KR20000023763A - Data carrier with a module and a hologram - Google Patents

Abstract

The invention provides a data carrier 1 having a data carrier structure 2 in which a dish-shaped element carrier 10 and a module 9 having elements 13 attached inside the element carrier 10 are used. ) Is provided with a dish-shaped hologram carrier 30 provided on the data carrier 1, which can represent the hologram 33 by way of a major surface 31 visible from the outside of the data carrier 1. have. The present invention provides a dish-shaped hologram carrier 30 provided on a data carrier to cover the dish-shaped device carrier 10 and at least substantially covers the device carrier 10.

Description

Data carrier with a module and a hologram

The data carrier disclosed above consists of a chip card generally known to those skilled in the art, for example, a credit card or a bank card in a banking transaction. In a known chip card, the module received in the recess terminating at the main body major surface is arranged relatively close to the small card edge of the chip card, and the hologram carrier is arranged close to the opposite small card edge of the chip card. . The known chip card and its module housed in the recess are designed for contact-bound operation, for which the chip carrier, which consists of a dish-shaped element carrier, contacts the first carrier main surface externally. A contact connection is provided which can be flat, which forms a contact area corresponding to the cross section of the recess whose surface form terminates at the first carrier major surface. Flat connection contacts are generally unprotected and exposed, which makes them relatively easy to damage, not only hindering their free operation, but also failing to achieve a satisfactory appearance.

A first carrier major surface facing the body surface, the first carrier major surface facing the body surface and containing a module terminated at the body surface, the data carrier body portion bounded by the body surface; At least one element mounted on an element carrier in a second carrier major surface area away from the body surface in the recess, the recess including a dish-shaped element having a recess; The carrier has a dish-shaped hologram carrier carried on a major surface visible from outside the data carrier.

1 shows a module comprising a dish-shaped chip carrier as a dish-shaped element carrier, a chip mounted as an element on the chip carrier, and a dish-shaped hologram carrier connected to the dish-shaped chip carrier before the module is mounted to the chip card. A plan view of a chip card forming a data carrier according to an embodiment of the invention comprising and configured for only contactless operation.

FIG. 2 is a portion of the chip card of FIG. 1 with a plate-shaped hologram carrier mounted on a plate-shaped chip carrier, the major surface being the same as the carrier major surface of the chip carrier, and the module mounted on the chip card being located; A cross-sectional view taken along line II-II in FIG. 1.

3 is a view similar to that of FIG. 2, with a macro configured for contactless operation, in which the module whose chip carrier forms the element carrier protrudes from the facing carrier major surface of the chip carrier along the entire environment of the surface; A view of a portion of a chip card forming a data carrier according to a second embodiment of the invention in a structure covered by a plate-shaped hologram carrier.

4 is a view similar to FIGS. 2 and 3, configured for both contact-boundary operation and contactless operation, wherein its chip carrier forms the device carrier, and its major surface is along the entire environment of the surface; A module covered by a dish-shaped hologram carrier protruding from an opposing carrier major surface of the chip, wherein the module represents a portion of a chip card forming a data carrier according to the present invention.

It is an object of the present invention to solve this problem and to provide an improved data carrier.

However, in the data carrier according to the invention, the dish-shaped element of the module in the first carrier major surface area facing the first body surface only after the module has been mounted in the recess of the data carrier, even if the data carrier is closed. Including a dish-shaped hologram carrier connected to the carrier has the advantage that the major surface of the hologram carrier covers at least a larger portion of the first carrier major surface of the device carrier. Such a structure according to the invention is advantageous because the hologram carrier can only be connected to the device carrier of the module after the module is mounted in the recess of the data carrier.

However, in the data carrier according to the present invention as described above, the first carrier of the element carrier connected to the data carrier body part by the hologram, the outer peripheral area and facing the body part surface along the entire environment of the first carrier main surface It further has the advantage that a main surface is provided for carrying the dish-shaped hologram carrier protruding from the main surface. In this way, the data carrier with particularly good protection can be realized because the hologram carrier has a sealing effect as well as for the mechanical protection of the device carrier with the data carrier module according to the invention.

