SE0501028L - Hybrid radiation curable composition and use thereof - Google Patents
Hybrid radiation curable composition and use thereofInfo
- Publication number
- SE0501028L SE0501028L SE0501028A SE0501028A SE0501028L SE 0501028 L SE0501028 L SE 0501028L SE 0501028 A SE0501028 A SE 0501028A SE 0501028 A SE0501028 A SE 0501028A SE 0501028 L SE0501028 L SE 0501028L
- Authority
- SE
- Sweden
- Prior art keywords
- radiation curable
- free radical
- curable composition
- compound
- hybrid radiation
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 150000003254 radicals Chemical class 0.000 abstract 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
- 125000002091 cationic group Chemical group 0.000 abstract 1
- 239000012952 cationic photoinitiator Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-M crotonate Chemical group C\C=C\C([O-])=O LDHQCZJRKDOVOX-NSCUHMNNSA-M 0.000 abstract 1
- -1 epoxide compound Chemical class 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000012949 free radical photoinitiator Substances 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Paints Or Removers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Epoxy Resins (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0501028A SE0501028L (sv) | 2005-05-04 | 2005-05-04 | Hybrid radiation curable composition and use thereof |
| PCT/SE2006/000531 WO2006118532A1 (en) | 2005-05-04 | 2006-05-03 | Hybrid radiation curable composition and use thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE0501028A SE0501028L (sv) | 2005-05-04 | 2005-05-04 | Hybrid radiation curable composition and use thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE0501028L true SE0501028L (sv) | 2006-11-05 |
Family
ID=37308239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE0501028A SE0501028L (sv) | 2005-05-04 | 2005-05-04 | Hybrid radiation curable composition and use thereof |
Country Status (2)
| Country | Link |
|---|---|
| SE (1) | SE0501028L (sv) |
| WO (1) | WO2006118532A1 (sv) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117682871A (zh) * | 2023-12-22 | 2024-03-12 | 辽宁省轻工科学研究院有限公司 | 应用于3d打印的低收缩光固化陶瓷浆料、制备方法及零缺陷陶瓷制品成型方法 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101291891B1 (ko) | 2005-09-13 | 2013-07-31 | 3디 시스템즈 인코오퍼레이티드 | Abs-유사 물품을 제조하기 위한 광경화성 조성물 |
| JP5205666B2 (ja) * | 2006-10-11 | 2013-06-05 | コリンズ・インク・コーポレイシヨン | 放射線硬化性インク |
| JP2010520947A (ja) * | 2007-03-14 | 2010-06-17 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | Abs様物品を製造するための光硬化性組成物 |
| CA2761159A1 (en) | 2009-06-12 | 2010-12-16 | E. I. Dupont De Nemours And Company | Process for multilayer coating |
| EP2440619B1 (en) * | 2009-06-12 | 2015-08-12 | Coatings Foreign IP Co. LLC | Radiation curable coating compositions |
| CN102167962B (zh) * | 2011-03-22 | 2013-04-10 | 深圳市飞世尔实业有限公司 | 一种用于光学玻璃镜片粘接的光固化胶粘剂及其制备方法 |
| CN102436145B (zh) * | 2011-09-01 | 2013-05-22 | 南昌大学 | 一种立体光刻快速成型光敏树脂及制备方法 |
| CN103305092A (zh) * | 2013-05-24 | 2013-09-18 | 无锡市华明化工有限公司 | 一种防腐蚀涂料及其制备方法 |
| CN103275592A (zh) * | 2013-05-24 | 2013-09-04 | 无锡市华明化工有限公司 | 一种防腐蚀丙烯酸酯涂料及其制备方法 |
| US10604659B2 (en) | 2015-06-08 | 2020-03-31 | Dsm Ip Assets B.V. | Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication |
| EP3341793B1 (en) * | 2015-10-01 | 2021-05-26 | DSM IP Assets B.V. | Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication |
| SE1730346A1 (en) | 2017-12-19 | 2019-06-11 | Perstorp Ab | A hybrid photopolymer composition for additive manufacturing |
| CN108441090B (zh) * | 2018-02-28 | 2020-06-30 | 东莞市大兴化工有限公司 | 卷材涂料及其制备方法 |
| EP4097163A1 (en) | 2020-01-27 | 2022-12-07 | Hitachi Energy Switzerland AG | Photo radiation curable epoxy for electrical components |
| SE545292C2 (en) * | 2020-07-08 | 2023-06-20 | Perstorp Ab | A radiation curable composition comprising a biobased reactive diluent |
| CN112062675A (zh) * | 2020-09-15 | 2020-12-11 | 常州速固得感光新材料有限公司 | 一种具有自由基和阳离子双重固化功能的单体、制备方法及辐射固化凹印油墨 |
| CN113234376B (zh) * | 2021-05-08 | 2023-03-17 | 江苏泰特尔新材料科技股份有限公司 | 一种无溶剂型uv印铁涂层及其制备方法与应用 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4657779A (en) * | 1986-03-19 | 1987-04-14 | Desoto, Inc. | Shrinkage-resistant ultraviolet-curing coatings |
| US5252694A (en) * | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
| US6350792B1 (en) * | 2000-07-13 | 2002-02-26 | Suncolor Corporation | Radiation-curable compositions and cured articles |
| US6579914B1 (en) * | 2000-07-14 | 2003-06-17 | Alcatel | Coating compositions for optical waveguides and optical waveguides coated therewith |
-
2005
- 2005-05-04 SE SE0501028A patent/SE0501028L/sv not_active Application Discontinuation
-
2006
- 2006-05-03 WO PCT/SE2006/000531 patent/WO2006118532A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117682871A (zh) * | 2023-12-22 | 2024-03-12 | 辽宁省轻工科学研究院有限公司 | 应用于3d打印的低收缩光固化陶瓷浆料、制备方法及零缺陷陶瓷制品成型方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006118532A1 (en) | 2006-11-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NAV | Patent application has lapsed |