KR20160004583A - Apparatus for transferring a wafer - Google Patents

Abstract

The wafer transfer apparatus includes a stocker for storing a plurality of FOSBs, an EFEM provided adjacent to the stocker, the EFEM having a first load port on which the FOSB is placed and a second load port on which the FOUP is placed, A first robot for loading the loaded FOSB to the first load port or for unloading the empty FOSB from the first load port and a second robot for receiving the FOSB from the FOSB mounted inside the EFEM, And loading the FOUP on the FOUP that is seated on the second load port. Therefore, the transfer of the wafer can be automated.

Description

[0001] Apparatus for transferring a wafer [0002]

The present invention relates to a wafer transfer apparatus, and more particularly, to a wafer transfer apparatus for transferring wafers for manufacturing semiconductor devices.

2. Description of the Related Art In general, a semiconductor device manufacturing process is performed by repeatedly performing a variety of unit processes such as photolithography, etching, diffusion, deposition, and metal processing on a wafer. In each unit process, the wafer is moved using the wafer carrier loaded with a plurality of wafers, or the wafers are put into each process in the wafer carrier state.

The wafer carrier is manufactured using a front opening shipping box (FOSB) and a front open unified pod (FOUP).

The FOUP is used for processing purposes, mainly for direct injection into production processes. In the FOUP, a plurality of wafers are loaded horizontally, and the wafers are transferred through the door of the FOUP.

The FOSB is mainly used for shipping to store or move wafers. The FOSB has a structure similar to that of the FOUP, and the wafer enters and exits through a door.

The wafer transferred using the FOSB is transferred to the FOUP and then put into each production process. The FOSB and the FOUP transfer the wafer from the FOSB to the FOUP while the robot is in a specific position.

At this time, the operator manually loads the FOSB and the FOUP at the specific position. The worker must repeatedly load the FOSB and the FOUP, so that the worker's body may be burdened. Further, since the FOSB and the FOUP are manually loaded, it is difficult to automate the process of transferring the wafer from the FOSB to the FOUP.

The present invention provides a wafer transfer apparatus that automatically supplies FOSB and FOUP.

The wafer transfer apparatus according to the present invention comprises a stocker for storing a plurality of FOSBs, an EFEM provided adjacent to the stocker, having a first load port on which the FOSB is placed and a second load port on which the FOUP is placed, Comprising a first robot for loading FOSBs loaded with wafers into the first load port or unloading empty FOSB from the first load port, and a second robot for loading and unloading the FOSB loaded in the first load port, And a second robot that draws the wafer from the FOSB and loads the FOUP on the FOUP that is seated on the second load port.

According to one embodiment of the present invention, the stocker includes a first port into which the FOSBs loaded with the wafers are charged, a second port through which the empty FOSB is discharged, and a shelf in which the FOSBs are placed, The robot can transfer the FOSB between the first and second ports and the shelf and between the shelf and the first load port.

According to one embodiment of the present invention, the wafer transfer apparatus may further include an OHT for loading an empty FOUP to the second load port, or for unloading the wafer loaded FOUP from the second load port .

According to one embodiment of the present invention, the wafer transfer device may further include an aligner for aligning the wafer drawn from the FOSB inside the EFEM.

According to one embodiment of the present invention, the wafer transfer device is provided in the stocker, and includes a first reader for recognizing a code attached to the FOSB to acquire information about the FOSB, A second reader for recognizing a code attached to the FOUP in order to obtain information on the FOUP and a third reader provided above the aligner and recognizing an identification mark of the wafer aligned in the aligner have.

According to one embodiment of the present invention, the wafer transfer apparatus is provided between the stockers when a plurality of EFEMs and the stocker are provided, and further includes a conveyor for transferring the FOSB from one stocker to another stocker .

The wafer transfer apparatus according to the present invention can store a plurality of FOSBs in a stocker and supply the FOSBs to a first load port of the EFEM using a first robot. Further, the FOUP can be supplied to the second load port by using the OHT. The wafers of the FOSB can be moved to the FOUP by using the second robot. The loading of the FOSB and the FOUP and the transfer of the wafer can be automated.

