KR102023655B1 - Transfer apparatus, transfer method, exposure apparatus, and device manufacturing method - Google Patents

Abstract

The conveying apparatus supplies a gas to one surface of the substrate, the first supporting portion 3 capable of floatingly supporting the substrate through the substrate, the second supporting portion 400 capable of supporting one surface of the substrate, and the first and One or more first and second support units arranged by the drive unit support the drive unit 402 for moving the at least one second support unit and arranging the first and second support units in the first direction by bringing the first and second support units closer or in contact with each other. And a conveying part for moving the substrate to the other side along the first direction.

Description

Transport apparatus, conveyance method, exposure apparatus, and device manufacturing method {TRANSFER APPARATUS, TRANSFER METHOD, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD}

This invention relates to a conveying apparatus, a conveying method, an exposure apparatus, and a device manufacturing method.

This application claims priority based on US Provisional Application No. 61 / 305,355 and 61 / 305,439, filed February 17, 2010, the content of which is incorporated herein by reference.

In the manufacturing process of electronic devices, such as a flat panel display, the processing apparatus of large board | substrates, such as an exposure apparatus and an inspection apparatus, is used. In the exposure process and test | inspection process using these processing apparatuses, the conveying apparatus as disclosed in the following patent document which conveys a large sized substrate (for example, a glass substrate) to a processing apparatus is used.

Japanese Laid-Open Patent Publication 2001 # 100169

In the above-mentioned large-sized board | substrate conveying apparatus, when a board | substrate supported by a board | substrate support member is passed to a board | substrate holding part, an air layer is interposed between a board | substrate and a board | substrate holding part, and deformation | transformation arises in a board | substrate after receiving, or board | substrate holding Placement | deviation shift of a board | substrate may arise with respect to the mounting position of a part on a part. When a displacement and deformation | transformation generate | occur | produce in a board | substrate after passing, the problem of exposure defects, such as being unable to perform predetermined | prescribed exposure in the appropriate position on a board | substrate, for example, arises. When dislocation and deformation | transformation of a board | substrate generate | occur | produce, in order to eliminate it, the problem of delaying the process of a board | substrate arises, for example by carrying out the board | substrate again. Moreover, when the water-receiving speed of a board | substrate is low, for example so that an air layer may not remain after water exchange, the problem of processing of a board | substrate will become delayed further.

The aspect of this invention aims at providing the conveying apparatus, the conveying method, the exposure apparatus, and the device manufacturing method which can carry out a board | substrate without generating a displacement and deformation | transformation.

According to a first aspect of the present invention, there is provided a gas support for one surface of a substrate, and a first support portion capable of floatingly supporting the substrate through the substrate, a second support portion capable of supporting the one surface of the substrate; And a drive unit for moving at least one of the first and second support units to arrange the first and second support units in a first direction by bringing the first and second support units into proximity or contact with each other, and the first and second array units arranged by the drive unit. The conveying apparatus provided with the conveyance part which moves the said board | substrate supported by one of the support parts to the other side along a said 1st direction.

According to a second aspect of the present invention, there is provided a first support part capable of supplying a gas to one surface of a substrate and floatingly supporting the substrate through the gas, and second and second materials capable of supporting the one surface of the substrate. A first driving part which moves the third support part and at least one of the first and second support parts, and arranges the first and second support parts in a first direction by bringing the first and second support parts into proximity or contact with each other; and the first and third support parts A second drive unit arranged to move in at least one of the first and third support units adjacent to or in contact with each other in a second direction, and the second support unit arranged by the first support unit by the first drive unit A first transfer part for moving the supporting substrate along the first direction toward the first support part; and the substrate supported by the first support part arranged on the third support part by the second driving part; Along the second direction, the transport apparatus and a second transfer unit for moving the side of the third support portion is provided.

According to a third aspect of the present invention, there is provided a conveying method for conveying a substrate, comprising: a first support portion capable of floatingly supporting the substrate through a gas supplied to one surface of the substrate, and a first support portion capable of supporting the one surface of the substrate. Moving at least one of the second supports, arranging the first and second supports in the first direction by bringing the first and second supports into close proximity or contact with each other; and the first substrate supported by one of the arranged first and second supports. There is provided a conveying method comprising moving the other side along the direction.

