KR900006653B1 - Apparatus and method for mounting circuit element on printed circuit board - Google Patents

Abstract

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Description

Apparatus and method for mounting circuit elements on a printed circuit board

1 is a perspective view objectively showing an embodiment of the automatic circuit element mounting apparatus according to the present invention.

2 is a plan diagram showing a position hole and a mounting reference code installed on a printed circuit board.

FIG. 3 is an overview view showing four clutches of the centralized selective rotation apparatus in which the mounting apparatus of FIG. 1 is mixed. FIG.

4 shows an overview of the lead wires of circuit elements exposed by the lead wires inspected by the camera.

5 is a flowchart showing the operation of the element mounting apparatus of the automatic circuit of FIG.

6 is an overview showing the position of circuit elements.

7-9 show an overview of the predetermined rotation of the rotating element by the centralized rotary device.

10 is a cutaway front view of the concentrated selective rotational element.

FIG. 11 is a front view showing the concentrated selective rotation apparatus of FIG.

FIG. 12 is a plan view showing a claw supporting a plate and arranging a claw of the central selective rotation apparatus. FIG.

FIG. 13 is a plan view showing a modified form of the batch clutter of FIG. 12. FIG.

14 to 16 are plan views showing the action of the concentrated selective rotation apparatus of FIG.

FIG. 17 is an overview diagram showing inspection methods and inspection of lead wires. FIG.

18 is an overview diagram showing an image during a lead wire inspection process.

19 is an overview view showing an image of a process of checking or inspecting a misregistration of a mounting head holding a rotating element on the mounting head by suction and rotational elements.

20 is an overview diagram showing a selection process system in which misregistration is applied.

FIG. 21 is an overview diagram showing surveys in the selection process system of FIG. 20. FIG.

FIG. 22 is an overview diagram showing an irradiation apparatus adapted to carry out the investigation of FIG. 21; FIG.

FIG. 23 is an overview diagram showing reference types of TV irradiators used in an image process.

24 to 29 are overviews showing the image process by the TV irradiator of FIG.

FIG. 30 is an overview diagram showing a misregistration data operation according to the ranking by the TV irradiator of FIG.

Fig. 31 is a front view showing a tray stacking device or unit for supplying circuit elements.

FIG. 32 is a fragmentary cutaway front view showing an essential part of the tray loading unit shown in FIG. 31; FIG.

33-35 are front views showing the operation of the tray stacking unit of FIG. 31, respectively.

36 is a side view showing a stick feeder for supplying circuit elements.

FIG. 37 is a cutaway side view showing essential portions of the stick feeder shown in FIG. 36; FIG.

FIG. 38 is a plan view showing a column of circuit elements supplied by a tape feeder. FIG.

FIG. 39 is a cutaway front view of the circuit element train of FIG. 38; FIG.

40 is a front view of the tape feeder.

Fig. 41 is a cutting plan diagram showing the main part of the tape feeder of Fig. 40;

42 is a cutaway side view showing the take-up rail;

43 is a cutaway side view of the pitch feedwheel;

FIG. 44 is a front view showing the action of the ratchet device attached to the pitch feedwheel of FIG. 43; FIG.

FIG. 45 is a plan view showing an air cylinder part for the operation of the ratchet device of FIG. 44. FIG.

FIG. 46 is a cross-sectional view taken along line II-II of FIG. 41 showing an apparatus for supporting a column of circuit elements at the circuit element extraction positions shown in FIG. 38 and FIG.

FIG. 47 is a cutaway view of a modified form of the support device shown in FIG. 46; FIG.

48 is a cutaway front view of the top tape guide component.

Fig. 49 is a partially cutaway front view showing a tape cutting device.

FIG. 50 is a cutaway front view showing an essential part of the tape cutting unit of FIG. 49; FIG.

The present invention relates to an apparatus and method for mounting circuit elements on a substrate, and more particularly to a flat plastic package component (hereinafter referred to as "FPP") on a substrate or a high precision printed circuit board. ), A plastic leaded chip carrier (hereinafter referred to as "PLCC"), a leadless chip carrier (hereinafter referred to as "LCC"), a small outline integrated circuit (Small) Outline Integrate Circuit) An apparatus and method for a surface mounted electronic circuit element which is referred to as a component (hereinafter referred to as "SOIC") or the like. This conventional circuit element mounting apparatus is attached to perform the position of the printed circuit board relative to the apparatus using the position holes formed in the surface of the plate.

The positioning of the mounting head is also performed based on the origin of the X and Y equivalence of the X-Y table on which the mounting head is mounted.

In the conventional mounting apparatus, the positional relationship between the position hole of the printed circuit board and the wiring form on the printed circuit board is not changed according to the printed circuit board, and similarly, the mutual positional relationship between the position hole and the origin of X and Y equivalence of the XY table head is similar. Does not continue to be associated with the printed circuit board.

The position hole of the printed circuit board is formed in the form of a batch by a continuous drill as a result of the positional error in which a hole about 3 mm wide is formed. This causes a misregistration of 0.3 mm in width between the printed circuit board and the amount of spacing of the mounting head towards the circuit element mounting position above the actual circuit element mounting position. The mutual positional relationship between the position hole and the origin of the X-Y table which merely maintains quantification in the conventional apparatus cannot prevent misregistration. A misregistration of about 0.3 mm sometimes fails to connect to surface mounted circuit elements buried with FPP, PLCC, LCC and SOIC for the substrate. This is because the spacing between the lead wires of the circuit elements is narrow.

In addition, the deviation of the position hole on the printed circuit board causes the mounting of the circuit element on the printed circuit board to be misplaced.

The present invention compensates for the above disadvantages of the prior art.

That is, it is an object of the present invention to provide an apparatus and method for mounting a circuit element on a substrate capable of mounting the circuit element on a high precision substrate.

It is a further object of the present invention to provide a device which can facilitate the supply of circuit elements, in particular for supplying FPP, PLCC, LCC, SOIC or similar surface mounted circuit elements to a predetermined circuit element extraction position. .

It is a further object of the present invention to provide a device having the ability to distinguish and supply circuit elements in sequence with a simple structure.

It is another object of the present invention to provide an apparatus capable of allowing chip-like circuit elements to be intermittently loaded in a predetermined circuit element extraction position without difficulty while the correct position is maintained.

It is a further object of the present invention to provide a device capable of performing the arrangement of empty storage tapes with circuit elements removed while ensuring the smooth operation of the tape feeder and similar devices.

It is a further object of the present invention to provide a method in which a circuit element, in particular a surface mount circuit element, can be easily located in the center without the lead wire being deformed or bent.

According to one aspect of the present invention, an apparatus for mounting a circuit element on a substrate includes a circuit element supply device for supplying a circuit element at a predetermined position of the device, and a concentrated selective rotation device for adjusting the arrangement and position of the circuit element; And a rotating element extraction head arranged to move between a predetermined position and an arrangement position of the concentrated selective rotation apparatus.

The extraction head is used to extract the rotating element from the feeder by suction and transfer it to the concentrated selective rotating device. The device also includes a mounting head arranged to be movable relative to the printed circuit board. The mounting head is supported thereon so that the position and arrangement of the circuit elements can be adjusted by the suction to the central selective rotation apparatus and used to load them onto the printed circuit board. Furthermore, the apparatus includes a substrate support device for supporting the printed circuit board on which the circuit element is mounted, and a lead wire inspection device and substrate for inspecting the lead wire of the circuit element whose position and posture are adjusted by the concentrated selective rotation device. Includes a substrate code check device for checking a mounting reference code on a printed circuit board supported on a support device.

Therefore, the device allows the mounting head to move relative to the printed circuit board which has been corrected according to the inspection result by each inspection device.

According to another aspect of the present invention, a centralized integration with the mounting device from a predetermined position is provided for supplying a circuit element to a predetermined position of the automounting device and for performing centralization and rotation of the rotating element by four clickers. By moving the circuit elements to the selective rotating device, the four clickers are mounted on the center and the selective rotating device, arranged to contact the four sides of the circuit elements, to transfer the circuit elements to the mounting head, and the printed circuit board to the stop position. Mounting a circuit element thereon, parallel to each other between a pair of four claws located opposite two parallel planes of the circuit element, passing through only two parallel planes or the end of each lead wire projecting from the body of the circuit element. Supporting two sides of a circuit element, and two clutches being separated from a lead wire or a body The circuits are concentrated and selective-rotated by four clutters, and then the remaining two sides of the circuit element are supported between the remaining two sides or a pair of other clutches passing through the ends of each lead wire protruding from the body. It is to provide a method for mounting a circuit element on a printed circuit board consisting of steps.

Objects and other additional advantages of the present invention will be better understood with reference to the following detailed description when considered in conjunction with the accompanying drawings, in which like reference numerals designate like or corresponding parts.

Now, the automatic circuit element mounting apparatus according to the present invention will be described with reference to the accompanying drawings. 1 shows an embodiment of a general structure of an automatic circuit element mounting apparatus according to the present invention.

The device of the illustrated embodiment is the right side of the back of the substrate stacking device or unit 2 and the base 1 of FIG. 1 arranged in front of the base l for loading the printed circuit board alternately with the base l. And a circuit element supply device or unit 4 arranged on the left side of the base 1 and a circuit element supply device or unit 3 arranged therein.

The device also includes televisions 50 integrated with the image processing device or unit and located at the top of the front part of the base 1. In FIG. 1 the water plane is shown for the television 50.

The substrate stacking device 2 includes a belt conveyor 21 mounted on each inner drawing of the support 20 facing each other and a pair of supports 20 mounted on the base 1. The substrate stacking device 2 has a positioning pin (not shown) into the position hole H of the printed circuit board P (FIG. 2) in the substrate stop position or the substrate mounting position to securely support the plate P. Is not inserted).

The circuit element supply device 3 shows a surface-mounted circuit element E such as FPP, PLCC, LCC, SOIC and the like and a stick feeder 31 or tape feeder (citic feeder 3l in FIG. 1). It is configured as a tray feeder (30) for supplying. The tray feeder 30 is used to arrange the plurality of trays 32 in such a way as to load them to hold the circuit elements E arranged in a line. The tray feeder 30 is moved forward by one pitch whenever the dark circuit element on the uppermost tray is extracted or removed from the circuit element extraction position (V). Thus, a series of lines of circuit elements on the tray are cut to the extraction position.

The stick feeder 31 is assembled with the storage circuit members loaded in the same way as the rectangular cylindrical sticks and uses the belt feeder to load the lowest of the circuit elements to the circuit element extraction position (V).

The tape feeder holds the circuit elements mounted in a line in the longitudinal direction of the tape and includes a tape wound on the reel, which is used to alternately supply the circuit elements loaded on the tape to the circuit element extraction position (V). do.

The device of the illustrated embodiment also includes a circuit element extraction device 6 mounted on an X-Y table movably arranged on the base 1. The extraction device 6 extracts the circuit elements from the tray feeder 30 by suction, the stick feeder by the suction pin 61, or the tape feeder at the circuit element extraction position (V) and concentrates them. Is used to deliver

The circuit element mounting device 4 is mounted or assembled to the support 40 which is arranged on the substrate stacking device 2 in a hanging manner. The support 40 is attached to the X-Y table head 41.

More specifically, the XY table head 41 is supported on the X-direction slide shaft 42 fixed to the frame 40 so that it can slide in the X direction and to be operated by the X-axis motor 43 in the X direction. The Y-direction slider 44 is interlocked with the ball screw shaft, and is supported on the Y-direction slide shaft arranged on the X-direction slider surface so as to slide in the Y direction, and operated by the Y-axis motor 45. It includes a Y-direction slider that engages the threaded shaft. The rotary element mounting apparatus 4 includes a mounting head 46 fixedly mounted at the lower end of the Y-direction slider.

In the illustrated embodiment, the mounting head 46 has three suction pins 47 arranged at equal intervals in the X direction. Each suction pin 47 is used to move vertically along the curved contour of the cam. Substrate code inspection apparatus camera 80 for inspecting and inspecting the mounting reference code (M) formed on the printed circuit board (P) and formed on the printed circuit board (P) at the same time as shown in FIG. Is fixedly mounted.

In the illustrated embodiment, two of these mounting reference symbols M are provided to allow deviation or deformation parallel to the printed circuit board P with respect to the substrate stacking device 2 for easy inspection.

In addition, the mounting reference symbol M may be integrally formed by etching, so that the positional relationship between the conduction type and the mounting reference symbol in each printed circuit board coefficient is maintained.

The concentrated selective rotation element 7 as briefly described above is arranged along the substrate stacking device 2 on the base 1. The concentrated selective rotation apparatus 7 shown in FIG. 3 is connected to the circuit element E supported by the suction pin 61 of the circuit element extraction head 60 and the respective suction pin 47 of the mounting head 46. Correspondingly, there are four sets of positioning clutches 70 in one set, and the four clutches 70 are operated for a narrow gap between the clutches, so that the lead wire R1 of the circuit element E (R2)... This is regulated and associated with that of the suction pin 47 in the center of the circuit element as a jeep.

At this time, the rotation angle θ (FIG. 6) indicating the position of the circuit element is fixed at 0 °. Then, when requested to rotate the circuit element E according to an angle of 90 °, 180 °, 270 ° or other preferred angles, each clutch 70 is rotated accordingly.

The centralized selective rotation apparatus 7 may be assembled only at angles of 0 °, 90 °, 80 ° and 270 °. Optionally, the element may be rotated by any selection angle. The centralized selective rotation apparatus 7 is a camera 90 for a lead wire inspection device fixedly mounted on one side thereof, which is used for inspecting the lead wires R1, R2, ... of the next concentrated circuit element E. I have got

As shown in FIG. 4, the camera 90 is used such that the diagonal edges J and K of the circuit element extend and protrude while the signal is going through, so that each lead wire R1 of the circuit element E can be raised. Rotation and position of (R2) ... are checked very precisely.

In order to operate the automatic circuit element mounting apparatus of the illustrated embodiment, data on the position on the printed circuit board P on which the circuit element E is mounted and the posture of the circuit element mounted on the plate P is supplied to the program controller. Is entered.

For example, the data on the mounting position may be indicated by the X and Y integration of the XY table, and the mounting posture may be indicated by the rotation angle θ .

The program controller generates a value for the mounting position of the circuit element, the angle of rotation of the rotating element, and the X and Y integration of the mounting order, and alternately supplies it to the circuit element mounting device.

The circuit element mounting apparatus 4, the substrate stacking apparatus 2, the concentrated selective rotation apparatus 7, and the circuit element extracting apparatus 6 are performed in accordance with the flow chart shown in FIG.

More specifically, the circuit element extraction head 60 of the circuit element extraction device 6 removes the circuit element E at the rotation element extraction position in the circuit element supply device 3 and transfers it to the concentrated selective rotation device. Then, finally, it is returned to its starting position for the next extraction. The concentrated selective rotation apparatus 7 in which the circuit element E is loaded performs concentration or position adjustment of the circuit element E by using the four clutches 70 shown in FIG.

Before transferring the circuit element E to the device 7, the clutters 70a and 70b are further removed as necessary in order for the predetermined rotation of the device 7 to be interlocked with the wider face of the rotating element E. It is performed to widen.

More specifically, the circuit element E in the circuit element supply device 3 is in the posture shown in FIG. 7, and the original position of the concentrated selective rotation device 7 is shown in FIG. 8. Suppose that causing the claw 70 to be arranged, the concentrated selective rotation element 7 is prepared to receive the circuit element E from the circuit element extraction head 60 while the claw 70 is in FIG. Maintain a posture as shown. The concentrated selective rotation element 7 also performs rotation by a predetermined angle θ as necessary.

Then, the mounting head 46 of the circuit element mounting device 4 removes the circuit element E indicated according to the program controller from the centralized selective rotation device 7 using the suction pin 47 and is located thereon. Inhale and support.

The lead wire of the circuit element E which is subjected to the concentration and rotation processing is observed by the camera 90 of the lead wire inspection device, and the obtained image is supplied to the position correcting unit or the image processing unit.

The printed circuit board P loaded by the substrate stacking device 2 stops at a predetermined position. The mounting reference sign M of the positioned printed circuit board P is inspected by the camera 80 of the substrate code inspection device and the obtained image is supplied to the positioning action unit. The images obtained by the cameras 80 and 90 appear on the receiver of the image processing television 50.

Positioning or image processing units or devices containing the results inspected by the respective lead wire inspection cameras 90 and substrate inspection cameras 80 may be provided with elements properly positioned above the circuit element mounting position of the printed circuit board. Data about the images of the cameras 80 and 90 indicating the state is stored in advance therein. Therefore, this effectively performs the mounting positioning operation by performing a comparison between the actual image obtained by each camera 80 and 90 and the stored image.

This results in the positioning of the mounting head 46 implemented to obtain accurate XY integration and angle of rotation θ .

Subsequently, the suction plate 47 is lowered to mount the circuit element E above the predetermined circuit element mounting position of the printed circuit board P. FIG. The suction pin then rises and the mounting head 46 is recovered to its starting position by the next mounting action.