In addition, since it is not necessary for the operator to repeatedly load the FOSB and the FOUP, it is possible to eliminate the possibility that an abnormality occurs in the body of the operator.

1 is a schematic plan view for explaining a wafer transfer apparatus according to an embodiment of the present invention.
2 is an enlarged view for explaining the EFEM, the second robot and the aligner shown in Fig.

Hereinafter, a wafer transfer apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

FIG. 1 is a schematic plan view for explaining a wafer transfer apparatus according to an embodiment of the present invention, and FIG. 2 is an enlarged view for explaining the EFEM, the second robot and the aligner shown in FIG.

1 and 2, the wafer transfer apparatus 100 includes a stocker 110, an EFEM 120, a first robot 130, a second robot 140, an aligner 150, an OHT 160, And a conveyor (170).

The storeer 110 stores a plurality of FOSBs 10. That is, in order to solve the buffering problem caused by the difference between the processing capability and the processing time of each processing apparatus, the stocker 110 may transfer the FOSB 10 loaded with the wafers 30 to another semiconductor manufacturing process apparatus Store them temporarily before transporting them. The stocker 110 may have a substantially rectangular parallelepiped shape.

The stocker 110 includes a shelf 112, a first port 114, and a second port.

The shelf 112 is a place where the FOSBs 10 are actually stored. The shelf 112 can be divided into a plurality of cells, and each cell can store one FOSB 10. [ Here, the shelf 112 may be installed in a multi-layered form.

The first port 114 is provided at one side of the stocker 110 and is a path through which the FOSBs 10 loaded with the wafers 30 are input into the stocker 110. The second port 116 is provided on one side of the stocker 110 and is a passage through which empty FOSBs 10 are discharged from the stocker 110. For example, the first port 114 and the second port 116 may be disposed to protrude from the stocker 110, or may be disposed between the shelves 112 of the stocker 110.

The FOSBs 10 may be charged into the first port 114 or discharged from the second port 116 by an unmanned conveyance truck (not shown) running along the unmanned conveyance line.

The first port 114 and the second port 116 are arranged adjacent to each other so that the FOSBs 10 can be inserted and discharged by one unmanned conveyance bogie. The first port 114 and the second port 116 may be spaced from each other or disposed on the other side of the stocker 110 so that the FOSBs 10 may be inserted and discharged by different unmanned conveyance bogies.

Meanwhile, the first port 114 and the second port 116 may be integrated so that the FOSBs 10 may be input and output in one port.

The stocker 110 may further include a first reader 118. The first reader 118 may be provided in the stocker 110, specifically, the first port 114. [ The first reader 118 recognizes the code attached to the FOSB 10 inserted through the first port 114 and acquires information about the FOSB 10. The information may be information about the wafer 30 loaded on the FOSB 10.

The code may be a bar code or an RF tag, and the first reader 118 may be a bar code reader or an RF reader.

The EFEM 120 is disposed adjacent to the stocker 110. The EFEM 120 uses a fan filter unit to form a downward flow to keep the interior clean.

In addition, the EFEM 120 includes a first load port 122 and a second load port 124.

The first load port 122 may be provided on one side of the EFEM 120. At this time, the first load port 122 may be located inside the stocker 110.

The first load port 112 supports the FOSB 10 on which the wafers 30 are loaded. In addition, the first load port 112 includes a first door open unit (not shown) and a mapping sensor (not shown).

The first door open unit opens and closes the door of the FOSB 10 seated on the first load port 112. The mapping sensor confirms the presence and position of the wafer 30 in the FOSB 10 where the door is opened.

The second load port 124 may be provided on one side and the other side on which the first load port 122 is provided. The second load port 114 supports the empty FOUP 20.

In addition, the second load port 114 includes a second door open unit (not shown) for opening and closing the door of the FOUP 20.

The EFEM 120 may further include a second reader 126. The second reader 126 may be included in the EFEM 120, specifically, the second load port 124. The second reader 126 recognizes the code attached to the FOUP 20 seated on the second load port 124 and acquires information on the FOUP 20. [

The code may be a bar code or an RF tag, and the second reader 126 may be a bar code reader or an RF reader.

The first robot 130 transports the FOSBs 10 within the stocker 110. For example, the first robot 130 can move along the longitudinal direction of the stocker 110.

The first robot 130 transfers the FOSB 10 between the shelf 112 and the first port 114 and the second port 116. Specifically, the first robot 130 transfers the FOSB 10 loaded with the wafer 30 from the first port 114 to the shelf 112, and transfers the empty FOSB 10 from the shelf 112 to the second To port 116. < / RTI >

The first robot 130 transfers the FOSB 10 between the shelf 112 and the first load port 122. Specifically, the first robot 130 transfers the FOSB 10 loaded with the wafer 30 from the shelf 112 to the first load port 122 and transfers the empty FOSB 10 from the first load port 122 ) To the shelf (112).

The second robot 140 is provided inside the EFEM 120 and transfers the wafer 30. Specifically, the second robot 140 takes out the wafers 30 loaded on the FOSB 10 of the first load port 122 and loads the wafers 30 inside the FOUP 20 of the second load port 124.

The second robot 140 can directly transfer the wafers 30 loaded on the FOSB 10 to the FOUP 20 but the wafers 30 loaded on the FOSB 10 are placed inside the EFEM 120 And then transferred to the FOUP 20. In this case,

The aligner 150 is provided inside the EFEM 120 and aligns the wafer 30 drawn out from the FOSB 10. [ Specifically, the aligner 150 aligns the wafer 30 by sensing the flat zone or the notch of the wafer 30 with the sensor while rotating the wafer 30 in a supported state.

The wafer 30 is aligned by the aligner 150 and then transferred to the FOUP 20 by the second robot 140 so that the FOUP 20 can be loaded with the wafers 30 in an aligned state. Therefore, there is no need to align the wafers 30 separately in a subsequent process for the wafers 30. [

The aligner 150 may further include a third reader 152. The third reader 152 may be disposed above the aligner 150. The third reader 152 recognizes the identification mark of the aligned wafer 30 at the aligner 150. Thus, information on each wafer 30 can be obtained.

The identification mark may be a number and a character, and the third reader 152 may be an OCR RF reader.

The OHT 160 is provided so as to pass above the second load port 124, and conveys the FOUP 20. Specifically, the OHT 160 loads the empty FOUP 20 into the second load port 124 and unloads the FOUP 20 loaded with the wafer 30 from the second load port 124. Further, the OHT 160 transfers the FOUP 20 on which the wafer 30 is loaded to another processing apparatus.

When a plurality of stockers 110 and EFEMs 120 are provided, a conveyor 170 is disposed between the stockers 110 to transfer the FOSBs 10 from one stocker 110 to another stocker 110.

When the second robot 140 or the aligner 150 provided in the EFEM 120 adjacent to any one of the stockers 110 fails, the wafer 30 of the FOSB 10 stored in the stocker 110 It is difficult to transfer them to the FOUP 20 in an aligned state. In this case, the FOSB 10 stored in the stocker 110 can be transferred to the other stocker 110 by using the conveyor 170. Therefore, the wafers 30 loaded on the FOSB 10 can be transferred to the FOUP 20 in an aligned state by using the second robot 140 or the aligner 150 in a steady state.

Hereinafter, the wafer transfer method using the wafer transfer apparatus 100 will be briefly described.

First, the FOSB 10 on which the wafer 30 is loaded is loaded into the first port 114 of the stocker 110 by using the unmanned conveyance bogie. The first reader 118 recognizes the code attached to the FOSB 10 inserted into the first port 114 and acquires information about the FOSB 10.

Next, the first robot 130 transfers the FOSB 10 loaded with the wafer 30 from the first port 114 to the shelf 112. The first robot 130 transfers the FOSB 10 loaded with the wafer 30 from the shelf 112 to the first load port 122.

Meanwhile, the OHT 160 loads the empty FOUP 20 into the second load port 124.

When the FOSB 10 loaded with the wafer 30 is loaded in the first load port 122, the first door open unit opens the door of the FOSB 10 seated on the first load port 122, The presence or absence of the wafer 30 in the FOSB 10 is confirmed.

When the empty FOUP 20 is seated on the second load port 124, the second reader 126 recognizes the code attached to the FOUP 20 to acquire information on the FOUP 20, The open unit opens the door of the FOUP 20 that is seated in the second load port 124.

Thereafter, the second robot 140 transfers the wafers 30 loaded on the FOSB 10 to the aligner 150, aligns them, and transfers them to the FOUP 20. The aligner 150 aligns the wafer 30 by sensing the flat zone or the notch of the wafer 30 with the sensor while rotating the wafer 30 in a supported state. At this time, the third reader 152 can recognize the identification mark of the aligned wafer 30 in the aligner 150 and acquire information about each wafer 30.

When the transfer of the wafers 30 is completed, the first door off unit blocks the door of the FOSB 10 and the second door open unit interrupts the door of the FOUP 20. [

 When the door of the FOUP 20 is shut off, the OHT 160 transfers the FOUP 20 loaded with the wafer 30 to the subsequent processing apparatus.

On the other hand, when the door of the FOSB 10 is shut off, the first robot 130 transfers the empty FOSB 10 from the first load port 122 to the shelf 112. Further, the empty FOSB 10 is transferred from the shelf 112 to the second port 116. Thereafter, the empty FOSB 10 is discharged through the second port 116 of the stocker 110 by using the unmanned conveyance bogie.

As described above, the wafer transfer apparatus according to the present invention can automatically perform loading and unloading of the FOSB, loading and unloading of the FOUP, and wafer transfer and alignment without an operator. Therefore, the labor of transferring the wafers can be automated to reduce labor.

In addition, since the stocker can store a plurality of FOSBs, it is possible to solve the buffering problem caused by the difference in processing capacity and processing time of the semiconductor manufacturing process apparatus.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

100: wafer transfer device 110: stocker
120: EFEM 130: 1st robot
140: Second robot 150: Earliner
160; OHT 170: Conveyor
10: FOSB 20: FOUP
30: wafer

Claims (6)

A Stocker storing a plurality of FOSB (Front Opening Shipping Box);
An Equipment Front End Module (EFEM) provided adjacent to the stocker and having a first load port on which the FOSB is placed and a second load port on which a Front Open Unified Pod (FOUP) is placed;
A first robot provided in the stocker, for loading wafers loaded FOSB into the first load port or unloading empty FOSB from the first load port; And
And a second robot that is provided inside the EFEM and draws the wafer from the FOSB mounted on the first load port and loads the FOUP on the FOUP seated on the second load port. The apparatus of claim 1, wherein the stocker comprises a first port into which the FOSBs loaded with the wafers are charged, a second port through which the empty FOSB is discharged, and a shelf on which the FOSBs are placed,
Wherein the first robot transfers the FOSB between the first port and the second port and the shelf and between the shelf and the first load port. The wafer transfer apparatus according to claim 1, further comprising an OHT (Overhead Hoist Transport) loading an empty FOUP to the second load port or unloading the FOUP loaded with the wafer from the second load port Device. The wafer transfer apparatus according to claim 1, further comprising an aligner for aligning the wafer drawn out from the FOSB inside the EFEM. 5. The system of claim 4, further comprising: a first reader on the stocker for recognizing a code attached to the FOSB to obtain information about the FOSB;
A second reader provided in the EFEM, the second reader recognizing a code attached to the FOUP to obtain information on the FOUP; And
Further comprising a third reader provided above the aligner for recognizing an identification mark of a wafer aligned in the aligner. 2. The wafer transfer apparatus according to claim 1, further comprising a conveyor for transferring the FOSB from one stocker to another when the EFEM and the stocker are provided in plural, .

Images