According to the fourth aspect of the present invention, at least one of the first support portion capable of floating support of the substrate and the second support portion capable of supporting the one surface of the substrate is moved through a gas supplied to one surface of the substrate. And arranging the first and second supports in the first direction by bringing the first and second supports closer or in contact with each other, and the substrate supported by the second supports arranged in the first support, toward the first support in the first direction. Moving the first support part and at least one of the third support parts supporting one surface of the substrate, and arranging the first and third support parts in a second direction by bringing the first and third support parts closer or in contact with each other; The conveyance room which includes moving the said board | substrate supported by the said 1st support part arranged in the 3rd support part to the said 3rd support part side along a said 2nd direction. It is provided.

According to a fifth aspect of the present invention, there is provided a substrate, comprising: a first support portion capable of supplying a gas to one surface of a substrate and floatingly supporting the substrate through the substrate; a second support portion supporting the one surface of the substrate; Arranging the drive unit which moves at least one of the first and second support parts and arranges the first and second support parts in proximity or contact with each other, and the substrate supported by the second support parts arranged by the drive parts. A conveying part for moving toward the first supporting part side along the direction, a lift mechanism for supporting the substrate mounted on the mounting part of the first supporting part by stopping supply of the gas, and lifting the upper part of the mounting part; The conveying apparatus provided with the carrying out mechanism which carries out the said board | substrate supported above the said mounting part from a said 1st support part is provided.

According to a sixth aspect of the present invention, there is provided a conveying method for conveying a substrate, comprising: a first support portion capable of floatingly supporting the substrate through a gas supplied to one surface of the substrate, and the one surface of the substrate; Moving at least one of the second supporting portions to arrange the first and second supporting portions in close proximity or contact with each other, and transferring the substrate supported by the arranged second supporting portions to the first supporting portion side along the arrangement direction; Supporting the substrate mounted on the placing portion of the first support portion by stopping the supply of the gas, lifting the substrate above the placing portion, and placing the substrate supported above the placing portion from the first supporting portion. A conveying method including carrying out is provided.

According to the 7th aspect of this invention, the exposure apparatus which exposes a board | substrate with exposure light is provided, The exposure apparatus provided with the said conveying apparatus which hold | maintains the said board | substrate and moves the said board | substrate to the irradiation area of the said exposure light. .

According to an eighth aspect of the present invention, there is provided a device manufacturing method comprising transferring the pattern onto the substrate using the above exposure apparatus and processing the substrate on which the pattern is transferred based on the pattern. .

According to the aspect of this invention, a board | substrate can be carried out without generating a mounting shift and a deformation | transformation.

1 is a cross-sectional plan view showing an overall outline of an exposure apparatus.
2 is an external perspective view showing a specific configuration in the chamber.
It is a figure which shows the peripheral structure of a plate holder.
It is a figure which shows the peripheral structure of a plate holder.
It is a figure which shows the structure of the principal part of a carrying part.
It is a figure which shows the structure of the principal part of a carry-in part.
It is a figure which shows the structure of the principal part of a carrying out part.
It is a figure which shows the structure of the principal part of a carrying out part.
It is a figure explaining the receiving process of a board | substrate with respect to a table for carrying in.
It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part.
It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part.
It is a figure which shows the state which floated and supported the board | substrate on the carrying-in table.
It is a figure explaining the process of conveying the board | substrate on the table for carrying in.
It is a figure explaining the process of moving a board | substrate to the plate holder side.
It is a figure which shows the state on which the board | substrate was mounted on the plate holder.
It is a figure explaining the receiving process of a board | substrate with respect to a table for carrying out.
It is a figure which shows the state which floated and supported the board | substrate on the plate holder.
It is a figure explaining the conveyance of the board | substrate from a plate holder to a carrying out part side.
It is a figure explaining the conveyance of the board | substrate from a plate holder to a carrying out part side.
It is a figure explaining the conveyance of a board | substrate from a plate holder to a carrying out part side.
It is a figure explaining the operation | movement which carries out a board | substrate from a carrying out part.
It is a figure which shows the structure of the carrying-in part which concerns on 2nd Embodiment.
It is a figure which shows the structure of the carrying-in part which concerns on 2nd Embodiment.
It is a figure explaining the structure which conveys a board | substrate to a plate holder side from a carrying-in part.
FIG. 18 is a diagram for explaining a step following FIG. 17; FIG.
It is a figure which shows the structure of the plate holder which concerns on 3rd Embodiment.
It is a figure explaining the structure which conveys a board | substrate to a plate holder side from a carrying-in part.
It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to a plate holder side.
21 is a diagram illustrating a configuration according to a fourth embodiment.
FIG. 22A is a diagram illustrating a handover operation of a substrate according to the fourth embodiment. FIG.
FIG. 22B is an explanatory diagram illustrating the handover operation of the substrate according to the fourth embodiment. FIG.
22C is an explanatory diagram illustrating the transfer operation of the substrate according to the fourth embodiment.
FIG. 22D is a diagram illustrating a handover operation of the substrate according to the fourth embodiment. FIG.
It is a perspective view which shows the structure inside the chamber which concerns on 5th Embodiment.
It is a top view which shows schematic structure of a carrying out part.
It is a top view which shows schematic structure of a carrying out part.
It is a figure explaining the loading process of the board | substrate which concerns on 5th Embodiment.
It is a figure explaining the receipt of a board | substrate from the carrying-in / out part to the plate holder side.
It is a figure explaining the receipt of a board | substrate from a plate holder to the carrying out part side.
28 is a cross-sectional plan view showing an overall outline of an exposure apparatus.
It is an external appearance perspective view which shows the specific structure in a chamber.
It is a figure which shows the peripheral structure of a plate holder.
It is a figure which shows the peripheral structure of a plate holder.
It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part.
It is explanatory drawing of the conveyance process of the board | substrate between a plate holder and a carrying out part.
It is a figure which shows the state which floated and supported the board | substrate on the table for carrying in.
It is a figure explaining the process of conveying the board | substrate on the table for carrying in.
It is a figure explaining the process of moving a board | substrate to the plate holder side.
35 is a view for explaining the operation of the take-out robot.
It is a front view explaining the operation | movement which carries out a board | substrate from a plate holder.
It is a front view explaining the operation | movement which carries out a board | substrate from a plate holder.
It is a side view explaining the operation | movement which carries out a board | substrate from a plate holder.
38 is a diagram illustrating a configuration of a carry-in unit according to the third embodiment.
It is a figure explaining the structure which conveys a board | substrate to a plate holder side from a carrying-in part.
It is a figure explaining the structure which conveys a board | substrate from a carrying-in part to a plate holder side.
40 is a diagram illustrating the configuration of an exposure apparatus main body according to a fourth embodiment.
It is a figure which shows the planar structure of a plate holder.
42A is a side sectional view of the plate holder.
42B is a side sectional view of the plate holder.
It is a figure which shows the structure of a vertical moving part.
It is a figure explaining the structure which conveys a board | substrate to a plate holder side from a carrying-in part.
It is a figure explaining the structure which conveys a board | substrate to a plate holder side from a carrying-in part.
It is a figure which shows the state in which a board | substrate is floated and supported on the table for carrying in.
It is a figure which shows the state which the contact part contacted the edge part of the board | substrate.
It is explanatory drawing of the process of moving a board | substrate from a table for carrying in to a plate holder.
48 is a perspective view for explaining the operation of the take-out robot.
It is explanatory drawing of the process of carrying out a board | substrate from a plate holder.
It is explanatory drawing of the process of carrying out a board | substrate from a plate holder.
It is explanatory drawing of the process of carrying out a board | substrate from a plate holder.
50A is a plan view illustrating a configuration of an adsorption mechanism according to the fifth embodiment.
50B is a side view illustrating the configuration of the adsorption mechanism according to the fifth embodiment.
51A is a side view for explaining an operation for carrying out a substrate from a plate holder.
It is a side view explaining the operation | movement which carries out a board | substrate from a plate holder.
52A is a diagram illustrating a configuration of a modification of the adsorption mechanism.
52B is a diagram illustrating a configuration of a modification of the adsorption mechanism.
It is a flowchart for demonstrating an example of the manufacturing process of a microdevice.

Embodiments of the present invention will be described with reference to the drawings. In addition, this invention is not limited to this. Hereinafter, the exposure apparatus provided with the conveying apparatus which concerns on this invention, and performs the exposure process which exposes the pattern for liquid crystal display devices with respect to the board | substrate with which the photosensitive agent was apply | coated, and the conveyance method and device manufacture which concern on this invention An embodiment of the method is also described.

(1st embodiment)

1 is a cross-sectional plan view showing a schematic configuration of an exposure apparatus of the present embodiment. The exposure apparatus 1 is provided with the exposure apparatus main body 3 which exposes the pattern for liquid crystal display devices on a board | substrate, the loading part 4, and the carrying out part 5 as shown in FIG. It is housed in a chamber 2 that is highly cleaned and adjusted to a predetermined temperature. In this embodiment, a board | substrate is a large glass plate and the size of one side is 500 mm or more, for example.

2 is an external perspective view showing a specific configuration in the chamber 2. The exposure apparatus main body 3 does not show the illumination system which illuminates the mask M with exposure light IL, as shown in FIG. 2, and the mask M in which the pattern for liquid crystal display devices was formed is not shown. A plate as a substrate holder formed so as to be movable two-dimensionally on an unmasked mask stage, a projection optical system PL disposed below the mask stage, and a base portion (not shown) disposed below the projection optical system PL. The holder 9 and the plate holder 9 are held, and a first moving mechanism 33 for moving the plate holder 9 in the chamber 2 is provided.

In addition, in the following description, two-dimensional movement of the plate holder 9 with respect to the base part (not shown) formed in the chamber 2 is performed in a horizontal plane, and the X-axis is orthogonal to each other in this horizontal plane. And Y axis. The holding surface of the plate holder 9 with respect to the board | substrate P becomes parallel to a horizontal plane in a reference state (for example, the state at the time of carrying out the board | substrate P). Moreover, the Z axis is set in the direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. In addition, each direction around an X-axis, a Y-axis, and a Z-axis is called θX direction, θY direction, and θZ direction, respectively.

The first moving mechanism 33 has a moving mechanism main body 35 and a holding part 34 disposed on the moving mechanism main body 35 and holding the plate holder 9. The moving mechanism main body 35 is supported by the gas bearing non-contacted by the guide surface (base part) which is not shown in figure, and can move on the guide surface in XY direction. Based on such a structure, the plate holder 9 can move in the predetermined area | region of a guide surface in the light emission side (image surface side of the projection optical system PL) in the state holding the board | substrate P. As shown in FIG.

The movement mechanism main body 35 can move in an XY plane on a guide surface by operation | movement of the coarse motion system containing actuators, such as a linear motor, for example. The holding | maintenance part 34 is movable with respect to the movement mechanism main body 35 in the Z-axis, (theta) X, (theta) Y direction by operation | movement of the micro motion system containing actuators, such as a voice coil motor, for example. The holding part 34 is operated in the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions by holding the substrate P by the operation of the substrate stage driving system including the coarse motion system and the fine motion system. Can move in two directions.

The exposure apparatus 1 performs exposure of a step-and-scan system with the rectangular substrate P mounted on the plate holder 9, and the pattern formed on the mask M is formed on the substrate P. A plurality of, for example, four exposure regions (pattern transfer regions) are sequentially transferred. That is, in this exposure apparatus 1, in the state where the illumination area | region on the slit on the mask M was illuminated by exposure light IL from an illumination system, the mask M is not shown by the drive system not shown by the controller which is not shown in figure. The mask stage holding the substrate and the plate holder 9 holding the substrate P are synchronously moved in a predetermined scanning direction (here, in the Y-axis direction) to thereby mask one exposure area on the substrate P. The pattern of (M) is transferred, that is, scanning exposure is performed. Moreover, the exposure apparatus 1 which concerns on this embodiment is what is called multi-lens type in which the projection optical system PL has several projection optical modules, and the said illumination system contains the some illumination module corresponding to the some projection optical module. It constitutes a scan exposure apparatus.

After the end of the scanning exposure of this one exposure area, a stepping operation is performed in which the plate holder 9 is moved in the predetermined amount X direction to the scanning start position of the next exposure area. And in the exposure apparatus main body 3, the pattern of the mask M is transferred to four exposure area | regions sequentially by repeating such scanning exposure and stepping operation | movement.

When the board | substrate P to which the photosensitive agent was apply | coated was carried in in the coater developer (not shown) arrange | positioned adjacent to the exposure apparatus 1 as shown in FIG. The carry-in table 40 which supports one surface (lower surface), and the 2nd moving mechanism 43 which moves the carry-in table 40 are provided. Moreover, the carry-in part 4 is able to adjust the temperature of the board | substrate P carried in to the table 40 for carrying in.