As can be seen from the above technique, the illustrated automatic circuit element mounting apparatus is a circuit in which one of the cameras is subjected to the concentrated selective rotation processing by examining the mounting reference mark formed on the printed rotating plate formed at the same time as the conduction type thereon. It is assembled to inspect the lead wires of the elements so that the amount of movement of the mounting head is corrected based on the inspection results of the camera.

This structure allows the mounting of circuit elements on the printed circuit board to be performed with high precision. It also substantially eliminates the errors in the placement of the printed circuit board and the position of the circuit elements, caused by the misregistration caused by the change in concentration and selective rotation of the circuit elements. This advantage markedly represents the mounting of surface-mounted circuit elements where the spacing between lead wires is as narrow as FPP, PLCC, LCC, SOIC, or similar ones on a print tumbler. Concentration of the circuit elements is performed simultaneously on the four surfaces of the circuit elements. Alternately, however, it may be carried out on the surfaces of each of the two surfaces of the circuit element.

This concentration produces no effect on the vertical force, so that the lead wires of the circuit elements are not deformed or bent. The structure of the concentrated selective rotation device 7 will be described in detail with reference to FIGS. 10 to 16 degrees.

The centralized selective rotation apparatus 7 includes a hollow shaft 72 for rotatably supporting the support 7l and the support 71.

The upper opening of the hollow shard 72 is fixed or fitted to the circuit element support pin 73 and has a compression spring 74 arranged on the hollow shaft 72 to produce a buffer effect on the circuit element support pin 73. ) Is curved upward.

The circuit element support pins 73 are lead wires Rl (R2)... It is located on a surface-mounted hoar element which holds a and is used to support it by suction.

The upper end of the hollow shaft 72 is horizontally fixed to the clutch support plate 76 through the mounting member 75 and the circuit element support pin 73 protrudes through the central hole 76a of the clutch support plate 76. It is.

As shown in FIG. 12, the clutch supporting plate 76 is formed with four slit-shaped switches at annular intervals of 90 degrees, and the four position clutches 70a and 70d respectively slide on the horizontal plate. It is arranged to be.

Four brackets 77 are integrally formed around the upper end of the hollow shaft 72 at equal intervals, and the levers 78 are pivotally connected to the pins 79, respectively. Each lever 78 is interlocked at its upper end with each recess 70e of the positioner 70a-70d.

Although only a pair of levers 78 are shown in FIG. 10, another pair of levers is provided in the vertical direction of the drawing. Angle lever 78 is linked to the lower end with the annular spring 700, which applies a continuous force to the lever 78 in the direction in which the upper or upper ends of the lever are separated from each other.

The hollow shaft 72 is also fixed to slide vertically thereon so that the pair of levers 78 shown in FIG.

For this purpose, the annular actuating member 701 is in its lowest position, and the base ends of the pair of levers 78 are separated by the annular springs 700, respectively, and consequently the positioners 70a-70d are Keep them away from each other.

The annular actuating member 701 is moved to the lifted position, and the projections 78a of the respective levers 78 are pulled up so that the positional clutches 70a to 70d come closer to each other.

The hollow shaft 72 also has two annular actuation members 702 positioned below the first annular actuation member 701 and fixed to be movable thereon so as to be able to slide vertically. It acts to actuate the other pair of levers provided in the vertical direction. The actuating member 702 is forced upward by the compression spring 703.

In FIG. 10 the actuating member 702 is in a low position and causes the positioner 70c and 70d to be spaced apart from each other. When the actuating member 702 is moved to the lifted position, the other pair of levers are pulled up, whereby the positioners 70c-70d are brought into close contact with each other.

As shown in FIG. 11, the bell cranks 705 and 706 are pivoted and supported through the pins 707 and 708 on the support 71, which are used to act as cam followers. The bell crank 705 is interlocked with the groove 701a of the first annular actuating member 701 (FIG. 10) and the base thereof so that the positioners 70a and 70b are operated.

On the other hand, in the bell grank 706, the flange-shaped interlocking material 702a of the second annular operation member 702 (10th degree) is interlocked with its base in order to operate the positional clutches 70c and 70d. have. In addition, the bell cranks 705 and 706 are in contact with the lower end of the cam groove of the cam plate 710 rotating through the rotary shaft 709, respectively. Therefore, the bell granks 705 and 706 move in the pivot axis direction with the rotation of the cam plate 710 so as to move perpendicularly to the first and second annular operation members 701 and 702.

Vertical movement of the operating member 701 is performed at the same time as the movement of the operating member 702, which will be described later. The support frame 71 is fixed to the detector 711 to check the rotational position of the plate 710.

As shown in FIG. 10, the hollow shaft 72 has a bevel gear 712 fixed at its lower end, which is a bevel gear fixed to a rotating shaft of a motor 714 which is stably mounted on the support 71. 713). The rotation of the motor 714 is caused to be rotated by the hollow shaft 72 and the selection angles 70a-70d and the support plate 76 mounted on the shaft 72.

The hollow shaft 72 connected through the joint 715 is a hose 761, and the base end is connected through a valve or something like a vacuum pump (not shown).

This exerts a suction force to pass through the interior of the hose 761 and the hollow shaft 72 and attach it to the circuit element support pin 73 from the guam.

In the circuit element concentrated selective rotation device 7 assembled as described above, the circuit elements are spaced in a space defined by the positioners 70a to 70d in which the pins 47 of the circuit element mounting device 4 are separated from each other. When (E) is loaded, circuit element support pins 73 protruding upward through the clutch support plate 76 are supported by the circuit elements E thereon by suction. The other pair of batching machines 70c-70d operate in close proximity to each other to adjust or position the ends.

In more detail, the ends of the lead wires are securely located between the batching claws 70c-70d.

As a result, as shown in FIG. 16, the batching clutters 70a and 70b are arranged so that the batching clutters 70a and 70d sandwich the circuit element E therebetween, as shown in FIG. 70a-70b are provided to be close to each other to adjust the ends of the lead wires R1 (R2) ... extending from the long side of the circuit element E.

That is, the ends of the lead wires are sandwiched between the batch clutters 70a and 70b. Next, the batching claws 70a-70b are operated to be separated from each other as shown in FIG. 15, and the batching claws 70c-70d of the lead wires of the circuit element E extending from the short side of the circuit element come close to each other. Keep close to each other again.

The vacuum suction tube applied to the circuit element support pin from the vacuum pump is then stopped such that the central portion of the circuit element E positioned by the batch clutch is sucked by the suction pin 47. The shape of the placement clutters 70a-70d can vary in shape and dimensions of the circuit elements depending on the shape and dimensions of the circuit elements. For example, when the circuit elements are of small dimensions, the placement clutters 70a-70b can be formed to have a smaller width than the placement clutters 70c-70d as shown in FIG. Again, as in the embodiment, the circuit elements are located via lead wires. However, the position is carried out through the body of the circuit element.

In this way, the circuit element arrangement device 7 prevents the deformation and bending of the lead wire by effectively preventing the side force from being applied to the lead wire of the circuit element. This causes a failure in the mounting of circuit elements to the removed printed circuit board. Such a structure also allows the condition of the projections of the lead wires to be detected or investigated during the lead wire detection and irradiation as described above when the circuit element is a surface mount type having multiple lead wires made on each of the four sides. Lead wire detection and inspection is carried out by using an irradiation apparatus designed as in FIGS. 17-19. The position of the circuit element E held on the suction pin 47 prior to the irradiation is adjusted by the centering and optical switching device shown in FIGS. 10 to 16 so that the circuit element E is the axis of the suction pin 47. It is held on the suction pin 47 in a straight line with in advance.

The circuit element E thus maintained is illuminated by a light source 91 arranged immediately below the circuit element so that the reflection of light from the lead wires R1, R2 ... Rn of the circuit element E is reflected by the camera receiver. 90 is captured by the device. As the light source 91, a ring-shaped illumination lamp is preferably used.

Because it is a lead wire (R1) (R2) ... made around the circuit element (E). (Rn) because it is the only emission to all. The halogen lamp 91b is connected to the light source 91 through the optical fiber 91a for this purpose. Camera receiver 90 is connected to lead wires R1 (R2). When detecting the reflection of light from Rn, the TV 50 converts the electrical signal into a double signal through it so as to display the brilliant image corresponding to each of the lead wires to the image processing unit and the device 92.

The image is displayed in a manner arranged in the X and Y directions of the television receiver surface of the TV as shown in FIG. In this example, when the lead wire has any defects, the TV will fail to project or display any image thereon or display an image that differs from the normal lead wire, resulting in a defect in the detected circuit element.

Again, this allows the deformation of lead wires, such as bending, to be effectively detected. In this investigation, the image processing unit 92 and the numerical operation control unit 93 are arranged in the optical image (B1) (B2)... In each row of X and Y of the television receiver surface of the TV 50. It is used to find the axial center (L1) (L2) ... (Ln) within the area area of (Bn). Next two adjacent centers of gravity (L1) (L2) Pitch interval between (Ln) (A1) (A2)... (An) is found one by one, and the pinking value of the pitch interval is calculated. The average value is determined within certain tolerances when any bending and deformation is detected.

When it is out of tolerance, a rejection command is supplied to the suction pin 47 to prevent the circuit element from mounting on the printed circuit board. The irradiation procedure is applied to each lead wire row in the X and Y directions in the same manner. So only complete circuit elements are mounted on the printed circuit board. The center O in the X and Y directions as shown in FIG. 19 when the unfilled irradiation is performed between the suction pins 47 and the circuit elements held in addition to the above lead wire irradiation through the TV 50 is the TV of the TV 50. A comparison of the positional relationship between the center O and the optical image, presented on the water surface, is obtained from each of the lead wires made to perform the investigation.

More specifically, the point of intersection (C) (G) (N) between the centerline of the adjacent end lead wires of the lead wire line adjacent to the three centers of each lead wire line arranged in the X and Y directions is found by using the optical image. The center (0 ') of the next circuit is found by using the intersection point (C) (G) and the positional error between the centers (O') (O) is obtained at the base of the X and Y coordinates and the center of the stolen (47). And unwritten between circuit elements held thereon to be sensed or measured.

The centering and optical switching device according to the result of the measurement allows precise centering of the circuit elements held on the suction pin 47. The next two rows of lead wires arranged in the X or Y direction are connected to each other by the center line of the lead wire using optical image, so that the deviation of the rotational direction of the circuit elements is not filled between each center line and the center line in the X and Y direction. Is detected due to. When any deviation of the full- angle θ is detected according to the above procedure, the numerical operation control unit 93 rotates the gear 96 used in the suction head 47 by an angle corresponding to the angle θ . By operating the pulse motor 95 through the pulse motor controller 94 so that the direction of the circuit elements held in the suction head 47 is modified.

Thus, the lead wire irradiation and sensing device can perform irradiation for each circuit element so that the mounting head performs mounting of the circuit element on the circuit board printed with high precision. This leads to a very difficult recalibration of the circuit elements required after the mounting of the circuit elements in the prior art removed with lead. When the guide pattern is formed of copper on the printed circuit board by printing, the above-mentioned mounting reference mark M of the circuit element P is formed in the same material as the guide pattern by printing. In this example, the solder is spread thinly on the surface of the mark like the guide pattern to prevent oxidation of the reference mark. However, the solder formed on the mounting reference marks does not form an even surface. Thus, when light is emitted from a single park trimmed on a printed circuit board onto an printed circuit element, irregular reflections occur on the surface of the solder to prevent the display of the corrected shape of the printed circuit board of the TV display, resulting in an image appearing on the TV display. It cannot be used as an adjustment data to correct the unfilled printed circuit board.

Such problems radiate light radially on the entire surface of the mounting reference sign formed of the same material as the guide pattern, present an arbitrary optical image of the sign on the television receiving surface of the television display through the camera, By showing the center of the outer frame line and the reference pattern corresponding to the mounting reference mark at the center position, any optical image of the mounting reference mark presented on the television receiving surface is aligned with the outer frame line of the reference pattern by vertical and vertical adjustment of the level Centered by the coordinates of the television image surface to adjust the positional cooperative relationship between the mounting head and the printed circuit board as compared to the center of the reference pattern installed on the television image surface of the television display. In the substrate unfilled calibration process adopted to detect unfilled in the direction of X and Y Has been found to be solved.

Thus, in the substrate non-write correction process as described above, a large amount of light is radiated radially to the mounting reference display so as to present an arbitrary optical image on the television receiving surface of the TV display, and the optical image is determined by the vertical adjustment of the double level. The resulting mounting reference marks, which coincide with the outer frame lines of the reference pattern, are optically detected. Such a procedure thus allows the solder to be thinly beaten so that the position coordination relationship between the mounting head and the printed circuit board can be precisely corrected even when applied to the reference mark. The substrate unwritten calibration process will now be described next with reference to FIGS.

The positional coordination relationship between the printed circuit board located on the belt conveyor 21 (FIG. 1) of the substrate transfer device and the mounting head 46 for mounting the circuit element on the printed circuit board in the substrate unfilled calibration is X and Y. It is corrected by the movement of the mounting head in the direction so that the circuit element can be precisely mounted at the predetermined position of the guide pattern of the printed circuit board.

Light emission is also performed on the mounting reference mark M made of copper, which is the same material as the guide pattern, so that the light reflected on the mark is an optical image that is easy to process to obtain data for positioning of the mounting head 46. It is used to form. Image processing is performed by using the system shown in FIG. 20 and FIG. More specifically, the system is adapted to reflect the light emitted from the incandescent lamp 82 connected to the power source 81 to the reflector so as to emit light in the substantial center of the mounting reference sign M of the printed circuit board P. FIG. The system is also adapted to emit light to the mounting reference (M) from a plurality of LED lamps 85 connected to a power source 84. As shown in FIG. 22, the LED lamp 85 is preferably in a substantially concentric manner with the mounting reference to substantially radiate a large amount of light from the lamp 85 to the reference sign M, like the incandescent lamp 82. It is ordered. The light reflected by the reference sign M is directed to the camera 80 through the lens 86 and supplied by the next actuator through the image processing unit 92 operated to the TV receiver 50.

The image processing unit 92 is connected to the numerical operation control unit 93, and FIG. 23 and the ground TV receiver 50 have a width Wl corresponding to the mounting reference mark M formed on the printed circuit board by printing. It has a reference pattern in the directions of X and Y constituting the outer frame line and center of (W2). The image processing system is adapted to observe the operator through the numerical operation control unit 93 and the TV receiver 50 before the adjustment, as described below, that the optical image I "is primary with the outer frame line F of the reference pattern. To display the optical image I formed by the reflected light of the reference mark of the printed circuit board, which is arbitrarily obtained by the camera 80, on the television receiver surface of the TV receiver 50 by the electric signal and the multilevel of the judging device. Is adopted to

When the optical image I "overflows the outer frame line F of the reference pattern as shown in Fig. 24, it is transmitted through the optical image I '(Fig. 25) by the adjustment of the lower part of the double level. In the X 'and Y' directions, the optical image is narrowed down to the optical image which is substantially coincident with the external frame line of the reference pattern. When displayed in the frame line, it is displayed on the television receiver surface of the TV receiver 50 while the optical image I coincides with the outer frame line F of the reference pattern in the X 'and Y' directions (FIG. 29). Is extended by the upward adjustment of the double level through the optical image I '(Fig. 28.) The center O' of each of the obtained optical images, which also coincides with the outer frame line F of the reference pattern, By the operator, the TV receiver 50 and the numerical operation control unit 93 Between each center (O ') (O) obtained and thus obtained through the predetermined center (O) of the reference pattern at coordinates (X1) (X2)… (xn), (y1) (y2). The number of based differences is calculated through the image processing unit 92, which is used as the image sensor and numerical operation control unit 93 to obtain the amount of unfilled therebetween. ) Is adjusted to the proper position with respect to the printed circuit board located on the conveyor and then lowered to mount the retained circuit element on the printed circuit board so that the circuit element is precisely positioned with respect to the guide pattern on the printed circuit board and is placed thereon by solder. It is fixed.

Thus, the non-stray calibration process ensures that the data positioning the printed circuit board is accurately obtained even if the printed circuit board located on the conveyor is located according to the mounting reference mark formed of the same material as the guide pattern. As a result, the surface mounting of the circuit elements on the printed circuit board is performed with high precision. The tray feeder 30 briefly described above in the automatic circuit element mounting mechanism is desired to be made to cope with a change in the surface mounting type circuit element arrangement interval in the tray 32 caused by the change of the circuit element.

This is because the spacing of the circuit elements of the tray 32 varies depending on its shape. In such automatic mounting mechanisms, it is also desirable that a large number of trays are arranged in a deposition manner so that empty trays from which circuit elements have been removed are automatically removed. The tray feeder 30, made for this purpose from 31 to 35, is used as the automatic circuit element mounting apparatus of the embodiment. More specifically, the tray feeder 30 has a pair of rails 10 mounted to the base 1 as shown in FIGS. 31 and 32. The unit also has a support 300 with four brackets 301 fixed to the bottom.

The bra cuts 301 each have a roller 302 mounted rotatably thereon as the unit moves along the rail 10. Arrow Y in FIG. 31 indicates the direction of forward movement of the unit. The tray loading unit also includes a device for moving the support 300, which constitutes a ball screw shaft 303 made under the support 300 and a motor 304 mounted to the support. In more detail, the ball screw shaft 303 is rotatably supported at both ends of the bearings 305 and 306 fixed to the bottom of the support 300, and the motor 304 is securely mounted to the support 300. The rotation shafts of the ball screw shaft 303 and the motor 304 use belt pulleys 307 and 308 fixed thereon between the timing belts 309, respectively. The ball screw shaft 303 is used in the center thereof with the internal threaded member 11 fixed to the base 1. In this way, when the motor 304 is driven, the rotational force of the motor is transmitted to the ball screw shaft 303 through the belt pulley 308, the timing belt 309, and the belt pulley 307 so that the ball screw to the internal screw member 11 is rotated. The positional relationship of the shaft 303 changes so that the support part 300 moves to the rail 10 with respect to the fixed base 1.

Two vertically extending guide shafts 310 arranged in a direction perpendicular to the moving direction of the tray loading unit are fixedly mounted to the support part 300.

Thus only one shaft 310 is shown in FIGS. 31 and 32. The elevator 311 is vertically obliquely supported on the guide shaft 310.

In an embodiment the tray 32 is formed in a rectangle and is formed of a plurality of recesses for positioning the surface mounted circuit elements therein at regular intervals.

Each of the plurality of trays 32 (eg ten such trays) holding a plurality of circuit elements is located in the elevator 311 in a deposition manner. The holding member 312 is pivotally mounted to the support part 300 through the brace 313 at a position close to the end of the elevator 311. The tray stacking unit is also fixedly mounted to the base 1 so that when the support part 300 is moved in the rear position opposite to the front position indicated by the arrow Y in FIG. A tray removal head 314.

The tray removal head 314 has a suction pin 315 mounted at its lower end in a vertically movable manner which is used to hold the tray 32 thereon by suction.

Vertical movement of the suction pins 315 is performed by a device such as an air cylinder, for example.

The tray exchange box and the frame 316 are also securely mounted to the support 300 at a position behind the elevator 311.

The aforementioned circuit element extraction head 60 is arranged opposite the tray 32. The extraction head 60 is adapted to move in the vertical direction not in the direction indicated by the arrow Y but in the Y direction or in the direction indicated by X in FIG.

The suction pin 61 of the head 60 moves vertically.

In addition, as shown in FIG. 32, the tray stacking unit includes a mounting plate 12 installed on the base 1 that extends over the moving range of the support 300. The placement plate 12 is used to move the support 300 forward by a distance corresponding to the spacing between the circuit elements arranged in the tray. The placement plate 12 is formed of a plurality of recesses having a width corresponding to the spacing S between the circuit elements. The recess 13 is detected optically, electromagnetically or mechanically by a detector 317 fixedly mounted to the support 300.

In addition, as shown in FIG. 31, the tray stacking unit includes limit switches LS1, LS2, and LS3 arranged in the base 1 along the rails 10 in order.

Limit switches LS1, LS2, and LS3 are the first stop position or the first stop position of each support portion 300, the second stop position or rear stop position of the support portion 300, the third stop position or the rear stop position. It is adopted to detect the stop position of the support portion 300 from the front.

For this purpose the limit switches are respectively located corresponding to these stop positions.

The leading stop position corresponds to the position where the circuit element extraction head 60 holds each circuit element in the rear row and the trailing stop position holds the empty tray from the circuit elements removed by the extraction head 60. Corresponds to the removal head 314 position.

The third stop position corresponds to the position of the head 60 holding each circuit element in the head row by suction.

The limit switch LS1 is operated when the protrusion 30la formed inside the front bracket 301 is adjacent to the switch, and the limit switch LS2 and LS3 are operated by the protrusion at the inside of the rear bracket 301, respectively. do.

As shown in FIG. 32, the motor 318 is mounted to the support 300 for the purpose of vertically moving the elevator 311. Motor 318 has a concentric disk-like cam 319 fixed to its rotating shaft. Adjacent to the roller 320 used as the cam follower.

The slider 321 is supported to be movable vertically to the slider bearing 322 fixed to the support 300 to extend upward. The slider 321 also has a pinion 323 rotatably mounted thereon, which uses a rack 324 mounted vertically to the support 300 and a rack 325 fixed to the elevator 311 and It is adapted to be aligned in parallel with the rack 324. The pinion and rack arrangement thus made are used to extend the vertical movement of the roller 320.

Thus, when the motor 318 is driven to move the elevator 311 vertically from the position shown in FIG. 32, the cam 319 is rotated and the slider 321 is raised up together with the roller 320 so that the pinion ( 323 rotates counterclockwise to the right or to FIG. 32 because the right rack 324 is fixed.

Such rotation of the pinion 323 causes the left rack 325 to be raised by a distance corresponding to the thickness of the tray 32.

The operation of the tray stacking unit will now be described next with reference to FIGS. 31 to 34 degrees.

The arrow 2 on the tray 32 in FIG. 31 indicates the extent to which the circuit element pulls the circuit element from the tray.

When starting supply of the circuit elements of the uppermost tray 32, the support 300 is in the backward position to actuate the limit switch LS3 of the rear bracket 301, so that the extraction head 60 is in the range (2). It is positioned on the left end or the uppermost circuit element of the tray 32.

As described above, the head 60 is not adapted to move in the direction indicated by the arrow Y in FIG.

The head 60 is then lowered to hold the circuit element by suction to perform the circuit element extraction operation and then raised and then moved in a direction perpendicular to the X direction. When the supply of the best circuit element of the tray is completed, the motor 304 is configured to rotate the ball screw shaft 303 so that the positional relationship of the ball screw shaft 303 of the internal threaded member 11 changes. Results in forward movement.

The detector 317 then stops operating the motor 304 when it detects the recess 13 of the placement plate 12 that matches the spacing S between the circuit elements. This causes the support 300 to be moved forward by the distance corresponding to the spacing S so that the circuit elements of the second row of trays are located opposite the extraction head.

The head then draws the circuit elements of the second row from the tray in turn. The same operation is repeated to perform the extraction of the third circuit element in the rearmost column.

Subsequently, the support part 300 moves to the rearmost stop position where the rear bracket 301 operates the limit switch LS2.

This causes the head to be in one position from the left end of the tray 32 as in the thirteenth and the holder 312 is speculated to fall sideways, disengaging from engagement with the tray. The tray removal head 314 is then lowered and operated by suction to maintain the best tray thereon and then raised.

The holder 312 is then pivoted in its original position to hold the remaining tray 32 in turn over the elevator 311.

The support 300 is now moved to an obliquely forward position where the rear bracket 301 operates the limit switch. Thus, the circuit element extraction head 60 is located opposite the circuit element E in the head row of the second tray as shown in FIG. When the motor 318 is started, the cam 319 is rotated to move the slider 321 upwards and to rotate the pinion to raise the rack 325 up so that the elevator 311 is one tray thick. Raised by the corresponding distance, the second tray is raised and lowered to the level at which the top tray which has been separated is located.

The extraction head 60 then begins to remove the circuit elements of the head row of the second tray. The second circuit elements of the tail row are alternately extracted from the tray in the same manner as described above.

In FIG. 35 all circuit elements of the second tray 32 are pulled out and the support part 300 is in the leading position and the top tray is located on the tray discharge box 316.

The support 300 then returns to the state shown in FIG. 33 and the tray removal head 314 holds the second tray thereon by suction. The extraction head 60 then performs circuit element extraction of the third tray in the manner described above.

In the above tray loading unit, however, the marking consists of holes instead of protrusions or recesses 13.

As described above, the tray stacking unit is so made that the elevator on which the tray is placed is mounted on a support that moves horizontally on the rails, allowing the circuit element extraction head to perform extraction at an invariant position.

The replacement of the placement device, also made of markings that coincide with the spacing between the circuit elements arranged in the tray, causes the distance of the tray movement to change as above. The tray removal head also allows the empty trays with missing circuit elements to be automatically and efficiently removed. This is because the removal can be performed in parallel with the supply of circuit elements.

In an embodiment the above-described stick feeder is made in the manner shown in FIG. 36 and FIG.

In more detail, the stick feeder 31 is mounted to the base 1 and applied to support a plurality of circuit element magazines 400 thereon in a deposited manner. The magazines 400 are each cylindrically shaped, such as plastic, metal, etc., and are adapted to accommodate circuit elements lined therein.

The magazine support 401 is supported at an angle to the base 1 at an angle of about 45 ° during the supply of the circuit element E. It has a chute 402 fixed to the previous end. The chute 402 is inclined at an angle of about 45 ° therein and is formed as a circuit element passageway through the lowest of the magazine 400. Chute 402 has a tooth detent member 403 mounted pivotally over pin 404 over the passageway. The detent member 403 is integrally attached to a leaf spring 405 having a back end fixed thereto with a clamp pin 406. The upper portion of the chute 402 is mounted with a small size air cylinder 408 through the support member 407.

The air cylinder 408 has a rod used to pull the end of the detent 403 when extended.

The detent member 403 is made of a spring (not shown) which is operated to pull the end of the detent member 403 to open the circuit element passage when the rod of the cylinder is tightened.

The stick feeder also includes a conveyor support 409 on the base 1 where the belt conveyor 40 is arranged horizontally. More specifically, a plurality of belt pulleys 411-414 are rotatably mounted on the conveyor support 409 and belts pass about it.

The pulley 411 is adapted to receive the driving force of the air cylinder 417 through the cog wheel 416.

More specifically, the contraction of the blow of the air cylinder 417 is passed through the cog wheel 416 and turned to the right of FIG. 36 and FIG. 37 to cause the pulley 411 to rotate in a predetermined amount. It rotates forward by a predetermined amount in the direction indicated by the arrow D in the figure.

When the air cylinder 417 returns to its original position due to elongation, the sawtooth barque 416 does not transmit rotational force to the pulley 411 and the belt 415 stops.

In this way, the belt 415 is intermittently driven.

As above, the stick feeder is made in such a way that the transfer of the circuit element to the circuit element extraction position is carried out by the belt conveyor, so that the chute that makes the passage through the magazine is made of a simple structure.

In addition, the belt conveyor can be applied to various circuit elements without any deformation, and thus the stick feeder can be provided as an excellent multi-purpose tool.

In the automounting device of the illustrated embodiment as briefly described above, the tapered feeder may be used instead of the stick feeder described above, which tape feeder may be arranged in a series of circuit elements (hereinafter referred to as " circuits " Urea string ".

In FIG. 38 and FIG. 39, a circuit element string, usually indicated by a reference letter T, is formed by a long stretch of a plurality of circuit elements E and a plurality of recesses T1 at equal intervals in which the circuit elements E are accommodated. A cover tape T3 for covering the excitation recording tape T2 and the recess T1 is formed. The cover tape T3 is bonded to the recording tape T2 by thermal compression bonding, mechanical bonding or the like.

The circuit element rows are formed through (T4) at equal intervals.

The tape feeder for handling such circuit element sequences may be constructed in such a manner as shown in FIGS. 40 to 48 degrees.

40 shows the general structure of the tape feeder.

The tape feeder constitutes a support 500 mounted on the base 1. The movement guide 501 is horizontally fixed on the support 500, and the circuit element string T drawn from the supply rail (not shown) is supported to move horizontally.

The tape feeder also constitutes a take-up rail 502 supported to rotate on the support 500 in such a way as to protrude upward from the base 500. The tape up reel 502 winds the peeled cover tape T3 from the recording tape T2. The take-up rail 502 is connected to a driving source (not shown) via the pulley 503, the belt 504, and the pulley 505 so that the driving force of the driving source can be transmitted to the rail 502. Take-up rail 502 is supported on support 500 through the support structure shown in detail in FIG. In addition, the support structure constitutes a shaft 506 fixed on the support 500, and a cylindrical member 508 formed in engagement with the pulley 503 is rotatably mounted through the bearing 507. The cylindrical member 508 is formed on the outer surface of the annular recess forming a pair of vertical surfaces 509 opposed to each other. The tape up reel 502 is formed on the inner surface of the protrusion 502a which is arranged on the outer surface of the cylindrical member 508 and is received in the recess of the wintong hing member 508. One of the side surfaces of the protrusion 502a is forced to contact one of the vertical surfaces 509 by the compression spring 510 received in the recess of the cylindrical member.

Such a structure allows the rotation of the pulley 503 to be sent to the rail 502 under a substantially constant frictional force and thus the rail may effectively wind the covertade T3 thereon under a substantially constant winding force.

As shown in FIG. 40, a pitch feed wheel 511 is rotatably supported on the left end of the support 500. Pitch feedwheel 511 as shown in FIG. 43 provides support 500 so that it can intermittently rotate to the left in FIG. 40 through a ratchet mechanism 514 arranged on its side. It is mounted so that it can be rotated through the bearing 513 on the shaft 512 firmly mounted thereon. The pitch feed wheel 511 is adapted to move the recording tape T2 intermittently at the fixed pitch. For this purpose, the wheel 511 is installed by the pin means or the engagement with the through (T4) or the like (not shown).

The ratchet mechanism 514 as shown in FIGS. 40 and 44 is a gear 515 formed in conjunction with the pitch feed wheel 511, the feed lever 516 supported on the shaft 512, and the feed lever 516 on the feed lever 516. A feed pawl 517 mounted by boat, a stop pull lever 519 mounted on a pivot 500 and an air cylinder 520 mounted on the support 500 through the shaft 518. The feed mole 517 is elastically exerted in the direction of engagement with the gear 5l5 by a spring (not shown) and the stopper lever 519 is forced to engage the gear 515 by the extension spring 521. This is applied. The range of motion of the feed pole 517 is controlled by a feed pawl stopper 522 fixed on the support 500. The structure in which the stopper lever 519 is constantly engaged with the gear 522 indicates a loss when the endpool of the stopper lever 519 moves from the crest of the gear 5l5 to its root, The circuit element E accommodated in the recess Tl of the recording tape T2 is unstable due to the impact that occurs when the endpool falls at the root and at the same time the gear 515 easily rotates at a higher speed than the feedpool.

In addition, the stopper lever 519 and the gear 515 are very worn down when the stopper lever 519 moves vertically several times at every pitch feed. In order to avoid such a loss, the fixed cam 523 is mounted on the shaft 5l8 coaxially with the stopper lever 519 and the stopper adjustment lever 524 is engaged with the groove 523a of the fixed cam 523. The stopper adjustment lever 524 is exerted a force toward the fixed cam 523 by the expansion spring 525.

Such a structure ensures that the stopper lever 519 will move halfway with the crested at the root of the gear 515 when the feed pole 517 rotates the gear 515 counterclockwise. As shown, the pawl of the stopper adjustment lever 524 may pass into the groove 523a of the fixed cam 523 where the distal end of the stopper lever 519 is lifted, and the stopper at the raised position. Accept the lever. This effectively prevents irregular rotation of the gear 515 and wear of the gear 515 and the stopper lever 519.

Before the feed pole 517 completes the pitch feed, the end 516a of the feed lever 516 is connected to the stopper adjustment lever 524 and the fixed cam 523 as the stopper adjustment lever 524 is shown in FIG. The release of the stopper lever 519 may enter the root of the gear 515 to prevent the gear 515 from rotating backwards. The feedpool 517 also stops by contacting the feedpool stopper 522, while it engages tightly with the gear 515 to prevent it from deviating.

As shown in FIG. 45, the air cylinder 520 is mounted on the sieve above the support 500, and the terminal end of the rod on the feed lever 561 through the connecting member 526 is mounted as a pivot. In addition, the pitch variable stopper 527 is fixed on the support 500 so as to lean on the connecting member 526 to adjust the blow of the air cylinder 520. Hitting the air cylinder is thus limited by the distance between the most retracted position and the position leaning on the pitch variable stopper 527 due to the connecting member 526 expanding the air cylinder 520. Pitch variable stopper 527 is provided for the purpose of adapting the tape feeder to various circuit element sequences having different spacing between circuit elements. Rotation of the pitch wheel wheel 51l in a fixed amount in the counterclockwise direction is performed every time the air cylinder 520 contracts. Furthermore, at the time of deflation, the feed pole 517 is moved from the position shown in FIG. 40 to the position shown in FIG. 44 to rotate the gear 515 counterclockwise, while the stopper lever when the air cylinder is enlarged. 519 locks gear 515 so that only feedpoll 517 returns to its original position.

The upper tape guide 528 on the support 500 is fixed to the opposite side of the movement guide 501 arranged at the front of the pitch feed heel 511.

The upper tape guide 528 as shown in FIG. 48 is formed with a slit 529 in the middle portion thereof for drawing the cover tape T3 towards it.

In the tape guide 528 on the slit 529, a roller 530 is rotatably mounted to smoothly peel the cover tape from the recording tape T2. The cover tape T3 of the circuit element string T thus passes around the roller 530 under tension and is then wound onto the take-up rail 502. As shown in FIG. 41 and FIG. 48, the upper tape guide 528 is provided with a tape presser 531 which prevents the edge of the recording tape T2 from which the cover tape T3 is peeled off. do. The taper 531 is provided to cover at least one portion of the recess Tl in which the circuit element E is accommodated.

