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DE602006003151D1 - Quinolinol-Derivate als Haftvermittler für Klebstoffe zur Befestigung von Chips. - Google Patents

Quinolinol-Derivate als Haftvermittler für Klebstoffe zur Befestigung von Chips.

Info

Publication number
DE602006003151D1
DE602006003151D1 DE602006003151T DE602006003151T DE602006003151D1 DE 602006003151 D1 DE602006003151 D1 DE 602006003151D1 DE 602006003151 T DE602006003151 T DE 602006003151T DE 602006003151 T DE602006003151 T DE 602006003151T DE 602006003151 D1 DE602006003151 D1 DE 602006003151D1
Authority
DE
Germany
Prior art keywords
adhesives
quinolinol derivatives
bonding chips
quinolinol
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006003151T
Other languages
English (en)
Inventor
Osama M Musa
Harry Richard Kuder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of DE602006003151D1 publication Critical patent/DE602006003151D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
    • C09J139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H10W72/07337—
    • H10W72/30—
    • H10W72/325—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W74/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
DE602006003151T 2005-08-25 2006-08-23 Quinolinol-Derivate als Haftvermittler für Klebstoffe zur Befestigung von Chips. Active DE602006003151D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/211,920 US20070049665A1 (en) 2005-08-25 2005-08-25 Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives

Publications (1)

Publication Number Publication Date
DE602006003151D1 true DE602006003151D1 (de) 2008-11-27

Family

ID=37478757

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006003151T Active DE602006003151D1 (de) 2005-08-25 2006-08-23 Quinolinol-Derivate als Haftvermittler für Klebstoffe zur Befestigung von Chips.

Country Status (10)

Country Link
US (1) US20070049665A1 (de)
EP (1) EP1758164B1 (de)
JP (1) JP4823809B2 (de)
KR (1) KR101233224B1 (de)
CN (1) CN1919953A (de)
AT (1) ATE411614T1 (de)
DE (1) DE602006003151D1 (de)
PT (1) PT1758164E (de)
SG (1) SG130162A1 (de)
TW (1) TWI415886B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8120153B1 (en) * 2005-09-16 2012-02-21 University Of Central Florida Research Foundation, Inc. High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module
US7468407B2 (en) * 2005-09-26 2008-12-23 National Starch And Chemical Investment Holding Copporation Metal salts of quinolinols and quinolinol derivatives in curable compositions
KR100918345B1 (ko) * 2007-11-23 2009-09-22 제일모직주식회사 이방 전도성 필름용　조성물　및 이를 이용한 이방 전도성필름
KR102360575B1 (ko) * 2015-05-08 2022-02-09 헨켈 아이피 앤드 홀딩 게엠베하 소결성 필름 및 페이스트, 및 그의 사용 방법
CN119351027B (zh) * 2024-11-14 2025-12-05 广东荣昇化工制品有限公司 一种铝合金用环保密着剂的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874080A (en) * 1953-07-18 1959-02-17 Deutsch Goldund Silber Scheide Self-hardening surface coating compositions
JPH05125118A (ja) * 1991-11-02 1993-05-21 Nippon Oil & Fats Co Ltd 紫外線吸収性ポリマー
JPH05247220A (ja) * 1992-02-28 1993-09-24 Nippon Steel Chem Co Ltd ８−ヒドロキシキノリン骨格を有する重合体及びその製造方法
US6482503B1 (en) * 1993-03-19 2002-11-19 Xerox Corporation Recording sheets containing pyrrole, pyrrolidine, pyridine, piperidine, homopiperidine, quinoline, isoquinoline, quinuclidine, indole, and indazole compounds
US5744533A (en) * 1997-06-04 1998-04-28 Johnson Matthey, Inc. Adhesive composition for bonding a semiconductor device
US6124374A (en) * 1998-05-29 2000-09-26 Block Drug Company, Inc. Antimicrobial denture adhesive and cleanser compositions
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
JP3816697B2 (ja) * 1999-07-07 2006-08-30 大日精化工業株式会社 重合体が結合した機能剤、その製造方法、それらの使用方法及びそれらを使用した物品
US6583201B2 (en) * 2001-04-25 2003-06-24 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices
US20030111519A1 (en) * 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices
JP4295047B2 (ja) * 2003-06-02 2009-07-15 日本軽金属株式会社 発光性有機高分子金属錯体及び湿式製膜可能な発光性有機高分子金属錯体組成物並びにその製造方法
CN1246368C (zh) * 2004-06-18 2006-03-22 中国科学院广州化学研究所 含有8－羟基喹啉金属配合物的交联高聚物及其制法和用途

Also Published As

Publication number Publication date
JP2007056265A (ja) 2007-03-08
CN1919953A (zh) 2007-02-28
KR101233224B1 (ko) 2013-02-14
KR20070024403A (ko) 2007-03-02
TWI415886B (zh) 2013-11-21
EP1758164A1 (de) 2007-02-28
SG130162A1 (en) 2007-03-20
TW200722470A (en) 2007-06-16
PT1758164E (pt) 2008-11-26
ATE411614T1 (de) 2008-10-15
EP1758164B1 (de) 2008-10-15
JP4823809B2 (ja) 2011-11-24
US20070049665A1 (en) 2007-03-01

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Legal Events

Date Code Title Description
8328 Change in the person/name/address of the agent

Representative=s name: MEISSNER, BOLTE & PARTNER GBR, 80538 MUENCHEN

8327 Change in the person/name/address of the patent owner

Owner name: HENKEL AG & CO. KGAA, 40589 DUESSELDORF, DE

8364 No opposition during term of opposition