The 2nd moving mechanism 43 has the moving mechanism main body 45 and the holding part 44 arrange | positioned on the moving mechanism main body 45, and holding the table 40 for carrying in. The moving mechanism main body 45 is supported by the gas bearing non-contactedly by the guide surface which is not shown in figure, and can move on the guide surface in XY direction. Based on such a structure, the table 40 for carrying in is movable in the predetermined area | region of a guide surface in the state which hold | maintained the board | substrate P. As shown in FIG. In addition, support of the movement mechanism main body 45 with respect to the guide surface which is not shown in figure is not limited to support by a gas bearing, The well-known guide mechanism (drive mechanism with respect to a guide surface) different from a gas bearing can also be used. .

The moving mechanism main body 45 is comprised in the same structure as the said moving mechanism main body 35, and can move in an XY plane on a guide surface. Moreover, the holding | maintenance part 44 is comprised in the same structure as the said holding | maintenance part 34, and is movable with respect to the movement mechanism main body 45 to Z-axis, (theta) X, (theta) Y direction. The holding portion 44 is movable in six directions in the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions with the substrate P held.

In addition, as shown in FIG. 2, the carrying out portion 5 receives one surface (lower surface) of the substrate P when the substrate P subjected to the exposure treatment by the exposure apparatus main body 3 is received. A carrying table 50 to be supported and a third moving mechanism 53 for moving the carrying table 50 are provided.

The 3rd moving mechanism 53 has the moving mechanism main body 55 and the holding | maintenance part 54 arrange | positioned on the moving mechanism main body 55, and hold | maintains the table 50 for carrying out. The moving mechanism main body 55 is supported by the gas bearing non-contacted by the guide surface which is not shown in figure, and can move on a guide surface in XY direction. Based on such a structure, the table 50 for carrying out can move in the predetermined area | region of a guide surface in the state which hold | maintained the board | substrate P. As shown in FIG.

The moving mechanism main body 55 is comprised in the same structure as the said moving mechanism main bodies 35 and 45, and can move in an XY plane on a guide surface. Moreover, the holding | maintenance part 54 is comprised with the structure similar to the said holding | maintenance parts 34 and 44, and is movable with respect to the movement mechanism main body 55 in the Z axis | shaft, (theta) X, (theta) Y direction. The holding part 54 is movable in six directions of the X-axis, Y-axis, Z-axis, (theta) X, (theta) Y, and (theta) Z direction, holding the board | substrate P. FIG.

Next, the peripheral structure of the plate holder 9 is demonstrated, referring FIG. 3A and FIG. 3B. 3: A is a figure which shows the planar structure of the plate holder 9, and FIG. 3B is a figure which shows the side structure of the plate holder 9. As shown in FIG. As shown to FIG. 3A, the board holder 9 is provided with the board | substrate mounting part 31 in which the board | substrate P is mounted. The upper surface of the substrate placing part 31 is completed so that the substantially holding surface of the plate holder 9 with respect to the board | substrate P may have a favorable flatness. In addition, a plurality of suction holes K1 are formed on the upper surface of the substrate placing part 31 for bringing the substrate P into close contact with the surface. Each suction hole K1 is connected to the vacuum pump which is not shown in figure.

Moreover, the upper surface of the board | substrate mounting part 31 is provided with the gas injection hole K2 which floats and supports the board | substrate P through the gas by spraying gas, such as air, on the lower surface of the board | substrate P. . Each gas injection hole K2 is connected to the gas injection pump which is not shown in figure. In addition, the suction hole K1 and the gas injection hole K2 are arranged in a zigzag shape with each other.

In addition, at the periphery of the plate holder 9, a guide pin 36 for guiding the substrate P at the time of loading the substrate P, and a substrate to the substrate placing portion 31 of the plate holder 9 are provided. The positioning pin 37 which defines the position of P is provided. These guide pins 36 and the positioning pins 37 are movable within the exposure apparatus main body 3 together with the plate holder 9.

The plate holder 9 is equipped with the position detection sensor 19 which detects the relative position of the table 40 for carrying in and the table 50 for carrying out in the side surface part 9a as shown to FIG. 3B. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance with respect to the table 40 for carrying in and the table 50 for carrying out, the table 40 for carrying in, and the table 50 for carrying out. Height detection sensor 19b for detecting the relative height with respect to the " Moreover, the recessed part is formed in the position corresponding to the position detection sensor 19 in the table 40 for carrying in and the table 50 for carrying out, whereby the position detection sensor 19 and the table 40 for carrying in are carried out. And the table 50 for carrying out are prevented from interfering.