The tape presser 531 of the upper tape guide 528 is formed with a large hole 532 at a position corresponding to the circuit element extraction position V defined in the movement guide 501. Thus, the suction piece 61 of the circuit element extraction head 60 may remove the exposed one of the circuit elements E received in the recess T1 there through by suction. When the suction pin 61 is lowered to the circuit element extraction position (V) to extract a circuit element (E) having a lead wire attached to the body such as a chip IC or the like, the circuit There is a fear that the lead wire of the element E may be deformed or bent due to the bending of the recording tape T2 caused by lowering the suction pin 61. The bottom surface of the movement guide 501 is recessed in the recording tape. This is because it does not coincide with the bottom surface of (T1).

In order to eliminate such a problem, the tape feeder has a movement guide corresponding to the circuit element tracking position V such that the upper surface of the tape support member 532a coincides with the bottom surface of the recess T1 as shown in FIG. A tape support member 532a is arranged to protrude upward through the bottom surface portion of 501. The height or length of the tide support member 532a is measured according to the shape of the circuit element E or the length of the recess T1.

Fig. 47 shows a modification of the arrangement of the tape support member 532a. In FIG. 47, the cylindrical member 533 is fixed to pass through a portion of the movement guide 501 corresponding to the circuit element extraction position V, and the tape support member 532a moves vertically through the cylindrical member 533. It is inserted so that the tape support member 532 is forced downward by the compression spring 534.

The tape support member 532 thus arranged is moved upward by the air cylinder 535 to support the bottom surface of the recess T1 of the recording tape T2 when the suction pin 61 is lowered. .

Now, a method of operating a tape feeder configured as described above is described later. The circuit element string T drawn from the supply rail is guided to the movement guide 501, and the cover tape T3 is peeled off from the recording tape T2 by the roller 530, and then the take-up rail. (502) wound over. The recording tape T2 on which the cover tape T3 is peeled off is rotated in FIG. 40 by the pitch feed wheel 511 rotated in a predetermined amount in a counterclockwise direction corresponding to the contraction of the air cylinder 520. It is moved intermittently to the left.

This causes the circuit elements accommodated in the recesses T1 of the recording tape T2 to be conveyed to the circuit element extraction position V in turn, during which the tape presser 531 of the upper tape guide 528 removes the edges of the tape. It adjusts or covers a part of the recess T1 in order to prevent the circuit element E from flying away from the recess due to loose, twisting or vibration of the recording tape T2. The circuit element E in the recess T1 is then exposed at the circuit element extraction position V and removed by the suction pin 61.

Since the tape feeder is so configured as described above, the pitch feed wheel intermittently moves the recording tape supporting the circuit elements thereon under tension and the rollers are arranged in front of the pitch feed wheel to strip the cover tape from the recording tape. do.

Such a structure effectively prevents the recording tape from loosening, twisting or deforming. Also, peeling the cover tape from the recording tape is accomplished flexibly and reliably because of the use of rollers. Furthermore, the tape feeder is provided with a tape dresser for receiving at least the upper surface of the recording tape from which the cover tape is peeled off, so that the circuit element is prevented from flying out of the recess.

When the empty part of the recording tape T2, in which the ash element is moved by the suction pin 61, is left as it is, it often hinders not only the pitch feed operation but also the operation of other machines.

In order to eliminate such drawbacks, the automatic circuit element mounting apparatus of the illustrated embodiment constitutes a tape cutting unit or machine that is adapted to cutting empty portions of the recording tape into small pieces for placement as shown in FIG. 49 and 50 degrees.

The tape cutting unit or machine shown at 49 and 50 degrees constitutes the base 600 and the support 601 securely mounted on the base 600. The pitch feed wheel 511 described above is arranged on the support 601. The circuit element extraction position V, in which the circuit element E is removed from the circuit element string T, is limited at the front of the pitch feed wheel 511 and the roller position V to expose the circuit element as described above. ), The cover tape T3 is peeled off from the recording tape T2 on the front side of the?

The exposed circuit element is in turn removed by the suction pin 6l. At the left end of the support 601, a tubular tape guide 602 is arranged to guide the empty tape T2 delivered by the pitch feed wheel 511 downward through the tape guide 602. The fixed blade 603 of the cutter is fixed to the lower end of the).

The movable blade 604 is fixed to the movable member 606 mounted on the rod of the air cylinder 605. The tape cutting unit also constitutes a chute 608 arranged near the lower end of the opening of the tape guide 602, which is a small piece formed by cutting the empty tape T2 through the belt conveyor 607 therethrough. It serves to drop.

The belt conveyor 607 constitutes the belt 609 moved horizontally in the direction indicated by the arrows at 49 and 50 degrees. The blank recording tape T2 is conveyed downward through the tape guide 602 and extends to a predetermined length from the lower end of the opening of the tape guide 602 due to the intermittent rotation of the pitch feed hill 511.

The air cylinder 605 then moves the movable member 606 indicated by an arrow Z '(FIG. 49) to cut the empty recording tape T2 into small pieces T2' as shown in FIG. It is operated to move the movable blade 604 forward through.

The small piece T2 'thus formed is dropped onto the belt 609 of the belt conveyor 607 by its own weight through the chute 608 and then into a small piece arranged with a case cylinder arranged near the belt 609 for placement. To carry.

It is thus noted that the tape cutting unit constructed as described above can arrange the blank tape to prevent it from interfering with the operation of the automatic circuit element mounting apparatus.

While the foregoing embodiments of the invention are described with some degree of specificity with reference to the drawings, modifications and variations are apparently possible in light of the teachings above.

It is, therefore, to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described.

Claims (20)

