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MY164298A - Method and device for encapsulating electronic components, wherein the encapsulating material is cooled - Google Patents

Method and device for encapsulating electronic components, wherein the encapsulating material is cooled

Info

Publication number
MY164298A
MY164298A MYPI20092009A MYPI20092009A MY164298A MY 164298 A MY164298 A MY 164298A MY PI20092009 A MYPI20092009 A MY PI20092009A MY PI20092009 A MYPI20092009 A MY PI20092009A MY 164298 A MY164298 A MY 164298A
Authority
MY
Malaysia
Prior art keywords
encapsulating
electronic components
cooled
encapsulating material
encapsulating electronic
Prior art date
Application number
MYPI20092009A
Inventor
Joannes Leonardus Jurrian Zijl
Mark Alexander Merkens
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of MY164298A publication Critical patent/MY164298A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/735—Heating or cooling of the mould heating a mould part and cooling another mould part during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

THE INVENTION RELATES TO A METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, WHEREIN A LIQUID ENCAPSULATING MATERIAL (9) COMPRISING POLYMER AFTER CURING IS COOLED IN FORCED MANNER. THE INVENTION FURTHER ALSO COMPRISES A MOULD PART (30) FOR APPLYING IN A DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, AND SUCH A DEVICE.
MYPI20092009A 2006-12-05 2007-11-28 Method and device for encapsulating electronic components, wherein the encapsulating material is cooled MY164298A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2000356A NL2000356C2 (en) 2006-12-05 2006-12-05 Method and device for encapsulating electronic components wherein the encapsulating material is cooled.

Publications (1)

Publication Number Publication Date
MY164298A true MY164298A (en) 2017-12-15

Family

ID=38255465

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20092009A MY164298A (en) 2006-12-05 2007-11-28 Method and device for encapsulating electronic components, wherein the encapsulating material is cooled

Country Status (6)

Country Link
KR (1) KR101495576B1 (en)
CN (1) CN101583475B (en)
MY (1) MY164298A (en)
NL (1) NL2000356C2 (en)
TW (1) TWI440144B (en)
WO (1) WO2008085026A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102490330B (en) * 2011-12-02 2014-06-04 北京化工大学 Temperature control method based on phase-transition energy-accumulation material
CN104960198B (en) * 2015-07-07 2017-05-10 北京博简复才技术咨询有限公司 Sensor element adhering device
US10486378B2 (en) 2016-08-01 2019-11-26 GM Global Technology Operations LLC Methods of manufacturing vehicle assemblies
US10408163B2 (en) 2016-08-01 2019-09-10 GM Global Technology Operations LLC Polymeric composite engine assembly and methods of heating and cooling said assembly
NL2021058B1 (en) * 2018-06-05 2019-12-11 Besi Netherlands Bv Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements
NL2021845B1 (en) 2018-10-22 2020-05-13 Besi Netherlands Bv Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874751A (en) * 1956-03-13 1959-02-24 Thermel Inc Temperature controlled press
JP2684677B2 (en) * 1988-05-25 1997-12-03 株式会社日立製作所 Method for manufacturing semiconductor device
JPH03129839A (en) * 1989-10-16 1991-06-03 Nec Yamagata Ltd Manufacture of semiconductor device
KR910011421A (en) * 1989-12-26 1991-08-07 빈센트 죠셉 로너 Isothermal Injection Molding Method
JP3162522B2 (en) * 1992-12-01 2001-05-08 アピックヤマダ株式会社 Resin molding method and resin molding device for semiconductor device
JP2000037745A (en) * 1998-07-21 2000-02-08 Matsushita Electronics Industry Corp Method and apparatus for manufacture of thermosetting resin molded product, and mold assembly

Also Published As

Publication number Publication date
KR20090099520A (en) 2009-09-22
TW200841432A (en) 2008-10-16
CN101583475A (en) 2009-11-18
NL2000356C2 (en) 2008-06-06
WO2008085026A1 (en) 2008-07-17
KR101495576B1 (en) 2015-02-25
TWI440144B (en) 2014-06-01
CN101583475B (en) 2014-09-10

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