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KR20120120134A - 전해 경질 금 도금액 및 이것을 사용하는 도금 방법 - Google Patents

전해 경질 금 도금액 및 이것을 사용하는 도금 방법 Download PDF

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Publication number
KR20120120134A
KR20120120134A KR1020127012784A KR20127012784A KR20120120134A KR 20120120134 A KR20120120134 A KR 20120120134A KR 1020127012784 A KR1020127012784 A KR 1020127012784A KR 20127012784 A KR20127012784 A KR 20127012784A KR 20120120134 A KR20120120134 A KR 20120120134A
Authority
KR
South Korea
Prior art keywords
gold
film
plating
plating solution
electrolytic hard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020127012784A
Other languages
English (en)
Korean (ko)
Inventor
마사토 후루카와
인준 손
Original Assignee
메타로 테쿠노로지 쟈판 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메타로 테쿠노로지 쟈판 가부시키가이샤 filed Critical 메타로 테쿠노로지 쟈판 가부시키가이샤
Publication of KR20120120134A publication Critical patent/KR20120120134A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
KR1020127012784A 2009-12-09 2010-11-30 전해 경질 금 도금액 및 이것을 사용하는 도금 방법 Withdrawn KR20120120134A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009279409A JP2011122192A (ja) 2009-12-09 2009-12-09 電解硬質金めっき液及びこれを用いるめっき方法
JPJP-P-2009-279409 2009-12-09
PCT/JP2010/071304 WO2011070933A1 (ja) 2009-12-09 2010-11-30 電解硬質金めっき液及びこれを用いるめっき方法

Publications (1)

Publication Number Publication Date
KR20120120134A true KR20120120134A (ko) 2012-11-01

Family

ID=44145478

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127012784A Withdrawn KR20120120134A (ko) 2009-12-09 2010-11-30 전해 경질 금 도금액 및 이것을 사용하는 도금 방법

Country Status (7)

Country Link
EP (1) EP2511400A4 (ja)
JP (1) JP2011122192A (ja)
KR (1) KR20120120134A (ja)
CN (1) CN102695819A (ja)
SG (1) SG181529A1 (ja)
TW (1) TW201137184A (ja)
WO (1) WO2011070933A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5025815B1 (ja) * 2011-08-10 2012-09-12 小島化学薬品株式会社 硬質金めっき液
JP5758361B2 (ja) * 2012-08-31 2015-08-05 日本エレクトロプレイテイング・エンジニヤース株式会社 ノンシアン系金‐パラジウム合金めっき液及びめっき方法
JP5152943B1 (ja) * 2012-09-19 2013-02-27 小島化学薬品株式会社 低遊離シアン金塩の製造方法
JP7219120B2 (ja) * 2019-03-04 2023-02-07 Eeja株式会社 電解金めっき液及びその製造方法、並びに金めっき方法及び金錯体
CN118352327B (zh) * 2024-01-10 2025-07-18 深圳市联合蓝海应用材料科技股份有限公司 替代纯金凸块封装倒装芯片的金银合金凸块及其制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
GB8501245D0 (en) * 1985-01-18 1985-02-20 Engelhard Corp Gold electroplating bath
JPS637390A (ja) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk 金−コバルト合金めつき液
JP3933930B2 (ja) * 1999-06-17 2007-06-20 デグサ ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング 光沢のある金層および金合金層を電着するための酸性浴および電着用光沢剤
FR2828889B1 (fr) * 2001-08-24 2004-05-07 Engelhard Clal Sas Bain electrolytique pour le depot electrochimique de l'or et de ses alliages
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
JP4320606B2 (ja) * 2004-03-15 2009-08-26 上村工業株式会社 金めっき浴
SG127854A1 (en) * 2005-06-02 2006-12-29 Rohm & Haas Elect Mat Improved gold electrolytes
JP5559455B2 (ja) * 2007-06-29 2014-07-23 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜
JP2009165730A (ja) 2008-01-18 2009-07-30 Kozo Motoki 洗浄用ブラシ
JP5216633B2 (ja) * 2008-03-19 2013-06-19 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. バックグラウンドめっきを抑制する方法
CN101550571A (zh) * 2008-03-31 2009-10-07 恩伊凯慕凯特股份有限公司 用于部分电镀的含有金的电镀液
KR101079554B1 (ko) * 2008-06-11 2011-11-04 니혼 고쥰도가가쿠 가부시키가이샤 전해 금도금액 및 그것을 이용하여 얻어진 금피막

Also Published As

Publication number Publication date
TW201137184A (en) 2011-11-01
CN102695819A (zh) 2012-09-26
WO2011070933A1 (ja) 2011-06-16
EP2511400A4 (en) 2013-07-24
JP2011122192A (ja) 2011-06-23
EP2511400A1 (en) 2012-10-17
SG181529A1 (en) 2012-07-30

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20120517

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid