TW200409785A - Latent hardener, manufacturing method for latent hardener, and adhesive - Google Patents

Abstract

This invention is to obtain an adhesive which is curable under conditions of low temperature and short time and has high shelf life. The adhesive has a silane coupling agent, an epoxy resin and a latent curing agent in which curing agent particles composed of a metal chelate are covered with a capsule. Since these curing agent particles are covered with the capsule at ordinary temperature, polymerization reaction of the epoxy resin does not occur, but when the adhesive is heated, the capsule is broken and the metal chelate constituting the curing agent particles reacts with the silane coupling agent to produce a cation, and the epoxy resin is polymerized by the cation (cation polymerization) to cure the adhesive. Since the reaction with which the cation is produced occurs at a lower temperature than a temperature at which conventional adhesive is thermally cured, the adhesive of the present invention is cured at a lower temperature and in a shorter time. As a result, the adhesive of the present invention is low- temperature curing type and has high shelf life.

Description

200409785

File: TW 1009F-IPO.doc SUNDIAL CONFIDENTIAL 玖, description of the invention (the description of the invention should state: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings are briefly explained) [the technical field to which the invention belongs] The present invention is The adhesive is particularly related to a latent hardener of the adhesive used when the semiconductor wafer and the TCP are connected by thermocompression. [Previous technology] In the past, when a semiconductor wafer was bonded to a substrate, or when TCP (Tape Carrier Package) and LCD (Liquid Crystal Display) were used to manufacture electrical equipment, they were bonded with a thermosetting resin epoxy resin. Agent. As shown by the symbol 111 in FIG. 7 (a), the LCD 111 includes a glass substrate 112, and an ITO electrode (Indium tinoxide) 113 ° LCD 111 disposed on the glass substrate 112. When following the TCP described below, the LCD 111 The surface on which the ITO electrode 113 is to be arranged is coated with an adhesive. Reference numeral 125 in FIG. 7 (b) indicates a state where the adhesive is applied to the LCD 111. Reference numeral 115 in FIG. 7 (C) indicates TCP. The TCP 115 includes a base film 116 and a metal wiring 117 disposed on the surface of the base film 116. The metal wiring 117 of the TCP115 is arranged on the arranged surface toward the adhesive 125 on the LCD111. After the alignment position, 200409785

File: T W1009F-IPO.doc, * SUNDIAL CONFIDENTIAt The layout of the metal wiring 117 of the TCP 115 will be pressed to the adhesive} 25. When the heating is held in this state, the adhesive 125 is softened, and the metal wiring 117 pushes the softened adhesive 125 backward and contacts the surface of the ITO electrode 113. Generally, a hardening agent such as imidazol is added to the above-mentioned adhesive after heating, and when the metal wiring 117 and the IT0 electrode 113 continue to be heated under the bonding state, the contact of the hardening agent is added. The effect of the medium will make the epoxy resin coincide and let the adhesive 25 harden. The reference numeral 101 in Fig. 7 (C) shows the electrical equipment in which the adhesive 25 is cured after being cured. This electrical equipment 丨 〇 丨 is in a state where the metal wiring 丨 丨 7 is in contact with the IT〇 electrode 113, and the TCP 115 and the LCD 111 are fixed by the hardened adhesive 125. Therefore, TCP115 and LCD111 are connected electrically and mechanically. However, when the above-mentioned adhesive is allowed to harden, it must be i 80. 〇 Above the temperature, the adhesive is heated. When the circuit of the metal wiring 117 is very fine, the TCP 115 may be deformed such as elongation or contraction during heating. This problem can be solved by lowering the heating temperature, but it will increase the time required for heat treatment and reduce productivity. Adhesives that are also excellent in hardening properties at low temperatures. In recent years, logically coincident resins such as Acrylate and logically coincident starters have been developed. 200409785

FiIe: TW1009F-IPO.doc

SUNDIAL CONFIDENTIAL. However, compared with the use of epoxy resins, the electrical properties and heat resistance in the hardened state are poor. [Summary of the Invention] The present invention was created to solve the above-mentioned problems of the prior art, and its purpose is to provide an adhesive which can be hardened under low temperature and short time conditions and has excellent preservation properties. The inventors of the present invention, instead of using a commonly used hardener, have focused on a method of superposing epoxy resin into cations. After repeated research, the following methods were found: at least one alkoxy group in the structure, a silane compound (Silane Couphng) and a metal adduct (or metal Alcolart) were added to the adhesive in the structure In the method, the epoxy resin is superposed (cation superposition) by using a cation generated when the metal difference a reacts with a sintering coupling agent (Silane Coupling). The hardening process in which a metal adduct and a silane coupling agent (Silane coupling) are added is then described in the following reaction formulas (1) to (4). 200409785 * t

