PT3232468T - Estrutura de dissipação de calor de um dispositivo semicondutor - Google Patents

Estrutura de dissipação de calor de um dispositivo semicondutor

Info

Publication number: PT3232468T
Authority: PT; Portugal
Prior art keywords: heat dissipation; dissipation structure; semiconductive device; semiconductive; heat
Prior art date: 2016-04-15

Application number

PT171519721T

Other languages

English (en)

Original Assignee

Omron Tateisi Electronics Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-04-15

Filing date

2017-01-18

Publication date

2021-01-18

2017-01-18 Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co

2021-01-18 Publication of PT3232468T publication Critical patent/PT3232468T/pt

Classifications

- H10W40/228—
- H10W40/60—
- H10W40/22—
- H10W40/226—
- H10W40/611—
- H10W40/77—
- H10W70/635—
- H10W70/65—
- H10W74/129—
- H10W40/231—
- H10W40/235—
- H10W40/242—
- H10W72/07331—
- H10W90/734—

PT171519721T 2016-04-15 2017-01-18 Estrutura de dissipação de calor de um dispositivo semicondutor PT3232468T (pt)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2016081964A JP6711098B2 (ja)	2016-04-15	2016-04-15	半導体装置の放熱構造

Publications (1)

Publication Number	Publication Date
PT3232468T true PT3232468T (pt)	2021-01-18

Family

ID=57838279

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PT171519721T PT3232468T (pt)	2016-04-15	2017-01-18	Estrutura de dissipação de calor de um dispositivo semicondutor

Country Status (7)

Country	Link
US (1)	US9997430B2 (pt)
EP (1)	EP3232468B1 (pt)
JP (1)	JP6711098B2 (pt)
KR (1)	KR101946467B1 (pt)
CN (1)	CN107301987B (pt)
PT (1)	PT3232468T (pt)
TW (1)	TWI648829B (pt)

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JP6693441B2 (ja) *	2017-02-27	2020-05-13	オムロン株式会社	電子装置およびその製造方法
CN110137720B (zh) *	2018-02-09	2022-07-26	富士康(昆山)电脑接插件有限公司	一种用来固定散热器的固定装置及其抵压装置
KR102185824B1 (ko)	2019-01-04	2020-12-02	강병혁	전력변환용 반도체 패키지의 방열구조
JP7771709B2 (ja)	2021-12-14	2025-11-18	オムロン株式会社	実装基板、及び実装基板を搭載した電気機器
EP4297080A1 (de) *	2022-06-20	2023-12-27	Siemens Aktiengesellschaft	Schaltungsanordnung mit einem schaltungsträger und einem halbleiterbauelement

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JP5983032B2 (ja) *	2012-05-28	2016-08-31	富士通株式会社	半導体パッケージ及び配線基板ユニット
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US9236323B2 (en) *	2013-02-26	2016-01-12	Intel Corporation	Integrated heat spreader for multi-chip packages
JP6075218B2 (ja)	2013-06-11	2017-02-08	株式会社デンソー	半導体装置
US9576930B2 (en) *	2013-11-08	2017-02-21	Taiwan Semiconductor Manufacturing Co., Ltd.	Thermally conductive structure for heat dissipation in semiconductor packages
JPWO2015072428A1 (ja) *	2013-11-12	2017-03-16	Jnc株式会社	ヒートシンク
DE102014205958A1 (de) *	2014-03-31	2015-10-01	Lemförder Electronic GmbH	Halbleiterschaltelementanordnung und Steuergeräteinrichtung für ein Fahrzeug

2016
- 2016-04-15 JP JP2016081964A patent/JP6711098B2/ja not_active Expired - Fee Related
2017
- 2017-01-18 PT PT171519721T patent/PT3232468T/pt unknown
- 2017-01-18 EP EP17151972.1A patent/EP3232468B1/en not_active Not-in-force
- 2017-01-20 US US15/410,781 patent/US9997430B2/en not_active Expired - Fee Related
- 2017-01-20 CN CN201710045272.7A patent/CN107301987B/zh not_active Expired - Fee Related
- 2017-03-23 TW TW106109642A patent/TWI648829B/zh not_active IP Right Cessation
- 2017-03-29 KR KR1020170039895A patent/KR101946467B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
TW201803049A (zh)	2018-01-16
US20170301602A1 (en)	2017-10-19
TWI648829B (zh)	2019-01-21
CN107301987B (zh)	2019-11-05
EP3232468B1 (en)	2021-01-06
CN107301987A (zh)	2017-10-27
JP2017191904A (ja)	2017-10-19
JP6711098B2 (ja)	2020-06-17
EP3232468A1 (en)	2017-10-18
KR101946467B1 (ko)	2019-02-08
US9997430B2 (en)	2018-06-12
KR20170118599A (ko)	2017-10-25

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JP2019004144A5 (ja)	2019-02-21	半導体デバイス
EP3584521A4 (en)	2020-12-30	REFRIGERATION DEVICE
EP3651291A4 (en)	2020-07-29	SEMICONDUCTOR LASER DEVICE
EP3690352A4 (en)	2020-09-09	REFRIGERATION DEVICE
DE112017007068T8 (de)	2019-12-19	Halbleitervorrichtung
EP3651292A4 (en)	2020-07-15	SEMICONDUCTOR LASER DEVICE
EP3660850C0 (en)	2024-12-04	SEMICONDUCTOR MEMORY DEVICE
TWI801301B (zh)	2023-05-01	半導體記憶裝置
EP3671095C0 (en)	2024-02-28	HEAT DISSIPATION DEVICE WITH IRREGULAR SHAPE
EP3561886A4 (en)	2020-09-02	SEMICONDUCTOR DEVICE
TWI800873B (zh)	2023-05-01	半導體記憶裝置
PT3232468T (pt)	2021-01-18	Estrutura de dissipação de calor de um dispositivo semicondutor
EP3546850A4 (en)	2020-08-19	REFRIGERATION DEVICE
EP3576166A4 (en)	2020-12-16	SEMICONDUCTOR DEVICE
EP3633355C0 (en)	2024-08-07	SEMICONDUCTOR INSPECTION DEVICE
DE102018115474A8 (de)	2019-05-23	Halbleitervorrichtungen
EP3564993A4 (en)	2020-09-02	HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR ELEMENT
EP3667203A4 (en)	2020-12-02	REFRIGERATION SYSTEM
EP3614079A4 (en)	2021-01-06	COOLING DEVICE
EP3575710A4 (en)	2020-12-23	REFRIGERATION DEVICE
ITUB20160027A1 (it)	2017-08-01	Procedimento per produrre dispositivi a semiconduttore e corrispondente dispositivo
EP3614078A4 (en)	2021-01-06	COOLING DEVICE
DE102017110821A8 (de)	2018-09-13	Halbleitervorrichtung
EP3575713A4 (en)	2020-12-02	REFRIGERATION DEVICE
EP3644494A4 (en)	2020-12-30	THYRISTOR START-UP DEVICE