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JP4538473B2 - Semiconductor device - Google Patents

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JP4538473B2
JP4538473B2 JP2007166722A JP2007166722A JP4538473B2 JP 4538473 B2 JP4538473 B2 JP 4538473B2 JP 2007166722 A JP2007166722 A JP 2007166722A JP 2007166722 A JP2007166722 A JP 2007166722A JP 4538473 B2 JP4538473 B2 JP 4538473B2
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integrated circuit
circuit element
semiconductor integrated
capacitor
thin film
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JP2007243229A (en
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健司 塩賀
ベネキ ジョン
和明 栗原
康男 山岸
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Fujitsu Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16265—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
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    • H01L2924/1901—Structure
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
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    • H01L2924/30107—Inductance

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Description

本発明は、コンピュータ等の電子機器に使用される半導体集積回路素子を実装してなる半導体装置に関する。より詳細には、半導体集積回路素子の近傍に電源供給用デカップリングキャパシタを配置して半導体集積回路素子の高周波領域における動作を安定化させることが可能な半導体装置に関する。   The present invention relates to a semiconductor device on which a semiconductor integrated circuit element used in an electronic device such as a computer is mounted. More specifically, the present invention relates to a semiconductor device in which a power supply decoupling capacitor is disposed in the vicinity of a semiconductor integrated circuit element to stabilize the operation of the semiconductor integrated circuit element in a high frequency region.

従来、電源電圧変動および基板内の高周波ノイズによる半導体集積回路素子の誤動作防止対策として、デカップリングキャパシタ（バイパスコンデンサ）を、回路配線基板の半導体集積回路素子の近傍に実装した半導体装置が知られている。このような半導体装置では、上記キャパシタとして、積層チップキャパシタが通常用いられる。   Conventionally, a semiconductor device in which a decoupling capacitor (bypass capacitor) is mounted in the vicinity of a semiconductor integrated circuit element on a circuit wiring board is known as a countermeasure for preventing malfunction of the semiconductor integrated circuit element due to power supply voltage fluctuations and high-frequency noise in the substrate. Yes. In such a semiconductor device, a multilayer chip capacitor is usually used as the capacitor.

図１は、積層チップキャパシタを実装した従来の半導体装置を示す。   FIG. 1 shows a conventional semiconductor device mounted with a multilayer chip capacitor.

図１の半導体装置においては、パッケージ基板１にＢＧＡ（ボールグリッドアレイ）接続された半導体集積回路素子２に対して、パッケージ下部に積層チップキャパシタ４がバンプ接続されている。このパッケージ基板１は、例えば、マルチチップモジュール（ＭＣＭ）基板等である。積層チップキャパシタ４の高さが回路配線基板（マザーボード）３と干渉するために、回路配線基板３のキャパシタ実装部分はくり貫いて形成してある。この場合、半導体集積回路素子２とキャパシタ４間のインダクタンスが問題となる。   In the semiconductor device of FIG. 1, a multilayer chip capacitor 4 is bump-connected to the lower part of the package with respect to a semiconductor integrated circuit element 2 BGA (ball grid array) connected to the package substrate 1. The package substrate 1 is, for example, a multichip module (MCM) substrate. Since the height of the multilayer chip capacitor 4 interferes with the circuit wiring board (motherboard) 3, the capacitor mounting portion of the circuit wiring board 3 is formed so as to penetrate. In this case, the inductance between the semiconductor integrated circuit element 2 and the capacitor 4 becomes a problem.

図１のような半導体装置の場合、パッケージ基板１内で、積層チップキャパシタ４と半導体集積回路素子２と間の配線の引き回しが必要になり、この引き回し配線でインダクタンスが存在することから、高速動作の半導体集積回路素子２に対しての電源電圧変動の抑止、および高周波リップル吸収の効果は薄れてくる。電圧変動を抑えるためにキャパシタに求められることは、等価直列抵抗（ＥＳＲ）、等価直列インダクタンス（ＥＳＬ）の低減である。特に、配線の引き回しによるインダクタンスの増加は、デカップリングキャパシタの高周波特性を妨げている。   In the case of the semiconductor device as shown in FIG. 1, it is necessary to route wiring between the multilayer chip capacitor 4 and the semiconductor integrated circuit element 2 in the package substrate 1, and since there is inductance in the routing wiring, high speed operation is possible. The effects of suppressing the fluctuation of the power supply voltage and absorbing the high frequency ripple with respect to the semiconductor integrated circuit element 2 are reduced. What is required of a capacitor in order to suppress voltage fluctuation is reduction of equivalent series resistance (ESR) and equivalent series inductance (ESL). In particular, an increase in inductance due to wiring routing hinders the high frequency characteristics of the decoupling capacitor.