An advantage of the data carrier according to the invention is that the data carrier is configured only for contactless operation, whose module comprises an element carrier without contact in the area of its first carrier major surface.

Advantages of the data carrier according to the invention are provided with a dish-shaped hologram carrier which completely covers the first carrier major surface of the element carrier, which is the first major surface facing the body surface, the main surface carrying the hologram. It is characterized by. In this way, particularly good protection can be obtained since the device carrier is protected and covered in its entire first carrier major surface area.

The data carrier according to the invention can be used for a variety of purposes and can take various forms, for example in the form of a key, bar or other. A preferred form according to the invention is characterized in that it is configured as a chip card.

In addition to the above-described aspects, additional aspects of the present invention will become apparent from the embodiments and the embodiments means described below.

The invention will be described below with reference to the accompanying drawings, which show three embodiments of the invention.

1 and 2 show a chip card 1 whose data carrier body portion forms a data carrier formed by a card body portion 2 produced in a lamination process. The card body 2 is bounded by a first body major surface 3 and a second body major surface 4. The stepped recess 5 is formed in the card body 5 by removing the material. It is an advantage that the stepped recess 5 can be manufactured by milling, but it can also be used with other techniques such as etching or laser. The stepped recess is bordered by an annular boundary surface 7 which is adjacent to the first body major surface 3 and parallel to the first body major surface 3, and which has a larger cross-sectional first recess part ( 6) and a second recessed portion 8 having a smaller cross section adjacent the first recessed portion 6 at its side remote from the first body major surface 3. As shown in FIG. 2, the recess 5 is opened into the first body main surface 3.

The chip card 1 shown in Figs. 1 and 2 is configured to operate without contact only. Thus, the module 9 configured for only contactless operation is mounted in the stepped recess 5. The module 9 is in the form of a printed circuit board and is remote from the dish-shaped chip carrier 10 and the first body major surface 3 bounded by the first carrier major surface 11. It has an element carrier constituted by two carrier major surfaces 12.

The module 9 has a chip in the recess 5 in the region of the second carrier major surface 12 remote from the first body major surface 3 covered by the dish-shaped chip carrier 10. It further has an element constituted by the chip 13 mounted on the dish-shaped chip carrier 10. The chip 13 has two chip connection contacts 14, 15. The two chip connection contacts 14, 15 are generally called pads and are connected in an electrically conductive manner to the two dish-shaped module connection contacts 18, 19 via two bonded wires 16, 17. do. For example, two module connection contacts 18, 19 are formed by conductor tracks provided on a printed circuit board forming the chip carrier 10. The two module connection contacts 18, 19 are transferred / received in the card body 2 via an electrically conductive adhesive 20 provided in the channels 21, 22 partially penetrating the card body 2. Two coil connection contacts 23 and 24 of the receiving coil 25 are connected. Suitably, the two channels 21, 22 can be formed in a milling operation like the stepped recess 5. 2 further illustrates the coil rotation 26 of the delivery / acceptance coil 25. The delivery / acceptance coil 25 acts as a conduit for inductive transmission without contact of data between the chip 13 integrated in the chip card 1 and the external delivery / acceptance device. The transmission / reception coil 25 is used to obtain a DC voltage from the chip 13 that forms a chip 13 and supplies a voltage for transmitting power to the chip 13 to enable data transfer of the chip 13. Ac It has a role to receive a signal.

In the chip card 1, in the annular boundary surface 7 of the larger recessed part 6, the layer of adhesive melted at high temperature is formed by the second carrier major surface 12 and the card body portion of the chip card 10. The entire module 9 is fixed to the card body 2 because it is provided so that adhesive bonding is made between the two. In addition, the two canals 21, 22 each extend laterally from each canal 21, 22 and dispose of excess of electrically conductive adhesive 20 as schematically shown in FIG. 2. It has pockets 28 and 29 that serve to play a role.

As described above, the chip card 1 shown in Figs. 1 and 2 has its own by means of a transmitting / receiving coil 25 means connected to the chip 13 in a contactless operation of the chip, ie in an electrically conductive manner. The act of transferring data from and to the chip 13 can be exclusive. The chip card 1 and its module 9 are thus configured to enable exclusive contactless operation.

In the case of the chip card 1 shown in FIGS. 1 and 2, the chip card 1 additionally has a dish-shaped hologram carrier 30. The hologram carrier 30 has a first major surface 31 visible from the outside of the chip card 1 and a second major surface 32 opposite the first major surface 31. At its first major surface 31 visible from the outside of the chip card 1, the hologram carrier 30 carries a hologram 33, for example displaying an image of a person, as shown in FIG. 1.

In an advantageous manner, the dish-shaped hologram carrier 30 of the chip card 1 as shown in FIGS. 1 and 2 is provided with a dish-shaped hologram carrier 30 with the first body major surface 3. It is arranged on the chip card 1 in such a way as to cover the dish-shaped chip carrier 10 in the region of its first carrier major surface 11 that faces. In this case, the dish-shaped hologram carrier 30 completely covers the dish-shaped chip carrier 10. The dish-shaped hologram carrier 30 is connected to the chip carrier 10 by means of adhesive bonding, which is not shown in FIG. 2, and its second major surface 32 and the first carrier major surface of the chip carrier 10 ( 11) is provided between. Advantageously, the chip card 1 shown in FIGS. 1 and 2 faces the first body main surface 3 before the module 9 is mounted in the stepped recess 5 of the chip card 1. A dish-shaped hologram carrier 30 connected to the dish-shaped chip carrier 10 in the region of the first carrier major surface 11. The two major surfaces 31, 32 of the dish-shaped hologram carrier 30 serve as the first carrier major surface 11 of the chip carrier 10 whose surface faces the first body major surface 3. Have exactly the same shape.

With the aid of the dish-shaped hologram carrier 30 of the chip card 1 shown in Figs. 1 and 2, in order to cover the chip carrier 10 in a very simple manner and without any additional means, the chip card 1dp. The dish-shaped chip carrier 10 is completely covered in its first carrier major surface 11 region because of the use of the hologram carrier 30, as a result of which the chap carrier has its first carrier major surface 11. A chip card 1 for contactless operation can be obtained which is effectively protected in the) area, has a perfect shape in the area of the chip carrier 10 and whose shape is determined by the hologram on the hologram carrier 30.

3 shows a chip card 1 forming a data carrier according to a second embodiment of the present invention. The chip card 1 shown in FIG. 3 has the same structure in large parts as the chip card 1 shown in FIGS. 1 and 2. The fundamental difference between the chip card 1 shown in FIG. 3 and the chip card 1 shown in FIGS. 1 and 2 is that the stepped recess 5 is milled in the region closest to the first body main surface 3. It has a third recessed portion 34 that can be manufactured as. The third recessed portion 34 is bounded by an additional annular boundary surface 35 parallel to the first carrier major surface 3.

In the area of the first carrier major surface 11 of the chip carrier 10 whose surface faces the main body surface 3 of the chip card 1 shown in FIG. 3, the module 9 has the chip card 1. It only includes a dish-shaped hologram carrier 36 which is connected to the dish-shaped chip carrier 10 and the card body 2 only after it is mounted in the recess 5. The hologram carrier 36 is bounded by a first major surface 37 and a second major surface 38. The hologram carrier 36 is on the one hand a second major surface 38 of the hologram carrier and on the other hand an annular junction of the first major surface 11 and the third recessed part 34 of the chip carrier 10. Connected to the dish-shaped chip carrier 10 and the card body 2 by adhesive bonding, not shown in FIG. 3, provided between the surfaces 35. The two major surfaces 37, 38 of the dish-shaped hologram carrier 36 protrude from the first carrier major surface 11 of the chip carrier 10, the first carrier major surface being partially shown in FIG. 3. It faces the first body major surface 3 along the entire circumference of the first carrier major surface 11 as shown.

