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PH12013000283A1 - Copper alloy wire for semiconductor packaging - Google Patents

Copper alloy wire for semiconductor packaging

Info

Publication number
PH12013000283A1
PH12013000283A1 PH12013000283A PH12013000283A PH12013000283A1 PH 12013000283 A1 PH12013000283 A1 PH 12013000283A1 PH 12013000283 A PH12013000283 A PH 12013000283A PH 12013000283 A PH12013000283 A PH 12013000283A PH 12013000283 A1 PH12013000283 A1 PH 12013000283A1
Authority
PH
Philippines
Prior art keywords
copper alloy
alloy wire
semiconductor packaging
pcnt
weight percentage
Prior art date
Application number
PH12013000283A
Inventor
Truan-Sheng Lui
Fei-Yi Hung
Original Assignee
Hung Fei Yi
Lui Truan Sheng
Feng Ching Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hung Fei Yi, Lui Truan Sheng, Feng Ching Metal Corp filed Critical Hung Fei Yi
Publication of PH12013000283A1 publication Critical patent/PH12013000283A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)

Abstract

The invention relates to a copper alloy wire for semiconductor packaging. Primarily, it is made of a copper alloy material. If the copper alloy material is calculated by a total weight percentage of 100 pcnt , it comprises 0.01~0.65 wt. pcnt of precious metals, 0.05 wt. pcnt or less of rare earth elements and a remaining weight percentage of copper. Accordingly, the copper alloy wire made of melted copper alloy can have not only better soldering balling and bonding properties but also an anti-oxidation capability at a high temperature.
PH12013000283A 2012-10-29 2013-09-19 Copper alloy wire for semiconductor packaging PH12013000283A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101139990A TWI403596B (en) 2012-10-29 2012-10-29 Copper alloy wire for semiconductor packaging

Publications (1)

Publication Number Publication Date
PH12013000283A1 true PH12013000283A1 (en) 2015-02-09

Family

ID=48482393

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12013000283A PH12013000283A1 (en) 2012-10-29 2013-09-19 Copper alloy wire for semiconductor packaging

Country Status (2)

Country Link
PH (1) PH12013000283A1 (en)
TW (1) TWI403596B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104278169B (en) * 2013-07-12 2016-08-31 河南理工大学 A kind of corrosion-resistant bonding brass wire and preparation method thereof
CN103805802A (en) * 2014-01-09 2014-05-21 东莞市共民实业有限公司 Copper-silver alloy for ultra-fine copper enameled wire and its production process
CN104018023A (en) * 2014-05-06 2014-09-03 阜阳市光普照明科技有限公司 Method for preparing copper alloy bonding wire for light-emitting diode (LED) encapsulation
JP6056876B2 (en) 2015-01-07 2017-01-11 三菱マテリアル株式会社 Superconducting stabilizer
JP6299802B2 (en) 2016-04-06 2018-03-28 三菱マテリアル株式会社 Superconducting stabilizer, superconducting wire and superconducting coil
JP6299803B2 (en) 2016-04-06 2018-03-28 三菱マテリアル株式会社 Superconducting wire and superconducting coil
TWI640640B (en) * 2017-09-22 2018-11-11 香港商駿碼科技（香港）有限公司 Dual-phase copper alloy wire resistant to repeated cold and heat shocks and manufacturing method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009014168A1 (en) * 2007-07-24 2009-01-29 Nippon Steel Materials Co., Ltd. Semiconductor device bonding wire and wire bonding method

Also Published As

Publication number Publication date
TWI403596B (en) 2013-08-01
TW201311914A (en) 2013-03-16

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