I

File: TW1009F-IPO.doc SUNDIAL CONFIDENTIAL [Chem. 1] X-Si-OR + H2O ^ X-Si-OH + R-OH Reaction formula (1) A1 + OH-Si-X 厶

Al-O-Si-X + RH

Reaction Formula (2)

^ Al-O-Si-X + X-Si-OH- ^ X-Si-O -Hh \ 1 /

; Al-〇-Si-X Reaction Formula (3) r-ch-ch2- ^ r-ch-ch2 +-> r-ch-ch2 +

\ / I I

〇 H + OH 'R-CH-CH2 OV 1' 〇r-ch_ch2 OH * Reaction formula (4) A silane compound having at least one alkoxy group, as shown in reaction formula (1), reacts with water in the adhesive. Oxygen will be hydrolyzed to become a silanol group. When the adhesive is heated, the broken alcohol group will react with metal compounds such as Ming compound, and Shixiyuan compound will bind with Ming compound. (Reaction formula (2)) Then, as shown in reaction formula (3), due to the equilibrium reaction between the silanol group and the bonded aluminum compound, other silanol groups remaining in the adhesive will coordinate, 200409785

File: TW1009F-IPO.doc,

SUNDIAL CONFIDENTIAL generates the Branstade acid point, as shown in reaction formula (4). 'Because of the activated proton, the epoxy ring at the end of the epoxy resin will open the ring, and it will be in phase with the epoxy ring of other epoxy resins. Coincidence (cationic coincidence). Therefore, when a silane coupling agent (Silane Coupling) and a metal coupler are added to the adhesive, a thermosetting resin such as an epoxy resin is cationically overlapped. The reactions shown in the reaction formulas ⑺ to ⑷ are performed at a temperature lower than the temperature at which the old adhesive hardens (180 ° or more). Therefore, the aforementioned adhesive can be used at a lower temperature than the old adhesive. Low temperature and short time hardening. However, when the metal adduct and the metal Alc〇art are added directly to the adhesive together with the silane coupling agent (Silane Coupling), the ring-like superposition reaction can also be performed at normal temperature, causing the adhesive viscosity to change. high. Therefore, the present inventors et al. Found a method of adding a latent hardener to an adhesive in a capsule made of a resin component that does not react with epoxy resin at ordinary temperature, and the above-mentioned metal compound was sealed. The present invention is based on the above-mentioned Transcendence, and the invention described in the item of the scope of patent application is a potential hardener, which has hardener particles and a capsule covering the surface of the hardener particles. The hardener particles are One of the metal adducts or the metal Alcolart, or both are the main components. 10 200409785

File.TW 1009F-IPO.doc, sundial confidentiai The invention described in the patent application @ item 2 is a potential hardener as described in item 1 of the patent scope, and the aforementioned metal philate is based on Latent compound is a potential hardener for the main ingredient. The invention described in item 3 of the scope of patent application is a potential hardener as described in item 1 of the scope of patent application, and the aforementioned metal Aleolamx AleGlan is a potential hardener. The invention described in item 4 of the scope of patent application is a latent hardener as described in items 1 to 3 of the patent scope. The aforementioned capsule ′ is a latent hardener of fluorinated resin as the main component. The invention described in the scope of patent application No. 5 is a potential hardener as described in any one of the scope of patent application No. 1 to the scope of patent application No. 4. The capsule is a resin particle having an average particle diameter smaller than the average particle diameter of the hardener particles, and the resin particles are stuck on the surface of the hardener, and are formed by refining as described in items i to ii of the aforementioned patent application range. Any of the potential hardeners. The invention described in item 6 of the scope of patent application, and the latent hardener described in item 5 of the scope of patent application, has a resin particle melting point of 30 ° C to 350 ° C. Apply for the monthly patent | The invention described in item 7 and the potential hardener described in item 5 of the patent application range, the heat of the resin particles mentioned above 200409785

FilerTWl 009F-IPO.doc ''

SUNDIAL CONFIDENTIAL The decomposition temperature is above 50 ° C and below 500 ° C. For the invention described in item 8 of the patent application IS, and the latent hardener described in item 5 of the patent application, the softening temperature of the aforementioned tree-moon particles is 0 ° C to 300 ° C. For the invention described in item 9 of the patent application, and the potential hardener described in item 5 of the patent application, the glass transition temperature of the aforementioned resin particles is -40 ° C to 300 ° C. The invention described in claim 10 of the scope of the patent application is a method for manufacturing a latent hardener. The method includes a hardener particle, the capsule coated on the surface of the hardener particle, and a process for manufacturing the hardener particle. Yes-A method for producing a latent hardener, the method includes the aforementioned resin component as a main component, and powder-like resin particles having an average diameter smaller than that of the hardener particles are attached to the surface of the hardener particles. The resin particles adhered to the surface of the hardener particles are dissolved to form a capsule encapsulation process. The invention described in the scope of patent application 帛 11, and the method of manufacturing the latent hardener described in scope of patent application # 10, have two processes. 1 is the aforementioned encapsulation process, which is a mixing process of mixing the hardener particles and the capsule material, and allowing the surface of the hardener particles to adhere to the capsule material.丄 The glue is attached to the hardener particles 12 200409785

File.TW 1009F-IPO.doc SUNDIAL CONFIDENTIAL The mixing process is performed while the capsule material is melted apart from other capsule materials. In the invention described in item 12 of the scope of patent application, as in the method of manufacturing a latent hardener described in any of the items in item 10 of the patent application and item 11 of the application, the average of the hardener particles is The ratio of the particle diameter to the average particle diameter of the aforementioned capsule material was 100: 80.

In the invention described in claim 13 in the scope of patent application, as in the method for manufacturing a latent hardener described in claim 10 of the scope of patent claims and any one of the paragraph u of the scope of patent claims, the average of the aforementioned hardener particles is The ratio of the particle diameter to the average particle diameter of the aforementioned capsule material was 100: 50. The invention described in item 14 of the scope of patent application contains a thermosetting resin, a silicon coupling agent (Silane Coupling), and the potential as described in any one of the items in the scope of patent application 1 to 9 of the patent scope Adhesive for hardener.

The structure of this month is as above. After the powdered capsule material is mixed with the hardener particles, the capsule material will adhere to the surface of the hardened M particles due to the electrostatic effect. In this state, the hardener particles are mixed at a high speed, and the resin particles adhered to the surface of the hardener particles due to static electricity will be mixed with the agitator, the inner wall of the stirring device, and the other tree hardener particles on the surface of the hardener particles. Time lapse, because of the energy generated by this physical impact Black Tree 13

Fiie: TW 1009F-IPO.doc

Fiie: TW 1009F-IPO.doc Lipid particles dissolve, or resin particles will fuse into sac 0 SUNDIAL CONFIDENtlAL · 4 substances (hardener particles). When the melted body forms the glue that coats the surface of the hardener particles, the latent hardener is combined with a silicon coupling agent (Silane ~ coffee) and an epoxy resin to make an adhesive, and the surface of the hardener particles is at room temperature. It is completely covered by the capsule, and does not react with the epoxy resin. Therefore, it is remembered that the preservation is very high, but when the adhesive is heated, the capsule will soften or turn, and the mechanical strength of the capsule will be significantly reduced. Therefore, when the adhesive is heated, the hardener particles will be subject to physical shock such as thermal expansion and pressure during thermal compression, which will easily damage the capsule, and the hardener particles will be released into the adhesive. If this kind of complaint is continuously heated, the cooking component of the hardener particles __ The metal admixture and the silane coupling agent (Silane coupling) in the adhesive will react to generate cations, which are overlapped with the epoxy resin because of the cations ( Cation overlap), and the adhesive will harden. The reaction between the hardener particles and the silane coupling agent (Silane Coupling) is lower than the temperature at which the conventional adhesives are thermally cured (above 180 ° C). Therefore, the adhesive of the present invention can be cured at a lower temperature and in a shorter time. . In order to increase the area in contact with the epoxy resin, the average particle diameter of the hardener particles is preferably smaller, but when the average particle diameter of the hardener particles becomes too large, 14

