KR900007451B1 - 내마이그레이션성이 우수한 동합금 - Google Patents
내마이그레이션성이 우수한 동합금 Download PDFInfo
- Publication number
- KR900007451B1 KR900007451B1 KR1019860009589A KR860009589A KR900007451B1 KR 900007451 B1 KR900007451 B1 KR 900007451B1 KR 1019860009589 A KR1019860009589 A KR 1019860009589A KR 860009589 A KR860009589 A KR 860009589A KR 900007451 B1 KR900007451 B1 KR 900007451B1
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- migration
- copper alloy
- electrical conductivity
- migration resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (2)
- 0.05 내지 0.15중량%의 Fe, 0.02 내지 0.05중량% P, 1.0 내지 5.0중량%의 Zn, 1.0 내지 2.5중량%의 Sn 및 잔부 Cu와 불순물로 이루어지는 것을 특징으로 하는 스프링한계 성질 및 내마이그레이션성이 우수한 동합금.
- 0.05 내지 0.20중량%의 Fe, 0.025 내지 0.050중량%의 P, 1.1 내지 3.5중량%의 Zn, 0.1중량% 미만의 Sn 및 잔부 Cu와 불순물로 이루어지는 것을 특징으로 하는 전기전도도 및 내마이그레이션성이 우수한 동합금.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60254358A JPS62116745A (ja) | 1985-11-13 | 1985-11-13 | 耐マイグレ−シヨン性に優れたりん青銅 |
| JP60-254358 | 1985-11-13 | ||
| JP60276233A JPS62136539A (ja) | 1985-12-09 | 1985-12-09 | 耐マイグレ−シヨン性に優れた高導電性銅合金 |
| JP60-276233 | 1985-12-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR870005109A KR870005109A (ko) | 1987-06-04 |
| KR900007451B1 true KR900007451B1 (ko) | 1990-10-10 |
Family
ID=26541650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019860009589A Expired KR900007451B1 (ko) | 1985-11-13 | 1986-11-13 | 내마이그레이션성이 우수한 동합금 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4822562A (ko) |
| EP (1) | EP0222406B1 (ko) |
| KR (1) | KR900007451B1 (ko) |
| DE (1) | DE3680991D1 (ko) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0776397B2 (ja) * | 1989-07-25 | 1995-08-16 | 三菱伸銅株式会社 | Cu合金製電気機器用コネクタ |
| US5882442A (en) * | 1995-10-20 | 1999-03-16 | Olin Corporation | Iron modified phosphor-bronze |
| US5820701A (en) * | 1996-11-07 | 1998-10-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US5865910A (en) * | 1996-11-07 | 1999-02-02 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US5853505A (en) * | 1997-04-18 | 1998-12-29 | Olin Corporation | Iron modified tin brass |
| US6132528A (en) * | 1997-04-18 | 2000-10-17 | Olin Corporation | Iron modified tin brass |
| US6695934B1 (en) * | 1997-09-16 | 2004-02-24 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6679956B2 (en) | 1997-09-16 | 2004-01-20 | Waterbury Rolling Mills, Inc. | Process for making copper-tin-zinc alloys |
| US6471792B1 (en) | 1998-11-16 | 2002-10-29 | Olin Corporation | Stress relaxation resistant brass |
| US6436206B1 (en) | 1999-04-01 | 2002-08-20 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
| US6344171B1 (en) | 1999-08-25 | 2002-02-05 | Kobe Steel, Ltd. | Copper alloy for electrical or electronic parts |
| JP4848539B2 (ja) * | 2001-08-23 | 2011-12-28 | Dowaメタルテック株式会社 | 放熱板およびパワー半導体モジュール、icパッケージ |
| US7163753B2 (en) * | 2002-04-15 | 2007-01-16 | Sumitomo Wiring Systems, Ltd. | Arc-resistant terminal, arc-resistant terminal couple and connector or the like for automobile |
| EP2641292B1 (en) | 2010-11-17 | 2019-06-19 | Luvata Appleton LLC | Alkaline collector anode |
| US8721765B2 (en) * | 2011-11-14 | 2014-05-13 | Mueller Industries, Inc. | Lead free dezincification alloy and method of making same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2155406A (en) * | 1938-04-28 | 1939-04-25 | Chase Brass & Copper Co | Electrical conductor |
| DE2353238C2 (de) * | 1973-10-24 | 1975-09-11 | Wieland-Werke Ag, 7900 Ulm | Verwendung einer phosphorhaltigen Messinglegierung |
| JPS5834536B2 (ja) * | 1980-06-06 | 1983-07-27 | 日本鉱業株式会社 | 半導体機器のリ−ド材用の銅合金 |
| JPS5931839A (ja) * | 1982-08-17 | 1984-02-21 | Kobe Steel Ltd | 高力導電性銅合金 |
-
1986
- 1986-11-13 US US06/930,114 patent/US4822562A/en not_active Expired - Lifetime
- 1986-11-13 EP EP86115808A patent/EP0222406B1/en not_active Expired - Lifetime
- 1986-11-13 KR KR1019860009589A patent/KR900007451B1/ko not_active Expired
- 1986-11-13 DE DE8686115808T patent/DE3680991D1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4822562A (en) | 1989-04-18 |
| EP0222406B1 (en) | 1991-08-21 |
| EP0222406A2 (en) | 1987-05-20 |
| EP0222406A3 (en) | 1989-06-28 |
| DE3680991D1 (de) | 1991-09-26 |
| KR870005109A (ko) | 1987-06-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19861113 |
|
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19861113 Comment text: Request for Examination of Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19900125 Patent event code: PE09021S01D |
|
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
Comment text: Decision on Publication of Application Patent event code: PG16051S01I Patent event date: 19900910 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19901226 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19910115 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
Payment date: 19910115 End annual number: 3 Start annual number: 1 |
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| FPAY | Annual fee payment |
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| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |