200425806 玖、發明說明： · (一） [發明所屬之技術領域] 本發明係有關基板材之藥液處理裝置。亦即，有關使用 於電路用基板之製造工程，對搬送中之基板材噴射藥液以 進行藥液處理之藥液處理裝置。 (二） [先前技術] <技術背景> 隨著電子機器之高性能化、小型輕量化，該電路用之基 板也高精密度化、細微化、極薄化、多樣化等，所形成之 電路之高精密度化與細微化也顯著。而且該種基板之製造 工程中，在各工程中，對於被搬送之基板材分別噴射藥液 ，因此，對基板材進行各種藥液處理與表面處理。 例如，依次噴射顯像液—蝕刻液—剝離液等之藥液，藉 此，依次實施顯像—蝕刻—剝膜等之藥液處理，表面處理 ，以形成電路。又例如，依次進行浸漬於非電解銅鍍液— 顯像液之噴射—電解銅鍍液中浸漬-剝膜等之藥液處理， 表面處理，而形成電路。 而且藉由經過進行該項藥液處理與表面處理之各工程之 製造工程，製造封裝有半導體零件之模組多層基板，以及 其他各種電路用之基板。 在此種基板之製造工程之各工程中，基板材係分別供應 到藥液處理裝置，而以輸送帶邊搬送邊噴射藥液來進行藥 液處理與表面處理。 第5(1)、（2)圖爲供說明該先前例之藥液處理裝置，其中 -6- 200425806 第5(1)圖係利用直輥式輸送帶之例的側面說明圖，第^(2)\ 圖之車輪式輸送帶之例的側面說明圖。 如該等圖式所示，例如顯像工程、蝕刻工程、剝膜工程 等中，在各藥液處理裝置1之處理室中係以輸送帶2將基 板材A —邊以水平姿勢搬送至搬送方向B，一邊對其上面 或下面之外表面（圖示例爲上面）由配設於前後左右之多個 噴嘴3噴射藥液C。然後，進行特定之藥處理與表面處理 而形成電路並製造基板。 此外，在此種藥液處理裝置1中，輸送帶2上典型上係 使用第5(1)圖所示之直輥4與第5(2)圖所示之車輪5。 可是此種先前之藥液處理裝置1被指出有下列的問題。 (第1問題） 第1，在基板材A有發生彎曲、波狀化D、折彎、腰折 、下垂E、鈎住、捲纏、掉落、跳躍等搬送上之問題。 亦即，電路用之基板材A如上述，極薄化與柔性化很顯 著，其絕緣層部分之厚度達1.0mm至60μηι左右，最近更 出現ΙΟμπι左右者。 而且此種極薄化與柔性化進步的基板材Α在藥液處理裝 置1上，在一邊由輸送帶2所搬送，一邊由噴嘴3噴射藥 液C時，由於被噴射之藥液C之噴射壓與重量，發生各種 搬運上之問題。 例如，在直輥4間與車輪5間之前後間隔F中，a.被以 水平姿勢搬送的薄板材A有時發生如圖示之彎曲、波狀化 D、折彎、腰折等，b.有時發生基板材A之前端部或後端部 200425806 對直輥4或車輪5之下垂E。 （ 因而常常發生c ·基板材A鈎住直輥4或車輪5，捲纏吸 附而被捲入，d ·基板材A由直輥4或車輪5掉落，或彈跳 等事故。 先前該種藥液處理裝置1對於基板材A常常發生該項搬 運上之問題及不良事故而成爲產量低落之問題。 (第2問題） 第2 ’針對基板材A有人指出由於上述以致彎曲、液狀 化D等而形成之凹陷中，所噴射之藥液C滯留成爲液窪G 時，或前端部或後端部如上述下垂E，以致妨礙藥液處理 ，表面處理的均勻性之問題。 亦即’電路用基材A雖然如上述高精密度化與細微化， 所形成之電路之高密度化與細微化顯著，惟如上述，若發 生積水G或下垂F時，藥液C噴射之均勻化受阻，視外 表面之位置’即發生處理之快慢、過與不足、參差，以致 損及藥液處理與表面處理之均勻性。 因此，先前的此種藥液處理裝置1中，上述之高精密度 化’細微化’高密度化之實現困難而成爲問題。 (第3問題） 第3，爲解決此種問題，在該種藥液處理裝置1中，先 前也有採用前導板進行，但是麻煩而效率差爲其缺點。 亦即’在搬送之前，分別在各基板材A以膠帶黏貼富於 剛性之硬質前導板，藉由前導板之引導以送基板材A以防 止基板材A之彎曲、液狀化D、折彎、腰折、下垂E、鈎 冬 200425806 住、捲纏、掉落、彈跳、液體滯留G等。 然而，粘貼此種前導板需要以手工作業對各基板材A實 施，既麻煩而效果差而爲人所垢病。 (第4問題） 第4爲噴嘴3之配設位置有侷限於輸送帶2之直輥4或 車輪5之正上面等問題。 亦即，要對極薄化與彈性化皆進步的基板材A噴射藥液 C之噴嘴3之配設位置皆如圖所示被侷限於直輥4或車輪5 之正上面（噴射基板材A上面對）或，正下面（噴射基板材A 下面時）。 若在直輥4或車輪5之前後間隔F之正上面或正下面對 該處搬送中或通過中之基板材A噴射藥液C，極薄而彈性 之基板材A會由於藥液C之噴射壓或重量，1 〇 〇 %當場折彎 ，腰折而掉落。 如上所述，先前那種藥液處理裝置1有噴嘴3之配設位 置受到限制之缺點。 (三）[發明內容] 本發明之基板材之藥液處理裝置有鑑於此種實情而爲解 決上述先前例之課題由發明者銳意硏究努力而成之結果。 而且以在距離輸送帶之輸送面上下方些許之高度位準設 置墊板爲其特徵。亦即，以將墊板在直輥與車輪間之前後 間隔配設成比該等外周頂面僅凹陷於上下些許之高度位準 爲其特徵。 因此，本發明之目的在提供一種基板材之藥液處理裝置 -9- 200425806 ，第1，消除基板材之搬送上之問題，第2，因此，基 >反材' 之藥液處理均勻，第3，而且該等之實現簡單容易，第4 ，可以自由設定噴嘴之配設位置。 用於解決上述課題之本發明之技術手段如下。首先，申 請專利範圍第1項之內容如下。即，該申請專利範圍第1 項之基板材之藥液處理裝置係使用於基板之製造工程，而 對基板材噴射藥液以進行藥液處理。 而且以具有用於搬送該基板材之輸送帶，用於對該基板 材噴射藥液之噴嘴，以及用於保護該基板材而配設於遠離 該輸送帶之搬送面之墊板爲其特徵。 申請專利範圍第2項如下。申請專利範圍第2項之基板 材的藥液處理裝置係在申請專利範圍第1項中，該輸送帶 以水平姿勢搬送該基板材，而該噴嘴係與被搬送之該基板 材相對向，而由上下方向噴射該藥液，且該墊板係配設於 僅離開該輸送帶之搬送面上下方稍許處爲其特徵。 申請專利範圍第3項如下。申請專利範圍第3項之基板 φ 材的藥液處理裝置係在申請專利範圍第2項中，該輸送帶 係將軸朝向左右的寬方向並以排列於前後之搬送方向2許 多搬送用直輥或車輪所構成，該直輥或車輪係配設於該搬 送面上下方而由上下方夾持該基板材並藉由接觸旋轉來搬 送。 該墊板以配設於鄰接於該輸送帶前後之直輥間與車_胃 ，同時配設成比該直輥或車輪之外周頂面至少凹陷於該® 板材之厚度左右之上下向之高度位準爲其特徵。 200425806 申請專利範圍4項以下。申請專利範圍第4項之基k材' 料的藥液處理裝置係在申請專利範圍第3項中，該噴嘴至 少配設於被搬送之基板材之上側並經由配管連接到泵或藥 液槽。 該墊板之等徵爲：配設於該輸送帶之至少下側之直輥間 或車間之前後間隔間，同時其頂面係配設於比下側之直輥 或車輪之外周頂面稍低的位置，至少由下方保持並引導該 基板材。 申請專利範圍第5項如下。申請專利範圍第5項之基板 材的藥液處理裝置係在申請專利範圍第4項中，該墊板之 特徵爲：該基板材之防止吸附用之槽或孔等之凹凸係沿著 前後之搬送方向形成許多。 申請專利範圍第6項如下。申請專利範圍第6項之基板 材的藥液處理裝置係在申請專利範圍第4項中，該墊板之 特徵爲：滑接於該輸送帶之前後之直輥或車輪，同時被定 位保持於該直輥或車輪的軸上。 申請專利範圍第7項如下。申請專利範圍第7項之基板 材的藥液處理裝置係在申請專利範圍第4項中，該墊板之 特徵爲：以多個直輥或車輪爲對象配設於該輸送帶之前後 的搬送方向，而且有多數個經由橋部在搬送方向連結成一 體。 申請專利範圍第8項如下。申請專利範圍第8項之基板 材的藥液處理裝置係在申請專利範圍第5、6或7項中’該 藥液處理裝置係使用於模組基板，玻璃基板以及其他電路 -11- 200425806 用之該基板之製造工程，尤其是該顯像工程、蝕刻工‘程、\ 或剝膜工程。 而且該基板材以富於極薄與柔性，該噴嘴用於對該基板 材噴射顯像液、蝕刻液、或剝離液等之藥液爲特徵。 本發明之構造如上，其功能如下。 ① 本基板材的藥液處理裝置係使用於電路用基板之製造 工程。 ② 而且該藥液處理裝置係在例如顯像工程、蝕刻工程、 或剝膜工程中對極薄而柔軟之基板材嘴射藥液以進行藥液 處理。並且具備輸送帶、噴嘴、墊板等。 ③ 輸送帶係以直輥或車輪所構成，而由上下方夾持基板材 而搬送至水平方向。噴嘴至少配設於被搬送之基板材之上側 ，而對基板材噴射顯像液、蝕刻液、或剝膜液等藥液。 ④ 墊板則配設於僅離開輸送帶之搬送面之上下些許之處 。亦即，墊板係介設於直輥間或車輪間之前後間隔處，同 時配設於比直輥或車輪之外周頂面至少凹陷於基板材之厚 度之上方或下方之高度位準。例如配設於稍低之位置。 ⑤ 因此，基板材被介設於直輥間或車輪間之前後間隔之 墊板所保持與引導，保持水平姿勢而搬送。 ⑥ 因此，利用該藥液處理裝置，可以防止在直輥間或車 輪間之前後間隔中，因爲藥液之噴射壓或重量以致基板材 彎曲、波狀化、折彎、腰折、下垂、捲纏、被捲入、掉落 或彈跳。 另外，雖然墊板的表面只要平滑狀即可，但是如形成槽 -12- 200425806 或孔等之凹凸，則更能確實防止基板材吸附於墊板。1 、 ⑦ 在本藥液處理裝置中，此種基板材可以防止彎曲，波 狀化等並以水平姿勢搬送’所以不致於在凹陷處或殘留藥 液，也不致於下垂。因此基板材可以整面沒有快慢，過與 不足與參差均勻地進行藥液裡。 ⑧ 而且該等優點可藉由配設墊板，而不需手工作業簡單 地達成。 而且墊板藉由滑接於直輥或車輪，同時利用該等之軸穩 定地定位保持，所以構造也簡單。另外，也可以將墊板以 # 多個直輥或車輪爲對象配設於搬運方向，並以橋部連結成 一體，可以簡化其構造。 ⑨ 在直輥間或車輪間之前後間隔中，墊板抗拒藥液之噴 射壓以保持，引導與支撐基板材，所以可以不考慮直輥或 車輪之關係位置自由設定噴嘴之配設位置。 (四）[實施方式] (基板Η之說明） 本藥液處理裝置6係使用於電路J所用基板Η之製造工 · 程中。茲參照第6圖說明基板Η之槪略。 電路J所用之基板Η係廣泛使用於各種電子機器，有單 面基板、雙面基板、多層基板（含最近之積累（build-up)法） 等各種。做爲此種基板Η之一環，也出現將1C、LSI元件 '被動零件、驅動零件、電容器等之半導體零件與電路J 組裝成一體之模組基板（半導體一體型之封裝基板）或，在 玻璃地（glass bare)與電路J 一起埋入半導體零件之玻璃基 板，亦即電漿顯示器PDP用之玻璃基板，或液晶LCD用之 -13- 200425806 玻璃基板，或CSP、PBGA等。當然在本說明書中所謂‘的基\ 板Η除了先前以來之印刷電路板之外也包含此種基板。 此種電路J用之基板Η隨著電子機器之高性能化、高功 能化、在高精密度化、微細化、以及極薄化、柔軟化、甚 至多層化、多樣化等也在進步，形成於外表面，即上面、 表面或下面、裏面之一方或雙方之電路J，甚至形成於內部 之電路J之高密度化，微細化很顯著。 基板Η例如印刷電路板係縱橫由例如5 0 0 m m X 5 0 0 m m左 右所構成。厚度在絕緣層部分由先前之1 . 6mm極薄化至 1.0mm左右，最近由20μιη至ΙΟμηι左右，電路J部分（銅 箔部分）爲75μιη至35μιη，最近極薄化至16μιη至ΙΟμπι左 右。多層基板之情形也是整體厚度極薄化到1 .Omm至 0 · 4 m m左右。電路J之寬或電路J間之間隙（s p a c e)也有細 微化至35μιη至25μηι左右，最近達到1〇μιη左右之傾向。 基板Η之槪要如上述。 (基板Η之製造方法之例） 其次，要邊參照第1圖與第6圖說明使用本藥液處理裝 置6之基板Η之製造方法。首先說明第1例之製造方法。 第1例之製造方法中，基板Η例如印刷電路板是依循下列 步驟製造的。 首先，準備在玻璃布（glasscloth)，陶瓷，或薄膜狀樹脂 製之絕緣層（芯材）之外表面以熱壓接等粘粘銅箔之銅箔疊 層板（copper foil laminate)之基板材A。然後，利用雷射等 實施通孔用之鑽孔加工。 -14- 200425806 通孔（through hole)係由基板材A(基板Η)之兩外表面間 之貫穿孔所構成，在一片上形成極小徑者數百個以上，其 直徑多爲〇.5mm至0.2mm以下。而且通孔係使用於連接兩 外表面之電路J(銅箔）間或多層基板之電路J(銅箔）間之層 間導通，或用於安裝封裝於電路J之零件。 此外，爲替代需要鑽孔加工之通孔（through hole)有人更 開發了形成小凸起，略呈圓錐台狀之接點的凸起（bump)， 藉由該凸起對多層基板等實現與通孔相同功能之技術。而 且凸起係按照電路J，依循顯像工程、蝕刻工程、剝離工程 而製造。 然後，在基板材A之銅范之外表面（上面•表面、下面· 裏面之一方或雙方）塗敷或張貼光敏性抗蝕刻成膜狀然後 ，將電路J之負底片（negative film)之電路照片放在上面曝 光，因此，外表面之光敏性抗鈾劑被曝光而留下硬化之電 路J之形成部分，其他不要部分利用藥液C之顯像液之噴 射溶解去除。 然後，此種基板材A之銅箔留下光敏性抗蝕劑硬化而被 覆蓋之電路J之形成部分，而藉由顯像而溶解去除光敏性 抗蝕劑所露出之不要部分被藥液C之蝕刻液（氯化銅、氯化 鐵、以及其他腐蝕液）之噴射而溶解去除與蝕刻。 然後，剩下的電路J之形成部分的光敏性抗蝕劑被藥液C 之剝離液之噴射而剝膜去除，而以剩下之電路J之形成部 分之銅箔在基板材A之外表面（上面•表面、下面•裏面之 一方或雙方）形成特定之電路J，藉此製造基板Η即印刷電 -15- 200425806 路板。 · 另外，在上述顯像工程、蝕刻工程、與剝膜工程中，爲 各工程之後處理用，或在剝膜工程之後之集中後處理用， 附設有用於噴射水洗液，中和劑液以及其他藥液c之洗淨 液之洗淨工程，藉此以淸洗與去除附著於基板材A外表面 之顯像液、蝕刻液、剝離液等藥液C。此外，有關銅箔雖 然是在張貼光敏性抗蝕劑之前進行表面粗化處理（軟蝕刻） ，惟該表面粗化處理多逐漸以噴射藥液C代替先前之機械 硏磨。 第1例之製造方法是由上述濕法（wet process)來進行。 第1例之製造方法是如上所述。 其次，要就第2例之製造方法加以敘述。基板Η例如印 刷電路板之製造方法雖以上述第1例之濕法爲代表，惟第 2例之半輔助法（semi-additive)也多被採用。 此種半輔助法首先在事先形成通孔之基板材A之外表面 (上面、表面、下面、裏面之一方或雙方）施予非電解銅電 鍍。然後，在該非電解銅電鍍上塗敷或張貼光敏性抗蝕劑 成膜狀後，安放電路J軟片（film)之電路照片曝光。然後， 光敏性抗蝕劑被曝光而留下硬化之部分，而其他部分即電 路J之形成部分被藥液C之顯像液之噴射溶解去除。 然後，對電路J之形成部分，即以顯像將光敏性抗蝕劑 溶解去除之電鍍圖案（pattern)部分，即非電解銅電鍍露出 之部分施予電解銅電銅而形成電路J。 至於殘留的硬化電路J之形成部分以外之光敏性抗蝕劑則 -16- 200425806 被藥液c之剝離液之噴射而剝膜去除，而露出之非電解1銅電* 鍍被藥液C之蝕刻液之噴射而快速蝕刻，並溶解法除。另外 ’依照上述附設洗淨工程做爲各工程之後處理之用。 第2例之半輔助法中，以電解銅電鍍如此形成電路J，藉 以製造基板Η，即印刷電路板。第2例之製造方法如上所 述。 但是，印刷電路板之製造方法與其他電路J用之基板Η 之製造方法最近漸趨多樣化，除了上述第1例、第2例之 外’己開發與使用各種方法。當然本發明也適用於該各種 基板Η之製造方法。 基板Η之製造方法如上所述。 (藥液處理裝置6之槪要） 以下參照第1(1)、（2)圖，第2(1)、（2)圖，第3(1)、（2) 圖’第4(1)、（2)圖等以詳細說明本發明之藥液處理裝置6。 該藥液處理裝置係使用於上述之基板Η之製造工程。並 對搬送之基板材Α噴射藥液C以藥液處理基板材Α。亦即 ’使用於基板Η之製造方法之各工程，例如顯像工程、蝕 刻工程、或剝膜工程等，並對該基板材Α分別噴射顯像液 、蝕刻液、或剝離液等之藥液C以進行藥液處理與表面處 理。 而且該藥液處理裝置6皆相同地在其處理室內具有輸送 帶2、噴嘴3、以及墊板7等。 藥液處理裝置6之槪略如上所述。 (輸送帶2之內容） -17- 200425806 首先敘述藥液處理裝置6之輸送帶2。該輸送帶2係使^ 用軸朝向左右之寬方向K，同時在前後之搬送方向B設置 多列之搬送用直輥4或車輪5所構成，該直輥4或車輪5 係配設於搬送面Μ之上下，並由上下夾持基板材A且藉由 接觸旋轉，以水平姿勢搬送至搬送方向B。 茲對此種輸送帶2進一步說明。首先，在第1(1)、（2)圖 ，第2(1)、（2)圖之例中，圖示著使用直輥4之輸送帶2。 亦即，在該圖示例之輸送帶2上，上下一對相對之長圓 柱狀之直輥4將軸8平行朝向左右之寬方向K，同時，沿 著搬送方向B在前後互相間保持前後間隔F，多根軸平行 排列成一列。而輸送帶2由前工程連續配設於該藥液處理 裝置6以至於後工程。 因此，輸送帶2之下側的各直輥4被旋轉驅動，並藉將 由前工程所供給之基板材A夾持於上側之被動用直輥4之 間’以水平姿勢由上游側搬送至下游側。 相對地，第3(1)、（2)圖，第4(1)、（2)圖之例圖示著使用 車輪5之輸送帶2。 亦即，該圖示例之輸送帶2在左右之寬方向K的軸8分 別保持特定間距間隔設置多列之短柱狀與車輪狀之車輪5 。而且此種附有車輪5之軸8有多根在寬度方向錯開間距 ’同時各車輪5係以前後重疊若干且以稍爲互相嚙合之關 係位置，平行於寬度方向K多數配置於搬送方向。 亦即，相鄰接之各列的軸8之車輪5係設定成前後不重 疊而左右錯開，結果，前後相鄰接的車輪5成爲在其前後 200425806 間隔F之間串設著鄰接的軸8之關係。此外，對於該巢3 圖，第4圖之輸送帶2，其他的構造是依循對第1(1)、（2) 圖，第2(1)、（2)圖之輸送帶2之說明。 輸送帶2之內容如上所述。 (噴嘴之說明） 其次，要就藥液處理裝置6之噴嘴3加以說明。如第1 (1) 、（2)圖所示，噴嘴3位於被搬送之基板材A之對面而由上 下方向L噴射顯像液、蝕刻液、剝離液、以及其他藥液C。 0 茲更詳細說明此種噴嘴3。首先，噴嘴3係使用孔狀者 ，惟也可以使用開縫狀者。 噴嘴3係對向配置於由輸送帶2以水平姿勢搬送之基板 材A之正上方或正下方，並保持若干上下間隔。在第1(1) 圖之例中係僅配設於正上方，在第1(2)圖係配設於正上方 與正下方。任何情形下，至少配設於被搬送之基板材A之 上側。 ， 在被搬送基板材A之正上方或正下方，分別配設於前後 φ 左右之多個噴嘴3分別透過噴液管（spray pipe)等之配管9 連接到泵或藥液槽（未圖示）。 於是藥液C由藥液槽經過泵或配管9供應，壓送至各噴 嘴3之後噴射到基板材A，事後，再被回收到藥液槽以循 環使用。 另外，此種噴嘴3與基板材A之間，即配設有噴嘴3之 區域上方或區域下方，並未介設輸送帶2之直輥4或車輪 -19- 200425806 噴嘴3之構造如上。 (墊板之說明） 其次，要針對該藥液處理裝置6之墊板7加以敘述。墊 板7係配置在前後鄰接之輸送帶2之直輥4之間或車輪5 之間成可拆卸狀態。 因爲墊板7由於上述至少在其上側配設有噴嘴3，因此 在輸送帶2之至少下側之直輥4之間或車輪5之間的各前 後間隔F必定有配設。亦即，位於上側噴嘴3之藥液C之 噴射區對面之下側的前後間隔F介設有墊板7。 此外，如第1 (2)圖所示，在噴嘴3設置於下側之情形下 ，在輸送帶2之上側之直輥4之間或車輪5之間之前後間 隔F，亦即位於下側之噴嘴3之藥液C之噴射區對面之上 側之前後間隔F也介設有墊板7。（在此情形下，墊板7係 位於基板材A之高位而非低位，惟在本說明書中也將其稱 爲墊板7)。 另外，如第1(1)、（2)圖，第3(1)圖，第4(1)圖等所示， 如此配設之各墊板7係沿著上下方向L由輸送帶2之搬送 面Μ上下間隔少許配設。 亦即，墊板7係配設於比直輥4或車輪5之外周頂面1 〇 至少在上方或下方凹陷基板材Α之厚度部分左右之高度位 準。 例如，對於配設於基板材A之下側之墊板7來說，其頂面 配設於比同樣配設於下側之直輥4或車輪5之外周頂面1 〇( 外周上面）稍低的位置，藉此由下面保持並引導基板材A。 -20- 200425806 當然，配設於基板材A上側之墊板7之頂面配設於It商-樣配設於上側之直輥4或車輪5之外周頂面1 0(外周下面） 稍高的位置，藉此由上面保持並引導基板材A。 如第1(1)、（2)圖或第2(1)、（2)圖之例所示，若輸送帶2 係由直輥4構成時，墊板7則沿著左右之寬度方向K形成 長板狀。亦即墊板7應介設於（沿著左右之寬度方向K配設 之）直輥4之間所形成之前後間隔F，且由平面或底面看來 成沿著寬度方向K形成長板狀。 相對地，如第3(1)、（2)圖或第4(1)、（2)圖之例所示，若 輸送帶2係以車輪5構成時，墊板7應分別介設於散佈於 前後左右（搬送方向B或寬度方向K)之各處之車輪之間的 前後間隔F，而由平面或底面看來，略呈正方形而配設成 多個散佈之狀態。 另外，在第1(1)、（2)圖，第2(1)、（2)圖或第3(1)、（2)圖 ，第4(1)、（2)圖之例由正面或背面看來，墊板7附設與突 設有用於滑接於前後之直輥4或車輪5之滑接部1 6。 雖然墊板7接觸基板材A —側之表面爲防止吸附於基板材 A而設成平滑面，惟如進一步將用爲防止基板材A之吸附之 槽或孔等之凹凸1 1沿著後之搬送方向B形成多數更好。 亦即，如第2(1)、（2)圖，第3(2)圖，第4(1)、（2)圖等 所示，若將槽狀之痕線或上下貫穿孔狀之明孔所構成之凹 凸1 1形成於基板材A，即可比僅以平滑面之情形更確實地 防止因藥液C以致基板材A吸附於墊板7。 另外，墊板7滑接於輸送帶2之前後之直輥4或車輪5 200425806 ，同時被定位保持於直輥4與車輪5之軸8。 亦即，墊板7如第1(1)、（2)圖，第3(1)圖’第4(1)圖等 所示，利用其滑接部1 6接觸，滑接於形成前後間隔F之則 後之直輥4或車輪5，即介設該墊板7之前後之兩直輕4 或車輪5之彎曲面，藉以定位保持。 與此同時，墊板7如第以1)、（2)圖’第3(丨）圖’第4〇) 圖等所示，被附設之安裝部1 2夾持直輥4或車輪5之凸起 部等之軸8藉以定位保持。 φ 此外，設置於基板材A上側之墊板7如第1 (2)圖所示’ 安裝部1 2除了夾持軸8，進一步被軸8懸吊保持。 另外，第4(1)、（2)圖所示之墊板7分別被單獨使用’惟 第1(1)、（2)圖，第2(1)、（2)圖’第3(1)、（2)圖等所不之 墊板7是連成兩連，3連多連使用。 亦即，在第 1(1)、 （2)圖，第 2(1)、 （2)圖，第 3(1)、 （2) 圖等所示之墊板7係在輸送帶2之前後之搬送方向B以多 個直輥4或車輪5爲對象配設’多個墊板透過橋部1 3橫跨 鲁 搬送方向B連成一體。 在直輥4的情形下，如第2(1)圖所示，橋部13係沿著被 輥送之基板材A之側方形成。 藉此，形成一體之連結對象之前後墊板7與兩側之橋部 1 3所圍繞之開口部1 4，該開口部1 4有直輥4或車輪5之 外周頂面1 〇等之外周頂部露出。亦即，多個墊板7係以橋 部1 3連接，同時在寬度方向K形成橫長的開口部1 4爲2至3 . 根多個，而形成由該處使直輥4露臉之略呈桌子之形狀。 -22- 200425806 相對地，車輪5之情形是如第3(2)圖所示，墊板/分別 鄰接而散布成棋子狀，因此橋部1 3被形成爲在前後左右連 結該多個墊板7之間的零件。 因此，由各墊板7與橋部1 3所圍繞之開口部1 5形成於 各處，在該開口部1 5成爲車輪5之外周頂面1 0等外周頂 部露出之關係位置。亦即，此時，多片的墊板7 —體集中 於橋部.1 3，許多小的開口部1 5散佈形成爲黑白相間狀， 而形成由該處使車輪分別露臉之略呈桌子之形狀。 墊板7之構造如上述。 (作用等） 本發明之構造如上述，而結果如下。 ① 本基板材A之藥液處理裝置6係使用於基板Η之製造 工程（參照第6圖）。亦即，使用於模組基板，玻璃基板， 以及其他電路J用之基板Η之製造工程。 ② 並且本藥液處理裝置6在例如此種基板Η之製造工程 之顯像工程、蝕刻工程、或剝膜工程中，對極薄且柔軟的 基板材Α噴射藥液C以進行藥液處理，爲形成電路】而進 行表面處理（參照第1(1)、（2)圖）。 而且本藥液處理裝置6具有搬送基板材A之輸送帶2， 將藥液C噴射於基板材A之多個噴嘴3，用於保持與引導 基板材A而配設於離開輸送帶2之搬送面Μ之墊板7。 ③ 本藥液處理裝置6之輸送帶2除了將軸8朝向左右之 寬方向Κ之外，同時由設置多列於前後之搬送方向Β之搬 送用直輕4或車輪5所構成。 -23 - 200425806 該直輥4或車輪5係配設於搬送面Μ之上下方，由’上卞_ 方邊夾持基板材Α邊接觸旋轉，並以水平姿勢搬送（參照第 1 (1)、（ 2)圖）（另外在第3 (1 )圖，第4 (1)圖中，省略上側車 輪5之圖示）。 另外，本藥液處理裝置6之噴嘴3係位於被搬送之基板 材A之對面，而由上下方向L噴嘴藥液C(參照第1(1)、（2) 圖）。 亦即，各噴嘴3係至少配設於被搬送之基板材a之上側 而透過配管9連接到泵或藥液槽，並且基板材a噴射顯像 液、蝕刻液、或剝離液等之藥液C。 ④ 本藥液處理裝置6之墊板7係離開輸送帶2之搬送面 Μ之上下些許之處。 亦即，墊板7係配置於在輸送帶2前後連接處之直輥4 之間或車輪5之間的前後間隔F(參照第1(1)、（2)圖，第 2(1)圖，第3(1)、（2)圖，第4(1)圖等）。同時墊板7係以比 直輥4或車輪5之外周頂面1 0至少在上方或下方凹陷基板 材A之厚度部分左右之高度位準介設（參照第1(1)、（2)圖 ，第3(1)圖，第4(1)圖等）。 另外’因爲噴嘴3至少配設於基板材A之上側，所以墊 板7至少配設於下側之直輥4或車輪5之間的前後間隔f ，而其頂面位於該等外周頂面1 0稍低的位置。 ⑤ 而且，在該藥液處理裝置6中基板材A係由墊板7保 持與引導，保持水平姿勢而搬送（參照第1(1)、（2)圖，第 3(1)圖，第4(1)圖等）。 -24· 200425806 亦即基板材A係用輸送帶2之直輕4或車輪5以水平婆-勢搬送。而且基板材A係以介設於直輥4之間或車輪5之 間之前後間隔F之墊板7，至少由下方保持與引導，甚至 也由上方保持與引導（參照第1(2)圖），而不受被噴射藥液C 之不良影響，繼續維持水平姿勢搬送。 ⑥ 利用本藥液處理裝置6可以防止由於噴嘴3所噴射之 藥液C之噴射壓或重量，在直輥4之間或車輪之間的前後 間隔F處，a.基板材A彎曲、液狀化D、折彎、腰折等（參 照第5(1)、（2)圖之先前例），b.對基板材A之前端部或後端 部之相對應之直輥4或車輪5發生下垂，c .基板材A捲纏 於直輥4或車輪5或吸附而捲入，以及d.基板材A由直輥 4或車輪5掉落或彈跳。 ’ 另外，墊板7之表面形成平滑狀即可，但是若沿著前後 之搬送方向B形成許多凹槽或明孔等之凹凸11即可更確實 防止因藥液C基板材A吸附於墊板7之問題（參照第2(1) 、（2)圖，第 3(2)圖，第 4(1)、（2)圖等）。 ⑦ 在本藥液處理裝置6中，該基板材A係以墊板7保持 與引導，所以可以保持水平姿勢順利搬送。 基板材A之彎曲，波狀化D等之發生得以防止，不致在 因彎曲，波狀化D等而形成之凹部，被噴射之藥液C殘留成 液窪（參照第5(1)、（2)圖先前例），並且可以防止基板材A 之前端部或後端部對相對應之直輥4或車輪5之下垂E。 因此，基板材A可以均勻地噴射以由噴嘴3噴射之藥液C ’整面沒有快慢、過與不足與參差，可均勻地進行藥液處 -25- 200425806 理以及表面處理以供形成電路：ί之用。 - 例如，在蝕刻工程中，經由測試所形成之電路j之蝕刻 偏差値，得到了下列的結果。即，對於縱橫爲5 0 0mmx 5 0 0mm 之基板材A，全面地檢查所形成之寬度或面積爲15μιη之電 路J 1 2 1點之結果，相對於本藥液處理裝置6所獲得之優點 偏差値〇·9，上述第5(1)、（2)圖之藥液處理裝置1之偏差 値爲1 . 6。 ⑧ 本藥液處理裝置6由於在輸送帶2之直輥4之間或車 _ 輪5之間配設墊板7，因此，容易實現上述各點。即不需 要任何手工作業，即可實現上述各點。 而且，墊板7利用本身的重量，以滑接部1 6滑接輸送帶 2之前後之直輥4或車輪5，同時利用直輥4或車輪5之軸 8穩定地定位與保持（參照第1(1)、（2)圖，第3(1)圖，第 4(1)圖等），因此，其構造也簡單而穩定。 也可以將墊板7以多個直輥4或車輪5爲對象配設於輸 送帶之前後之搬送方向B，並藉由靈活運用橋部13俾將成 · 爲2連或3連等多數連之墊板7在搬送方向連接成一體（參 照第2(1)圖，第3(2)圖），由此可見構造上也可以簡化。 ⑨ 另外，在本藥液處理裝置6因爲在輸送帶2之直輥4 之間或車輪5之間的前後間隔F介設有墊板7，所以可以 自由設定噴嘴3之配設位置。200425806 (1) Description of the invention: (1) [Technical field to which the invention belongs] The present invention relates to a chemical liquid processing device for a base plate. That is, regarding a manufacturing process for a circuit board, a chemical liquid processing device that sprays a chemical liquid on a substrate material being transported to process the chemical liquid. (Two) [prior art] < Technical background > As electronic devices have become more high-performance, smaller, and lighter, the substrates for this circuit have become more precise, miniaturized, extremely thin, and diversified, and the resulting circuits have become more precise. And the refinement is also remarkable. Moreover, in this kind of substrate manufacturing process, in each process, the base material to be transported is sprayed with a chemical solution, so various chemical liquid treatments and surface treatments are performed on the base material. For example, a chemical solution such as a developing solution-etching solution-stripping solution is sequentially sprayed, and a chemical solution treatment such as developing-etching-stripping film and the like are sequentially performed to form a circuit. For another example, a chemical solution treatment such as immersion in a non-electrolytic copper plating solution—spraying of a developing solution—immersion in an electrolytic copper plating solution—stripping and peeling film, and then surface treatment are performed to form a circuit. Furthermore, through the manufacturing process of each process of chemical liquid treatment and surface treatment, a multi-layer substrate for a module in which semiconductor parts are packaged, and other substrates for various circuits are manufactured. In each process of the manufacturing process of such a substrate, the base plate is supplied to the chemical liquid processing device, and the chemical liquid is processed and surface-treated by spraying the chemical liquid while being conveyed by a conveyor belt. Figures 5 (1) and (2) are for explaining the chemical liquid processing device of the previous example, of which -6-200425806 Figure 5 (1) is a side explanatory view of an example using a straight-roller conveyor belt. 2) \ Side view of an example of a wheeled conveyor. As shown in these drawings, for example, in a development process, an etching process, a peeling process, etc., in the processing chamber of each chemical liquid processing apparatus 1, the base plate A is conveyed to the conveyance in a horizontal posture by a conveyor belt 2 In the direction B, a plurality of nozzles 3 arranged on the front, back, left, and right are sprayed with the chemical liquid C on the outer surface of the upper or lower side (the upper side in the example of the figure). Then, specific chemical treatment and surface treatment are performed to form a circuit and manufacture a substrate. Further, in this chemical liquid processing apparatus 1, the conveyor belt 2 typically uses straight rollers 4 shown in Fig. 5 (1) and wheels 5 shown in Fig. 5 (2). However, such a conventional chemical liquid processing apparatus 1 has been pointed out as follows. (First problem) First, there are problems in transportation of the base plate A such as bending, corrugation D, bending, waist folding, sagging E, hooking, entanglement, dropping, jumping, and the like. That is, as described above, the base plate A for the circuit is extremely thin and flexible, and the thickness of the insulating layer portion is 1. 