この問題を回避するため、半導体集積回路素子近傍にキャパシタを配置し、半導体集積回路素子の電源、グランドからキャパシタまでの配線引き回しを最短にすることにより、インダクタンスの低減が可能となる。そこで、特開平４−２１１１９１号公報には、セラミック回路基板上に誘電体薄膜を形成し、インダクタンスを低減することにより電源系に対するノイズの低減を実現することが考案されている。   In order to avoid this problem, it is possible to reduce the inductance by arranging a capacitor in the vicinity of the semiconductor integrated circuit element and minimizing the wiring from the power supply of the semiconductor integrated circuit element and the ground to the capacitor. In view of this, Japanese Patent Application Laid-Open No. 4-211191 has devised that a noise reduction for a power supply system is realized by forming a dielectric thin film on a ceramic circuit board and reducing inductance.

また、特開平７−１７６４５３号公報、特開２００１−６８５８３号公報、特開２００１−３５９９０号公報には、ビアホールを有する支持基板上に形成された薄膜型キャパシタの上面パッドを半導体集積回路素子に、下面パッドは回路基板に接続し、インダクタンスを低減することが考案されている。   In Japanese Patent Laid-Open Nos. 7-176453, 2001-65883, and 2001-35990, the upper surface pad of a thin film capacitor formed on a support substrate having a via hole is used as a semiconductor integrated circuit element. It has been devised that the lower pad is connected to the circuit board to reduce inductance.

図２は、キャパシタ内蔵インターポーザを実装した従来の半導体装置を示す。図２の（Ａ）においては、パッケージ基板１上にＢＧＡ接続された半導体集積回路素子２に対して、半導体集積回路素子２下部にキャパシタ内蔵インターポーザ５がＢＧＡ接続されている。この場合、インターポーザ５の高さがパッケージ基板１と干渉するため、パッケージ基板１のインターポーザ実装部分はくり貫いてある。図２の（Ｂ）の構成では、パッケージ基板１と半導体集積回路素子２との間にキャパシタ内蔵インターポーザ５がＢＧＡ接続により実装されている。   FIG. 2 shows a conventional semiconductor device mounted with a capacitor built-in interposer. In FIG. 2A, a capacitor built-in interposer 5 is BGA-connected to the lower part of the semiconductor integrated circuit element 2 with respect to the semiconductor integrated circuit element 2 connected to the package substrate 1 by BGA. In this case, since the height of the interposer 5 interferes with the package substrate 1, the interposer mounting portion of the package substrate 1 is hollowed out. In the configuration of FIG. 2B, a capacitor built-in interposer 5 is mounted between the package substrate 1 and the semiconductor integrated circuit element 2 by BGA connection.

図１に比べて、図２の半導体装置の場合は、半導体集積回路素子とキャパシタの接続距離は短くなるが、インターポーザ型を使用すると、製造工程が増加し、技術的にも困難となり、低コスト化は難しくなる。また、素子間接続数が増加するので信頼性の面でも問題がある。また、図２（Ａ）のようにキャパシタ自体の厚みのため、半導体集積回路素子の実装用パッケージを加工しなければならない。   Compared to FIG. 1, in the semiconductor device of FIG. 2, the connection distance between the semiconductor integrated circuit element and the capacitor is shortened. However, if the interposer type is used, the manufacturing process is increased, which is technically difficult and low in cost. It becomes difficult. Further, since the number of connections between elements increases, there is a problem in terms of reliability. Further, as shown in FIG. 2A, due to the thickness of the capacitor itself, a package for mounting a semiconductor integrated circuit element must be processed.

従来、半導体集積回路素子の近傍にキャパシタを配置するには、図２に示したように、支持基板と半導体集積回路素子間にインターポーザ型のチップキャパシタを適用しなければならなかった。しかし、インターポーザ型キャパシタを作製するには、基板にスルービアを形成しなければならず、導体とセラミックスを同時焼成するプロセスによるものや、シリコン等の基板に貫通孔を形成して導体を充填してスルービアを形成しなければならない。これらは、製造上、技術的に困難であり、低コスト化を見込むことができなかった。   Conventionally, in order to arrange a capacitor in the vicinity of a semiconductor integrated circuit element, an interposer type chip capacitor must be applied between the support substrate and the semiconductor integrated circuit element as shown in FIG. However, in order to fabricate an interposer type capacitor, a through via must be formed in the substrate, and a process in which a conductor and ceramics are simultaneously fired, or a through hole is formed in a substrate such as silicon to fill the conductor. Through vias must be formed. These are technically difficult to manufacture and cost reduction cannot be expected.

本発明は、上記の点に鑑みてなされたものであり、インターポーザ構造や積層チップキャパシタを使用することなく、半導体集積回路素子の近傍の最短距離にデカップリングキャパシタを実装することを可能とし、キャパシタのデカップリング機能を最大限に引き出すことができる半導体装置を提供することを目的とする。   The present invention has been made in view of the above points, and enables a decoupling capacitor to be mounted at the shortest distance in the vicinity of a semiconductor integrated circuit element without using an interposer structure or a multilayer chip capacitor. An object of the present invention is to provide a semiconductor device that can maximize the decoupling function.

