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SE8106889L - Berelement for komponenter i form av integrerade kretsar - Google Patents

Berelement for komponenter i form av integrerade kretsar

Info

Publication number
SE8106889L
SE8106889L SE8106889A SE8106889A SE8106889L SE 8106889 L SE8106889 L SE 8106889L SE 8106889 A SE8106889 A SE 8106889A SE 8106889 A SE8106889 A SE 8106889A SE 8106889 L SE8106889 L SE 8106889L
Authority
SE
Sweden
Prior art keywords
module
relationship
components
integrated circuits
film
Prior art date
Application number
SE8106889A
Other languages
English (en)
Other versions
SE457677B (sv
Inventor
J Hoppe
Y Haghiri-Tehrani
Original Assignee
Gao Ges Automation Org
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19803046192 external-priority patent/DE3046192A1/de
Application filed by Gao Ges Automation Org filed Critical Gao Ges Automation Org
Publication of SE8106889L publication Critical patent/SE8106889L/sv
Publication of SE457677B publication Critical patent/SE457677B/sv

Links

Classifications

    • H10W72/701—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H10W70/699—
    • H10W72/07236—
    • H10W72/5522—
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
SE8106889A 1980-11-21 1981-11-19 Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort SE457677B (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3043877 1980-11-21
DE19803046192 DE3046192A1 (de) 1980-12-08 1980-12-08 Traegerelement fuer ic-bausteine

Publications (2)

Publication Number Publication Date
SE8106889L true SE8106889L (sv) 1982-05-22
SE457677B SE457677B (sv) 1989-01-16

Family

ID=25789226

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8106889A SE457677B (sv) 1980-11-21 1981-11-19 Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort

Country Status (7)

Country Link
US (1) US4549247A (sv)
CH (1) CH661816A5 (sv)
FR (1) FR2494908B1 (sv)
GB (1) GB2088630B (sv)
IT (1) IT1139726B (sv)
NL (1) NL189937C (sv)
SE (1) SE457677B (sv)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
FR2565408B1 (fr) * 1984-05-30 1987-04-10 Thomson Csf Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
US4713730A (en) * 1985-10-07 1987-12-15 Rockwell International Corporation Microwave plug-in signal amplifying module solderment apparatus
IL80683A0 (en) * 1985-12-20 1987-02-27 Hughes Aircraft Co Chip interface mesa
US4870476A (en) * 1986-02-13 1989-09-26 Vtc Incorporated Integrated circuit packaging process and structure
FR2617666B1 (fr) * 1987-07-02 1989-10-27 Bull Cp8 Carte a microcircuits electroniques et son procede de fabrication
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
US4937656A (en) * 1988-04-22 1990-06-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
EP0339763A3 (en) * 1988-04-28 1990-04-25 Citizen Watch Co. Ltd. Ic card
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
USRE35385E (en) * 1988-12-12 1996-12-03 Sgs-Thomson Microelectronics, Sa. Method for fixing an electronic component and its contacts to a support
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US20010030370A1 (en) * 1990-09-24 2001-10-18 Khandros Igor Y. Microelectronic assembly having encapsulated wire bonding leads
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
KR930024126A (ko) * 1992-05-12 1993-12-22 아키라 기타하라 표면실장소자와 그의 반제품
US5255430A (en) * 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
DE19532755C1 (de) * 1995-09-05 1997-02-20 Siemens Ag Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls
DE19535775C2 (de) * 1995-09-26 2000-06-21 Siemens Ag Verfahren zum elektrischen Verbinden eines Kontaktfeldes eines Halbleiterchips mit zumindest einer Kontaktfläche sowie danach hergestellte Chipkarte
DE19635732A1 (de) * 1996-09-03 1998-03-05 Siemens Ag Trägerelement für einen Halbleiterchip
ATE207243T1 (de) * 1996-05-17 2001-11-15 Infineon Technologies Ag Trägerelement für einen halbleiterchip
DE19840248A1 (de) * 1998-09-03 2000-03-16 Fraunhofer Ges Forschung Schaltungschip mit spezifischer Anschlußflächenanordnung
DE102005044001B3 (de) * 2005-09-14 2007-04-12 W.C. Heraeus Gmbh Laminiertes Substrat für die Montage von elektronischen Bauteilen
DE102009023405A1 (de) * 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés
US3649950A (en) * 1970-01-27 1972-03-14 Amp Inc Post connector and assembly
US3702464A (en) * 1971-05-04 1972-11-07 Ibm Information card
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
DE2414297C3 (de) * 1974-03-25 1980-01-17 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur teilautomatischen Herstellung von Zwischenträgern für Halbleiterbauelemente
US4177519A (en) * 1975-07-28 1979-12-04 Sharp Kabushiki Kaisha Electronic control assembly mounted on a flexible carrier and manufacture thereof
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape
JPS52124865A (en) * 1976-04-13 1977-10-20 Sharp Corp Semiconductor device
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Industrial Co Ltd Device for attaching chip circuit parts
FR2382101A1 (fr) * 1977-02-28 1978-09-22 Labo Electronique Physique Dispositif a semi-conducteur, comportant des pattes metalliques isolees
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein

Also Published As

Publication number Publication date
FR2494908B1 (fr) 1986-12-26
NL8105002A (nl) 1982-06-16
SE457677B (sv) 1989-01-16
US4549247A (en) 1985-10-22
GB2088630A (en) 1982-06-09
CH661816A5 (de) 1987-08-14
IT8125059A0 (it) 1981-11-13
IT1139726B (it) 1986-09-24
NL189937B (nl) 1993-04-01
GB2088630B (en) 1985-02-13
NL189937C (nl) 1993-09-01
FR2494908A1 (fr) 1982-05-28

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