LT2012042A - Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas - Google Patents
Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdasInfo
- Publication number
- LT2012042A LT2012042A LT2012042A LT2012042A LT2012042A LT 2012042 A LT2012042 A LT 2012042A LT 2012042 A LT2012042 A LT 2012042A LT 2012042 A LT2012042 A LT 2012042A LT 2012042 A LT2012042 A LT 2012042A
- Authority
- LT
- Lithuania
- Prior art keywords
- solution
- oxidator
- activating
- treating
- acceleration
- Prior art date
Links
- 229920003023 plastic Polymers 0.000 title abstract 4
- 239000004033 plastic Substances 0.000 title abstract 4
- 238000001465 metallisation Methods 0.000 title abstract 3
- 239000000126 substance Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 abstract 3
- 230000001133 acceleration Effects 0.000 abstract 2
- 230000003213 activating effect Effects 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 230000000711 cancerogenic effect Effects 0.000 abstract 1
- -1 chlorate ions Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910000000 metal hydroxide Inorganic materials 0.000 abstract 1
- 150000004692 metal hydroxides Chemical class 0.000 abstract 1
- 150000007522 mineralic acids Chemical class 0.000 abstract 1
- 150000002940 palladium Chemical class 0.000 abstract 1
- 150000002941 palladium compounds Chemical class 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/78—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
lšradimas priskiriamas prie plastikų paviršiaus paruošimo prieš cheminį metalizavimą ir gali būti panaudotas įvairiose pramonės srityse, kur reikalingos dekoratyvinės arba funkcinės metalų dangos ant plastikų. Siūlomo išradimo tikslas yra kokybiškas plastikų paviršiaus paruošimas prieš cheminį metalizavimą kuo mažesnėmis sąnaudomis, ėsdinimo tirpalo aktyvumui išliekant stabiliu ir nenaudojant kancerogeninių ir kitaip žalingų žmogui ir aplinkai medžiagų. Tikslas pasiekiamas tuo, kad plastikų paviršiaus paruošimo prieš cheminį metalizavimą būdas, apimantis plastiko ėsdinimą neorganinės rūgšties tirpalu su oksidatoriumi, aktyvavimą paladžio druskos tirpalu, bei apdorojimą redukuojančiu arba akceleruojančiu tirpalu, siūlomame būde plastiko paviršių ėsdina 0,5-5 g/l tirpaus chlorato tirpalu 50-80 tūrio% sieros rūgštyje, kambario temperatūroje, o prieš aktyvavimą paladžio junginių tirpalu bei apdorojimą redukuojančiu arba akceleruojančiu tirpalu dar apdoroja šarminių metalų hidroksidų tirpalu; papildomai į ėsdinimo tirpalą deda 2-20 g/l kito oksidatoriaus, kurio standartinis oksidacinis potencialas viršija chlorato jonų potencialą.
Priority Applications (12)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2012042A LT5997B (lt) | 2012-06-05 | 2012-06-05 | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
| PT137275954T PT2855731E (pt) | 2012-06-05 | 2013-06-05 | Processo para a metalização de superfícies plásticas não condutoras |
| PCT/EP2013/061568 WO2013182590A1 (en) | 2012-06-05 | 2013-06-05 | Process for metallizing nonconductive plastic surfaces |
| ES13727595.4T ES2575001T3 (es) | 2012-06-05 | 2013-06-05 | Procedimiento para metalizar superficies plásticas no conductoras |
| EP13727595.4A EP2855731B1 (en) | 2012-06-05 | 2013-06-05 | Process for metallizing nonconductive plastic surfaces |
| JP2015515506A JP6180518B2 (ja) | 2012-06-05 | 2013-06-05 | 非導電性プラスチック表面を金属化するための方法 |
| KR1020147034195A KR102130947B1 (ko) | 2012-06-05 | 2013-06-05 | 비전도성 플라스틱 표면의 금속화 방법 |
| CN201380029727.6A CN104364421B (zh) | 2012-06-05 | 2013-06-05 | 使非导电塑料表面金属化的方法 |
| CA2875323A CA2875323C (en) | 2012-06-05 | 2013-06-05 | Process for metallizing nonconductive plastic surfaces |
| PL13727595.4T PL2855731T3 (pl) | 2012-06-05 | 2013-06-05 | Proces metalizacji nieprzewodzących powierzchni z tworzywa sztucznego |
| BR112014029353-8A BR112014029353B1 (pt) | 2012-06-05 | 2013-06-05 | processo para metalizar superfícies plásticas não condutoras |
| US14/399,987 US20150129540A1 (en) | 2012-06-05 | 2013-06-05 | Process for metallizing nonconductive plastic surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2012042A LT5997B (lt) | 2012-06-05 | 2012-06-05 | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| LT2012042A true LT2012042A (lt) | 2013-12-27 |
| LT5997B LT5997B (lt) | 2014-02-25 |
Family