上記課題を解決するため、本発明の半導体装置は、支持基板と、前記支持基板上に配置された半導体集積回路素子と、前記半導体集積回路素子のデカップリングキャパシタとを備え、前記半導体集積回路素子とリードフレームとがワイヤボンディングにより電気的に接続される半導体装置であって、前記デカップリングキャパシタは、前記半導体集積回路素子上に配置され、前記半導体集積回路素子上面の電極パッドに電気的に接続され、前記半導体集積回路素子上面における前記デカップリングキャパシタの基板を含めた高さが、前記ワイヤボンディングのワイヤ高さよりも低いことを特徴とする。 In order to solve the above problems, a semiconductor device of the present invention comprises a support substrate, a semiconductor integrated circuit element disposed on the support substrate, and a decoupling capacitor of the semiconductor integrated circuit element, and the semiconductor integrated circuit element The decoupling capacitor is disposed on the semiconductor integrated circuit element and is electrically connected to an electrode pad on the upper surface of the semiconductor integrated circuit element. The height of the upper surface of the semiconductor integrated circuit element including the substrate of the decoupling capacitor is lower than the wire height of the wire bonding.

また、本発明の半導体装置において、前記支持基板をシリコンとすることができる。   In the semiconductor device of the present invention, the support substrate can be silicon.

本発明の半導体装置によれば、キャパシタをシリコンやガラス等の平滑性を有する基板上に作製し、このキャパシタを基板側から薄型化することで、半導体集積回路素子のパッケージ実装時のワイヤボンディングのワイヤ高さよりも低くしてあり、半導体集積回路素子とキャパシタ間を最短距離にすることができる。半導体集積回路素子に薄膜キャパシタを実装し、両者の距離を最短することができるため、キャパシタの低抵抗化および低インダクタンス化を達成させることができ、半導体集積回路素子の高周波領域（ＧＨｚ帯）での動作を安定化することを可能にする半導体装置を提供できる。   According to the semiconductor device of the present invention, a capacitor is manufactured on a substrate having smoothness such as silicon or glass, and the capacitor is thinned from the substrate side, so that wire bonding at the time of packaging a semiconductor integrated circuit element can be performed. The height is lower than the wire height, and the shortest distance between the semiconductor integrated circuit element and the capacitor can be achieved. Since a thin film capacitor can be mounted on a semiconductor integrated circuit element and the distance between the two can be minimized, the resistance and the inductance of the capacitor can be reduced, and the high frequency region (GHz band) of the semiconductor integrated circuit element can be achieved. It is possible to provide a semiconductor device that makes it possible to stabilize the operation.

以下、本発明の実施の形態を添付の図面を参照しながら具体的に説明する。   Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings.

図３に、本発明の半導体装置の参考例の構成を示す。図３の（Ａ）は、本発明の半導体装置の参考例の構成例を示し、（Ｂ）はこの参考例の半導体装置の部分拡大図である。 FIG. 3 shows a configuration of a reference example of the semiconductor device of the present invention. FIG. 3A shows a configuration example of a reference example of the semiconductor device of the present invention, and FIG. 3B is a partial enlarged view of the semiconductor device of this reference example .

図３の参考例において、半導体装置１０は、支持基板としてのパッケージ基板１と、パッケージ基板１上に実装された半導体集積回路素子２と、半導体集積回路素子２の高周波領域における動作を安定化するデカップリングキャパシタとして配置される薄膜キャパシタ２０とから構成される。薄膜キャパシタ２０は、半導体集積回路素子２下面の電極パッド部に電気的に接続されると共に、パッケージ基板１上における薄膜キャパシタ２０の基板を含めた厚さが半導体集積回路素子２の半田バンプ高さＨよりも小さく構成されている。 In the reference example of FIG. 3, the semiconductor device 10 stabilizes the operation of the package substrate 1 as a support substrate, the semiconductor integrated circuit element 2 mounted on the package substrate 1, and the semiconductor integrated circuit element 2 in the high frequency region. The thin film capacitor 20 is arranged as a decoupling capacitor. The thin film capacitor 20 is electrically connected to the electrode pad portion on the lower surface of the semiconductor integrated circuit element 2, and the thickness including the substrate of the thin film capacitor 20 on the package substrate 1 is the height of the solder bump of the semiconductor integrated circuit element 2. It is configured to be smaller than H.

