PH12020500544A1 - Surface treatment apparatus - Google Patents
Surface treatment apparatusInfo
- Publication number
- PH12020500544A1 PH12020500544A1 PH12020500544A PH12020500544A PH12020500544A1 PH 12020500544 A1 PH12020500544 A1 PH 12020500544A1 PH 12020500544 A PH12020500544 A PH 12020500544A PH 12020500544 A PH12020500544 A PH 12020500544A PH 12020500544 A1 PH12020500544 A1 PH 12020500544A1
- Authority
- PH
- Philippines
- Prior art keywords
- negative electrode
- workpieces
- surface treatment
- electrode rails
- treatment apparatus
- Prior art date
Links
- 238000004381 surface treatment Methods 0.000 title abstract 2
- 239000012530 fluid Substances 0.000 abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A surface treatment device (1) having: a treatment tank (3-1) housing treatment fluid; at least one positive electrode (20) arranged inside the treatment tank; an N number (N being an integer of at least 2) of negative electrode rails (40A, 40B); a plurality of jigs (30) that hold each of a plurality of workpieces (2) immersed in treatment fluid and come in contact with the N number of negative electrode rails and set each of the plurality of workpieces as negative electrodes; and an N number of rectifiers (50) connected to each of the N number of negative electrode rails and at least one of the positive electrodes. Each of the plurality of jigs includes an N number of conduction paths (31A, 31B) that are connected from each of the N number of negative electrode rails to each of an N number of different sites on each one of the plurality of workpieces. The N number of conduction paths are insulated from each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017203867 | 2017-10-20 | ||
| PCT/JP2018/037757 WO2019078064A1 (en) | 2017-10-20 | 2018-10-10 | Surface treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PH12020500544A1 true PH12020500544A1 (en) | 2021-01-25 |
Family
ID=66173277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PH12020500544A PH12020500544A1 (en) | 2017-10-20 | 2020-06-03 | Surface treatment apparatus |
Country Status (6)
| Country | Link |
|---|---|
| JP (3) | JP6744646B2 (en) |
| KR (1) | KR20200075843A (en) |
| CN (1) | CN111247273B (en) |
| PH (1) | PH12020500544A1 (en) |
| TW (1) | TWI682072B (en) |
| WO (1) | WO2019078064A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102287457B1 (en) * | 2019-07-10 | 2021-08-10 | 엘지전자 주식회사 | Drying apparatus of organic solution |
| JP7380338B2 (en) * | 2020-03-06 | 2023-11-15 | 住友金属鉱山株式会社 | Plating equipment and plating method |
| CN112095138B (en) * | 2020-09-23 | 2021-07-09 | 东莞市泰利锐航机械科技有限公司 | Electroplating rack for continuous electroplating production line of circuit board |
| JP7529277B2 (en) * | 2021-08-04 | 2024-08-06 | 株式会社アルメックステクノロジーズ | Workpiece holding fixture and surface treatment device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2727250B2 (en) * | 1990-03-14 | 1998-03-11 | 株式会社中央製作所 | Power supply control device in plating equipment |
| JPH0737680B2 (en) * | 1990-07-09 | 1995-04-26 | 株式会社アルメックス | Power supply method |
| JP2005220414A (en) | 2004-02-06 | 2005-08-18 | Ebara Corp | Plating apparatus |
| JP5457010B2 (en) * | 2007-11-01 | 2014-04-02 | アルメックスPe株式会社 | Continuous plating equipment |
| JP4977046B2 (en) | 2008-01-21 | 2012-07-18 | Jx日鉱日石金属株式会社 | Edge overcoat prevention device and electroplating material manufacturing method using the same |
| DE102012012990B4 (en) * | 2011-06-30 | 2014-09-04 | Almex Pe Inc. | Surface treatment system and workpiece support support |
| JP5833355B2 (en) * | 2011-06-30 | 2015-12-16 | アルメックスPe株式会社 | Surface treatment equipment |
| JP5795514B2 (en) * | 2011-09-29 | 2015-10-14 | アルメックスPe株式会社 | Continuous plating equipment |
| JP6041927B2 (en) * | 2015-05-07 | 2016-12-14 | アルメックスPe株式会社 | Surface treatment equipment |
| JP6317299B2 (en) * | 2015-08-28 | 2018-04-25 | 株式会社荏原製作所 | Plating apparatus, plating method, and substrate holder |
-
2018
- 2018-10-10 WO PCT/JP2018/037757 patent/WO2019078064A1/en not_active Ceased
- 2018-10-10 JP JP2019549224A patent/JP6744646B2/en active Active
- 2018-10-10 CN CN201880067500.3A patent/CN111247273B/en not_active Expired - Fee Related
- 2018-10-10 KR KR1020207012917A patent/KR20200075843A/en not_active Withdrawn
- 2018-10-17 TW TW107136457A patent/TWI682072B/en not_active IP Right Cessation
-
2020
- 2020-06-03 PH PH12020500544A patent/PH12020500544A1/en unknown
- 2020-07-27 JP JP2020126750A patent/JP6820626B2/en not_active Expired - Fee Related
- 2020-12-23 JP JP2020213928A patent/JP7007756B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6820626B2 (en) | 2021-01-27 |
| JPWO2019078064A1 (en) | 2020-06-18 |
| KR20200075843A (en) | 2020-06-26 |
| JP2021046613A (en) | 2021-03-25 |
| JP6744646B2 (en) | 2020-08-19 |
| JP7007756B2 (en) | 2022-01-25 |
| JP2020169396A (en) | 2020-10-15 |
| TWI682072B (en) | 2020-01-11 |
| TW201923164A (en) | 2019-06-16 |
| WO2019078064A1 (en) | 2019-04-25 |
| CN111247273A (en) | 2020-06-05 |
| CN111247273B (en) | 2022-12-20 |
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