ID=48577746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LT2012042A LT5997B (lt) | 2012-06-05 | 2012-06-05 | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US20150129540A1 (lt) |
| EP (1) | EP2855731B1 (lt) |
| JP (1) | JP6180518B2 (lt) |
| KR (1) | KR102130947B1 (lt) |
| CN (1) | CN104364421B (lt) |
| BR (1) | BR112014029353B1 (lt) |
| CA (1) | CA2875323C (lt) |
| ES (1) | ES2575001T3 (lt) |
| LT (1) | LT5997B (lt) |
| PL (1) | PL2855731T3 (lt) |
| PT (1) | PT2855731E (lt) |
| WO (1) | WO2013182590A1 (lt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014087004A1 (en) | 2012-12-07 | 2014-06-12 | Atotech Deutschland Gmbh | Process for metallizing nonconductive plastic surfaces |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10920321B2 (en) | 2014-05-30 | 2021-02-16 | Uab Rekin International | Chrome-free adhesion pre-treatment for plastics |
| US9506150B2 (en) | 2014-10-13 | 2016-11-29 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
| EP3181726A1 (en) * | 2015-12-18 | 2017-06-21 | ATOTECH Deutschland GmbH | Etching solution for treating nonconductive plastic surfaces and process for etching nonconductive plastic surfaces |
| US20200087791A1 (en) * | 2017-06-01 | 2020-03-19 | Jcu Corporation | Multi-stage resin surface etching method, and plating method on resin using same |
| FR3074808B1 (fr) | 2017-12-13 | 2020-05-29 | Maxence RENAUD | Outillage de galvanoplastie |
| CN108624907A (zh) * | 2018-04-26 | 2018-10-09 | 复旦大学 | 非金属基体高效催化电极及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52112668A (en) * | 1976-03-18 | 1977-09-21 | Sony Corp | Etching solution for plastics |
| US4919768A (en) * | 1989-09-22 | 1990-04-24 | Shipley Company Inc. | Electroplating process |
| US5160600A (en) * | 1990-03-05 | 1992-11-03 | Patel Gordhanbai N | Chromic acid free etching of polymers for electroless plating |
| US6512182B2 (en) * | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
| DE10259187B4 (de) * | 2002-12-18 | 2008-06-19 | Enthone Inc., West Haven | Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren |
| US20050199587A1 (en) | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
| LT2008082A (lt) * | 2008-10-28 | 2010-05-25 | Chemijos Institutas | Poliimido ir kitų plastikų ėsdinimo būdas |
| JP5552269B2 (ja) * | 2009-07-02 | 2014-07-16 | トヨタ自動車株式会社 | 無電解めっき処理方法 |
| CN102409320B (zh) * | 2011-11-29 | 2015-02-25 | 沈阳工业大学 | 一种abs塑料表面电镀前处理的方法 |
-
2012
- 2012-06-05 LT LT2012042A patent/LT5997B/lt not_active IP Right Cessation
-
2013
- 2013-06-05 CN CN201380029727.6A patent/CN104364421B/zh not_active Expired - Fee Related
- 2013-06-05 BR BR112014029353-8A patent/BR112014029353B1/pt not_active IP Right Cessation
- 2013-06-05 WO PCT/EP2013/061568 patent/WO2013182590A1/en not_active Ceased
- 2013-06-05 US US14/399,987 patent/US20150129540A1/en not_active Abandoned
- 2013-06-05 PT PT137275954T patent/PT2855731E/pt unknown
- 2013-06-05 EP EP13727595.4A patent/EP2855731B1/en not_active Not-in-force
- 2013-06-05 ES ES13727595.4T patent/ES2575001T3/es active Active
- 2013-06-05 KR KR1020147034195A patent/KR102130947B1/ko not_active Expired - Fee Related
- 2013-06-05 CA CA2875323A patent/CA2875323C/en active Active
- 2013-06-05 PL PL13727595.4T patent/PL2855731T3/pl unknown
- 2013-06-05 JP JP2015515506A patent/JP6180518B2/ja active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014087004A1 (en) | 2012-12-07 | 2014-06-12 | Atotech Deutschland Gmbh | Process for metallizing nonconductive plastic surfaces |
| LT6070B (lt) | 2012-12-07 | 2014-09-25 | Atotech Deutschland Gmbh | Plastikų paviršiaus paruošimo prieš jų cheminį metalizavimą būdas |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2855731A1 (en) | 2015-04-08 |
| CN104364421B (zh) | 2017-07-21 |
| WO2013182590A1 (en) | 2013-12-12 |
| KR20150024327A (ko) | 2015-03-06 |
| BR112014029353A2 (pt) | 2017-06-27 |
| BR112014029353B1 (pt) | 2021-04-20 |
| KR102130947B1 (ko) | 2020-07-08 |
| JP2015518924A (ja) | 2015-07-06 |
| JP6180518B2 (ja) | 2017-08-16 |
| CA2875323A1 (en) | 2013-12-12 |
| PL2855731T3 (pl) | 2016-09-30 |
| LT5997B (lt) | 2014-02-25 |
| PT2855731E (pt) | 2016-06-15 |
| CN104364421A (zh) | 2015-02-18 |
| EP2855731B1 (en) | 2016-03-23 |
| CA2875323C (en) | 2020-08-25 |
| ES2575001T3 (es) | 2016-06-23 |
| US20150129540A1 (en) | 2015-05-14 |
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