この薄膜キャパシタ２０は、例えば、シリコンやガラス等の平滑性を有する基板上に、誘電体層を間に挟み込んだ上部電極層と下部電極層を形成することにより作製される。この薄膜キャパシタ２０の電極パッド及び基板を含めた厚さは５０μｍ以下まで薄型化してある。薄膜キャパシタ２０と半導体集積回路素子２の電極パッド部どうしを、例えば、Ａｕ−Ａｕの超音波接合を利用して電気的に接続することで実装される。   The thin film capacitor 20 is manufactured, for example, by forming an upper electrode layer and a lower electrode layer with a dielectric layer sandwiched between them on a smooth substrate such as silicon or glass. The thickness of the thin film capacitor 20 including the electrode pad and the substrate is reduced to 50 μm or less. The thin film capacitor 20 is mounted by electrically connecting the electrode pad portions of the semiconductor integrated circuit element 2 using, for example, Au-Au ultrasonic bonding.

図３の（Ｂ）に示したように、半導体集積回路素子２をパッケージ基板１に半田バンプにより接合する際に用いられる半田バンプの高さＨ（ここでは、パッケージ基板１及び半導体集積回路素子２の各電極パッドの厚さを含む高さとする）は、７０μｍ程度である。また、パッケージ基板１の電極パッド及び半導体集積回路素子２の電極パッドの厚さは共に、１０μｍ程度である。したがって、この実施形態の薄膜キャパシタ２０は、パッケージ基板１上における薄膜キャパシタ２０の基板を含めた厚さが半導体集積回路素子２の半田バンプ高さＨよりも小さく、もしくは同程度の高さに構成することができる。   As shown in FIG. 3B, the height H of the solder bump used when the semiconductor integrated circuit element 2 is bonded to the package substrate 1 by the solder bump (here, the package substrate 1 and the semiconductor integrated circuit element 2). The height including the thickness of each electrode pad is about 70 μm. The thicknesses of the electrode pads of the package substrate 1 and the electrode pads of the semiconductor integrated circuit element 2 are both about 10 μm. Therefore, the thickness of the thin film capacitor 20 of this embodiment including the substrate of the thin film capacitor 20 on the package substrate 1 is smaller than or equal to the solder bump height H of the semiconductor integrated circuit element 2. can do.

この参考例では、図３の（Ｂ）のように、薄膜キャパシタ２０の基板背面が、パッケージ基板１の表面に接触する構成にしてある。このように構成することで、半導体集積回路素子２をパッケージ基板１に接続する際に、半田バンプ高さが規定されることになる。このように半導体集積回路素子２とパッケージ基板１間の距離が規定されると、半田溶融時に、半導体集積回路素子２とパッケージ基板１の電極パッドにより半田の広がりが制限されるため、半田の表面張力により接続部の形状は球欠体となることが防止され、円柱形状になる。このため、半田と半導体集積回路素子２およびパッケージ基板１上の電極パッドとの接着部分に応力集中が生じることを防止できる。 In this reference example , the back surface of the thin film capacitor 20 is in contact with the surface of the package substrate 1 as shown in FIG. With this configuration, when the semiconductor integrated circuit element 2 is connected to the package substrate 1, the solder bump height is defined. When the distance between the semiconductor integrated circuit element 2 and the package substrate 1 is defined in this way, the solder spread is limited by the electrode pads of the semiconductor integrated circuit element 2 and the package substrate 1 when the solder is melted. The shape of the connecting portion is prevented from being a spherical defect due to the tension, and becomes a cylindrical shape. For this reason, it is possible to prevent stress concentration from occurring in the bonding portion between the solder and the semiconductor integrated circuit element 2 and the electrode pad on the package substrate 1.

なお、特開昭５７−１１８６５０号公報に記載されたように、半田溶融時に、支持基板の電極と回路素子の電極間の半田接続部を球欠体ではなく、円柱形状に形成すると、同一半田量でも接続高さが高くなり、温度変化により生じる応力が、半田接続部に均一にしかも高さ増加分だけ減少して分配される。ため、回路素子の半田接続部の接続信頼性が向上する。   In addition, as described in Japanese Patent Application Laid-Open No. 57-118650, when the solder connection portion between the electrode of the support substrate and the electrode of the circuit element is formed in a columnar shape instead of a spherical notch during solder melting, the same solder Even if the amount is high, the connection height is increased, and the stress caused by the temperature change is distributed to the solder connection portion uniformly and decreased by the height increase. Therefore, the connection reliability of the solder connection portion of the circuit element is improved.

図４に、本発明の半導体装置の第１の実施形態の構成を示す。 FIG. 4 shows the configuration of the first embodiment of the semiconductor device of the present invention.

図４の実施形態において、半導体装置１１は、支持基板としてのパッケージ基板１と、パッケージ基板１上に実装された半導体集積回路素子２と、半導体集積回路素子２の高周波領域における動作を安定化するデカップリングキャパシタとして配置される薄膜キャパシタ２０とから構成される。この半導体装置１１は、半導体集積回路素子２とリードフレーム１６とがワイヤボンディングにより電気的に接続される構成であり、樹脂モールド１８に封止された状態で使用される。   In the embodiment of FIG. 4, the semiconductor device 11 stabilizes the operation of the package substrate 1 as a support substrate, the semiconductor integrated circuit element 2 mounted on the package substrate 1, and the semiconductor integrated circuit element 2 in the high frequency region. The thin film capacitor 20 is arranged as a decoupling capacitor. The semiconductor device 11 has a configuration in which the semiconductor integrated circuit element 2 and the lead frame 16 are electrically connected by wire bonding, and is used in a state of being sealed in a resin mold 18.

