KR900008664A - 캐리어기판 및 그 제조방법 - Google Patents

캐리어기판 및 그 제조방법

Info

Publication number: KR900008664A
Authority: KR; South Korea
Prior art keywords: manufacturing; carrier substrate; carrier; substrate
Prior art date: 1988-11-30
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

KR1019890017383A

Other languages

English (en)

Other versions

KR930006274B1 (ko

Inventor

히데다까 시기

다까지 다께나까

후미유끼 고바야시

Original Assignee

가부시기가이샤 히다찌세이사꾸쇼

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-11-30

Filing date

1989-11-29

Publication date

1990-06-03

1989-11-29 Application filed by 가부시기가이샤 히다찌세이사꾸쇼 filed Critical 가부시기가이샤 히다찌세이사꾸쇼

1990-06-03 Publication of KR900008664A publication Critical patent/KR900008664A/ko

1993-07-09 Application granted granted Critical

1993-07-09 Publication of KR930006274B1 publication Critical patent/KR930006274B1/ko

2009-11-29 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W70/635—
- H10W20/40—
- H10W70/60—
- H10W72/012—
- H10W72/20—
- H10W70/655—
- H10W72/07251—

KR1019890017383A 1988-11-30 1989-11-29 캐리어기판 및 그 제조방법 Expired - Fee Related KR930006274B1 (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP63-302396		1988-11-30
JP63302396A JPH02148862A (ja)	1988-11-30	1988-11-30	回路素子パッケージ、キャリヤ基板および製造方法

Publications (2)

Publication Number	Publication Date
KR900008664A true KR900008664A (ko)	1990-06-03
KR930006274B1 KR930006274B1 (ko)	1993-07-09

Family

ID=17908409

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019890017383A Expired - Fee Related KR930006274B1 (ko)	1988-11-30	1989-11-29	캐리어기판 및 그 제조방법

Country Status (5)

Country	Link
JP (1)	JPH02148862A (ko)
KR (1)	KR930006274B1 (ko)
CN (1)	CN1015582B (ko)
DE (1)	DE3939647A1 (ko)
GB (1)	GB2225670B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100437740B1 (ko) *	1996-04-22	2004-08-27	꼬게마 꽁빠니 제네랄 데 마띠에르 뉘끌레르	유해액체,특히고체입자로충진된유해액체의샘플링장치

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2503725B2 (ja) *	1990-05-18	1996-06-05	日本電気株式会社	多層配線基板
GB2267993B (en) *	1992-06-15	1995-11-22	Gnb Ind Battery Co	Modular battery cabinet assembly
US5378927A (en) *	1993-05-24	1995-01-03	International Business Machines Corporation	Thin-film wiring layout for a non-planar thin-film structure
JPH07221462A (ja) *	1994-02-03	1995-08-18	Murata Mfg Co Ltd	複合回路部品
US5904499A (en) *	1994-12-22	1999-05-18	Pace; Benedict G	Package for power semiconductor chips
EP0804806A1 (en) *	1994-12-22	1997-11-05	Benedict G. Pace	Device for superheating steam
US6614110B1 (en)	1994-12-22	2003-09-02	Benedict G Pace	Module with bumps for connection and support
US6384344B1 (en)	1995-06-19	2002-05-07	Ibiden Co., Ltd	Circuit board for mounting electronic parts
DE69637246T2 (de)	1996-09-12	2008-02-14	Ibiden Co., Ltd., Ogaki	Leiterplatte zur montage elektronischer bauelemente
JPH10308565A (ja) *	1997-05-02	1998-11-17	Shinko Electric Ind Co Ltd	配線基板
JP3973340B2 (ja)	1999-10-05	2007-09-12	Ｎｅｃエレクトロニクス株式会社	半導体装置、配線基板、及び、それらの製造方法
JP4023076B2 (ja) *	2000-07-27	2007-12-19	富士通株式会社	表裏導通基板及びその製造方法
JP2005045073A (ja) *	2003-07-23	2005-02-17	Hamamatsu Photonics Kk	裏面入射型光検出素子

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3875479A (en) *	1973-05-07	1975-04-01	Gilbert R Jaggar	Electrical apparatus
US4023197A (en) *	1974-04-15	1977-05-10	Ibm Corporation	Integrated circuit chip carrier and method for forming the same
US4202007A (en) *	1978-06-23	1980-05-06	International Business Machines Corporation	Multi-layer dielectric planar structure having an internal conductor pattern characterized with opposite terminations disposed at a common edge surface of the layers
DE2915240A1 (de) *	1978-06-28	1980-01-03	Mitsumi Electric Co	Gedruckte schaltung
US4221047A (en) *	1979-03-23	1980-09-09	International Business Machines Corporation	Multilayered glass-ceramic substrate for mounting of semiconductor device
US4322778A (en) *	1980-01-25	1982-03-30	International Business Machines Corp.	High performance semiconductor package assembly
US4302625A (en) *	1980-06-30	1981-11-24	International Business Machines Corp.	Multi-layer ceramic substrate
US4407007A (en) *	1981-05-28	1983-09-27	International Business Machines Corporation	Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate
US4430365A (en) *	1982-07-22	1984-02-07	International Business Machines Corporation	Method for forming conductive lines and vias
EP0111890B1 (en) *	1982-12-15	1991-03-13	Nec Corporation	Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a perovskite structure
JPS59180514A (ja) *	1983-03-31	1984-10-13	Toshiba Corp	光受信モジユ−ル
FR2556503B1 (fr) *	1983-12-08	1986-12-12	Eurofarad	Substrat d'interconnexion en alumine pour composant electronique
JPS60178695A (ja) *	1984-02-17	1985-09-12	インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン	電気的相互接続パツケ−ジ
JPS6148994A (ja) *	1984-08-17	1986-03-10	株式会社日立製作所	モジユ−ル基板
JPH0714105B2 (ja) *	1986-05-19	1995-02-15	日本電装株式会社	混成集積回路基板及びその製造方法
JPH0734455B2 (ja) *	1986-08-27	1995-04-12	日本電気株式会社	多層配線基板
JPS6366993A (ja) *	1986-09-08	1988-03-25	日本電気株式会社	多層配線基板
GB2197540B (en) *	1986-11-12	1991-04-17	Murata Manufacturing Co	A circuit structure.
JP2610487B2 (ja) *	1988-06-10	1997-05-14	株式会社日立製作所	セラミック積層回路基板

1988
- 1988-11-30 JP JP63302396A patent/JPH02148862A/ja active Pending
1989
- 1989-11-29 GB GB8926971A patent/GB2225670B/en not_active Expired - Lifetime
- 1989-11-29 KR KR1019890017383A patent/KR930006274B1/ko not_active Expired - Fee Related
- 1989-11-30 CN CN89109771A patent/CN1015582B/zh not_active Expired
- 1989-11-30 DE DE3939647A patent/DE3939647A1/de not_active Withdrawn

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR100437740B1 (ko) *	1996-04-22	2004-08-27	꼬게마 꽁빠니 제네랄 데 마띠에르 뉘끌레르	유해액체,특히고체입자로충진된유해액체의샘플링장치

Also Published As

Publication number	Publication date
CN1015582B (zh)	1992-02-19
GB2225670A (en)	1990-06-06
KR930006274B1 (ko)	1993-07-09
CN1043407A (zh)	1990-06-27
DE3939647A1 (de)	1990-05-31
GB8926971D0 (en)	1990-01-17
GB2225670B (en)	1992-08-19
JPH02148862A (ja)	1990-06-07

Publication	Publication Date	Title
KR910007164A (ko)	1991-04-30	반도체장치 및 그 제조방법
KR900009894A (ko)	1990-07-05	피복 조성물 및 그 제조방법
KR900019215A (ko)	1990-12-24	반도체장치 및 그의 제조방법
KR900009576A (ko)	1990-07-04	메르캅토화합물 및 그 제조방법
KR880701638A (ko)	1988-11-04	코팅된 유리물건 및 그 제조방법
KR890700922A (ko)	1989-04-28	반도체 장치와 그 제조방법
KR880013254A (ko)	1988-11-30	반도체장치 및 그 제조방법
KR900007097A (ko)	1990-05-09	광역 램프 및 그 제조 방법
KR900017166A (ko)	1990-11-15	액티브매트릭스기판의 제조방법
KR910008793A (ko)	1991-05-31	반도체장치 및 그 제조방법
KR870011686A (ko)	1987-12-26	반도체장치 및 그 제조방법
KR860001495A (ko)	1986-02-26	반도체장치 및 그 제조방법
KR930703807A (ko)	1993-11-30	캐리어 테이프 및 그 제조방법
KR900008644A (ko)	1990-06-03	반도체 장치 제조 방법
KR860006844A (ko)	1986-09-15	반도체장치 및 그 제조방법
KR870009477A (ko)	1987-10-27	반도체장치와 그 제조방법
KR890015368A (ko)	1989-10-30	반도체장치 제조방법
KR890015360A (ko)	1989-10-30	반도체장치 및 그 제조방법
KR890004403A (ko)	1989-04-21	반도체 장치 및 제조방법
KR880701621A (ko)	1988-11-04	벨트 및 그 제조방법
KR890013782A (ko)	1989-09-26	광전자집적회로 및 그 제조방법
KR880701813A (ko)	1988-11-05	캠축 및 캠축 제조방법
KR900008664A (ko)	1990-06-03	캐리어기판 및 그 제조방법
KR890004398A (ko)	1989-04-21	반도체장치 및 그의 제조방법
KR890015418A (ko)	1989-10-30	반도체 집적회로와 그 제조방법

Legal Events

Date	Code	Title	Description
1989-11-29	A201	Request for examination
1989-11-29	PA0109	Patent application	St.27 status event code: A-0-1-A10-A12-nap-PA0109
1989-11-29	PA0201	Request for examination	St.27 status event code: A-1-2-D10-D11-exm-PA0201
1989-11-29	R17-X000	Change to representative recorded	St.27 status event code: A-3-3-R10-R17-oth-X000
1990-06-03	PG1501	Laying open of application	St.27 status event code: A-1-1-Q10-Q12-nap-PG1501
1992-11-21	E902	Notification of reason for refusal
1992-11-21	PE0902	Notice of grounds for rejection	St.27 status event code: A-1-2-D10-D21-exm-PE0902
1993-01-21	T11-X000	Administrative time limit extension requested	St.27 status event code: U-3-3-T10-T11-oth-X000
1993-02-19	P11-X000	Amendment of application requested	St.27 status event code: A-2-2-P10-P11-nap-X000
1993-02-19	P13-X000	Application amended	St.27 status event code: A-2-2-P10-P13-nap-X000
1993-06-16	G160	Decision to publish patent application
1993-07-09	PG1605	Publication of application before grant of patent	St.27 status event code: A-2-2-Q10-Q13-nap-PG1605
1993-09-24	E701	Decision to grant or registration of patent right
1993-09-24	PE0701	Decision of registration	St.27 status event code: A-1-2-D10-D22-exm-PE0701
1993-09-27	GRNT	Written decision to grant
1993-09-27	PR0701	Registration of establishment	St.27 status event code: A-2-4-F10-F11-exm-PR0701
1993-09-27	PR1002	Payment of registration fee	St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1
1996-06-05	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4
1997-04-16	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5
1997-12-26	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6
1999-01-13	R18-X000	Changes to party contact information recorded	St.27 status event code: A-5-5-R10-R18-oth-X000
1999-03-05	PN2301	Change of applicant	St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301
2001-06-28	FPAY	Annual fee payment	Payment date: 20010629 Year of fee payment: 9
2001-06-29	PR1001	Payment of annual fee	St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9
2002-07-10	LAPS	Lapse due to unpaid annual fee
2002-07-10	PC1903	Unpaid annual fee	St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20020710 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE
2003-06-10	PC1903	Unpaid annual fee	St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20020710
2004-08-02	R17-X000	Change to representative recorded	St.27 status event code: A-5-5-R10-R17-oth-X000
2004-10-27	R18-X000	Changes to party contact information recorded	St.27 status event code: A-5-5-R10-R18-oth-X000
2018-10-18	P22-X000	Classification modified	St.27 status event code: A-4-4-P10-P22-nap-X000
2025-01-02	P22-X000	Classification modified	St.27 status event code: A-4-4-P10-P22-nap-X000
2026-01-06	P22-X000	Classification modified	St.27 status event code: A-4-4-P10-P22-nap-X000

KR900008664A - 캐리어기판 및 그 제조방법 - Google Patents

Info

Links

Classifications

Applications Claiming Priority (2)

Publications (2)

Family

ID=17908409

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (13)

Family Cites Families (19)

Cited By (1)

Also Published As

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Legal Events