In the case of the chip card 1 shown in FIG. 3, the chip carrier 10 is effectively protected in its first carrier major surface 11 area and in its complete form in the chip carrier area without a simple manner and without additional means. Contactless operation with As an additional advantage of the chip card 1 shown in FIG. 3, the dish-shaped hologram carrier 36 provides a suitable mechanical protection for the chip carrier 10 and the placement of the chip card 1 in the area of the chip carrier 10. In addition to bringing about a complete shape, in addition, the dish-shaped hologram carrier 36 can serve as a seal so that a module 9 with particularly good protection can be realized.

4 shows a chip card 1 forming a data carrier according to a third embodiment of the present invention. The module 9 of the chip card 1 comprises two elastically flexible pin-shaped module connection contacts 18, 19 which are assembled in the chip carrier 10, the length of these contacts connecting these two modules. It is determined in a manner based on the elasticity of the contacts 18, 19 and is in electrical contact with the coil connection contacts 23, 24 of the two coils 25 under the influence of these elasticities.

In the chip card 1 shown in FIG. 4, additional module connection contacts provided in the area of the first carrier major surface 11 of the chip carrier are connected to the chip carrier 10 of the module 9 and the chip card 1 is connected. Paired contacts, which can be contact coupled from the outside, are made and adapted to cooperate. The chip card 1 shown in FIG. 4 has a total of eight additional module contacts, but in FIG. 4 only two additional module connection contacts 39, 40 are shown. The additional module connection contacts-as seen in the two additional module connection contacts 39, 40 shown in FIG. 4-are connected to the chip via two additional junction wires 41, 42 shown in FIG. 4. 13 is connected to an additional chip connection contact (pad). Additional bond wires pass through the mower formed in the chip carrier 10, the two bores 43 and 44 are shown in FIG.

The chip 13 forming the element of the chip card 1 shown in FIG. 4 is a dual purpose chip, and its module connection contacts 18, 19 arranged in the region of the second carrier main surface 12 are Connected to the coil connection contacts 23, 24 of the coil 25, which coils, as applied, exchange data without contact between the dual purpose chip and the read / write station for transferring energy without contact to the dual purpose chip. To the first carrier major surface 11 region to serve as contact-bound data exchange between the dual purpose chip and the read / write station and to transfer contact-bound energy to the dual purpose chip. Has additional module connection contacts arranged.

The chip card 1 shown in FIG. 4 is similar to the chip card shown in FIG. 3, with a first carrier major surface facing the first body major surface 3 and a first carrier major surface of the chip carrier. Dish-shaped hologram carrier connected to card body 2 and dish-shaped chip carrier 10 only after module 9 is assembled in recess 5 of chip card 1 in region (11). (36). The hologram carrier 36 is bounded by a first major surface 37 and a second major surface 38. On its first major surface 37 visible from the outside of the chip card 1, the hologram carrier 36 moves a hologram not shown in FIG. 4. The hologram carrier 36 is on the one hand the second major surface 38 of the hologram carrier and on the other hand the annular bonding surface 35 of the third recessed part 34 and the first main of the chip carrier 10. Attached to the surface 11 is attached to the dish-shaped chip carrier 10 and the card body 2 by means of adhesive bonding not shown in FIG. 4. The adhesive bond between the card body 2 and the dish-shaped chip carrier 10 is an adhesive bond formed during the embossing operation. The embossing operation serves to attach the hologram carrier 36 to the chip card 1 and is formed during the embossing operation when weaving the third recess portion 34.

