-11 Mitsuboshi Diamond Ind Co Ltd Cutter for cutting brittle material, scriber using the same and scribing method
EP1179512B1 (en) * 2000-08-11 2011-12-28 Mitsuboshi Diamond Industrial Co., Ltd. Cutter wheel, apparatus and method for scribing brittle materials
JP2003002675A (en) * 2001-06-21 2003-01-08 Nakamura Tome Precision Ind Co Ltd Method and apparatus for splitting glass plate
JP2003114420A (en) * 2001-10-03 2003-04-18 Matsushita Electric Ind Co Ltd Liquid crystal display panel manufacturing method

Also Published As

Publication number Publication date
CN100358818C (en) 2008-01-02
JP2004359502A (en) 2004-12-24
JP4256724B2 (en) 2009-04-22
TWI300766B (en) 2008-09-11
CN1572738A (en) 2005-02-02
KR20040108556A (en) 2004-12-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees