RU2009134481A - Устройство подсветки и устройство плоского дисплея, использующее его - Google Patents
Устройство подсветки и устройство плоского дисплея, использующее его Download PDFInfo
- Publication number
- RU2009134481A RU2009134481A RU2009134481/28A RU2009134481A RU2009134481A RU 2009134481 A RU2009134481 A RU 2009134481A RU 2009134481/28 A RU2009134481/28 A RU 2009134481/28A RU 2009134481 A RU2009134481 A RU 2009134481A RU 2009134481 A RU2009134481 A RU 2009134481A
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- Prior art keywords
- point light
- light source
- circuit board
- printed circuit
- flexible printed
- Prior art date
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- 238000005286 illumination Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 claims abstract 12
- 239000002184 metal Substances 0.000 claims abstract 6
- 239000000853 adhesive Substances 0.000 claims abstract 4
- 230000001070 adhesive effect Effects 0.000 claims abstract 4
- 239000004065 semiconductor Substances 0.000 claims abstract 4
- 239000011347 resin Substances 0.000 claims abstract 2
- 229920005989 resin Polymers 0.000 claims abstract 2
- 239000000835 fiber Substances 0.000 claims 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Planar Illumination Modules (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Liquid Crystal (AREA)
Abstract
1. Устройство подсветки, содержащее: ! пластину световода, и ! множество точечных источников света, смонтированных на гибкой печатной плате, расположенной рядом с боковой поверхностью пластины световода, ! в котором !точечный источник света содержит полупроводниковое светоизлучающее устройство, металлический сердечник, собранный с полупроводниковым устройством, и электродный ввод, при этом часть металлического сердечника выступает со стороны монтажной поверхности, ! гибкая печатная плата содержит монтажный проводник, соединенный с электродным вводом точечного источника света и рассевающий тепло проводник, соответствующий точечному источнику света и отделенный от смежного рассеивающего тепло проводника так, чтобы не было проводимости от одного другому, ! электродный ввод точечного источника света и монтажный проводник гибкой печатной платы скреплены вместе с помощью проводящего адгезива, и ! металлический сердечник точечного источника света и рассеивающий тепло проводник гибкой печатной платы скреплены вместе с помощью проводящего адгезива. ! 2. Устройство подсветки по п.1, в котором два смежных рассеивающих тепло проводника существенно отделены друг от друга в средней точке между двумя смежными точечными источниками света. ! 3. Устройство подсветки по п.1, в котором на монтажной поверхности гибкой печатной платы сформирован слой белой смолы. ! 4. Устройство плоского дисплея, содержащее панель дисплея и устройство подсветки, установленное на сторону задней поверхности панели дисплея, в котором устройство подсветки является устройством подсветки по любому из пп.1-3.
Claims (4)
1. Устройство подсветки, содержащее:
пластину световода, и
множество точечных источников света, смонтированных на гибкой печатной плате, расположенной рядом с боковой поверхностью пластины световода,
в котором
точечный источник света содержит полупроводниковое светоизлучающее устройство, металлический сердечник, собранный с полупроводниковым устройством, и электродный ввод, при этом часть металлического сердечника выступает со стороны монтажной поверхности,
гибкая печатная плата содержит монтажный проводник, соединенный с электродным вводом точечного источника света и рассевающий тепло проводник, соответствующий точечному источнику света и отделенный от смежного рассеивающего тепло проводника так, чтобы не было проводимости от одного другому,
электродный ввод точечного источника света и монтажный проводник гибкой печатной платы скреплены вместе с помощью проводящего адгезива, и
металлический сердечник точечного источника света и рассеивающий тепло проводник гибкой печатной платы скреплены вместе с помощью проводящего адгезива.
2. Устройство подсветки по п.1, в котором два смежных рассеивающих тепло проводника существенно отделены друг от друга в средней точке между двумя смежными точечными источниками света.
3. Устройство подсветки по п.1, в котором на монтажной поверхности гибкой печатной платы сформирован слой белой смолы.
4. Устройство плоского дисплея, содержащее панель дисплея и устройство подсветки, установленное на сторону задней поверхности панели дисплея, в котором устройство подсветки является устройством подсветки по любому из пп.1-3.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-035625 | 2007-02-16 | ||
| JP2007035625 | 2007-02-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2009134481A true RU2009134481A (ru) | 2011-03-27 |
| RU2419740C1 RU2419740C1 (ru) | 2011-05-27 |
Family
ID=39689786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2009134481/28A RU2419740C1 (ru) | 2007-02-16 | 2007-10-10 | Устройство подсветки и устройство плоского дисплея, использующее его |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8157430B2 (ru) |
| CN (1) | CN101611262B (ru) |
| RU (1) | RU2419740C1 (ru) |
| WO (1) | WO2008099531A1 (ru) |
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| KR101545939B1 (ko) * | 2008-10-27 | 2015-08-21 | 삼성디스플레이 주식회사 | 광원 모듈, 이의 제조방법 및 이를 갖는 백라이트 어셈블리 |
| CN102170747B (zh) * | 2010-02-26 | 2013-04-03 | 佳必琪国际股份有限公司 | 押出式软性电路板、其制作方法及具有该电路板的条灯 |
| JP5691681B2 (ja) * | 2010-03-15 | 2015-04-01 | 日亜化学工業株式会社 | 発光装置 |
| WO2011125346A1 (ja) * | 2010-04-07 | 2011-10-13 | シャープ株式会社 | 発光装置およびその製造方法 |
| US8419203B1 (en) * | 2010-09-03 | 2013-04-16 | Rockwell Collins, Inc. | Single card multi mode LCD backlight |
| EP2437581A1 (de) * | 2010-09-30 | 2012-04-04 | Odelo GmbH | Leuchtdiode auf Keramiksubstratbasis |
| JP2012113919A (ja) * | 2010-11-24 | 2012-06-14 | Toshiba Corp | 照明装置 |
| WO2012090576A1 (ja) * | 2010-12-28 | 2012-07-05 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| AU2014200021B2 (en) * | 2010-12-28 | 2015-07-09 | Nichia Corporation | Light emitting device |
| DE102011110799A1 (de) * | 2011-08-22 | 2013-02-28 | Heraeus Materials Technology Gmbh & Co. Kg | Substrat für den Aufbau elektronischer Elemente |
| US8851736B2 (en) * | 2011-08-30 | 2014-10-07 | Lg Innotek Co., Ltd. | Light emitting module with heatsink plate having coupling protrusions |
| US20130100694A1 (en) * | 2011-10-24 | 2013-04-25 | Kocam International Co., Ltd. | LED Backlight Module |
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| US20090103295A1 (en) * | 2007-10-17 | 2009-04-23 | Keeper Technology Co., Ltd. | LED unit and LED module |
| KR101535064B1 (ko) * | 2008-01-17 | 2015-07-09 | 삼성디스플레이 주식회사 | 표시 장치용 광원 모듈 및 이를 포함하는 표시 장치 |
| CN101539278B (zh) * | 2008-03-19 | 2010-11-10 | 富准精密工业(深圳)有限公司 | 发光二极管组合 |
| CN101645478A (zh) * | 2008-08-08 | 2010-02-10 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管散热结构 |
-
2007
- 2007-10-10 RU RU2009134481/28A patent/RU2419740C1/ru not_active IP Right Cessation
- 2007-10-10 WO PCT/JP2007/069731 patent/WO2008099531A1/ja not_active Ceased
- 2007-10-10 CN CN2007800514338A patent/CN101611262B/zh not_active Expired - Fee Related
- 2007-10-10 US US12/527,336 patent/US8157430B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101611262B (zh) | 2011-01-26 |
| WO2008099531A1 (ja) | 2008-08-21 |
| US8157430B2 (en) | 2012-04-17 |
| CN101611262A (zh) | 2009-12-23 |
| RU2419740C1 (ru) | 2011-05-27 |
| US20100027291A1 (en) | 2010-02-04 |
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| Date | Code | Title | Description |
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| MM4A | The patent is invalid due to non-payment of fees |
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