In the chip card 1 shown in FIG. 4, the two major surfaces 37, 38 of the dish-shaped hologram carrier 36 have a first carrier major surface (as shown in part in FIG. 4). It protrudes from the first carrier major surface 11 of the chip carrier 10 facing the first body major surface 3 along the entire periphery of 11. In this way, in the chip card 1 shown in FIG. 4, the dish-shaped hologram carrier 36 is formed by the chip carrier 10 and the first for the perfect shape of the chip card 1 in the area of the chip carrier 10. In addition to mechanically adequately protecting the parts arranged in the region of the carrier major surface 11, ie the additional module connection contacts of the chip carrier 10, additionally the dish-shaped hologram carrier 36 is provided. By having the sealing function, a module 9 having a particularly excellent protective function can be realized.

In the chip card shown in FIG. 4, the dish-shaped hologram carrier 36 has a passage as its passages 45, 46 are shown in FIG. 4. The passages in the dish-shaped hologram carrier 36 provide access to additional module connection contacts, through which the contact pins of the read / write device are covered by a larger portion by the dish-shaped hologram carrier 36. The flat additional module connection contacts are electrically conductive.

The invention is not limited by the three embodiments described above. The invention can also be applied to a chip card configured only for contact-bound operation, having a module for realizing contact-bound operation for this purpose, and a dish-type chip of such a module for realizing contact-bound operation. The carrier is covered by a dish-shaped hologram carrier. The dish-shaped hologram carrier does not need to completely cover the underlying chip carrier and may expose a narrow outer region of the chip carrier for optical reasons. The present invention is also applicable to data carriers having an injection-molded detector carrier body. In addition, in addition to the dish-shaped hologram carrier which covers the dish-shaped element carrier in at least a larger portion, the data carrier according to the invention comprises at least one additional hologram carrier.

Claims (7)

A data carrier body portion bounded by the body portion surface; A dish-shaped element carrier terminating at the body surface, receiving the module, the dish-shaped element carrier having a first carrier major surface, and having a recess facing the body surface; Having a second carrier surface remote from the body surface; Having at least one device mounted on the device carrier in a second carrier major surface area away from the body surface surface in the recess covered by the device carrier; A data carrier having a dish-shaped hologram carrier for carrying a hologram on a major surface of a dish-shaped hologram carrier visible from outside of the data carrier; The dish-shaped hologram carrier is arranged on the data carrier so that the dish-shaped element carrier of the module is covered in the carrier major surface area facing the body surface, and covers the dish-shaped element carrier in at least a larger portion. And a data carrier. The device of claim 1, wherein the data carrier is at least more than a dish-shaped element carrier of the module in a first carrier major surface area facing the first body major surface before the module is mounted in a recess of the data carrier. And a dish-shaped hologram carrier connected to the major surface of the hologram carrier for transporting the hologram covering the first carrier major surface of the device carrier in a large portion. The device of claim 1, wherein the data carrier is at least a dish-shaped element carrier and at least more than one of the modules in a first carrier major surface area facing the first body surface after the module is mounted in a recess of the data carrier. And a dish-shaped hologram carrier connected to a major surface of the hologram carrier covering a large portion of the first carrier major surface of the device carrier. 4. A holographic carrier according to claim 3, having a major surface for transporting holograms, said dish-shaped hologram carrier facing said body surface along the entire periphery of its first carrier major surface and by means of a peripheral region of the data carrier body. A data carrier protruding from the first carrier major surface of the element carrier connected to the portion. 2. The data carrier of claim 1, wherein the data carrier is configured for only contactless operation, the module of which includes an element carrier that is not in contact with the first carrier major surface area. 6. The data carrier of claim 5, wherein a major surface for transporting the hologram is provided, the dish-shaped hologram carrier completely covering the first carrier major surface of the element carrier facing the body surface. 7. A data carrier according to any one of claims 1 to 6, wherein said data carrier is configured as a chip card.