FilerTWl009F-IPO.doc

FilerTWl009F-IPO.doc SUNDIAL CONFIDENTIAL ′ It is difficult to form capsules, so m is more than 50 // m is less than. It takes hours to mix the hardener particles. The difference between the particle size of the hardener particles and the smaller the average particle size of the hardener particles is preferably 0.5 or more. As mentioned above, when the resin particles and latent hardeners are processed through the process, Hybrid deletion (for example, "NHS_0" manufactured by Nara Machinery Co., Ltd.) can be used. The ratio of the hardening age to the capsule material is calculated by the formula. Formula (1) ... M / m = DXF / (4xdxf) In the above formula ⑴, M is the amount of hardener particles added (g), m is the amount of sacrifice material added (g), D is the average particle diameter (#m) of the powdery hardener particles; d is the average particle diameter (#m) of the capsule material, F is the specific gravity of the hardener particles, and f is the specific gravity of the capsule material. In addition, the specific gravity refers to the density ratio of each substance to the density of water when the standard substance is at 4 ° C. However, the above formula (1) is a theoretical formula, and the optimum addition ratio of the hardener particles and the capsule material is determined depending on the situation. In addition, if a thermoplastic resin is added to the adhesive, the properties of the thermoplastic resin will increase cohesion and the adhesiveness of the adhesive will be higher. If a highly polar thermoplastic resin is used, the thermoplastic resin not only adds to the hardening reaction of the epoxy resin, but also combines with the inorganic material through the silane coupling agent (Silane Coupling). Therefore, not only does the adhesive harden more, it also improves the affinity with the coating of inorganic materials. 15 200409785

File: TW 1009F-lPO.doc 1 SUNDIAL CONFIEiENTlAl: ▲ In order to make the above-mentioned inventions, special gifts, and advantages of the present invention more obvious and understandable, the following exemplified-the preferred embodiment, and with the accompanying drawings, make The detailed description is as follows: [Embodiment] The process for manufacturing the latent hardener of the present invention is described below. First, the metal adduct-aluminum adduct is dissolved in an organic solvent to prepare a metal adduct dissolving agent, and then the above metal fold compound solution is spray-dried by a spray-drying device to obtain a hardened product (spray Dryer method). Numeral 31 in FIG. 1 (a) indicates hardenable particles. Then prepare a melting point above 30 ° C, below 35 ° (rc, thermal decomposition temperature above 50 ° C, 500t: below, softening temperature above 0t: above 3 ° (Γ (: below, glass transition temperature at -40 ° C) Powder resin (resin particles) of various conditions above 30 (TC and below). The ratio of the average particle diameter of the resin particles to the average particle diameter of the hardener particle material is 100 or more. 80. Next, the hardenable particles are 31. After mixing with the resin particles in a predetermined addition ratio /% σ and mixing in the mixing device, the resin particles having an average particle size smaller than the hardener particles 31 will be electrostatically adhered and coated on the surface of the hardener particles 31 (mixed Engineering). The symbol in the figure shows the capsule material in this state. The surface of each hardener particle 3 is covered with many resin particles 32. 16 200409785

File: TW 1009F-IPO.doc

SUNDIAL CONFIDENTIAL Put the hardener particles 3 with electrostatically attached resin particles 32 on the surface.] Put them into the hardener particle 3 of the stirring device. The resin particles 32 on the surface will be mixed with the resin particles 32 on the surface of other hardening particles 31, or they will be stirred. The rotating fan blades, inner walls, etc. of the device collide, or friction generates heat, and the resin particles 32 are melted. The melted resin particles 32 become one body (stirring process). Reference numeral 33 in FIG. 1 (C) shows a capsule formed by the resin particles 32 as a whole. The capsule 3 3 covers the entire surface of the hardener particles 31, and the hardener particles 31 and the capsule 33 constitute a latent hardener 30. Next, the adhesive of the present invention made using the latent hardener 3 will be described. And the manufacturing process of electrical equipment using the adhesive of the present invention. The epoxy resin, the thermoplastic resin, the Silane Coupling, which is a thermosetting resin, the above-mentioned latent hardener 30, the conductive particles, and the solvent are mixed and stirred according to a predetermined addition ratio, respectively. Then agent. In this state, the adhesive is paste-like. Reference numeral 21 in FIG. 2 (a) shows a release film. A certain amount of the above-mentioned adhesive is applied to the surface of the release adhesive film 21, and the solvent in the adhesive will evaporate after drying to form a coating layer of the adhesive (Fig. 2 (b)). The symbol 2G in Figure 2 (b) shows the state where the coating layer 25 is formed.

17

File: TW 1009F-IPO.doc »''

Adhesive film for SUNDIAL CONFIDENTIAL. Reference numeral 27 in the figure shows conductive particles dispersed in the adhesive as the latent hardener 30. In this state, the hardenable particles 31 of the latent hardener 30 are enclosed in the capsule 33 and the hardenable particles 30 do not contact the silane coupling agent (Sdane Coupling) in the adhesive constituting the coating layer 25 of the figure. Hardening reaction does not occur with the coating layer. Reference numeral 11 in FIG. 3 (a) shows an LCD, and the LCDU forms a narrow, multi-branch IT0 electrode 13 (Indium tin oxide) on one side of the glass substrate 12 and the glass substrate 12. This figure shows five ιτ〇 electrodes 13. On the surface of the LCD 11 where the ITO electrode 13 is formed, a Tcp portion, which will be described later, is connected to the coating layer 25 (FIG. 3 (b)) supporting the adhesive film 20 shown in FIG. 2 (b). Since the adhesive force between the release film 21 and the coating layer 25 is smaller than that between the coating layer and the ITO electrode 13, when the release film 2 is peeled off, the coating layer 25 remains on the LCD 11 (No. 3 (c) Figure). Reference numeral 15 in FIG. 5 indicates TCP. TCP15 has a long base film 6 On one side of the base film 16, narrow metal wirings 7 are arranged along the length direction of the base film 16 (the figure here shows five metal wirings). The ends of the metal wiring 17 in the longitudinal direction are located at the ends of the base film 6 in the longitudinal direction, respectively. Figure 3 (d) is not a cross-sectional view taken along line A-A in Figure 5.

File: TW1009F-IPO.doc SUNDIAL CONFIDENTIAL The surface of the metal wiring 17 on the side of the TCP15 is facing the LCD11ITO electrode 13, the end of the TCP15 is opposite the coating layer 25 of the ITO electrode 13, the IT0 electrode 13 of the LCD11 and the metal of TCPI5 The wirings 17 are opposed to each other. In this state, the surface on which the metal wiring 17 of TCP15 is arranged is pressed against the coating layer 25, and the overlapping portion of TCP15 and LCD11 is pressed together, and then the whole is heated, so that the coating layer 25 is softened. Because pressing the metal wiring 17 will push the softened coating layer 25 back, the conductive particles 27 in the remaining coating layer 25 will be sandwiched between the metal wiring 17 and the ITO electrode 13 (Section 4 (e) Figure). If heating and pressing are continued in this state, heating will cause the capsule 33 to deflate or soften, and the mechanical strength of the capsule 33 will be significantly weakened. At this time, because the hardener particles are thermally expanded due to heating, the capsule 33 that is weakened in mechanical strength due to heating is broken, and the hardener particles 31 and the epoxy resin and the silane coupling agent (Silane Coupling) in the coating layer 25 are broken. ) Mix 0 When the hardener particles 31 are mixed with the epoxy resin and the silane coupling agent (Silane Coupling) in the coating layer 25, the compound containing the hardener particles 31 will be mixed with the silane coupling agent (Silane Coupling). As a result, the cations in the coating layer 25 are released. This cation causes the epoxy to proceed (cation overlap), and the metal wiring Π and the Ito electrode 13 will be in the package 19 * 1 200409785

File: TW1009F-IPO.doc SUNDIAL CONFIDENTIAL · The conductive layer 27 is sandwiched, and the coating layer 25 is hardened in this state. (Fig. 4 (f)) The numeral 10 in Fig. 4 (f) shows the electrical equipment in which the coating layer 25 is hardened. In this electrical device 10, not only the metal wiring Π and the Ito electrode 13 can continue to be connected through the conductive particles 27, but also the LCD 11 and the TCP 15 are hardened and the coating layer 25 is mechanically connected. In this way, the adhesive of the present invention not only has excellent storage properties, but also hardens the epoxy resin due to the superposition of cations. The adhesive can harden the adhesive at a lower temperature and in a shorter time than conventional hardeners. [Example] An aluminum compound (Alumiun Tris acetactate manufactured by Kawaken Seika Chemical Co., Ltd.) (trade name "I Lukate A (W)" and an inscription Alcolrat (Kawaken Seiko Chemical Co., Ltd.) were used. Manufactured Alumium Isopropylate (trade name "AIPD")), disperse them separately in the solvent methethyl ethyl ketone I (Methyl ethyl ketone), respectively, to make a metal admixture solution containing 10% by weight of the adduct, A metal Alcolart solution containing 10% by weight of Alcolart. Next, using a spray drying device (trade name "GC-31" manufactured by Yamato Lapochic Co., Ltd.), spray 20 200409785 at a spray inlet temperature of 80 ° C.

File: TW 1009F-lPO.doc SUNDIAL CONFIDENTIAL Dry mouse gas inflow Mist outlet temperature of 60 ° C, spray pressure of 1kg / c m2 MW minutes, spray the metal admixture solution and metal partial milk solution separately, It is dried and made into 2 kinds of powdery hardeners (hardener particles) (spray drying method). In addition, Shuyuko 32, a powdery fluorinated resin (manufactured by Daikin Industry Co., Ltd., with a trade name of "Lupron L-5", having a primary particle diameter of 0.2 v m and a melting point of 327.0) was prepared. Using the product manufactured by Nara Machinery Manufacturing Co., Ltd. under the trade name "Hybndaize BU NHS-0", the hardener particles 31 to 20 parts by weight and the resin particles 32 to 3 parts are used in the process described in item i) above. After mixing, the resin particles 32 are electrostatically adhered to the surface of the hardener (mixing process), and are stirred at a running speed of 100111 / sec and a processing time of 5 minutes (stirring process) to form capsules 33 to obtain 2 types Of potential hardener 30. Thermoplastic resin bis phenol A-type epoxy resin (manufactured by Petrochemical Shell Epoxy Co., Ltd., trade name [r EP828] 50 weight part is added with thermoplastic resin phenoxy resin ( 50 parts by weight of Toto Kasei Co., Ltd. under the trade name "YP50", silane coupling agent (Silane Coupling) (manufactured by Unika Co., Ltd. under the trade name "A-187") 1 part by weight, 2.5 conductive particles 10 parts by weight, 10 parts by weight of each latent hardener, and organic solvent, and then dispersed into 糨 14200200409

File: TW 1009F-IPO.doc

SUNDIAL CONFIDENTIAL Paste adhesive, these adhesives were used in the process of the second and third drawings to prepare the adhesive film 20 of Examples 1 and 2. The following "room temperature storage test" and "40.0 storage test" were performed using the adhesive films 20 of these Examples 1 and 2, respectively. [Room Temperature Storage Test] Using these adhesive films 20 of Examples 1 and 2 and Comparative Examples 1 and 2, the above-mentioned Figures 3 (a) to 3 (d), 4 (e), and 4 (f) In the process shown in the figure, after TCP15 is connected to the LCDU, the peel strength (initial peel strength) of Tcpi5 on the LCDn is measured. In addition, the adhesive films 20 ′ of Examples 1 and 2 and Comparative Examples i and 2 were stored at room temperature (25t :) for 1 day, 3 days, and 7 days, respectively, and each of the adhesive films 20 after storage was the same as described above. After the connection of TCP15 and LCDU, the peeling strength (peeling strength after storage) of Tcpi5 on LCDU was measured. [Storage Test at 40 ° C] This test saves the bonding film 20 under the same conditions in the "room temperature storage test" described in uranium, except that the storage temperature of the bonding film 20 is adjusted from room temperature to 4 C. The TCpi5 and After LCD11 is connected, measure peel strength after storage 22 200409785 money

File: TW 1009F-IPO.doc SUNDIAL CONFIDENTIAL degree. In the above-mentioned "room temperature storage test" and "40 ° C storage test", if the peel strength after storage reaches 90% or more of the initial peel strength, "◎" is drawn, and 80% or more and 90% or less "0", 70 Above "%" and "80%" draw "△" and below 70% draw "X" for evaluation. The evaluation results are shown in Table 2 below. 【Table 1】

Table 1: Results of evaluation tests

Stored at 40 ° C at room temperature. Stored on the 3rd, 7th, and 3rd days. Example 1 ◎ ◎ ◎ 〇 Example 2 ◎ ◎ ◎ 〇 Comparative Example 1 XXXX Comparative Example 2 XXXX Comparative Examples 1 and 2 in Table 1 above will be implemented The two types of hardener particles used in Examples 1 and 2 were directly added to the adhesive without forming a capsule. In addition, TCP15 is configured with 25 // m metal wiring at 25 # m intervals. LCD11 has a surface area of 1 cm2. The resistance is formed by 100 IT0 electrode 13. The overlap between TCP15 and LCD11 is added. After applying a load of 3Mpa, do heating for 10 seconds to increase the temperature of the coating layer 25 23 200409785

File: TW 1009F-IPO.doc is connected to 13 (TC. SUNDIAL CONFIDENTIAL · * As can be seen from Tables 1 and 2 above, in Examples i and 2 in which hardener particles 31 are enclosed in capsules 33, The evaluation results of the "room temperature storage test" and the 40 C storage test were both good. On the other hand, in Comparative Examples 1 and 2 in which the capsule was not formed and the curing agent was directly added to the adhesive, the results of each storage test were also obtained. All of them were inferior. From these results, it was confirmed that the adhesive using the latent hardener of the present invention has excellent storage stability.