A base, a circuit element supply for supplying circuit elements to a predetermined position on the base, an intensive selection rotator for adjusting the position and posture of the circuit element, the electric supply and the electric selection The circuit element extraction heads arranged to be able to move between the rotating devices, and the extraction heads which are incorporated by removing the circuit elements from the supplied device by incorporation, and transfer the removed circuit elements to the centralized selective rotation device. And a mounting head arranged to be movable relative to the printed circuit board, and the electrical mounting head being suctioned to the electrical circuit elements whose position and posture thereon are controlled by the electric centrally selected rotary devices thereon. Accepts and transports it to the printed printed circuit board, and the electrical circuit A substrate support device for supporting lint circuit boards, a lead wire inspection device for inspecting lead wires of electrical circuit elements controlled by a concentrated selective rotation device whose position and posture are electrical, and the substrate support device A substrate marking inspection device for inspecting the mounting reference marking of the printed circuit unit supported above is constructed, and all the electrical devices are mounted on the base, and the electrical mounting heads associated with the printed circuit board. Apparatus and method for mounting a circuit element on a printed circuit board, characterized in that the movement is corrected according to the inspection result by each inspection apparatus described above. 2. Apparatus and method for mounting a circuit element on a printed circuit board according to claim 1, wherein said circuit element supply device constitutes a tray feeder and a stick feeder. 3. The apparatus of claim 2, further comprising: a support arranged such that the tray feeder described above is movable in the longitudinal direction, an elevator configured to support a plurality of stacked trays arranged thereon so as to be able to move vertically with respect to the supported support; Arrangement means for constituting marks coinciding at intervals between the circuit elements arranged on the trays, sensors for inspecting the marks, and corresponding gaps for inspecting marks posted with the detector. Drive means for moving the support forwarded to a distance forward, a tray removal head for removing the bin tray to which the circuit elements described above are moved, and an electric bin tray disposed by the tray removal head described above Apparatus for mounting a circuit element on a printed circuit board, characterized by constituting a tray receiver How. 4. Apparatus and method for mounting a circuit element on a printed circuit board according to claim 3, wherein said arrangement means constitutes an elongated plate formed by recesses, projections or holes serving as the indications. . The magazine according to claim 2, wherein said stick feeder includes a frame for supporting at least one magazine constituting a circuit element housed therein, a chute for providing said magazine and a communication circuit element passageway, and said magazine. Constitutes a belt conveyor for receiving the circuit elements through the chute delivered from and moving them one by one to the circuit element extraction position, wherein the chute is provided with means for receiving thereon the circuit elements in the chute. Apparatus and method for mounting a circuit element on a printed circuit board, characterized in that. 6. Apparatus and method according to claim 5, characterized in that the magazines and chutes described above are arranged in such a way that they are inclined horizontally with the chute facing downwards. An apparatus and method for mounting a circuit element on a printed circuit board according to claim 1, wherein the circuit element supply described above constitutes a tray feeder and a tape feeder. 8. The recording tape according to claim 7, wherein the tape feeder described above comprises a pitch feed wheel for intermittent movement at a predetermined pitch, a recording tape formed with a recess for accommodating circuit elements therein at equal intervals, and the posting of said recording tape. Rollers arranged in front of the electric pitch feedwheel to remove the cover tape from the electric recording tape to cover a recess, and a tape press for adjusting at least the upper surface of the electric recording tape from which the electric cover tape is peeled off. And each of the circuit elements described above can be exposed to be extracted from the recording tapes posted at the limited circuit element extraction position at the front of the pitch feed wheels described above. Device and its method. 9. The printed circuit unit of claim 8, wherein the tape presser described above constitutes an opening formed at an intermediate portion thereof, and the circuit element extraction position described above is defined inside the electrical opening of the tape presser described above. Apparatus and method for mounting elements. 9. An apparatus and method for mounting a circuit element on a printed circuit board according to claim 8, wherein said tape presser adjusts at least both edges of said upper drawing of said recording tape. 8. The cover of claim 7, wherein the tape feeder is a cover for covering the electrical lugs of the recording tapes described above to cause the electrical circuit elements to be removed at a defined circuit element extraction position in front of the pitch feed fills. Pitch feedwheel and latch mechanisms for intermittently moving recessed recording tapes formed at equal intervals in which circuit elements are received at predetermined pitches so that the tapes are peeled off the electrical recording tapes on the front of the pitch pitch wheels. The ratchet mechanism is a ratchet gear arranged to be rotated together with the electric pitch feed pin, a feed lever arranged to be movable and coaxial with the electric ratchet gear and the pibutt, and a pivot on the electric feed lever. Feed poles applied in the direction of engagement with the mounted and electrical gears, A feedforle stopper that is leaning against the feedforle, which has been reclined, a backstop stopper lever with a force applied in the direction of engagement with the gear, the stopper control lever pivotally mounted on the stopper lever, The pivoting movement of the feed lever can be rotated through the feedpool, which is delivered in a predetermined amount in the forward direction, and when the ratchet is rotated in the forward direction. Apparatus and method for mounting a circuit element on a printed circuit board, characterized by causing the stopper adjustment levers to be engaged with the fixed cams as described above, in order to urge the backstop stopper levers transmitted from an electric ratchet gear. 8. The tape feeder according to claim 7, characterized in that the tape feeder constitutes a tape cutting unit for constituting a cutter for cutting into the empty tape scrap to which the circuit element is moved and a belt conveyor for discharging the scrap. Apparatus and method for mounting circuit elements on a printed circuit board. 8. The tray of claim 7, wherein the tray feeder described above comprises a support for longitudinal movement, an elevator for supporting a plurality of stacked trays arranged thereon and movable vertically with respect to the support, Arrangement means for constituting an indication coincident with the interval between the circuit elements arranged above; A drive means for moving a support forward, a tray removal head for removing the bin tray to which the circuit circuit is moved, and a tray receiver for receiving the electric bin tray discharged by the tray removal head. Apparatus and chambers for mounting circuit elements on printed circuit boards comprising: . 14. Apparatus and method for mounting a circuit element on a printed circuit board according to claim 13, wherein said arrangement means constitutes an elongated bay formed by recesses, protrusions or holes serving as the indications. 8. The magazine according to claim 7, wherein the electric stick feeder includes a frame for supporting at least one magazine constituting a circuit element housed therein, a chute for providing a circuit element passage in communication with the electric magazine; Constitutes a belt conveyor for receiving the circuit elements through the chute delivered from and moving them one by one to the circuit element extraction position, wherein the chute is provided with means for receiving thereon the circuit elements in the chute. Apparatus and method for mounting a circuit element on a printed circuit board, characterized in that. 16. Apparatus and method for mounting circuit elements on a printed circuit board according to claim 15, wherein the magazines and chutes described above are arranged in such a manner as to be inclined in a horizontal plane such that the chute is directed downwards. A method for mounting a circuit element on a printed circuit board, wherein the circuit element is fed to a predetermined position of the automounting device, and from the predetermined position line where the circuit element that has been electrical is delivered to concentrate and rotate the circuit element with four clickers. The four selectors, which are moved to the centralized selection rotating device coupled to the electric mounting device, are mounted on the centralized selective rotating device and arranged so as to be opposite to the inner side of the circuit element. The four clutches described above include the relationship of delivering a mounted edging suitable for accommodating circuit elements, transporting the printed circuit board to the storm position, and mounting the circuit element to the printed circuit board when in the transferred storm position. The step of concentrating and selectively rotating the electric circuit elements by Parallel electricity between a pair of claws out of the four claws placed opposite to the two parallel planes of the circuit element, which are only posted through the parallel planes or the ends of each of the lead wires protruding from a sieve It accepts two sides of a circuit element, then separates the two clasps from the lead wires or sieves that have been posted, and then between the other pairs of clutches through only the ends of each of the remaining two sides or lead wires protruding from the sieves. Apparatus and method for mounting a circuit element on a printed circuit board, comprising the step of receiving two sides of said circuit element remaining on the printed circuit board. 18. The method of claim 17, wherein only two faulty circuit elements are mounted on a printed circuit board to display two optical images of each of the lead wires protruding from the electrical circuit elements on the television surface of the TV. By radiating light to the circuit elements housed on the mounting head, each of the lead wires is bent by a comparative operation between each of the centers of the axes of the lead wires and the pitch intervals based on the optical images. And a step of finding a pitch spacing and an average between each two adjacent optical images around the center centered thereon, the apparatus and method for mounting a circuit element on a printed circuit board. 18. The printed circuit board of claim 17, further comprising preparing a printed circuit board constituting at least one mounting reference mark formed of the same material as the conduction type disposed thereon for transport to the electrical stop position, In order to display the optical image irregularly on the TV receiving surface through the camera, light is radiated radially to the entire surface of the mounting reference, which is lighted, and the TV receiving surface of the TV is placed on the outer frame line and its center position. The reference type, which constitutes the center of the reference type corresponding to the posted mounting reference mark of the reference type, is adjusted by vertically adjusting the binary level of the optical image of the mounted mounting reference mark displayed on the television surface of the posted TV. Electrical optics matched with the external frame line of the circuit and matched with the reference type Electrical mounting heads and electrical for mounting electrical circuit elements on the substrate, which are compared to the electrical center of the electrical reference type, which is pre-fixed to the television surface of the electronic television of the unknown. Checking for mis-entry between the electrical center of the posted optical image and the electrical center of the referenced reference type to adjust the positional interrelationships between the substrates, the printed circuit board posted therewith. Apparatus and method for mounting a circuit element on a printed circuit board, characterized in that the circuit element is correctly mounted on the predetermined part of the circuit board. The circuit elements are fed to a predetermined position of the automounting device, and the electrical elements of the circuits are mounted to concentrate and rotate the circuit elements with four clickers installed in the electric concentrated selective rotation device and arranged to oppose the four sides of the circuit elements. The step of concentrating and selectively rotating the circuit elements, which are posted by the four clickers, moving from the predetermined position to the concentrated selection rotator combined with the mounting device described above, is carried out by means of one or two pinned faces of the circuit elements that have been described. Two sides of the electrical circuit elements parallel to each other between a pair of four of the four clutches disposed opposite to the two parallel surfaces of the circuit elements, which are passed through the ends of each lead wire projecting from the sieve. And then separate the two clotted electric wires from the lead wires or sieves. Receiving the remaining two sides of an electrical circuit element between different clutch pairs through the remaining two sides or through the ends of each of the lead wires protruding from the sieve, and receiving the circuit elements thereon by suctioning the electrical circuit elements. The light is delivered to an electrical circuit element housed on the electrical mounting head for display of the binary optical image of each of the electrical lead wires of the electrical circuit element on the television surface of the TV. Each adjacent two of the center of the axis of the leaded wire and the center of the center of the wire, based on the optical image, to examine the bending of each of the wires that were wired by the comparison operation between each of the radiated and pitch intervals. Finds the pitch spacing and the average between the optical images of the Prepare printed circuit boards constituting at least one mounting reference mark made of the same material as the conduction type placed thereon to discharge the true lead wire and to transport the stop position to the light reflected on the mounting warehouse sign. In order to irregularly display the optical image on the TV receiving surface through the camera, light is radiated radially to the entire surface of the mounting reference. It constitutes the center of the reference type corresponding to the posted mounting reference mark on the position, and the vertical adjustment of the binary irregular optical image of the mounted mounting reference mark displayed on the television surface of the posted TV. Match the outer frame line of the reference type mentioned above, and match the reference type The electrical mounting head and the electrical mounting heads accommodate the defect-free circuit elements thereon, matching the center of the mounted optical image to the electrical reference type pre-fixed on the television surface of the electronic television. In order to adjust the positional interrelationships between a substrate, it constructs a relationship that finds mis-entry between the electrical center of the electrical image and the electrical center of the reference type. Apparatus and method for mounting a circuit element on a printed circuit board, characterized in that the circuit element is correctly mounted on the predetermined part without defect.

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