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TW201612967A - Polishing method and polishing apparatus - Google Patents

Polishing method and polishing apparatus

Info

Publication number
TW201612967A
TW201612967A TW104125908A TW104125908A TW201612967A TW 201612967 A TW201612967 A TW 201612967A TW 104125908 A TW104125908 A TW 104125908A TW 104125908 A TW104125908 A TW 104125908A TW 201612967 A TW201612967 A TW 201612967A
Authority
TW
Taiwan
Prior art keywords
polishing
treatment
substrates
substrate
chemical
Prior art date
Application number
TW104125908A
Other languages
Chinese (zh)
Other versions
TWI681449B (en
Inventor
Hiroshi Yoshida
Kuniaki Yamaguchi
Koichi Fukaya
Daisuke Minoshima
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW201612967A publication Critical patent/TW201612967A/en
Application granted granted Critical
Publication of TWI681449B publication Critical patent/TWI681449B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H10P52/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a polishing method and polishing device for performing chemical treatment of a substrate prior to polishing and between polishings for semiconductor wafers and other substrates. The polishing method for polishing a substrate by pressing the substrate to be polished on a polishing surface on a polishing table comprises a chemical washing treatment step for, when a plurality of stages of polishing treatment are performed on substrates using a plurality of polishing tables, performing washing treatment of the substrates using a chemical liquid between the plurality of stages of polishing treatment.
TW104125908A 2014-09-01 2015-08-10 Polishing method and polishing apparatus TWI681449B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014177468A JP6587379B2 (en) 2014-09-01 2014-09-01 Polishing equipment
JP2014-177468 2014-09-01

Publications (2)

Publication Number Publication Date
TW201612967A true TW201612967A (en) 2016-04-01
TWI681449B TWI681449B (en) 2020-01-01

Family

ID=55439567

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125908A TWI681449B (en) 2014-09-01 2015-08-10 Polishing method and polishing apparatus

Country Status (3)

Country Link
JP (1) JP6587379B2 (en)
TW (1) TWI681449B (en)
WO (1) WO2016035499A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614089B (en) * 2016-04-04 2018-02-11 環球晶圓日本股份有限公司 Protective film forming method of semiconductor substrate
TWI773673B (en) * 2016-06-30 2022-08-11 日商荏原製作所股份有限公司 Substrate processing equipment
TWI855230B (en) * 2020-02-21 2024-09-11 日商迪思科股份有限公司 Processing equipment

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019131174A1 (en) * 2017-12-27 2019-07-04 株式会社 荏原製作所 Substrate processing device and substrate processing method
JP7349352B2 (en) * 2019-12-27 2023-09-22 グローバルウェーハズ・ジャパン株式会社 Silicon wafer polishing method
JP7394821B2 (en) * 2020-06-30 2023-12-08 株式会社荏原製作所 Substrate processing equipment
CN112864066B (en) * 2020-12-31 2022-06-10 至微半导体(上海)有限公司 Push-pull type wafer box loading and conveying system of wafer cleaning equipment
CN216781428U (en) * 2021-09-07 2022-06-21 杭州众硅电子科技有限公司 Wafer polishing system
JP2023086404A (en) * 2021-12-10 2023-06-22 株式会社荏原製作所 Substrate cleaning equipment and substrate polishing equipment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362478B2 (en) * 1993-11-05 2003-01-07 富士通株式会社 Wafer polishing apparatus and wafer polishing method
JPH08153695A (en) * 1994-11-30 1996-06-11 Nkk Corp Polishing method, polishing apparatus used therefor, and polishing finishing apparatus
KR100487590B1 (en) * 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 Polishing device
WO1999046084A1 (en) * 1998-03-09 1999-09-16 Ebara Corporation Polishing apparatus
JP4402106B2 (en) * 1998-04-06 2010-01-20 株式会社荏原製作所 Polishing device
JP2003179020A (en) * 2001-12-12 2003-06-27 Sumitomo Mitsubishi Silicon Corp Polishing cloth texture transferring prevention method
JP2004022855A (en) * 2002-06-18 2004-01-22 Shibaura Mechatronics Corp Method for manufacturing semiconductor device
JP2005277396A (en) * 2004-02-27 2005-10-06 Ebara Corp Substrate processing method and apparatus
JP2006032694A (en) * 2004-07-16 2006-02-02 Toshiba Corp Manufacturing method of semiconductor device
JP4843285B2 (en) * 2005-02-14 2011-12-21 東京エレクトロン株式会社 Electronic device manufacturing method and program
JP2009238896A (en) * 2008-03-26 2009-10-15 Renesas Technology Corp Method of manufacturing semiconductor integrated circuit device
JP2013089797A (en) * 2011-10-19 2013-05-13 Ebara Corp Substrate cleaning method and substrate cleaning device
JP6193623B2 (en) * 2012-06-13 2017-09-06 株式会社荏原製作所 Polishing method and polishing apparatus
JP6055648B2 (en) * 2012-10-26 2016-12-27 株式会社荏原製作所 Polishing apparatus and polishing method
JP2014130881A (en) * 2012-12-28 2014-07-10 Ebara Corp Polishing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI614089B (en) * 2016-04-04 2018-02-11 環球晶圓日本股份有限公司 Protective film forming method of semiconductor substrate
TWI773673B (en) * 2016-06-30 2022-08-11 日商荏原製作所股份有限公司 Substrate processing equipment
TWI855230B (en) * 2020-02-21 2024-09-11 日商迪思科股份有限公司 Processing equipment

Also Published As

Publication number Publication date
JP6587379B2 (en) 2019-10-09
JP2016049612A (en) 2016-04-11
WO2016035499A1 (en) 2016-03-10
TWI681449B (en) 2020-01-01

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