The case where the adhesive film is produced using the adhesive agent has been described above, but the application of the present invention is not limited to this. For example, the adhesive agent may be directly used in the form of a paste. The symbol 11 shown in FIG. 6 (a) is the same as that shown in FIG. 3 (a). It is an LCD. When the LCD11 is connected to TCP1 ^ S, it must first be on the surface of the ITO electrode 13 of LCDII and on the surface of TCP15. Adhesive is applied to the connected portions to form a coating layer 45 of the adhesive (FIG. 6 (b)).

Then, after performing the alignment of TCP15 in the process shown in Figure 3 (d) above, in the process shown in Figures 4 (e) and 4 (f) above, connect TCP15 to LCD11 to obtain electrical equipment 40 (Figure 6 (c)). The case where TCP15 and LCD11 are connected using an adhesive has been described above, but the application of the present invention is not limited to this. It can be used for the connection of substrates and semiconductor wafers and in the manufacture of various electrical equipment.

24 200409785

File: TW 1009F-IPO.doc '. 1

SUNDIAL CONFIDENTIAL The above description refers to the case where conductive particles are dispersed in an adhesive, but the application of the present invention is not limited to this. For example, adhesives containing no conductive particles are also included in the scope of the present invention. As the metal compound, various metal compounds such as a complex compound, a titanium compound, and an aluminum compound can be used. Among them, the most reactive compound is preferred. In addition, the method for producing the hardener particles by the spray drying method has been described above, but the present invention is not limited to this. The case of using a fluorinated resin having a melting point of 327t: has been described above, but the scope of use of the present invention is not limited to this, as long as the melting point is within 30 ×: above 350 C, and the thermal decomposition temperature is above 50 ° C and 500 ° C , The softening temperature is above 300 ° C. (: Below, one of conditions such as glass transition temperature of -40 ° C to 300 ° C, etc., thermoplastic resins, bridging resins, gel resins can also be used. For the above resins, for example, look at acrylic Resin (manufactured by Nippon Paint Co., Ltd., trade name "Micro Gel"), Poly-methyl methacrylate resin (r mp series manufactured by Soken Chemical Co., Ltd.), Benzodiguanamine resin ( "Product name" Eposter "made by Japan Catalyst Co., Ltd., Silicon Resin (made by GE Toshiba Silicon Co., Ltd., trade name" Tospar "), etc. The capsules formed by dissolving the resin particles having the above characteristics are Capsule 25 200409785 pile: TWl 009F-IPO.doc

SUNDIAL CONFIDENTIAL In the project, the resin constituting the resin particles sometimes undergoes chemical deterioration. This may be because the melting point, thermal decomposition temperature, softening temperature, and glass transition temperature of the capsules exceed the previous resin temperature range. The above thermosetting resin is described using an epoxy resin as an example, but the application of the present invention is not limited to this. If it is a cationic resin, such as urea resin, melamine resin, phenol resin, vinyl ether resin, oxetane resin, etc., but if the strength of the adhesive after hardening is considered, It is best to use epoxy. In addition, the silane coupling agent (Silane used in the present invention

Coupling) is preferably a substance represented by the following formula (1). [Chemical 2]

ATX —Si—χ3 …… General formula (5) X4 (In the general formula (5) above, at least one of the substituents X1 to X4 is an alkoxy group. The alkoxy group is best It is methoxy (Methoxy) or ethoxy (Ethoxy). In addition, among the substituents X1 to X4 other than alkoxy, it is preferred that at least one of the substituents is epoxy or ethylene. It is a Glycidil group with an epoxy-substituted group. It has a B 26 200409785 • 1 · 4 1

File: TW1009F-IPO.doc SUNDIAL CONFiL) ENTIAL The base is, for example, the Metacryloxipropil base. In addition, all of the substitution groups XI to X4 may be Alchoxy groups, that is, so-called silicates. ) In addition to Phenoxy resins, thermoplastic resins, such as polyethylene resin, urinary resin, Polyvinyl acetate, Ethylene Vinyle Acetate, polybutadiene rubber, etc. Can also be used. In addition to the present invention, additives such as an anti-aging agent, a filler, and a colorant may be added. ® In the adhesive of the present invention, since the hardener particles composed of the metal admixture are coated with capsules, the epoxy resin does not overlap at normal temperature, and the adhesive has high storage stability. In addition, the adhesive of the present invention is hardened due to the cationic superposition reaction of the epoxy resin. The superposition reaction of the cations is lower than the temperature at which the superposition reaction of the conventional hardener occurs in the past. Therefore, the adhesive of the present invention can be cured at a lower temperature and in a shorter time than the conventional adhesive. In summary, although the present invention has been disclosed as # above in a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various changes without departing from the spirit and scope of the present invention. Changes and retouching, therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent application. 27 200409785 «1 4

