PT1758164E - Derivados do quinolinol como promotores da aderência em colas de fixação de moldes - Google Patents
Derivados do quinolinol como promotores da aderência em colas de fixação de moldes Download PDFInfo
- Publication number
- PT1758164E PT1758164E PT06017529T PT06017529T PT1758164E PT 1758164 E PT1758164 E PT 1758164E PT 06017529 T PT06017529 T PT 06017529T PT 06017529 T PT06017529 T PT 06017529T PT 1758164 E PT1758164 E PT 1758164E
- Authority
- PT
- Portugal
- Prior art keywords
- advertising
- promoters
- quinolinol derivatives
- molding lines
- quinolinol
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
- C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H10W72/07337—
-
- H10W72/30—
-
- H10W72/325—
-
- H10W72/352—
-
- H10W72/353—
-
- H10W72/354—
-
- H10W74/00—
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/211,920 US20070049665A1 (en) | 2005-08-25 | 2005-08-25 | Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT1758164E true PT1758164E (pt) | 2008-11-26 |
Family
ID=37478757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT06017529T PT1758164E (pt) | 2005-08-25 | 2006-08-23 | Derivados do quinolinol como promotores da aderência em colas de fixação de moldes |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20070049665A1 (pt) |
| EP (1) | EP1758164B1 (pt) |
| JP (1) | JP4823809B2 (pt) |
| KR (1) | KR101233224B1 (pt) |
| CN (1) | CN1919953A (pt) |
| AT (1) | ATE411614T1 (pt) |
| DE (1) | DE602006003151D1 (pt) |
| PT (1) | PT1758164E (pt) |
| SG (1) | SG130162A1 (pt) |
| TW (1) | TWI415886B (pt) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8120153B1 (en) * | 2005-09-16 | 2012-02-21 | University Of Central Florida Research Foundation, Inc. | High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module |
| US7468407B2 (en) * | 2005-09-26 | 2008-12-23 | National Starch And Chemical Investment Holding Copporation | Metal salts of quinolinols and quinolinol derivatives in curable compositions |
| KR100918345B1 (ko) * | 2007-11-23 | 2009-09-22 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
| WO2016182663A1 (en) | 2015-05-08 | 2016-11-17 | Henkel IP & Holding GmbH | Sinterable films and pastes and methods for the use thereof |
| CN119351027B (zh) * | 2024-11-14 | 2025-12-05 | 广东荣昇化工制品有限公司 | 一种铝合金用环保密着剂的制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2874080A (en) * | 1953-07-18 | 1959-02-17 | Deutsch Goldund Silber Scheide | Self-hardening surface coating compositions |
| JPH05125118A (ja) * | 1991-11-02 | 1993-05-21 | Nippon Oil & Fats Co Ltd | 紫外線吸収性ポリマー |
| JPH05247220A (ja) * | 1992-02-28 | 1993-09-24 | Nippon Steel Chem Co Ltd | 8−ヒドロキシキノリン骨格を有する重合体及びその製造方法 |
| US6482503B1 (en) * | 1993-03-19 | 2002-11-19 | Xerox Corporation | Recording sheets containing pyrrole, pyrrolidine, pyridine, piperidine, homopiperidine, quinoline, isoquinoline, quinuclidine, indole, and indazole compounds |
| US5744533A (en) * | 1997-06-04 | 1998-04-28 | Johnson Matthey, Inc. | Adhesive composition for bonding a semiconductor device |
| US6124374A (en) * | 1998-05-29 | 2000-09-26 | Block Drug Company, Inc. | Antimicrobial denture adhesive and cleanser compositions |
| US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
| JP3816697B2 (ja) * | 1999-07-07 | 2006-08-30 | 大日精化工業株式会社 | 重合体が結合した機能剤、その製造方法、それらの使用方法及びそれらを使用した物品 |
| US6583201B2 (en) * | 2001-04-25 | 2003-06-24 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
| US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
| US7108806B2 (en) * | 2003-02-28 | 2006-09-19 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
| JP4295047B2 (ja) * | 2003-06-02 | 2009-07-15 | 日本軽金属株式会社 | 発光性有機高分子金属錯体及び湿式製膜可能な発光性有機高分子金属錯体組成物並びにその製造方法 |
| CN1246368C (zh) * | 2004-06-18 | 2006-03-22 | 中国科学院广州化学研究所 | 含有8-羟基喹啉金属配合物的交联高聚物及其制法和用途 |
-
2005
- 2005-08-25 US US11/211,920 patent/US20070049665A1/en not_active Abandoned
-
2006
- 2006-08-22 SG SG200605716-0A patent/SG130162A1/en unknown
- 2006-08-22 CN CNA2006101265039A patent/CN1919953A/zh active Pending
- 2006-08-23 JP JP2006226254A patent/JP4823809B2/ja not_active Expired - Fee Related
- 2006-08-23 DE DE602006003151T patent/DE602006003151D1/de active Active
- 2006-08-23 EP EP06017529A patent/EP1758164B1/en not_active Not-in-force
- 2006-08-23 PT PT06017529T patent/PT1758164E/pt unknown
- 2006-08-23 AT AT06017529T patent/ATE411614T1/de not_active IP Right Cessation
- 2006-08-24 TW TW095131062A patent/TWI415886B/zh not_active IP Right Cessation
- 2006-08-24 KR KR1020060080520A patent/KR101233224B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1758164B1 (en) | 2008-10-15 |
| DE602006003151D1 (de) | 2008-11-27 |
| KR101233224B1 (ko) | 2013-02-14 |
| ATE411614T1 (de) | 2008-10-15 |
| US20070049665A1 (en) | 2007-03-01 |
| CN1919953A (zh) | 2007-02-28 |
| JP4823809B2 (ja) | 2011-11-24 |
| EP1758164A1 (en) | 2007-02-28 |
| TW200722470A (en) | 2007-06-16 |
| JP2007056265A (ja) | 2007-03-08 |
| SG130162A1 (en) | 2007-03-20 |
| TWI415886B (zh) | 2013-11-21 |
| KR20070024403A (ko) | 2007-03-02 |
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