0mm to 60μηι, and more recently, about 10μπι. In addition, when the base material A having such an extremely thinner and more flexible substrate is sprayed on the chemical liquid processing device 1 by the conveyor 3 while the chemical liquid C is sprayed from the nozzle 3, the chemical liquid C is sprayed. Pressure and weight cause various transportation problems. For example, in the interval F between the straight rollers 4 and the wheels 5, a. The thin sheet A being transported in a horizontal posture sometimes undergoes bending, corrugation D, bending, waist folding, etc. as shown in the figure, b. Occasionally, the front or rear end of the base plate A 200425806 sagging E against the straight roller 4 or the wheel 5 may occur. (Consequently, c. Base plate A hooks straight roller 4 or wheel 5 and is entangled and sucked. D. Base plate A falls from straight roller 4 or wheel 5, or bounces. Accidents The liquid processing device 1 often suffers from the transportation problem and bad accidents of the base plate A, and becomes a problem of low yield. (Second problem) The second person 'points out that the base plate A is bent, liquefied, etc. due to the above. In the formed depression, when the sprayed chemical solution C stays and becomes the liquid depression G, or the front end or the rear end portion sags as described above, the treatment of the chemical solution and the uniformity of the surface treatment are hindered. Although the substrate A has high precision and miniaturization as described above, the density and miniaturization of the formed circuit is significant. However, as described above, if the stagnant water G or sagging F occurs, the uniformity of the spray of the medicinal solution C is blocked. The position of the outer surface 'is the speed, overshoot, undershoot, and unevenness of the treatment, which may impair the uniformity of the chemical liquid treatment and the surface treatment. Therefore, in the previous such chemical liquid processing device 1, the above-mentioned high precision is achieved' Miniaturization 'and high density (3rd problem) Third, in order to solve such a problem, this type of chemical liquid processing device 1 has previously been performed using a front guide plate, but it is cumbersome and inefficient for its shortcomings. Before transportation, the rigid front guide plates with rigidity are adhered to each base plate A with tape, and the base plate A is guided by the front guide plate to prevent the base plate A from bending, liquefying D, bending, waist folding, Sagging E, Hook winter 200425806 Living, winding, falling, bouncing, liquid retention G, etc. However, pasting this type of front guide requires manual operation on each base plate A, which is cumbersome and has poor results and is contaminated by people. (Fourth problem) The fourth problem is that the arrangement position of the nozzle 3 is limited to the straight roller 4 of the conveyer belt 2 or directly above the wheels 5. That is, the base material must be improved in both extreme thinning and elasticity. The positions of the nozzles 3 for spraying the chemical liquid C are all limited to the upper side of the straight roller 4 or the wheel 5 (the upper side of the spraying base plate A faces) or the lower side (when the lower side of the spraying base plate A is shown). If it is directly above or below the interval F before the straight roller 4 or the wheel 5 Spraying the chemical solution C on the base plate A being transported or passing through it, the extremely thin and elastic base plate A will be bent on the spot due to the spray pressure or weight of the chemical solution C, and will fall down at the waist. As mentioned above, the conventional liquid medicine processing device 1 has the disadvantage that the arrangement position of the nozzles 3 is limited. (3) [Summary of the Invention] The liquid medicine processing device of the base plate of the present invention is to solve the above problems in view of this fact. The problem of the previous example is the result of intensive research by the inventor. It is also characterized by the setting of a shim plate at a certain height level from the conveying surface of the conveyor belt. That is, the shim plate is placed on a straight roller and It is characteristic that the front and back space between the wheels is recessed to a certain height level above and below these outer peripheral top surfaces. Therefore, the object of the present invention is to provide a chemical liquid processing device for base plates-9-200425806, No. 1 To eliminate the problem of the transportation of the base plate, the second, therefore, the treatment of the base liquid of the "anti-material" is uniform, the third, and the realization of these is simple and easy, the fourth, the placement position of the nozzle can be set freely. The technical means of the present invention for solving the above-mentioned problems are as follows. First, the content of the first patent application is as follows. That is, the chemical liquid processing device for the base plate in item 1 of the patent application scope is used in the manufacturing process of the substrate, and the base plate is sprayed with the chemical liquid to perform the chemical liquid treatment. Further, it is characterized by having a conveyor belt for conveying the base plate, a nozzle for spraying a chemical solution to the substrate material, and a pad plate arranged on the conveying surface away from the conveyor belt to protect the base plate. The second item of the scope of patent application is as follows. In the patent application scope item 1, the chemical liquid processing device of the base sheet is in the patent application scope item 1. The conveyor belt transports the base sheet material in a horizontal posture, and the nozzle faces the base sheet material being conveyed, and It is characterized in that the chemical liquid is sprayed from the up and down direction, and the pad is arranged only slightly above and below the conveying surface of the conveyor belt. The third item of patent application scope is as follows. In the patent application scope item 3, the substrate φ material chemical processing device is in the patent application scope item 2. The conveyor belt has the shaft oriented in the wide direction of the left and right and arranged in the forward and backward transport directions. 2 Many straight rollers for transport Or wheels, the straight rollers or wheels are arranged on the conveying surface and below, the base plate is clamped from above and below, and is conveyed by contact rotation. The backing plate is arranged between the straight rollers adjacent to the front and back of the conveyor belt and the car_stomach. At the same time, it is arranged to be recessed at least about the thickness of the ® sheet from the top surface of the straight roller or the outer periphery of the wheel. Level is its characteristic. 200425806 The scope of patent application is less than 4 items. In the patent application scope item 4 of the base material, the chemical liquid processing device is in the patent application scope item 3, the nozzle is arranged at least on the upper side of the base plate being transported and connected to the pump or the medicinal solution tank through a pipe. . The characteristics of the pad are: at least the lower rollers of the conveyor belt or the front and rear compartments of the workshop. At the same time, the top surface is arranged slightly above the outer peripheral top surface of the lower rollers or wheels. The low position holds and guides the base plate at least from below. Item 5 of the scope of patent application is as follows. The liquid medicine processing device of the base plate in the scope of the patent application No. 5 is in the scope of the patent application in the fourth scope. The pad is characterized in that the grooves or holes of the base plate prevent the unevenness along the front and back. There are many transport directions. Item 6 of the scope of patent application is as follows. The chemical liquid processing device for the base plate of the sixth scope of the patent application is in the fourth scope of the patent application. The characteristics of the pad are: straight rollers or wheels slidingly connected to the front and back of the conveyor belt, and simultaneously positioned and maintained at The straight roller or wheel on the shaft. Item 7 of the scope of patent application is as follows. The chemical liquid processing device for the base plate of the seventh scope of the patent application is in the fourth scope of the patent scope. The feature of the pad is that a plurality of straight rollers or wheels are arranged before and after the conveyor. Direction, and many of them are integrated in the conveying direction via the bridge. Item 8 of the scope of patent application is as follows. The chemical liquid processing device of the base plate of the patent application item No. 8 is in the patent application range of the fifth, sixth or seventh item. The chemical liquid treatment device is used for module substrates, glass substrates and other circuits. 