この実施形態において、薄膜キャパシタ２０は、半導体集積回路素子２上面の電極パッド部に電気的に接続されると共に、半導体集積回路素子２の上面における薄膜キャパシタ２０の基板を含めた高さＨ１がボンディングワイヤ１７のワイヤ高さＨ２も小さく構成されている。   In this embodiment, the thin film capacitor 20 is electrically connected to the electrode pad portion on the upper surface of the semiconductor integrated circuit element 2 and the height H1 including the substrate of the thin film capacitor 20 on the upper surface of the semiconductor integrated circuit element 2 is bonded. The wire height H2 of the wire 17 is also small.

図３の実施形態と同様に、この薄膜キャパシタ２０は、例えば、シリコンやガラス等の平滑性を有する基板上に、誘電体層を間に挟み込んだ上部電極層と下部電極層を形成することにより作製される。この薄膜キャパシタ２０の電極パッド及び基板を含めた厚さは５０μｍ以下まで薄型化してある。薄膜キャパシタ２０と半導体集積回路素子２の電極パッド部どうしを、例えば、Ａｕ−Ａｕの超音波接合を利用して電気的に接続することで実装される。   Similar to the embodiment of FIG. 3, the thin film capacitor 20 is formed by forming an upper electrode layer and a lower electrode layer with a dielectric layer sandwiched therebetween on a substrate having smoothness such as silicon or glass. Produced. The thickness of the thin film capacitor 20 including the electrode pad and the substrate is reduced to 50 μm or less. The thin film capacitor 20 is mounted by electrically connecting the electrode pad portions of the semiconductor integrated circuit element 2 using, for example, Au-Au ultrasonic bonding.

この実施形態では、薄膜キャパシタ２０の基板を含めた厚さＨ１が、半導体集積回路素子２表面からのボンディングワイヤ１７のワイヤ高さＨ２よりも小さいことを特徴とする。図４に示したように、ワイヤボンディングのリードフレーム１６からのワイヤ高さは１５０μｍ程度であり、薄膜キャパシタ２０を内蔵っする本実施形態の半導体装置１１は容易に作製することができる。   In this embodiment, the thickness H1 including the substrate of the thin film capacitor 20 is smaller than the wire height H2 of the bonding wire 17 from the surface of the semiconductor integrated circuit element 2. As shown in FIG. 4, the height of the wire from the lead frame 16 for wire bonding is about 150 μm, and the semiconductor device 11 of this embodiment including the thin film capacitor 20 can be easily manufactured.

図４の半導体装置１１においても、参考例と同様、薄膜キャパシタ２０は、その支持基板としてのシリコンウェハーの背面を研磨して、厚さ５０μｍ以下に薄型化してある。また、薄膜キャパシタ２０と半導体集積回路素子２の各電極端子どうしを、Ａｕ−Ａｕの超音波接合法を用いて実装してある。上述したように、ボンディングワイヤ１７のワイヤ高さは１５０μｍ程度であり、樹脂モールド１８を形成する際に、薄膜キャパシタ２０が干渉することがない。したがって、薄膜キャパシタ２０を内蔵する半導体装置１１が容易に作製することができる。 Also in the semiconductor device 11 of FIG. 4, as in the reference example , the thin film capacitor 20 is thinned to a thickness of 50 μm or less by polishing the back surface of a silicon wafer as its supporting substrate. The electrode terminals of the thin film capacitor 20 and the semiconductor integrated circuit element 2 are mounted using an Au—Au ultrasonic bonding method. As described above, the wire height of the bonding wire 17 is about 150 μm, and the thin film capacitor 20 does not interfere when the resin mold 18 is formed. Therefore, the semiconductor device 11 incorporating the thin film capacitor 20 can be easily manufactured.

図５は、本発明に係る薄膜キャパシタの製造方法の実施例を説明するための図である。図６は、図５の薄膜キャパシタを実装した本発明の半導体装置の詳細構造を示す。   FIG. 5 is a diagram for explaining an embodiment of a method of manufacturing a thin film capacitor according to the present invention. FIG. 6 shows a detailed structure of the semiconductor device of the present invention on which the thin film capacitor of FIG. 5 is mounted.

図５の（ａ）に示したように、支持基板にはシリコンウェハー２１を用いている。支持基板にシリコンを使用することで、背面研磨による薄型化が容易である。シリコンは３０μｍ程度に薄く研磨しても割れにくいため、本発明に係る薄膜キャパシタ２０の支持基板として好適である。また、半導体集積回路素子２と薄膜キャパシタ２０との熱膨張係数をほぼ同じレベルに合わせることができ、実装ストレスを回避することができる。   As shown in FIG. 5A, a silicon wafer 21 is used as the support substrate. By using silicon for the support substrate, it is easy to reduce the thickness by back polishing. Silicon is suitable as a support substrate for the thin film capacitor 20 according to the present invention because it is difficult to break even if it is polished as thin as about 30 μm. Further, the thermal expansion coefficients of the semiconductor integrated circuit element 2 and the thin film capacitor 20 can be adjusted to substantially the same level, and mounting stress can be avoided.

図５の（ｂ）、（ｃ）、（ｄ）に示したように、シリコンウェハー２１上に下部電極層２３、誘電体層２４、上部電極層２５の薄膜を順次成膜する。この実施例では、厚さ０．３ｍｍのＳｉＯ２熱酸化膜が形成されたシリコンウェハー２１を用い、まず、このシリコンウェハー２１上に下部電極材料としてＴｉＯ２（０．０５μｍ）／Ｐｔ（０．１μｍ）をスパッタリング法により成膜を行う。次に、同一真空系内で、高誘電体材料（Ｂａ、Ｓｒ）ＴｉＯ３（以下、ＢＳＴという）をスパッタリング法により成膜する。さらに、その上に、Ｐｔ（０．１μｍ）をスパッタリング法により成膜してある。 As shown in FIGS. 5B, 5 </ b> C, and 5 </ b> D, the lower electrode layer 23, the dielectric layer 24, and the upper electrode layer 25 are sequentially formed on the silicon wafer 21. In this embodiment, a silicon wafer 21 on which a 0.3 mm thick SiO 2 thermal oxide film is formed is used. First, TiO 2 (0.05 μm) / Pt (0. 1 μm) is formed by sputtering. Next, a high dielectric material (Ba, Sr) TiO 3 (hereinafter referred to as BST) is formed by sputtering in the same vacuum system. Furthermore, Pt (0.1 μm) is formed thereon by sputtering.

本発明に係る薄膜キャパシタ２０の、誘電体層２４を構成する誘電体酸化物として好適な構成材料としては、ストロンチウム（Ｓｒ）、バリウム（Ｂａ）、鉛（Ｐｂ）、スズ（Ｚｒ）、ビスマス（Ｂｉ）、タンタル（Ｔａ）、チタン（Ｔｉ）、マグネシウム（Ｍｇ）、ニオブ（Ｎｂ）等の中、少なくとも1つの元素を含む複合酸化物を適用することができる。薄膜キャパシタ２０の誘電体層２４に好適な誘電体酸化物として、上記実施例の(Ｂａ，Ｓｒ)ＴｉＯ３の他、例えば、Ｐｂ（Ｚｒ，Ｔｉ）Ｏ３、Ｐｂ（Ｍｇ，Ｎｂ）Ｏ３、ＳｒＢｉ２Ｔａ２Ｏ９、Ｔａ２Ｏ５等を挙げることができる。 As the constituent material suitable for the dielectric oxide constituting the dielectric layer 24 of the thin film capacitor 20 according to the present invention, strontium (Sr), barium (Ba), lead (Pb), tin (Zr), bismuth ( A composite oxide containing at least one element among Bi), tantalum (Ta), titanium (Ti), magnesium (Mg), niobium (Nb), and the like can be used. As a dielectric oxide suitable for the dielectric layer 24 of the thin film capacitor 20, for example, Pb (Zr, Ti) O 3 , Pb (Mg, Nb) O 3 in addition to (Ba, Sr) TiO 3 of the above embodiment. , SrBi 2 Ta 2 O 9 , Ta 2 O 5 and the like.

また、本発明に係る薄膜キャパシタ２０において、誘電体層２４を間に挟み込んで形成される上部電極層２５及び下部電極層２３に好適な構成材料として、白金（Ｐｔ）、金（Ａｕ）、銅（Ｃｕ）、鉛（Ｐｂ）、ルテニウム（Ｒｕ）、ルテニウム酸化物、イリジウム（Ｉｒ）、イリジウム酸化物、クロム（Ｃｒ）等の中、少なくとも１つ以上の金属元素又は金属酸化物を含有するものを適用することができる。   In addition, in the thin film capacitor 20 according to the present invention, platinum (Pt), gold (Au), copper as suitable constituent materials for the upper electrode layer 25 and the lower electrode layer 23 formed by sandwiching the dielectric layer 24 therebetween. (Cu), lead (Pb), ruthenium (Ru), ruthenium oxide, iridium (Ir), iridium oxide, chromium (Cr), or the like containing at least one metal element or metal oxide Can be applied.

次に、図５の（ｅ）に示したように、フォトリソグラフィ法により、上部電極層２５および誘電体層２４の開口部をパターニングする。さらに、Ａｒイオンミリングを使用して、Ｐｔ、ＢＳＴの一括ドライエッチングを行う。   Next, as shown in FIG. 5E, the openings of the upper electrode layer 25 and the dielectric layer 24 are patterned by photolithography. Furthermore, collective dry etching of Pt and BST is performed using Ar ion milling.

次に、図５の（ｆ）、（ｇ）に示したように、ポリイミド絶縁層２６を成膜して、Ｃｒ膜０．０５μｍ、Ｃｕ膜１μｍ、Ａｕ膜１０μｍを順次積層して電極パッド２２が形成してある。図６に示したように、この電極パッド２２には、半導体集積回路素子２の電極パッド１２とＡｕ−Ａｕ超音波接合を行なうため、薄膜キャパシタ２０側は、直径４０μｍ、厚さ１０μｍ程度のＡｕ最表面パッドが形成され、半導体集積回路素子２側には、厚さ０．２μｍ程度のＡｕ最表面パッドが形成されている。半導体集積回路素子２の電極パッド１２は、Ｃｕ膜３μｍ、Ｎｉ膜２μｍ、Ａｕ膜０．２μｍを積層して形成してある。   Next, as shown in FIGS. 5F and 5G, a polyimide insulating layer 26 is formed, and a Cr film 0.05 μm, a Cu film 1 μm, and an Au film 10 μm are sequentially stacked to form an electrode pad 22. Is formed. As shown in FIG. 6, since this electrode pad 22 is subjected to Au-Au ultrasonic bonding with the electrode pad 12 of the semiconductor integrated circuit element 2, the thin film capacitor 20 side has an Au having a diameter of about 40 μm and a thickness of about 10 μm. An outermost surface pad is formed, and an Au outermost surface pad having a thickness of about 0.2 μm is formed on the semiconductor integrated circuit element 2 side. The electrode pad 12 of the semiconductor integrated circuit element 2 is formed by stacking a Cu film 3 μm, a Ni film 2 μm, and an Au film 0.2 μm.

その後、図５の（ｈ）、図６の（Ａ）に示したように、シリコンウェハー２１の背面２１ａを研磨して、薄膜キャパシタ２０の基板２１を含む厚さ（電極パッド２２を除く）を４０μｍまで薄型化させる。これは、半導体集積回路素子２の実装高さ（バンプ高さ）と同程度の厚さにするためである。   After that, as shown in FIGS. 5H and 6A, the back surface 21a of the silicon wafer 21 is polished, and the thickness (excluding the electrode pads 22) including the substrate 21 of the thin film capacitor 20 is polished. Thinner to 40 μm. This is because the thickness is approximately equal to the mounting height (bump height) of the semiconductor integrated circuit element 2.

このようにして作製された薄膜キャパシタ２０を適用することによって、薄膜キャパシタを内蔵した本発明の半導体装置を得ることができる。   By applying the thin film capacitor 20 manufactured in this way, the semiconductor device of the present invention incorporating the thin film capacitor can be obtained.

図６の（Ｂ）に示したように、薄膜キャパシタ２０の電極パッド２２と半導体集積回路素子２の電極パッド１２とのＡｕ−Ａｕ超音波接合によって、薄膜キャパシタ２０の電極部と半導体集積回路素子２の電極部とが接合され、本発明の半導体装置１０が完成する。   As shown in FIG. 6B, the electrode portion of the thin film capacitor 20 and the semiconductor integrated circuit element are formed by Au—Au ultrasonic bonding between the electrode pad 22 of the thin film capacitor 20 and the electrode pad 12 of the semiconductor integrated circuit element 2. The two electrode portions are joined to complete the semiconductor device 10 of the present invention.

図６の実施例の半導体装置１０においては、薄膜キャパシタ２０の厚さは、半導体集積回路素子２の半田バンプ高さＨよりある程度小さくしてあり、薄膜キャパシタ２０の基板の背面２１ａはパッケージ基板１の表面に接触していない。この実施例のように、完成品としての半導体装置１０を使用する際に、半導体集積回路素子２の半田接合部の温度変化による応力変動の影響が直接、薄膜キャパシタ２０に伝わらないように構成してもよい。半田疲労寿命を延ばすことができ、半田接合の電気的接続の信頼性を向上することができる。   In the semiconductor device 10 of the embodiment of FIG. 6, the thickness of the thin film capacitor 20 is made somewhat smaller than the solder bump height H of the semiconductor integrated circuit element 2, and the back surface 21 a of the substrate of the thin film capacitor 20 is the package substrate 1. There is no contact with the surface. As in this embodiment, when the semiconductor device 10 as a finished product is used, the influence of the stress fluctuation due to the temperature change of the solder joint portion of the semiconductor integrated circuit element 2 is not directly transmitted to the thin film capacitor 20. May be. The solder fatigue life can be extended, and the reliability of the electrical connection of the solder joint can be improved.