File: TW 1009F-IPO.doc SUNDIAL CONFIDENTIAL [Brief description of the drawings] Figures 1 (a) to 1 (c) are explanatory drawings for an example of a latent hardener manufacturing process of the present invention. Figures 2 (a) and 2 (b) are drawings for explaining an example of the process of manufacturing an adhesive film using the adhesive of the present invention. Figures 3 (a) to 3 (d) are drawings for the first half of the engineering description for bonding the LCD and TCP using the adhesive of the present invention. Figures 4 (e) and 4 (f) are diagrams for explaining the semi-process after TCP and LCD are bonded. Fig. 5 is a plan view illustrating the state where the TCP and the LCD are aligned. Figures 6 (a) to 6 (c) are explanatory diagrams of other examples of the bonding process using the adhesive of the present invention. Figures 7 (a) to 7 (c) are explanatory diagrams of the process of bonding LCD and TCP using an adhesive using traditional technology. Description of figure numbers 20, 45: Adhesive (coating layer) 3 0: Potential hardener 31: Hardener particles 32: Capsule material 28 200409785 SUNDIAL CONFIDENTIAL:

File: TW 1009F-IPO.doc 33: Capsule

29

Claims (1)

200409785 File: TWl 009F-iPO.doc SUNDIAL CONFIDENTIAl: Capsules with hardener particles and covering the surface of this hardening application patent 1. A potential hardener particle surface, the hardener particles are metal philosophical compounds or metals One or both of the Ak phases are the main components. The latent hardener described in Patent Model ® Item 丨, wherein the main component of the metal admixture is an aluminum adduct. If the patent scope is declared! The latent hardener according to the above item, wherein the main component of the metal Alcolart is aluminum Akolart. 4. The latent hardener according to item 丨 of the application scope, wherein the main component of the resin component is a fluorinated resin. 5. The latent hardener as described in item 1 of the scope of the patent application, wherein the capsule is a tree-moon particle having an average particle diameter smaller than the average particle diameter of the hardener particle, and the resin particles will adhere to the surface of the aforementioned hardener After melting, it forms any potential hardener as described in items 1 to 4 of the aforementioned patent application scope. 6. The potential hardener described in item 5 of the scope of patent application, wherein the melting point of the resin particles is above 30 ° C and below 350 ° C. 7. The latent hardener as described in item 5 of the scope of patent application, wherein the thermal decomposition temperature of the resin particles is above 50 ° C and 500X: below. 30 200409785 File: TW 1009F-IPO.doc SUNDIAL CONFIDENTIAL · 8. The latent hardener described in item 5 of the scope of patent application, wherein the softening temperature of the resin particles is above 0 ° C and below 300 ° C. 9. The latent hardener as described in item 5 of the scope of patent application, wherein the glass transition temperature of the resin particles is above -40 ° C and 300. (: Hereinafter.) A method of manufacturing a latent hardener, the method includes hardener particles, the capsules coated on the surface of the hardener particles, and the private and industrial workers who manufacture the hardener, and the method further includes The resin component is used as a main component, and powder-like resin particles having an average diameter smaller than the hardener particles are attached to the surface of the hardener particles, and the resin particles attached to the surface of the hardener particles are dissolved to form The capsule encapsulation process. 11. The manufacturer of the latent hardener described in item 10 of the patent application scope has two processes. One is the encapsulation process, which uses mixing the hardener particles with the capsule material. The second step is to make the surface of the hardener particles adhere to the capsule material. The second step is to stir the hardener particles while the capsule material is attached to the capsule material to melt. I2 · 如The method for manufacturing a potential change brake according to one of the scope of application patent No. 10 and u, the ratio of the average particle diameter of the hardener particles to the average particle diameter of the capsule material is 1 00: 80. 13. The method for producing a latent hardener as described in one of items 10 and u of the scope of the patent application, the average particle size of the hardener particles for the capsule material 31 200409785 SUNDIAL CONFldENTIAL · File: TW The ratio of the average particle diameter of 1009F-IPO.doc is 100: 50. 14. An adhesive, which contains a thermosetting resin, a silane coupling agent (Silane Coupling), and any of the patent application scope items 1 to 9 A latent hardener as described in one item.