11- 200425806 The manufacturing process of the substrate, especially the development process, etching process, or peeling process. The base material is extremely thin and flexible, and the nozzle is used to spray a chemical solution such as a developing solution, an etching solution, or a peeling solution on the substrate material. The structure of the present invention is as above, and its function is as follows. ① The chemical liquid processing device of the base plate is used in the manufacturing process of circuit board. ② In addition, the chemical liquid processing device sprays the chemical liquid on the extremely thin and soft base plate in the imaging process, the etching process, or the peeling process to perform the chemical liquid treatment. In addition, it is equipped with a conveyor belt, a nozzle, a pad, and the like. ③ The conveyor belt is composed of straight rollers or wheels, and the base material is clamped by the upper and lower sides to carry it horizontally. The nozzle is arranged at least on the upper side of the base plate being conveyed, and sprays a chemical liquid such as a developing liquid, an etching liquid, or a peeling liquid on the base plate. ④ The backing plate is arranged only slightly above and below the conveying surface of the conveyor belt. That is, the backing plate is arranged at the front and back space between the straight rollers or the wheels, and at the same time, it is arranged at a level higher than or below the thickness of the base plate than the outer top surface of the straight rollers or wheels. For example, it is arranged at a slightly lower position. ⑤ Therefore, the base plate is held and guided by the backing plate interposed between the straight rollers or the wheels, and transported in a horizontal posture. ⑥ Therefore, by using the chemical liquid processing device, it is possible to prevent the base plate from bending, corrugating, bending, waist-folding, sagging, rolling in the back and forth space between the straight rollers or the wheels. Entangled, entangled, dropped, or bouncing. In addition, although the surface of the backing plate may be smooth, if unevenness such as a groove -12-200425806 or a hole is formed, the base plate can be more reliably prevented from being adsorbed on the backing plate. 1. ⑦ In this medicinal liquid processing device, this kind of base plate can prevent bending, corrugation, etc., and can be transported in a horizontal posture 'so that it will not cause the medicinal solution to remain in the depressions or sag. Therefore, the base plate can be uniformly processed in the liquid without the speed, over, under, and uneven. ⑧ And these advantages can be easily achieved by installing a pad without manual work. In addition, the pad is slidably connected to a straight roller or a wheel, and at the same time, the shaft is stably positioned and held, so the structure is simple. In addition, it is also possible to arrange the shim plate in the conveying direction for a plurality of straight rollers or wheels, and to integrate the bridge portion into one body, which can simplify the structure. ⑨ During the interval between the straight rollers or wheels, the backing plate resists the spray pressure of the chemical liquid to maintain, guide and support the base plate, so the position of the nozzle can be freely set regardless of the position of the straight rollers or wheels. (IV) [Embodiment] (Description of Substrate Η) This chemical liquid processing apparatus 6 is used in the manufacturing process of the substrate Η used in the circuit J. The strategy of the substrate will be described with reference to FIG. 6. The substrates used in Circuit J are widely used in various electronic devices, including single-sided substrates, double-sided substrates, and multilayer substrates (including the recent build-up method). As one of such substrates, there are also module substrates (semiconductor-integrated package substrates) that integrate semiconductor components such as 1C, LSI components, passive components, drive components, capacitors, and circuits J, or glass substrates. Ground (glass bare) is embedded into the glass substrate of the semiconductor part together with the circuit J, that is, the glass substrate for the plasma display PDP, or the -13-200425806 glass substrate for the LCD, or the CSP, PBGA, etc. Of course, the so-called “base board” in this specification includes such a board in addition to the printed circuit board. This type of circuit board for circuit J is also progressing with the increase in the performance and functionality of electronic equipment, as well as high precision, miniaturization, ultra-thinning, softening, and even multilayering and diversification. The circuit J on the outer surface, that is, the top, the surface or the bottom, one or both of the inside, and even the circuit J formed on the inside, has a high density, and the miniaturization is remarkable. The substrate Η, such as a printed circuit board, is composed of, for example, about 500 m m × 50 m m. The thickness in the insulation layer is from the previous one. 6mm extremely thin to 1. About 0mm, recently from about 20 μm to 10 μm, the circuit J part (copper foil part) is 75 μm to 35 μm, and recently extremely thinned to about 16 μm to 10 μm. In the case of a multilayer substrate, the overall thickness is extremely thinned to 1. Omm to about 0 · 4 m m. The width of the circuit J or the gap (s p a c e) between the circuits J also tends to be reduced to about 35 μm to 25 μm, and recently tends to reach about 10 μm. The substrate should be as described above. (Example of a method of manufacturing a substrate Η) Next, a method of manufacturing a substrate 本 using the chemical liquid processing apparatus 6 will be described with reference to Figs. 1 and 6. First, the manufacturing method of the first example will be described. In the manufacturing method of the first example, a substrate, such as a printed circuit board, is manufactured by the following steps. First, prepare a base sheet of a copper foil laminate, such as glass cloth, ceramic, or a thin-film resin-based insulating layer (core material), by thermocompression bonding. A. Then, a laser or the like is used for drilling of the through hole. -14- 200425806 A through hole is formed by a through hole between the two outer surfaces of the base plate A (substrate Η). There are hundreds of extremely small diameters formed on one piece, and the diameter is mostly 0. 5mm to 0. 2mm or less. Furthermore, the through-hole is used for conducting between layers of circuit J (copper foil) connecting the two outer surfaces or between circuits J (copper foil) of the multi-layer substrate, or for mounting and packaging the components of circuit J. In addition, in order to replace through holes that require drilling processing, some people have developed bumps that form small bumps, slightly conical frustum-shaped contacts, and use the bumps to achieve multi-layer substrates and the like. Through-hole technology with the same function. Further, the protrusions are manufactured in accordance with the circuit J, in accordance with the imaging process, the etching process, and the peeling process. Then, apply or post a photosensitive anti-etching film on the outer surface (one or both of the upper surface, the lower surface, and the lower surface) of the base plate A. Then, the circuit of the negative film of circuit J The photo is exposed on the top. Therefore, the outer surface of the photosensitive anti-uranium agent is exposed to leave the formation part of the hardened circuit J, and the other unnecessary parts are removed by spraying and dissolving with the developing solution of chemical solution C. Then, the copper foil of such a base plate A leaves the photoresist hardened and covered with the formation portion of the circuit J, and the unnecessary portion exposed by the photoresist is dissolved and removed by the development solution C. The etching solution (copper chloride, ferric chloride, and other etching solutions) is sprayed to dissolve, remove and etch. Then, the remaining photoresist of the forming portion of the circuit J is peeled off by spraying the peeling liquid of the chemical solution C, and the copper foil with the remaining forming portion of the circuit J is on the outer surface of the base plate A (One or both of the upper surface, the lower surface, and the lower surface) to form a specific circuit J, thereby manufacturing a printed circuit board, namely a printed circuit board. In addition, in the above-mentioned development process, etching process, and