以上の図５及び図６の説明では、図３の実施形態に基づいて薄膜キャパシタ２０及び半導体装置１０の作製方法を述べてきたが、同様にして、図４の半導体装置１１も容易に作製することができる。すなわち、図６の（Ａ）に示した薄膜キャパシタ２０を上下反転させた状態で、薄膜キャパシタ２０の電極パッド２２と半導体集積回路素子２の電極パッド１２とのＡｕ−Ａｕ超音波接合によって、薄膜キャパシタ２０の電極部と半導体集積回路素子２の電極部とを接合して、図４の半導体装置１１を作製できる。   In the above description of FIGS. 5 and 6, the manufacturing method of the thin film capacitor 20 and the semiconductor device 10 has been described based on the embodiment of FIG. 3. Similarly, the semiconductor device 11 of FIG. 4 is easily manufactured. be able to. That is, the thin film capacitor 20 shown in FIG. 6A is turned upside down by Au—Au ultrasonic bonding between the electrode pad 22 of the thin film capacitor 20 and the electrode pad 12 of the semiconductor integrated circuit element 2. The semiconductor device 11 of FIG. 4 can be manufactured by bonding the electrode portion of the capacitor 20 and the electrode portion of the semiconductor integrated circuit element 2.

積層チップキャパシタを実装した従来の半導体装置を示す図である。It is a figure which shows the conventional semiconductor device which mounted the multilayer chip capacitor. キャパシタ内蔵インターポーザを実装した従来の半導体装置を示す図である。It is a figure which shows the conventional semiconductor device which mounted the interposer with a built-in capacitor. 本発明の半導体装置の参考例の構成を示す図である。It is a figure which shows the structure of the reference example of the semiconductor device of this invention. 本発明の半導体装置の第１の実施形態の構成を示す図である。 1 is a diagram showing a configuration of a first exemplary embodiment of a semiconductor device of the present invention. 本発明に係る薄膜キャパシタの製造方法を説明するための説明図である。It is explanatory drawing for demonstrating the manufacturing method of the thin film capacitor which concerns on this invention. 図５の薄膜キャパシタを実装した本発明の半導体装置の詳細構造を示す図である。It is a figure which shows the detailed structure of the semiconductor device of this invention which mounted the thin film capacitor of FIG.

符号の説明Explanation of symbols

１ パッケージ基板
２ 半導体集積回路素子
３ 回路配線基板
４ 積層チップキャパシタ
５ キャパシタ内蔵インターポーザ
１０、１１ 半導体装置
１２ 電極パッド
１５ 半田バンプ
１６ リードフレーム
１７ ボンディングワイヤ
１８ 樹脂モールド
２０ 薄膜キャパシタ
２１ シリコンウェハー
２１ａ 研磨面
２２ 電極パッド
２３ 下部電極層
２４ 誘電体層
２５ 上部電極層
２６ ポリイミド絶縁層 DESCRIPTION OF SYMBOLS 1 Package board | substrate 2 Semiconductor integrated circuit element 3 Circuit wiring board 4 Multilayer chip capacitor 5 Capacitor built-in interposer 10, 11 Semiconductor device 12 Electrode pad 15 Solder bump 16 Lead frame 17 Bonding wire 18 Resin mold 20 Thin film capacitor 21 Silicon wafer 21a Polishing surface 22 Electrode pad 23 Lower electrode layer 24 Dielectric layer 25 Upper electrode layer 26 Polyimide insulating layer

Claims (2)

支持基板と、前記支持基板上に配置された半導体集積回路素子と、前記半導体集積回路素子のデカップリングキャパシタとを備え、前記半導体集積回路素子とリードフレームとがワイヤボンディングにより電気的に接続される半導体装置であって、
前記デカップリングキャパシタは、前記半導体集積回路素子上に配置され、前記半導体集積回路素子上面の電極パッドに電気的に接続され、前記半導体集積回路素子上面における前記デカップリングキャパシタの基板を含めた高さが、前記ワイヤボンディングのワイヤ高さよりも低いことを特徴とする半導体装置。 A support substrate, a semiconductor integrated circuit element disposed on the support substrate, and a decoupling capacitor of the semiconductor integrated circuit element are provided, and the semiconductor integrated circuit element and the lead frame are electrically connected by wire bonding. A semiconductor device,
The decoupling capacitor is disposed on the semiconductor integrated circuit element, electrically connected to an electrode pad on the upper surface of the semiconductor integrated circuit element, and a height including the substrate of the decoupling capacitor on the upper surface of the semiconductor integrated circuit element Is lower than the wire height of the wire bonding. 前記支持基板はシリコンであることを特徴とする請求項１記載の半導体装置。   The semiconductor device according to claim 1, wherein the support substrate is silicon.
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