[go: up one dir, main page]

KR900009850A - 에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물 - Google Patents

에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물

Info

Publication number
KR900009850A
KR900009850A KR1019890018367A KR890018367A KR900009850A KR 900009850 A KR900009850 A KR 900009850A KR 1019890018367 A KR1019890018367 A KR 1019890018367A KR 890018367 A KR890018367 A KR 890018367A KR 900009850 A KR900009850 A KR 900009850A
Authority
KR
South Korea
Prior art keywords
epoxy resin
composition
curing agent
agent composition
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019890018367A
Other languages
English (en)
Other versions
KR0169709B1 (ko
Inventor
쇼지 다니
마사히꼬 야마나까
도미오 노베
시게오 다까쯔지
Original Assignee
신닛뽕리가 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신닛뽕리가 가부시끼가이샤 filed Critical 신닛뽕리가 가부시끼가이샤
Publication of KR900009850A publication Critical patent/KR900009850A/ko
Application granted granted Critical
Publication of KR0169709B1 publication Critical patent/KR0169709B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681—Metal alcoholates, phenolates or carboxylates
    • C08G59/685—Carboxylates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
KR1019890018367A 1988-12-13 1989-12-12 에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물 Expired - Fee Related KR0169709B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP31478988 1988-12-13
JP314789/1988 1988-12-13
JP3098/1989 1989-01-10
JP309889 1989-01-10

Publications (2)

Publication Number Publication Date
KR900009850A true KR900009850A (ko) 1990-07-05
KR0169709B1 KR0169709B1 (ko) 1999-03-20

Family

ID=26336604

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890018367A Expired - Fee Related KR0169709B1 (ko) 1988-12-13 1989-12-12 에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물

Country Status (3)

Country Link
US (1) US5034493A (ko)
KR (1) KR0169709B1 (ko)
DE (1) DE3941173A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223862A (en) * 1991-04-08 1993-06-29 Corning Incorporated High-index, organic lens member
JP3651729B2 (ja) * 1997-03-14 2005-05-25 株式会社東芝 含浸用樹脂組成物
DE19936605A1 (de) * 1999-08-04 2001-02-15 Osram Opto Semiconductors Gmbh Transparente Gießharzmasse für SMT-fähige LED-Anwendungen mit hoher Temperatur und hohen Helligkeiten oder Leuchtstärken
DE602006006338D1 (de) * 2005-11-22 2009-05-28 Huntsman Adv Mat Switzerland Witterungsbeständiges epoxidharzsystem
TWI403531B (zh) 2009-03-09 2013-08-01 松下電器產業股份有限公司 透明薄膜

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689444A (en) * 1971-04-23 1972-09-05 Celanese Coatings Co Latent catalysts for one-component epoxy resin/anhydride compositions
US4013987A (en) * 1975-08-22 1977-03-22 Westinghouse Electric Corporation Mica tape binder
JPS6029730B2 (ja) * 1977-08-06 1985-07-12 三菱電機株式会社 エポキシ樹脂組成物
US4321351A (en) * 1979-11-05 1982-03-23 Ciba-Geigy Corporation Process for the production of epoxy resin castings
US4923911A (en) * 1987-12-29 1990-05-08 Ciba-Geigy Corporation Curable mixtures

Also Published As

Publication number Publication date
DE3941173A1 (de) 1990-06-21
US5034493A (en) 1991-07-23
KR0169709B1 (ko) 1999-03-20

Similar Documents

Publication Publication Date Title
DE68928328D1 (de) Harzzusammensetzung
DE69212343D1 (de) Schaumfähige Epoxydharzzusammensetzung
KR900700518A (ko) 개질된 에폭시 수지
DE69034033D1 (de) Thermoplastische Harzzusammensetzung
KR860700039A (ko) 에폭시수지용 경화제 및 에폭시수지의 경화방법
DE69119662D1 (de) Epoxydharzzusammensetzung
DE69121926D1 (de) Kautschuk-modifizierte Epoxyharzzusammensetzungen
FI904156A7 (fi) Pitkälle kehitetty epoksihartsikoostumus ja menetelmä sen valmistamiseksi
BR9002890A (pt) Composicao de resina moldavel amassada e moldagem
JPS6466172A (en) Quick curing agent and accelerator for epoxy resin
DE69032416D1 (de) Polyimidhaltige Harzzusammensetzung
FI890648A7 (fi) Katalysaattoreita ja niitä sisältäviä epoksihartsikoostumus
DE3751717D1 (de) Epoxydharzzusammensetzung
KR900011853A (ko) 수지 조성물
EP0424872A3 (en) Curing agent for epoxy resin
DE69025017D1 (de) Thermohärtende Harzzusammensetzung
KR900006818A (ko) 감방사선성 수지 조성물
KR900007946A (ko) 경화성수지조성물
DE69129146D1 (de) Epoxydharzzusammensetzung
KR900013007A (ko) 반도체-캡슐화 에폭시 수지 조성물
KR900009850A (ko) 에폭시 수지용 경화제 조성물 및 에폭시 수지 조성물
KR0136590B1 (en) Epoxy resin composition
DE68928663D1 (de) Thermoplastische Harzzusammensetzung
BR8904915A (pt) Composicao de resina epoxido e aplicacao
GB8925825D0 (en) Two part epoxy resin composition

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20060926

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20071014

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20071014

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000