peeling process, it is used for post-processing of each process, or concentrated post-processing after peeling process. It is also equipped with a spray water washing solution, a neutralizing agent solution, and other The cleaning process of the cleaning solution of the chemical solution c is used to wash and remove the chemical solution C such as the developing solution, the etching solution, and the peeling solution attached to the outer surface of the base plate A. In addition, although the copper foil is subjected to a surface roughening treatment (soft etching) prior to the application of the photoresist, the surface roughening treatment is gradually replaced by the spraying of the chemical solution C to the previous mechanical honing. The manufacturing method of the first example is performed by the aforementioned wet process. The manufacturing method of the first example is as described above. Next, the manufacturing method of the second example will be described. Although the method of manufacturing a substrate such as a printed circuit board is typified by the wet method of the first example described above, the semi-additive method of the second example is also often used. In this semi-assisted method, non-electrolytic copper plating is first applied to the outer surface (one or both of the upper surface, the upper surface, the lower surface, and the inner surface) of the base plate A in which a through hole is formed in advance. Then, a photoresist is applied or pasted on the electroless copper plating to form a film, and then a circuit photograph of a circuit J film is placed and exposed. Then, the photosensitive resist is exposed to leave a hardened portion, and the other portion, i.e., the formation portion of the circuit J, is sprayed, dissolved and removed by the developing solution of the chemical solution C. Then, the formation portion of the circuit J, that is, the electroplating pattern portion in which the photosensitive resist is dissolved and removed by development, that is, the portion exposed by the electroless copper plating is applied with electrolytic copper electric copper to form the circuit J. As for the remaining photoresist other than the formation part of the hardened circuit J, it is -16-200425806. It is stripped and removed by the spray of the stripping solution of the chemical solution c, and the exposed non-electrolytic 1 copper electrode * Etching of the etching solution to quickly etch and dissolve. In addition, ’according to the above-mentioned additional cleaning process for subsequent processing of each process. In the semi-assisted method of the second example, the circuit J is formed by electrolytic copper plating in this manner to manufacture a substrate Η, that is, a printed circuit board. The manufacturing method of the second example is as described above. However, a method for manufacturing a printed circuit board and a method for manufacturing a substrate Η for other circuits J have recently been diversified. In addition to the above-mentioned first and second examples, various methods have been developed and used. Of course, the present invention is also applicable to the manufacturing methods of the various substrates. The method of manufacturing the substrate Η is as described above. (Summary of chemical liquid processing device 6) Refer to Figures 1 (1), (2), Figures 2 (1), (2), Figures 3 (1), (2), and Figure 4 (1) (2) and the like to explain the medicinal solution processing apparatus 6 of the present invention in detail. This chemical liquid processing device is used in the above-mentioned manufacturing process of the substrate. The base material A is sprayed with the chemical solution C to treat the base material A with the chemical solution. That is, each process of the manufacturing method of the substrate Η, such as a development process, an etching process, or a peeling process, etc., and spraying a chemical solution such as a developing solution, an etching solution, or a peeling solution on the substrate A C for chemical treatment and surface treatment. The chemical liquid processing apparatus 6 also has a conveyor belt 2, a nozzle 3, a pad 7 and the like in the processing chamber. The outline of the chemical liquid processing device 6 is as described above. (Contents of Conveyor Belt 2) -17- 200425806 First, the conveyor belt 2 of the chemical liquid processing device 6 will be described. The conveyor belt 2 is configured by using a shaft facing the left and right width direction K, and at the same time, a plurality of rows of conveying straight rollers 4 or wheels 5 are arranged in the forward and backward conveying direction B. The straight rollers 4 or wheels 5 are arranged for conveying. The base plate A is clamped up and down on the surface M and rotated by contact, and is conveyed to the conveyance direction B in a horizontal posture. This kind of conveyor belt 2 is explained further below. First, in the examples of FIGS. 1 (1) and (2) and FIGS. 2 (1) and (2), the conveyor belt 2 using the straight roller 4 is illustrated. That is, on the conveyor belt 2 illustrated in the figure, an upper and lower pair of opposite long cylindrical straight rollers 4 are parallel to the shaft 8 toward the left and right width direction K, and at the same time, the front and back sides are kept forward and backward along the conveying direction B. At intervals F, multiple axes are arranged in parallel in a row. And the conveyor belt 2 is continuously arranged in the chemical liquid processing device 6 from the front process to the rear process. Therefore, each of the straight rollers 4 on the lower side of the conveyor belt 2 is rotationally driven, and is transported from the upstream side to the downstream side in a horizontal posture by holding the base plate A supplied by the previous process between the passive straight rollers 4 on the upper side. side. In contrast, the examples in Figs. 3 (1) and (2) and Figs. 4 (1) and (2) illustrate the conveyor belt 2 using wheels 5. As shown in Figs. That is, the conveyor belt 2 illustrated in the figure is provided with a plurality of rows of short columnar and wheel-shaped wheels 5 at the axis 8 of the width direction K in the left and right directions. In addition, there are a plurality of such shafts 8 with wheels 5 staggered in the width direction. At the same time, the wheels 5 are superimposed on each other and are slightly intermeshing with each other. They are arranged parallel to the width direction K in the transport direction. That is, the wheels 5 of the shafts 8 of the adjacent rows are set so that they do not overlap front and back and are shifted from side to side. As a result, the wheels 5 that are adjacent to the front and rear are arranged in series with adjacent shafts 8 between the front and rear 200425806 interval F. Relationship. In addition, for the nest 3 and the conveyor belt 2 in FIG. 4, the other structures follow the description of the conveyor belt 2 in FIGS. 1 (1) and (2) and 2 (1) and (2). The content of the conveyor belt 2 is as described above. (Description of Nozzle) Next, the nozzle 3 of the chemical liquid processing apparatus 6 will be described. As shown in Figs. 1 (1) and (2), the nozzle 3 is located on the opposite side of the base plate A being conveyed, and ejects a developing liquid, an etching liquid, a peeling liquid, and other chemical liquid C from the upper and lower directions L. 0 This nozzle 3 is described in more detail. First, the nozzle 3 is a hole-shaped one, but a slit-shaped one can also be used. The nozzles 3 are arranged opposite to each other directly above or directly below the substrate material A conveyed by the conveyor belt 2 in a horizontal posture, and maintain a number of vertical intervals. In the example of Fig. 1 (1), it is arranged only directly above, and in the example of Fig. 1 (2), it is arranged directly above and directly below. In any case, it should be placed at least on the base plate A being transported. A plurality of nozzles 3, which are respectively arranged above and below the base plate A being conveyed, are arranged at the front and rear sides of φ, respectively, and are connected to a pump or a chemical tank (not shown) through a pipe 9 such as a spray pipe. ). Then, the chemical liquid C is supplied from the chemical liquid tank through the pump or the piping 9, and is pressure-fed to the nozzles 3, and then sprayed to the base plate A. After that, it is recovered to the chemical liquid tank for recycling. In addition, between the nozzle 3 and the base plate A, that is, above or below the area where the nozzle 3 is arranged, the straight roller 4 or wheel of the conveyer belt 2 is not interposed. The structure of the nozzle 3 is as above. (Description of Pad Plate) Next, the pad plate 7 of the chemical liquid processing apparatus 6 will be described. The backing plate 7 is arranged in a detachable state between the straight rollers 4 or the wheels 5 of the conveyor belt 2 adjacent to each other. Since the shim plate 7 is provided with the nozzle 3 at least on the upper side thereof, each of the front and rear intervals F between the straight rollers 4 or the wheels 5 of at least the lower side of the conveyor belt 2 must be provided. That is, the back-and-forth interval F on the lower side opposite to the ejection zone of the chemical liquid C on the upper nozzle 3 is provided with a pad 7. In addition, as shown in FIG. 1 (2), when the nozzle 3 is disposed on the lower side, the front and back space F between the straight rollers 4 on the upper side of the conveyor belt 2 or between the wheels 5 is on the lower side. A backing plate 7 is also interposed between the front and back space F on the upper side opposite to the spray area of the chemical liquid C of the nozzle 3. (In this case, the backing plate 7 is located at the high position rather than the lower position of the base plate A, but it is also referred to as the backing plate 7 in this specification). In addition, as shown in FIGS. 1 (1), (2), 3 (1), 4 (1), etc., each of the pads 7 thus arranged is arranged along the vertical direction L by the conveyor belt 2 The conveyance surface M is arranged at a slight interval from top to bottom. That is, the shim plate 7 is disposed at a height level that is at least about the thickness of the base plate A above or below the outer peripheral top surface 10 of the straight roller 4 or the wheel 5. For example, for the shim plate 7 disposed on the lower side of the base plate A, its top surface is disposed slightly lower than the outer peripheral top surface 10 (the upper surface of the outer periphery) of the straight roller 4 or the wheel 5 which is also disposed on the lower side. The low position, whereby the base plate A is held and guided from below. -20- 200425806 Of course, the top surface of the backing plate 7 disposed on the upper side of the base plate A is disposed on the It quotient-like the straight roller 4 or the wheel 5 disposed on the upper side and the outer peripheral top surface 10 (lower outer periphery) is slightly higher. Position, thereby holding and guiding the base plate A from above. As shown in the examples of Figures 1 (1), (2) or 2 (1), (2), when the conveyor belt 2 is composed of straight rollers 4, the pad 7 is along the left and right width direction K Form a long plate. That is, the backing plate 7 should be interposed between (arranged along the left and right width direction K) the front and back space F formed between the straight rollers 4, and viewed from the plane or bottom surface to form a long plate shape along the width direction K. . In contrast, as shown in the examples in Figures 3 (1) and (2) or Figures 4 (1) and (2), if the conveyor belt 2 is composed of wheels 5, the pads 7 should be interspersed in the distribution. The front-to-back spacing F between the wheels at the front, rear, left, and right (conveying direction B or width direction K) is slightly square when viewed from the plane or bottom surface, and is arranged in a plurality of scattered states. In addition, in the figures 1 (1), (2), 2 (1), (2) or 3 (1), (2), and the examples of 4 (1), (2) are shown from the front Or viewed from the back, the pad 7 is attached with and protruded with a sliding contact portion 16 for slidingly contacting the front and rear straight rollers 4 or wheels 5. Although the backing plate 7 is in contact with the base plate A, the surface on the side is provided as a smooth surface to prevent the base plate A from adhering to the unevenness of the grooves or holes 11 to prevent the base plate A from adhering. Most of the conveyance directions B are better. That is, as shown in Figs. 2 (1), (2), 3 (2), 4 (1), (2), etc., if the groove-like marks or the penetrating holes are made up and down The irregularities 11 formed by the holes are formed on the base plate A, so that the base plate A can be prevented from being adsorbed on the backing plate 7 due to the chemical solution C more than when only the smooth surface is formed. In addition, the backing plate 7 is slidably connected to the straight roller 4 or the wheel 5 200425806 before and after the conveyor belt 2, and is simultaneously positioned and held on the shaft 8 of the straight roller 4 and the wheel 5. That is, as shown in FIGS. 1 (1) and (2), FIG. 3 (1) and FIG. 4 (1), etc., the pad 7 is brought into contact with the sliding contact portion 16 to form a front-to-back gap. F is the straight roller 4 or the wheel 5 behind, that is, the two straight light 4 or the curved surface of the wheel 5 are interposed between the front and back of the pad 7 so as to maintain the positioning. At the same time, as shown in FIG. 1), (2), FIG. 3 (丨), and FIG. 4), the mounting plate 12 holds the straight roller 4 or the wheel 5 The shaft 8 of the projection or the like is positioned and held. φ In addition, as shown in Fig. 1 (2), the shim plate 7 provided on the upper side of the base plate A is attached to the shaft 8 and held by the shaft 8 in addition to the shaft 8. In addition, the pads 7 shown in Figs. 4 (1) and (2) are used separately, but only Figs. 1 (1) and (2), Figs. 2 (1) and (2), and Fig. 3 (1 ), (2) The pads 7 shown in the figure are connected in two, and three are used in multiples. That is, the pads 7 shown in Figs. 1 (1), (2), 2 (1), (2), 3 (1), (2), etc. are before and after the conveyor belt 2. In the conveying direction B, a plurality of straight rollers 4 or wheels 5 are provided as a target, and a plurality of pads are integrated through the bridge conveying direction 13 across the Lu conveying direction B. In the case of the straight roll 4, as shown in Fig. 2 (1), the bridge portion 13 is formed along the side of the base plate A being fed by the roll. Thereby, the opening portion 14 surrounded by the front and back pads 7 and the bridge portions 13 on both sides is formed as an integrated connection object, and the opening portion 14 has a straight roller 4 or an outer peripheral top surface 10 of the wheel 5 and other outer periphery. The top is exposed. That is, a plurality of pads 7 are connected by a bridge portion 13 while forming a horizontally long opening portion 14 in the width direction K from 2 to 3. There are many roots, and a shape of a table is formed from which the straight roller 4 is exposed. -22- 200425806 In contrast, in the case of wheel 5, as shown in Figure 3 (2), the pads / are adjacent to each other and spread into a pawn shape. Therefore, the bridge portion 13 is formed to connect the multiple pads in front, back, left, and right. Between 7 parts. Therefore, the openings 15 surrounded by each of the shim plates 7 and the bridges 13 are formed at various places, and the openings 15 become positions where the outer peripheral tops such as the outer peripheral top surface 10 of the wheel 5 are exposed. That is, at this time, a plurality of pads 7-body concentrated on the bridge. 13. Many small openings 15 are scattered in black and white, forming a shape of a table from which the wheels are exposed. The structure of the backing plate 7 is as described above. (Effects, etc.) The structure of the present invention is as described above, and the results are as follows. ① The chemical liquid processing device 6 of the base plate A is used in the manufacturing process of the substrate Η (see Fig. 6). That is, it is used in the manufacturing process of module substrates, glass substrates, and other substrates for circuit J. ② In addition, in the development process, etching process, or peeling process of such a substrate Η manufacturing process, the chemical liquid processing apparatus 6 sprays the chemical liquid C on the extremely thin and soft base plate A to perform the chemical liquid treatment. Surface treatment is performed to form a circuit] (see Figures 1 (1) and (2)). In addition, the chemical liquid processing device 6 has a conveyor belt 2 for conveying the base plate A, and sprays the chemical liquid C on the plurality of nozzles 3 of the base plate A. The liquid liquid processing device 6 is configured to hold and guide the base plate A and is arranged to be conveyed away from the conveyor 2面 Ｍ 的 垫板 7。 