KR830006477A - 알미늄 케리어(carrier)상에 벗길 수 있는 구리층을 제공하기 위한 공정 및 이에의한 제품 - Google Patents
알미늄 케리어(carrier)상에 벗길 수 있는 구리층을 제공하기 위한 공정 및 이에의한 제품 Download PDFInfo
- Publication number
- KR830006477A KR830006477A KR1019810002780A KR810002780A KR830006477A KR 830006477 A KR830006477 A KR 830006477A KR 1019810002780 A KR1019810002780 A KR 1019810002780A KR 810002780 A KR810002780 A KR 810002780A KR 830006477 A KR830006477 A KR 830006477A
- Authority
- KR
- South Korea
- Prior art keywords
- aluminum
- thin film
- layer
- copper
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
Claims (13)
- 구리층이 알미늄 케리어층에 점착적으로 접착되나 구리층을 손상함이 없이 상기 알미늄 케리어층이 기계 장치에 의하여 용이하게 분리됨을 특징으로 하며, 알미늄의 케리어층과 구리의 덮음층을 포함하는 인쇄 회로의 제조에 대하여 사용하기에 적당한 합성구조를 제공하기 위한 처리공정이(1) 알미늄박막층을 제공하는 단계와;(2) 상기 알미늄박막의 적어도 한쪽표면을 표면불순물을 제거하도록 청정하는 단계와;(3) 상기 알미늄박막을 상기 알미늄박막의 표면이 활성화 되도록 상기 박막을 음극화하는 방법을 통하여 적당한 전기영동액내에 위치시키며 전류를 흐르게 하는 단계와;(4) 표면상에 산화알미늄의 얇은층이 형성되도록 하기 위하여 상기 박막이 양극화되는 방법을 통하여 적당한 전기영동액내에 상기 활성화된 박막을 위치시키며, 전류를 흐르게 하는 단계와;(5) 알미늄 박막의 양극화표면상에 구리의 얇은층을 전기분해로 침전시키는 단계를 포함하는 알미늄 케리어상에 벗길 수 있는 구리층을 제공하기 위한 공정.
- 제 1항의 공정에서 (2)단계후에 상기 알미늄 박막이 표면불순물을 제거하도록 물로 헹구어지는 알미늄 케리어상에 벗길 수 있는 구리층을 제공하기 위한 공정.
- 제1항의 공정에서, (3)단계후에 상기 알미늄 박막이 표면불순물을 제거하도록 물로 헹구어지는 알미늄 케리어상에 벗길 수 있는 구리층을 제공하기 위한 공정.
- 제1항의 공정에서 (4)단계후에 상기 알미늄 박막이 표면불순물을 제거하도록 물로 헹구어지는 알미늄 케리어상에 벗길 수 있는 구리층을 제공하기 위한 공정.
- 제1항의 공정에서, (3)단계를 수행하는데 사용된 전기영동액이, 체적율로, 53내지 73%의 인산과 5내지 25%의 황산과 12내지 32%의 물을 포함하는 알미늄 케리어상에 벗길 수 있는 구리층을 제공하기 위한 공정.
- 제1항의 공정에서, (4)단계에서 활용된 전기영동액이 체적율로 53내지 73%의 인산과, 5내지 25%의 황산과, 12내지 32%의 물을 포함하는 알미늄 케리어상에 벗길 수 있는 구리층을 제공하기 위한 공정.
- 구리층이 알미늄 케리어층에 점차적으로 접착되나 구리층의 손상없이 기계장치에 의하여 알미늄층이 용이하게 분리되는 것을 특징으로하며 그리고 알미늄의 케리어층과 구리의 덮음층을 포함하는 인쇄회로의 제조에 사용하기에 적당한 합성구조가,(1) 알미늄박막을 제공하는 단계와;(2) 상기 알미늄박막의 적어도 한 표면에서 표면불순물을 제거하는 청정단계와;(3) 상기 알미늄박막을 상기 알미늄박막의 표면이 활성화되도록 상기 박막을 음극화하는 방법을 통하여 적당한 전기영동액내에 위치시키며 전류를 흐르게 하는 단계와;(4) 표면상에 산화알미늄의 얇은 층이 형성되도록 하기 위하여 상기 박막이 양극화되는 방법을 통하여 적당한 전기영동액내에 상기 활성화된 박막을 위치시키며, 전류를 흐르게 하는 단계와;(5) 알미늄박막의 양극화표면상에 구리의 얇은층을 전기분해로 침전시키는 단계를 포함하는 공정으로서 생산될 합성구조.
- 제7항의 합성구조에서, (2)단계후에 상기 알미늄박막이 표면불순물을 제거하도록 물로 헹구어주는 합성구조.
- 제7항의 합성구조에서, (3)단계후에 상기 알미늄박막이 표면불순물을 제거하도록 물로 헹구어지는 합성구조.
- 제7항의 합성구조에서 (4)단계후에 상기 알미늄박막이 표면불순물을 제거하도록 물로 헹구어지는 합성구조.
- 제7항의 합성구조에서, (3)단계에서의 전기 영동액이 체적율로 53내지 73%의 인산과, 5내지 25%의 황산과 12내지 32%의 물을 포함하는 합성구조.
- 제7항의 합성구조에서 (4)단계에서의 전기 영동액이 체적율로 53내지 73%의 인산과, 5내지 25%의 황산과 12내지 32%의 물을 포함하는 합성구조.
- 전술된 바와 같은 방법과 제품.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/106,477 US4293617A (en) | 1979-12-26 | 1979-12-26 | Process for producing strippable copper on an aluminum carrier and the article so obtained |
| US106477 | 1993-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR830006477A true KR830006477A (ko) | 1983-09-24 |
Family
ID=22311619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019810002780A Ceased KR830006477A (ko) | 1979-12-26 | 1981-07-30 | 알미늄 케리어(carrier)상에 벗길 수 있는 구리층을 제공하기 위한 공정 및 이에의한 제품 |
Country Status (20)
| Country | Link |
|---|---|
| US (1) | US4293617A (ko) |
| JP (1) | JPS6031915B2 (ko) |
| KR (1) | KR830006477A (ko) |
| AU (1) | AU535003B2 (ko) |
| BR (1) | BR8008512A (ko) |
| CA (1) | CA1150849A (ko) |
| DE (1) | DE3046213A1 (ko) |
| FR (1) | FR2472468A1 (ko) |
| GB (1) | GB2066295B (ko) |
| HK (1) | HK45284A (ko) |
| IL (1) | IL61797A (ko) |
| IN (1) | IN153612B (ko) |
| IT (1) | IT1128725B (ko) |
| LU (1) | LU83033A1 (ko) |
| MX (1) | MX155237A (ko) |
| NL (1) | NL185627C (ko) |
| NZ (1) | NZ195918A (ko) |
| PH (1) | PH15879A (ko) |
| SE (1) | SE8008965L (ko) |
| SG (1) | SG7284G (ko) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4386139A (en) * | 1980-10-31 | 1983-05-31 | Furukawa Circuit Foil Co., Ltd. | Copper foil for a printed circuit and a method for the production thereof |
| US4463084A (en) * | 1982-02-09 | 1984-07-31 | Alps Electric Co., Ltd. | Method of fabricating a circuit board and circuit board provided thereby |
| US4534831A (en) * | 1982-09-27 | 1985-08-13 | Inoue-Japax Research Incorporated | Method of and apparatus for forming a 3D article |
| JPS60170287A (ja) * | 1984-02-14 | 1985-09-03 | 信越化学工業株式会社 | 銅張積層基板 |
| JPS62181313U (ko) * | 1986-05-12 | 1987-11-17 | ||
| JP3296543B2 (ja) * | 1996-10-30 | 2002-07-02 | スズキ株式会社 | めっき被覆アルミニウム合金、及びそのシリンダーブロック、めっき処理ライン、めっき方法 |
| US6319620B1 (en) | 1998-01-19 | 2001-11-20 | Mitsui Mining & Smelting Co., Ltd. | Making and using an ultra-thin copper foil |
| US6183880B1 (en) | 1998-08-07 | 2001-02-06 | Mitsui Mining & Smelting Co., Ltd. | Composite foil of aluminum and copper |
| RU2149101C1 (ru) * | 1999-01-21 | 2000-05-20 | Мареичев Анатолий Васильевич | Многослойный листовой или рулонный материал (варианты) |
| US6447929B1 (en) | 2000-08-29 | 2002-09-10 | Gould Electronics Inc. | Thin copper on usable carrier and method of forming same |
| US6955740B2 (en) * | 2002-01-10 | 2005-10-18 | Polyclad Laminates, Inc. | Production of laminates for printed wiring boards using protective carrier |
| US6770976B2 (en) | 2002-02-13 | 2004-08-03 | Nikko Materials Usa, Inc. | Process for manufacturing copper foil on a metal carrier substrate |
| US7073496B2 (en) * | 2003-03-26 | 2006-07-11 | Saint-Gobain Abrasives, Inc. | High precision multi-grit slicing blade |
| DE10347459B3 (de) * | 2003-10-13 | 2005-05-25 | Actinium Pharmaceuticals, Inc. | Radium-Target sowie Verfahren zu seiner Herstellung |
| DE102004022200B4 (de) * | 2004-05-05 | 2006-07-20 | Actinium Pharmaceuticals, Inc. | Radium-Target sowie Verfahren zu seiner Herstellung |
| DE102006008023B4 (de) * | 2006-02-21 | 2008-05-29 | Actinium Pharmaceuticals, Inc. | Verfahren zum Reinigen von 225Ac aus bestrahlten 226Ra-Targets |
| EP2082071B1 (en) | 2006-09-08 | 2014-06-25 | Actinium Pharmaceuticals Inc. | Method for the purification of radium from different sources |
| JP6274556B2 (ja) * | 2013-12-03 | 2018-02-07 | スズキ株式会社 | 電解めっき方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2708655A (en) * | 1955-05-17 | Electrolytic polishing of aluminum | ||
| US1727331A (en) * | 1927-01-17 | 1929-09-10 | Eastman Kodak Co | Process of coating aluminum electrolytically |
| BE407434A (ko) * | 1934-02-10 | |||
| US2703781A (en) * | 1950-05-25 | 1955-03-08 | Kaiser Aluminium Chem Corp | Anodic treatment of aluminum surfaces |
| BE559886A (ko) * | 1956-08-08 | |||
| US2888387A (en) * | 1957-05-14 | 1959-05-26 | Tiarco Corp | Electroplating |
| US3098804A (en) * | 1960-03-28 | 1963-07-23 | Kaiser Aluminium Chem Corp | Metal treatment |
| US3468765A (en) * | 1966-08-04 | 1969-09-23 | Nasa | Method of plating copper on aluminum |
| DE1621115C3 (de) * | 1967-10-17 | 1981-06-25 | Metalloxyd GmbH, 5000 Köln | Verfahren zur Herstellung eines Trägers aus Aluminium für lithographische Druckplatten |
| DE2413932C2 (de) * | 1973-04-25 | 1984-08-30 | Yates Industries, Inc., Bordentown, N.J. | Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise |
| US3935080A (en) * | 1974-10-02 | 1976-01-27 | Polychrome Corporation | Method of producing an aluminum base sheet for a printing plate |
| US3915811A (en) * | 1974-10-16 | 1975-10-28 | Oxy Metal Industries Corp | Method and composition for electroplating aluminum alloys |
| US4097342A (en) * | 1975-05-16 | 1978-06-27 | Alcan Research And Development Limited | Electroplating aluminum stock |
-
1979
- 1979-12-26 US US06/106,477 patent/US4293617A/en not_active Expired - Lifetime
-
1980
- 1980-12-08 DE DE19803046213 patent/DE3046213A1/de active Granted
- 1980-12-17 AU AU65486/80A patent/AU535003B2/en not_active Ceased
- 1980-12-17 MX MX185320A patent/MX155237A/es unknown
- 1980-12-18 GB GB8040555A patent/GB2066295B/en not_active Expired
- 1980-12-19 IN IN1411/CAL/80A patent/IN153612B/en unknown
- 1980-12-19 SE SE8008965A patent/SE8008965L/xx unknown
- 1980-12-22 FR FR8027224A patent/FR2472468A1/fr active Granted
- 1980-12-22 NZ NZ195918A patent/NZ195918A/xx unknown
- 1980-12-22 CA CA000367295A patent/CA1150849A/en not_active Expired
- 1980-12-23 LU LU83033A patent/LU83033A1/fr unknown
- 1980-12-23 BR BR8008512A patent/BR8008512A/pt not_active IP Right Cessation
- 1980-12-23 IT IT50449/80A patent/IT1128725B/it active
- 1980-12-23 NL NLAANVRAGE8007024,A patent/NL185627C/xx not_active IP Right Cessation
- 1980-12-24 IL IL61797A patent/IL61797A/xx unknown
- 1980-12-24 PH PH25032A patent/PH15879A/en unknown
- 1980-12-26 JP JP55184153A patent/JPS6031915B2/ja not_active Expired
-
1981
- 1981-07-30 KR KR1019810002780A patent/KR830006477A/ko not_active Ceased
-
1984
- 1984-01-26 SG SG72/84A patent/SG7284G/en unknown
- 1984-05-24 HK HK452/84A patent/HK45284A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| GB2066295A (en) | 1981-07-08 |
| IL61797A (en) | 1984-12-31 |
| AU6548680A (en) | 1981-07-02 |
| NL8007024A (nl) | 1981-07-16 |
| CA1150849A (en) | 1983-07-26 |
| PH15879A (en) | 1983-04-13 |
| LU83033A1 (fr) | 1981-03-27 |
| US4293617A (en) | 1981-10-06 |
| DE3046213C2 (ko) | 1989-04-20 |
| JPS6031915B2 (ja) | 1985-07-25 |
| NL185627C (nl) | 1990-06-01 |
| FR2472468B1 (ko) | 1985-03-22 |
| SE8008965L (sv) | 1981-06-27 |
| GB2066295B (en) | 1983-02-16 |
| BR8008512A (pt) | 1981-07-21 |
| IL61797A0 (en) | 1981-01-30 |
| IT8050449A0 (it) | 1980-12-23 |
| IN153612B (ko) | 1984-07-28 |
| AU535003B2 (en) | 1984-02-23 |
| NL185627B (nl) | 1990-01-02 |
| FR2472468A1 (fr) | 1981-07-03 |
| IT1128725B (it) | 1986-06-04 |
| DE3046213A1 (de) | 1981-08-27 |
| MX155237A (es) | 1988-02-09 |
| NZ195918A (en) | 1983-11-30 |
| HK45284A (en) | 1984-06-01 |
| JPS56127787A (en) | 1981-10-06 |
| SG7284G (en) | 1985-02-15 |
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