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PH12018500801A1 - Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer - Google Patents

Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer

Info

Publication number
PH12018500801A1
PH12018500801A1 PH12018500801A PH12018500801A PH12018500801A1 PH 12018500801 A1 PH12018500801 A1 PH 12018500801A1 PH 12018500801 A PH12018500801 A PH 12018500801A PH 12018500801 A PH12018500801 A PH 12018500801A PH 12018500801 A1 PH12018500801 A1 PH 12018500801A1
Authority
PH
Philippines
Prior art keywords
film
thermosetting resin
protective film
forming
resin film
Prior art date
Application number
PH12018500801A
Other languages
English (en)
Other versions
PH12018500801B1 (en
Inventor
Masanori Yamagishi
Akinori Sato
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12018500801B1 publication Critical patent/PH12018500801B1/en
Publication of PH12018500801A1 publication Critical patent/PH12018500801A1/en

Links

Classifications

    • H10W74/47—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H10W74/01—
    • H10W74/10—
    • H10W74/121—
    • H10W74/40—

Landscapes

  • Engineering & Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Dicing (AREA)
PH12018500801A 2015-11-04 2018-04-13 Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer PH12018500801A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015217097 2015-11-04
PCT/JP2016/082544 WO2017078053A1 (ja) 2015-11-04 2016-11-02 熱硬化性樹脂フィルムと第２保護膜形成フィルムのキット、熱硬化性樹脂フィルム、第１保護膜形成用シート及び半導体ウエハ用第１保護膜の形成方法

Publications (2)

Publication Number Publication Date
PH12018500801B1 PH12018500801B1 (en) 2018-10-29
PH12018500801A1 true PH12018500801A1 (en) 2018-10-29

Family

ID=58661938

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12018500801A PH12018500801A1 (en) 2015-11-04 2018-04-13 Kit for thermosetting resin film and second protective film forming film, thermosetting resin film, first protective film forming sheet, and method for forming first protective film for semiconductor wafer

Country Status (7)

Country Link
JP (1) JP6304852B2 (zh)
KR (1) KR102541134B1 (zh)
CN (1) CN108140622B (zh)
PH (1) PH12018500801A1 (zh)
SG (1) SG11201803007TA (zh)
TW (1) TWI638845B (zh)
WO (1) WO2017078053A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7210901B2 (ja) * 2017-06-26 2023-01-24 味の素株式会社 樹脂組成物層
JP6998250B2 (ja) * 2018-03-27 2022-01-18 日本カーバイド工業株式会社 赤外線レーザ照射用樹脂組成物及び赤外線レーザ照射用樹脂フィルム
CN112839767A (zh) * 2019-02-26 2021-05-25 琳得科株式会社 带有第一保护膜的工件加工物的制造方法
DE102020210104B4 (de) 2020-08-10 2025-02-06 Disco Corporation Verfahren zum bearbeiten eines substrats

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3317784B2 (ja) * 1994-08-10 2002-08-26 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物
JPH10158478A (ja) * 1996-11-29 1998-06-16 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
TW469609B (en) * 2000-10-11 2001-12-21 Ultratera Corp Chipless package semiconductor device and its manufacturing method
JP4170839B2 (ja) 2003-07-11 2008-10-22 日東電工株式会社 積層シート
JP4939002B2 (ja) * 2005-06-29 2012-05-23 ローム株式会社 半導体装置および半導体装置集合体
JP2007035880A (ja) * 2005-07-26 2007-02-08 Matsushita Electric Works Ltd バンプ付きウエハの製造方法、バンプ付きウエハ、半導体装置
WO2011090038A1 (ja) * 2010-01-21 2011-07-28 積水化学工業株式会社 熱硬化性樹脂組成物、フリップチップ実装用接着剤、半導体装置の製造方法、及び、半導体装置
JP2010212724A (ja) * 2010-05-17 2010-09-24 Rohm Co Ltd 半導体装置
CN104380197B (zh) * 2012-05-17 2019-01-01 太阳油墨制造株式会社 碱显影型的热固化性树脂组合物、印刷电路板
JP2016500732A (ja) * 2012-10-31 2016-01-14 ダウ グローバル テクノロジーズ エルエルシー 硬化性組成物
JP5735029B2 (ja) * 2013-03-28 2015-06-17 日東電工株式会社 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法

Also Published As

Publication number Publication date
PH12018500801B1 (en) 2018-10-29
SG11201803007TA (en) 2018-05-30
CN108140622B (zh) 2021-03-05
CN108140622A (zh) 2018-06-08
TW201728640A (zh) 2017-08-16
KR102541134B1 (ko) 2023-06-08
TWI638845B (zh) 2018-10-21
KR20180079307A (ko) 2018-07-10
JPWO2017078053A1 (ja) 2018-02-01
JP6304852B2 (ja) 2018-04-04
WO2017078053A1 (ja) 2017-05-11

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