Surface M of the pad plate 7. ③ The conveyor belt 2 of the chemical liquid processing device 6 is constituted by a straight line 4 or wheels 5 for conveyance, in which a plurality of lines are arranged in the forward and backward conveyance directions B, in addition to the shaft 8 facing the left and right width direction K. -23-200425806 The straight rollers 4 or wheels 5 are arranged above and below the conveying surface M, and the base plate A is held in contact with and rotated by the upper side of the square, and is conveyed in a horizontal posture (see section 1 (1) ((2)) (In addition, in Figures 3 (1) and 4 (1), the illustration of the upper wheel 5 is omitted). In addition, the nozzle 3 of the chemical liquid processing apparatus 6 is located on the opposite side of the substrate material A being conveyed, and the chemical liquid C is nozzle L from the vertical direction L (see Figs. 1 (1) and (2)). That is, each of the nozzles 3 is arranged at least on the upper side of the base plate a being conveyed, and is connected to a pump or a chemical liquid tank through a pipe 9, and the base plate a sprays a chemical liquid such as a developing liquid, an etching liquid, or a peeling liquid. C. ④ The backing plate 7 of this chemical liquid processing device 6 is slightly above and below the conveying surface Μ of the conveyor belt 2. That is, the backing plate 7 is arranged at the front-rear interval F between the straight rollers 4 or between the wheels 5 at the front-rear connection of the conveyor belt 2 (refer to Figs. 1 (1) and (2) and Fig. 2 (1). , Figures 3 (1), (2), Figure 4 (1), etc.). At the same time, the backing plate 7 is positioned at a height level at least about the thickness of the base plate A at the top or bottom of the outer peripheral top surface 10 of the straight roller 4 or the wheel 5 (refer to Figures 1 (1) and (2)). , Figure 3 (1), Figure 4 (1), etc.). In addition, 'Because the nozzle 3 is arranged at least on the upper side of the base plate A, the shim plate 7 is arranged at least at the front-back interval f between the straight rollers 4 or the wheels 5 on the lower side, and its top surface is located at the outer peripheral top surfaces 1 0 is slightly lower. ⑤ In this chemical liquid processing device 6, the base plate A is held and guided by the shim plate 7, and is transported in a horizontal posture (refer to FIGS. 1 (1), (2), 3 (1), and 4 (1) Figures, etc.). -24 · 200425806 That is, the base plate A is conveyed by the straight light 4 or wheels 5 of the conveyor belt 2 in a horizontal position. Moreover, the base plate A is supported and guided at least by the bottom plate 7 interposed between the straight rollers 4 or the front and back intervals F between the wheels 5 (see also Fig. 1 (2)). ), Without being adversely affected by the sprayed liquid C, continue to carry in a horizontal posture. ⑥ Use of the chemical liquid processing device 6 can prevent the pressure or weight of the chemical liquid C sprayed from the nozzle 3 at the front-to-back interval F between the straight rollers 4 or between the wheels, a. The base plate A is bent, liquefied D, bent, waist folded, etc. (refer to the previous examples in Figures 5 (1) and (2)), b. The corresponding straight rollers 4 or wheels 5 of the front or rear end of the base plate A sag, c. The base plate A is wound around the straight roll 4 or the wheel 5 or is sucked in, and d. The base plate A is dropped or bounced by the straight rollers 4 or the wheels 5. 'In addition, the surface of the backing plate 7 may be smooth, but if a large number of grooves or open holes 11 are formed along the forward and backward conveying direction B, it is possible to more surely prevent the chemical liquid C-based plate A from being adsorbed on the backing plate. Question 7 (refer to Figure 2 (1), (2), Figure 3 (2), Figure 4 (1), (2), etc.).本 In this chemical liquid processing device 6, the base plate A is held and guided by the shim plate 7, so that it can be smoothly transported while maintaining a horizontal posture. The bending of the base plate A and the occurrence of corrugation D and the like are prevented, so that the sprayed chemical liquid C remains as a liquid depression in the recess formed by the bending and corrugation D and the like (refer to Section 5 (1), ( 2) The previous example in the figure), and it is possible to prevent the front end or the rear end of the base plate A from sagging E against the corresponding straight roller 4 or wheel 5. Therefore, the base plate A can be uniformly sprayed with the chemical liquid C 'sprayed from the nozzle 3 without the speed, overshooting, undershooting, and unevenness on the entire surface. The chemical liquid treatment can be performed uniformly and the surface treatment can be performed to form a circuit: ί 之 用. -For example, in the etching process, the following results were obtained by testing the etch deviation j of the circuit j formed. That is, for the base plate A having a width and width of 500 mm x 500 mm, the results of a comprehensive inspection of the formed circuit J 1 2 1 with a width or an area of 15 μm are deviated from the advantages obtained by the chemical liquid processing device 6値 〇 · 9, the deviation 値 of the chemical liquid processing device 1 of the above 5 (1), (2) is 1. 6. ⑧ Since the medicinal liquid processing device 6 is provided with a pad 7 between the straight rollers 4 of the conveyor belt 2 or between the car and the wheel 5, the above-mentioned points are easily realized. That is, the above points can be achieved without any manual work. Furthermore, the backing plate 7 uses its own weight to slide the straight rollers 4 or wheels 5 of the conveyor belt 2 in the sliding contact portion 16 while stably positioning and holding the straight rollers 4 or the shafts 8 of the wheels 5 (refer to 1 (1), (2), 3 (1), 4 (1), etc.), so its structure is also simple and stable. The shim plate 7 can also be arranged in the conveying direction B of the conveyor belt with a plurality of straight rollers 4 or wheels 5 as the target, and can be converted into two or three, such as two or three, by flexibly using the bridge portion 13 俾. The bottom plate 7 is integrated in the conveying direction (see FIG. 2 (1), FIG. 3 (2)), and it can be seen that the structure can be simplified. ⑨ In addition, since the chemical liquid processing device 6 is provided with a backing plate 7 between the straight rollers 4 of the conveyor belt 2 or the front-to-back space F between the wheels 5, the arrangement position of the nozzles 3 can be freely set.
亦即，噴嘴3之配設位置不必侷限於直輥4或車輪5的 正上面（由上側之噴嘴3朝基板材A之上面噴射藥液時）（參 照第1(1)、（2)圖），或正下面（由下側之噴嘴3向基板材A -26- 200425806 下面噴射藥液C時）（參照第1(2)圖），也可以將噴嘴3配設_ 於直輥4之間或車輪5之間的前後間隔F之上方或下方 (未圖示）。 換言之，在直輥4之間與車輪5之間的前後間隔F，墊 板7是抗拒著由噴嘴3噴射之藥液C之噴射壓而保持，引 導與支撐基板材A，所以不必考慮噴射壓之不良影響，即 不必考慮與直輥4或車輪5之關係位置，即可自由設定噴 嘴3之配設位置。 | [發明之效果] 本發明之基板材的藥液處理裝置，如上所述，是以將墊 板配設於僅距離輸送帶之搬送面些許之高度位準爲其特徵 。亦即，以將墊板在搬送用之直輥或車輪間之前後間隔中 ，配設於比該等之外周頂面僅凹陷於上下方些許的高度位 準爲其特徵。 因此，本發明之基板材的藥液處理裝置可發揮下列的效 果。 φ (第1效果） 第1，基板材之搬送上之問題被消除。換言之，因爲本 發明之藥液處理裝置係在輸送帶之直輥或車輪間的前後間 隔距離搬送面上下方些許處配設墊板，所以基板材可以保 持水平姿勢搬送。 因此，可以確實防止如上所述之先前例之藥液處理裝置 ，被搬送之基板材在途中所發生之彎曲、波狀化、折彎、 腰折、下垂、鈎住、捲纒、掉落、彈跳等問題。因此，基 -27- 200425806 板材之惡化事故激減，產量大幅增加。另外，若在墊被上\ 形成條紋或明孔等凹凸時，可以更確實防止基板材吸附於 墊板。 而且，此種搬送上之問題的防止，對於極薄化與柔軟化 之進展顯著之電路用基板，其意義尤其重大。 (第2效果） 第2，藉此可以實現基板材之藥液處理之均勻化。亦即， 如上所述，本發明之藥液處理裝置上，基板材是保持水平 姿勢順利搬送。因此，不致如上述之先前例之藥液處理裝 置，所搬送之基板材成爲彎曲或波狀化，也不會在凹部成 爲藥液之液窪而滯留，以致前端部或後端部下垂的問題。 因此，基板材整面可以處理得毫無快慢，過與不足或參 差，藥液處理與表面處理均等實施。 此點對於高精密度，細微化進步而電路之高密度化，細 微化顯著的電路用基板意義尤其重大，可說開啓了該等的 實現，即量產體質的實現之路。 (第3效果） 第3，而且此事容易實現。亦即，本發明之藥液處理裝 置藉由在輸送帶之直輥或車輪間配設墊板，所以容易實現 上述之第1點與第2點。 而且墊板係滑接於直輥或車輪，同時利用軸穩定地定位 與保持，並且也可以藉由橋部連接2連、3連等，構造簡 單而穩定。 因爲不必如上述之先前例之藥液處理裝置，將前導板粘 200425806 貼於各基板材的麻煩手工作業，省卻麻煩而有效率。’ (第4效果） 第4，噴嘴之配設位置可以自由設定。即，在本發明之 藥液處理裝置之輸送帶之直輥或車輪之間配設有墊板。 因此，不必如上述之此種先前例之藥液處理裝置限制將 噴嘴配設於直輥或車輪之正上方或正下方。因爲正上方與 正下方以外之前後間隔’墊板抗拒著藥液之噴射壓以保持 與支撐基板材，因此’可以自由設定噴嘴之配設位置。 此點對於極薄化與柔軟化之進步顯著之電路用基板，意 義尤其重大。 如上所述，解決了先前例存在之所有課題之本發明所發 揮之效果顯著而重大。 (五）[圖式簡單說明] 第1(1)、（2)圖爲針對本發明之基板材之藥液處理裝置， 供說明發明之實施形態並表示適用於直輥式之輸送帶之例 其中第1(1)圖爲其一例之側面說明圖，第1(2)圖爲另一例 之側面說明圖。 第2(1)、（2)圖爲供說明本發明之實施形態，表示適用於 直輥式之輸送帶之例，其中第2(1)圖爲重要部分之平面說 明圖’第2(2)圖爲第2(1)圖之部分擴大圖。 第3(1)、（2)圖爲供說明本發明之實施形態，表示適用於 車輪式輸送帶之例，其中第3 (1 )圖爲其一例之側面說明圖 ，第3(2)圖爲同例之平面說明圖。 第4(1) ' (2)圖爲供說明本發明之實施形態，表示適用於 -29- 200425806 車輪式輸送帶之例，其中第4(1)圖爲其他例之重要部分之_· 側面說明圖，第4(2)圖爲同例之重要部份之平面說明圖。 第5 (1 )、（2)圖爲供說明此種先前例之基板材之藥液處理 裝置，其中第5 (1 )圖爲使用直輥式輸送帶之例的側面說明 圖，第5 (2)圖爲使用車輪式輸送帶之例的側面說明圖。 第6圖爲將基板基板材模式化之平面說明圖。 [主要部分之代表符號說明] 1 藥液處理裝置（先前例） 2 輸送帶 3 噴嘴 4 直輥 5 車輪 6 藥液處理裝置（本發明） 7 墊板 8 軸 9 配管 10 外周頂面 11 凹凸 12 安裝部 13 橋部 14 開口部 15 開口部 16 滑接部 A 基板材 -30 - 200425806 B 搬送方向 C 藥液 D 波狀化 E 下垂 F 前後間隔 G 液窪 Η 基板That is, the arrangement position of the nozzle 3 does not need to be limited to the top surface of the straight roller 4 or the wheel 5 (when the chemical liquid is sprayed from the upper nozzle 3 to the upper surface of the base plate A) (refer to Figs. 1 (1) and (2)) , Or directly below (when spraying the liquid C from the lower nozzle 3 to the base plate A -26- 200425806) (refer to Figure 1 (2)), the nozzle 3 can also be arranged _ between the straight rollers 4 Or above or below the space F between the wheels 5 (not shown). In other words, at the front-to-back distance F between the straight rollers 4 and the wheels 5, the shim plate 7 is held against the spray pressure of the chemical liquid C sprayed by the nozzle 3, and guides and supports the base plate A, so there is no need to consider the spray pressure. The adverse effect is that the position of the nozzle 3 can be set freely without considering the position with respect to the straight roller 4 or the wheel 5. [Effect of the invention] As described above, the chemical liquid processing device of the base plate of the present invention is characterized by disposing the pad at a height level only a little from the conveying surface of the conveyor belt. That is, it is characterized by arranging the shim plate at a height level slightly lower than the outer peripheral top surface in the space between the front and back of the straight rollers or wheels for transportation. Therefore, the medicinal solution processing apparatus for the base material of the present invention can exhibit the following effects. φ (First effect) First, the problem of conveying the base material is eliminated. In other words, since the chemical liquid processing device of the present invention is provided with pads on the conveying surface at a distance from the front and back of the straight rollers or wheels of the conveyor, the base plate can be transported in a horizontal posture. Therefore, it is possible to surely prevent the base material sheet being transported from being bent, corrugated, bent, waist folded, sagging, hooked, rolled, dropped, etc. Bounce and other issues. As a result, the deterioration of base -27- 200425806 plates has sharply reduced, and production has increased significantly. In addition, when irregularities such as stripes or open holes are formed on the mat, it is possible to more reliably prevent the base material from being attracted to the mat. In addition, the prevention of such transportation problems is particularly significant for circuit boards that have made significant progress in extremely thinning and softening. (Second effect) Second, it is possible to achieve uniform treatment of the chemical solution of the base plate. That is, as described above, in the medicinal solution processing apparatus of the present invention, the base material is smoothly conveyed while maintaining a horizontal posture. Therefore, the chemical liquid processing device of the previous example does not cause the base plate to be bent or corrugated, and it will not stay in the recessed portion as a liquid sag of the chemical liquid, causing the front end or the rear end to sag. . Therefore, the entire surface of the base plate can be processed without any speed, overshoot, undershoot, or unevenness, and the chemical liquid treatment and surface treatment can be performed equally. This point is particularly important for high precision, finer progress and higher density of circuits, and significant miniaturization of circuit substrates. It can be said that such realization, that is, the road to mass production physique. (Third effect) Third, and this is easy to achieve. That is, since the chemical liquid processing apparatus of the present invention is provided with a pad between the straight rollers or wheels of the conveyor belt, it is easy to realize the above-mentioned first and second points. In addition, the pad is slidingly connected to a straight roller or a wheel, and the shaft is stably positioned and held at the same time. The bridge can also be connected to two or three bridges with a simple and stable structure. Because there is no need for the chemical liquid processing device of the previous example described above, the troublesome manual operation of sticking the front guide plate 200425806 to each base plate is saved, which is troublesome and efficient. (4th effect) Fourth, the arrangement position of the nozzle can be set freely. That is, a pad is arranged between the straight rollers or wheels of the conveyor belt of the chemical liquid processing apparatus of the present invention. Therefore, it is not necessary to restrict the nozzles to be disposed directly above or directly below the straight rollers or wheels as in the chemical liquid processing apparatus of the previous example. Because the backing plate is directly above and below the back and forth space, the pad resists the spray pressure of the medicinal solution to maintain and support the base plate, so the position of the nozzle can be freely set. This point is particularly significant for circuit boards that have made significant progress in thinning and softening. As described above, the effect of the present invention that solves all the problems existing in the previous examples is significant and significant. (V) [Schematic description] Figures 1 (1) and (2) are for the liquid medicine processing device of the base plate of the present invention, for explaining the embodiment of the invention, and showing an example of a straight roller type conveyor belt FIG. 1 (1) is a side explanatory diagram of one example, and FIG. 1 (2) is a side explanatory diagram of another example. Figures 2 (1) and (2) are for explaining the embodiment of the present invention, and show an example of a straight-roller type conveyor belt. Among them, Figure 2 (1) is a plan explanatory diagram of important parts. Figure) is a partially enlarged view of Figure 2 (1). Figures 3 (1) and (2) are diagrams for explaining the embodiment of the present invention, and show an example applicable to a wheeled belt. Among them, Figure 3 (1) is a side explanatory view of an example, and Figure 3 (2) It is a plan explanatory diagram of the same example. Fig. 4 (1) '(2) is a diagram for explaining the embodiment of the present invention, and shows an example applicable to a -29-200425806 wheeled belt. Among them, Fig. 4 (1) is an important part of other examples. Explanatory diagram. Figure 4 (2) is a plan explanatory diagram of the important part of the same example. Figures 5 (1) and (2) are illustrations of the chemical liquid processing device for the base plate of the previous example, and Figure 5 (1) is a side explanatory view of an example using a straight roller conveyor. 2) The figure is a side explanatory view of an example using a wheeled belt. Fig. 6 is a plan explanatory view of a substrate-based plate material. [Description of Representative Symbols of Main Parts] 1 Chemical liquid processing device (previous example) 2 Conveyor belt 3 Nozzle 4 Straight roller 5 Wheel 6 Chemical liquid processing device (Invention) 7 Backing plate 8 Shaft 9 Piping 10 Outer peripheral top surface 11 Concave and convex 12 Mounting part 13 Bridge part 14 Opening part 15 Opening part 16 Sliding part A Base plate -30-200425806 B Transport direction C Chemical solution D Corrugated E Sagging F Front-to-back interval G Liquid sink
J 電路 Κ 寬度方向 L 上下方向 Μ 搬送面J circuit KK width direction L vertical direction Μ conveying surface
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