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KR900012354A - Packaged integrated circuit with decoupling capacitors in the cavity - Google Patents

Packaged integrated circuit with decoupling capacitors in the cavity

Info

Publication number
KR900012354A
KR900012354A KR1019900000464A KR900000464A KR900012354A KR 900012354 A KR900012354 A KR 900012354A KR 1019900000464 A KR1019900000464 A KR 1019900000464A KR 900000464 A KR900000464 A KR 900000464A KR 900012354 A KR900012354 A KR 900012354A
Authority
KR
South Korea
Prior art keywords
cavity
integrated circuit
decoupling capacitors
packaged integrated
packaged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019900000464A
Other languages
Korean (ko)
Other versions
KR0168424B1 (en
Inventor
알. 하이트 래리
Original Assignee
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 텍사스 인스트루먼츠 인코포레이티드 filed Critical 텍사스 인스트루먼츠 인코포레이티드
Publication of KR900012354A publication Critical patent/KR900012354A/en
Application granted granted Critical
Publication of KR0168424B1 publication Critical patent/KR0168424B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019900000464A 1989-01-17 1990-01-16 Packaged Integrated Circuits With Decoupling Capacitors in the Cavity Expired - Lifetime KR0168424B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29779789A 1989-01-17 1989-01-17
US297,797 1989-01-17

Publications (2)

Publication Number Publication Date
KR900012354A true KR900012354A (en) 1990-08-03
KR0168424B1 KR0168424B1 (en) 1999-01-15

Family

ID=23147788

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900000464A Expired - Lifetime KR0168424B1 (en) 1989-01-17 1990-01-16 Packaged Integrated Circuits With Decoupling Capacitors in the Cavity

Country Status (2)

Country Link
JP (1) JPH0362566A (en)
KR (1) KR0168424B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489035B2 (en) 2004-11-09 2009-02-10 Samsung Electronics Co., Ltd. Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997011492A1 (en) * 1995-09-20 1997-03-27 Hitachi, Ltd. Semiconductor device and its manufacture
JP4618941B2 (en) * 2001-07-24 2011-01-26 三洋電機株式会社 Semiconductor device
JP4538473B2 (en) * 2007-06-25 2010-09-08 富士通株式会社 Semiconductor device
US8818296B2 (en) 2012-11-14 2014-08-26 Power Integrations, Inc. Noise cancellation for a magnetically coupled communication link utilizing a lead frame
US9035435B2 (en) 2012-11-14 2015-05-19 Power Integrations, Inc. Magnetically coupled galvanically isolated communication using lead frame
CN207217523U (en) * 2014-11-12 2018-04-10 株式会社村田制作所 Complex electronic device, circuit module and DC-DC converter module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489035B2 (en) 2004-11-09 2009-02-10 Samsung Electronics Co., Ltd. Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Also Published As

Publication number Publication date
KR0168424B1 (en) 1999-01-15
JPH0362566A (en) 1991-03-18

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Legal Events

Date Code Title Description
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Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19900116

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Patent event code: PA02012R01D

Patent event date: 19950116

Comment text: Request for Examination of Application

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Patent event date: 19900116

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19980327

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19980715

GRNT Written decision to grant
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