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SG148911A1 - Method for the single-sided polishing of bare semiconductor wafers - Google Patents

Method for the single-sided polishing of bare semiconductor wafers

Info

Publication number
SG148911A1
SG148911A1 SG200802734-4A SG2008027344A SG148911A1 SG 148911 A1 SG148911 A1 SG 148911A1 SG 2008027344 A SG2008027344 A SG 2008027344A SG 148911 A1 SG148911 A1 SG 148911A1
Authority
SG
Singapore
Prior art keywords
polishing
bare semiconductor
semiconductor wafers
sided polishing
semiconductor wafer
Prior art date
Application number
SG200802734-4A
Inventor
Klaus Roettger
Klaus-Peter Meier
Norbert Graeml
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG148911A1 publication Critical patent/SG148911A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H10P52/00—
    • H10P52/402—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Method for the Single-Sided Polishing of Bare Semiconductor Wafers The invention relates to a method for the single-sided polishing of a bare semiconductor wafer by using a polishing head with a membrane made of a resilient material, by which the polishing pressure is transmitted onto the backside of the semiconductor wafer to be polished, wherein the semiconductor wafer is pressed against a polishing cloth with a smooth surface while supplying a polishing agent and is prevented from sliding off the membrane by a retainer ring. The retainer ring is provided with channels on a side surface facing the polishing cloth.
SG200802734-4A 2007-06-06 2008-04-09 Method for the single-sided polishing of bare semiconductor wafers SG148911A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007026292A DE102007026292A1 (en) 2007-06-06 2007-06-06 Process for one-sided polishing of unstructured semiconductor wafers

Publications (1)

Publication Number Publication Date
SG148911A1 true SG148911A1 (en) 2009-01-29

Family

ID=39942082

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200802734-4A SG148911A1 (en) 2007-06-06 2008-04-09 Method for the single-sided polishing of bare semiconductor wafers

Country Status (7)

Country Link
US (1) US20080305722A1 (en)
JP (1) JP2008306189A (en)
KR (1) KR100945761B1 (en)
CN (1) CN101320690A (en)
DE (1) DE102007026292A1 (en)
SG (1) SG148911A1 (en)
TW (1) TW200849357A (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009030292B4 (en) * 2009-06-24 2011-12-01 Siltronic Ag Method for polishing both sides of a semiconductor wafer
DE102009030295B4 (en) * 2009-06-24 2014-05-08 Siltronic Ag Method for producing a semiconductor wafer
DE102009038941B4 (en) 2009-08-26 2013-03-21 Siltronic Ag Method for producing a semiconductor wafer
DE102009051008B4 (en) 2009-10-28 2013-05-23 Siltronic Ag Method for producing a semiconductor wafer
DE102009052744B4 (en) 2009-11-11 2013-08-29 Siltronic Ag Process for polishing a semiconductor wafer
DE102010005904B4 (en) 2010-01-27 2012-11-22 Siltronic Ag Method for producing a semiconductor wafer
DE102010010885B4 (en) * 2010-03-10 2017-06-08 Siltronic Ag Method for polishing a semiconductor wafer
DE102010013520B4 (en) 2010-03-31 2013-02-07 Siltronic Ag Process for double-sided polishing of a semiconductor wafer
DE102010014874A1 (en) 2010-04-14 2011-10-20 Siltronic Ag Method for producing a semiconductor wafer
DE102010024040A1 (en) 2010-06-16 2011-12-22 Siltronic Ag Process for polishing a semiconductor wafer
CN102263024A (en) * 2011-07-18 2011-11-30 北京通美晶体技术有限公司 Back side anticorrosion method of single side polishing wafer
DE102011082777A1 (en) 2011-09-15 2012-02-09 Siltronic Ag Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer
DE102011089362B4 (en) 2011-12-21 2014-01-16 Siltronic Ag A method of polishing a substrate of semiconductor material
DE102012201516A1 (en) 2012-02-02 2013-08-08 Siltronic Ag Semiconductor wafer polishing method for semiconductor industry, involves performing removal polishing on front and back sides of wafer, and single-sided polishing on front side of wafer in presence of polishing agent
DE102013204839A1 (en) 2013-03-19 2014-09-25 Siltronic Ag Method of polishing a wafer of semiconductor material
DE102013205448A1 (en) 2013-03-27 2014-10-16 Siltronic Ag A method of polishing a substrate of semiconductor material
DE102013213838A1 (en) 2013-07-15 2014-09-25 Siltronic Ag A method of polishing a substrate of semiconductor material
DE102015217109B4 (en) 2015-09-08 2022-08-18 Siltronic Ag Process for polishing a substrate made of semiconductor material

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US5769696A (en) * 1995-02-10 1998-06-23 Advanced Micro Devices, Inc. Chemical-mechanical polishing of thin materials using non-baked carrier film
JP3106418B2 (en) * 1996-07-30 2000-11-06 株式会社東京精密 Polishing equipment
US5944583A (en) * 1997-03-17 1999-08-31 International Business Machines Corporation Composite polish pad for CMP
US6132294A (en) * 1998-09-28 2000-10-17 Siemens Aktiengesellschaft Method of enhancing semiconductor wafer release
US6287174B1 (en) * 1999-02-05 2001-09-11 Rodel Holdings Inc. Polishing pad and method of use thereof
US6527624B1 (en) * 1999-03-26 2003-03-04 Applied Materials, Inc. Carrier head for providing a polishing slurry
US6224472B1 (en) 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6267643B1 (en) * 1999-08-03 2001-07-31 Taiwan Semiconductor Manufacturing Company, Ltd Slotted retaining ring for polishing head and method of using
DE60138343D1 (en) * 2000-07-31 2009-05-28 Ebara Corp Substrate holder and polishing device
EP1193031A1 (en) * 2000-09-29 2002-04-03 Infineon Technologies SC300 GmbH & Co. KG Arrangement for polishing disk-like objects
DE10058305A1 (en) 2000-11-24 2002-06-06 Wacker Siltronic Halbleitermat Process for the surface polishing of silicon wafers
US7192340B2 (en) * 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
US20030124963A1 (en) * 2001-12-27 2003-07-03 Applied Materials, Inc. Carrier head with a non-stick membrane
WO2003061904A1 (en) * 2002-01-22 2003-07-31 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
DE10217374A1 (en) * 2002-04-18 2003-06-18 Wacker Siltronic Halbleitermat Production of semiconductor wafers made from silicon comprises sawing a single crystal made from silicon into silicon wafers, forming a mechanical cut on both sides of the wafers, polishing using polishing plates, and surface polishing
US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
JP2005026538A (en) * 2003-07-04 2005-01-27 Renesas Technology Corp Manufacturing method of semiconductor integrated circuit device
KR100600231B1 (en) * 2003-07-12 2006-07-13 동부일렉트로닉스 주식회사 CMP polishing head and its operation method
US6821192B1 (en) * 2003-09-19 2004-11-23 Applied Materials, Inc. Retaining ring for use in chemical mechanical polishing
TWI280177B (en) * 2004-02-02 2007-05-01 Powerchip Semiconductor Corp Dummy process of chemical mechanical polishing process and polishing pad conditioning method
US6951510B1 (en) 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
US7201642B2 (en) * 2004-06-17 2007-04-10 Systems On Silicon Manufacturing Co. Pte. Ltd. Process for producing improved membranes
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
KR100632468B1 (en) * 2005-08-31 2006-10-09 삼성전자주식회사 Retainer Rings, Polishing Heads & Chemical Mechanical Polishing Devices
JP2008062355A (en) * 2006-09-08 2008-03-21 Fujitsu Ltd Polishing apparatus and method for manufacturing electronic apparatus

Also Published As

Publication number Publication date
US20080305722A1 (en) 2008-12-11
DE102007026292A1 (en) 2008-12-11
CN101320690A (en) 2008-12-10
KR20080107258A (en) 2008-12-10
KR100945761B1 (en) 2010-03-08
TW200849357A (en) 2008-12-16
JP2008306189A (en) 2008-12-18

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