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PH12014500725B1 - Method for compression-molding electronic component and die apparatus - Google Patents

Method for compression-molding electronic component and die apparatus

Info

Publication number
PH12014500725B1
PH12014500725B1 PH12014500725A PH12014500725A PH12014500725B1 PH 12014500725 B1 PH12014500725 B1 PH 12014500725B1 PH 12014500725 A PH12014500725 A PH 12014500725A PH 12014500725 A PH12014500725 A PH 12014500725A PH 12014500725 B1 PH12014500725 B1 PH 12014500725B1
Authority
PH
Philippines
Prior art keywords
resin
die cavity
release film
mold release
supplied
Prior art date
Application number
PH12014500725A
Other languages
English (en)
Other versions
PH12014500725A1 (en
Inventor
Hiroshi Uragami
Naoki Takada
Osamu Otsuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of PH12014500725A1 publication Critical patent/PH12014500725A1/en
Publication of PH12014500725B1 publication Critical patent/PH12014500725B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H10W74/01—
    • H10W74/016—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H10W72/0198—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
PH12014500725A 2008-08-08 2014-04-01 Method for compression-molding electronic component and die apparatus PH12014500725B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008205018A JP5153509B2 (ja) 2008-08-08 2008-08-08 電子部品の圧縮成形方法及び金型装置
PCT/JP2009/003683 WO2010016223A1 (ja) 2008-08-08 2009-08-03 電子部品の圧縮成形方法及び金型装置

Publications (2)

Publication Number Publication Date
PH12014500725A1 PH12014500725A1 (en) 2015-01-26
PH12014500725B1 true PH12014500725B1 (en) 2019-12-06

Family

ID=41663452

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014500725A PH12014500725B1 (en) 2008-08-08 2014-04-01 Method for compression-molding electronic component and die apparatus

Country Status (7)

Country Link
JP (1) JP5153509B2 (zh)
KR (3) KR101430797B1 (zh)
CN (2) CN103921384B (zh)
MY (2) MY152441A (zh)
PH (1) PH12014500725B1 (zh)
TW (3) TWI529822B (zh)
WO (1) WO2010016223A1 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5576197B2 (ja) * 2010-07-08 2014-08-20 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
JP5731009B2 (ja) * 2011-11-08 2015-06-10 アピックヤマダ株式会社 樹脂封止装置および樹脂供給装置
KR101373459B1 (ko) * 2011-12-23 2014-03-11 세메스 주식회사 수지 몰딩 장치
KR101299259B1 (ko) * 2013-04-03 2013-08-22 주식회사 에스아이 플렉스 Ｍｏｄｅ ｋｅｙ 취부 공법
JP6049597B2 (ja) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP6057880B2 (ja) 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置
JP6212399B2 (ja) 2014-01-21 2017-10-11 Ｔｏｗａ株式会社 フィルムシート切り抜き装置及び切り抜き方法
JP6017492B2 (ja) 2014-04-24 2016-11-02 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP6310773B2 (ja) * 2014-05-22 2018-04-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP5944445B2 (ja) * 2014-07-18 2016-07-05 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、樹脂封止電子部品、及び突起電極付き板状部材の製造方法
JP6282564B2 (ja) * 2014-09-16 2018-02-21 東芝メモリ株式会社 半導体装置の製造方法
JP6400446B2 (ja) * 2014-11-28 2018-10-03 Ｔｏｗａ株式会社 突起電極付き板状部材の製造方法、突起電極付き板状部材、電子部品の製造方法、及び電子部品
JP6212609B1 (ja) 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6279047B1 (ja) 2016-10-11 2018-02-14 Ｔｏｗａ株式会社 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法
JP6270969B2 (ja) * 2016-11-22 2018-01-31 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給機構、並びに圧縮成形方法及び圧縮成形装置
JP6774865B2 (ja) 2016-12-13 2020-10-28 アピックヤマダ株式会社 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
JP6165372B1 (ja) * 2017-01-10 2017-07-19 信越エンジニアリング株式会社 ワーク搬送装置及びワーク搬送方法
JP6236561B1 (ja) * 2017-04-27 2017-11-22 信越エンジニアリング株式会社 ワーク貼り合わせ装置及びワーク貼り合わせ方法
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
JP6349447B2 (ja) * 2017-08-10 2018-06-27 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法及び樹脂封止電子部品の製造装置
TWI787417B (zh) 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 壓縮成形用模具及壓縮成形裝置
CN110223992B (zh) * 2019-06-27 2021-09-03 武汉华星光电半导体显示技术有限公司 显示面板、显示面板的成型模具及显示面板的制备方法
CN110667021B (zh) * 2019-09-16 2021-06-25 大同新成新材料股份有限公司 一种碳复合材料压平成型装置及其使用方法
WO2022264374A1 (ja) * 2021-06-17 2022-12-22 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP7644494B2 (ja) * 2021-09-28 2025-03-12 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2023106688A (ja) * 2022-01-21 2023-08-02 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3900947B2 (ja) * 2002-01-30 2007-04-04 大日本インキ化学工業株式会社 燃料電池用セパレータの製造方法、燃料電池セパレータおよび燃料電池
JP4268389B2 (ja) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP4262468B2 (ja) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 樹脂モールド方法、樹脂モールド装置およびこれに用いる支持治具
JP4336499B2 (ja) * 2003-01-09 2009-09-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP4431440B2 (ja) * 2004-05-25 2010-03-17 住友重機械工業株式会社 樹脂供給装置及び樹脂供給方法
JP4741383B2 (ja) * 2006-02-17 2011-08-03 富士通セミコンダクター株式会社 電子部品の樹脂封止方法
JP4855307B2 (ja) * 2007-03-13 2012-01-18 Ｔｏｗａ株式会社 電子部品の圧縮成形方法

Also Published As

Publication number Publication date
KR101523164B1 (ko) 2015-05-26
TW201007859A (en) 2010-02-16
CN102105282B (zh) 2014-04-09
KR20130124416A (ko) 2013-11-13
CN102105282A (zh) 2011-06-22
KR101430797B1 (ko) 2014-08-18
KR20130125407A (ko) 2013-11-18
TW201616586A (zh) 2016-05-01
TW201436061A (zh) 2014-09-16
JP5153509B2 (ja) 2013-02-27
PH12014500725A1 (en) 2015-01-26
KR20110051228A (ko) 2011-05-17
TWI567837B (zh) 2017-01-21
CN103921384A (zh) 2014-07-16
CN103921384B (zh) 2016-11-16
MY182931A (en) 2021-02-05
WO2010016223A1 (ja) 2010-02-11
KR101523163B1 (ko) 2015-05-26
MY152441A (en) 2014-09-30
TWI529822B (zh) 2016-04-11
TWI543275B (zh) 2016-07-21
JP2010036542A (ja) 2010-02-18

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