Next, the structure of the principal part of the carrying-in part 4 is demonstrated, referring FIG. 4A and 4B. 4: A is a top view which shows the periphery structure of the table 40 for carrying in, and FIG. 4B is a figure which shows the cross section seen from the arrow of A'A of FIG. 4A.

As shown to FIG. 4A and 4B, the carry-in part 4 is provided with the 1st conveyance part 42 which transfers the board | substrate P from the table 40 for carrying in to the plate holder 9. As shown to FIG. The 1st conveyance part 42 contains the guide part 42a and the contact part 42b which abuts on the board | substrate P. As shown in FIG.

On the upper surface of the table 40 for carrying in, the two groove-shaped recessed parts 40a formed along one direction (Y direction shown by the same figure) are formed. The said guide part 42a is formed in this recessed part 40a. The said contact part 42b is attached to the guide part 42a in the state which protruded from the upper surface of the table 40 for carrying in. The contact part 42b is comprised from elastic members, such as rubber | gum, for example, and can reduce the damage to the board | substrate P when it contacts.

Moreover, the upper surface of the table 40 for carrying in is provided with the gas injection hole K3 which floats and supports the board | substrate P through the base | substrate by spraying gas, such as air, on the lower surface of the board | substrate P. . Each gas injection hole K3 is connected to the gas injection pump which is not shown in figure.

Moreover, the suction hole K4 for contact | adhering the board | substrate P along this surface is formed in the upper surface of the table 40 for carrying in. Each suction hole K4 is connected to the vacuum pump which is not shown in figure. The gas injection holes K3 and the suction holes K4 are arranged in a zigzag shape with each other along the Y direction. In addition, the gas injection hole K3 and the suction hole K4 are not limited to such a zigzag arrangement, and may be arrange | positioned in various forms (for example, you may arrange | position alternately along a Y direction). In addition, the gas injection hole K3 and the suction hole K4 are not limited to mutually forming independently, You may use the same hole as gas injection hole K3 and the suction hole K4. In this case, what is necessary is just to connect each hole so that switch with a gas injection pump and a vacuum pump can be suitably switched.

In addition, the through-hole which allows the board | substrate support pin of the up-and-down movement mechanism for carrying out the board | substrate P between the coater developer (not shown) can be inserted into the table 40 for carrying in as mentioned later ( 47) is formed.

Next, the structure of the principal part of the carrying out part 5 is demonstrated, referring FIG. 5A and FIG. 5B. As shown to FIG. 5A and 5B, the carry-out part 5 is provided with the 2nd conveyance part 52 which transfers the board | substrate P from the plate holder 9 to the table 50 for carrying out. The 2nd conveyance part 52 contains the guide part 52a and the adsorption part 52b which adsorbs-holds the board | substrate P. As shown in FIG.

On the upper surface of the table 50 for carrying out, the two groove-shaped recessed parts 50a formed along one direction (Y direction shown by the same figure) are formed. The said guide part 52a is formed in this recessed part 50a. The said adsorption | suction part 52b is attached to the guide part 52a in the state which protruded from the upper surface of the table 50 for carrying out. The adsorption | suction part 52b contains the vacuum adsorption pad which adsorbs and hold | maintains the board | substrate P, for example by vacuum adsorption.

In addition, the adsorption part 52b is provided with the contact part 58 which abuts on the board | substrate P extruded from the plate holder 9 at the time of carrying out a board | substrate. This contact part 58 is comprised from elastic members, such as rubber | gum, for example.

Moreover, the upper surface of the table 50 for carrying out is provided with the gas injection hole K5 which floats and supports the board | substrate P through the gas by spraying gas, such as air, on the lower surface of the board | substrate P. . Each gas injection hole K5 is connected to the gas injection pump which is not shown in figure.

Further, a plurality of suction holes K6 are formed on the upper surface of the table 50 for carrying out to bring the substrate P into close contact with the surface. Each suction hole K6 is connected to the vacuum pump which is not shown in figure. In addition, the gas injection holes K5 and the suction holes K6 are arranged in a zigzag shape with each other.

In addition, through-out hole which allows the board | substrate support pin of the up-and-down movement mechanism for carrying out the board | substrate P between the coater developer (not shown) can be inserted into the table 50 for carrying out as mentioned later ( 57) is formed.

Next, operation | movement of the exposure apparatus 1 is demonstrated, referring FIGS. 6-15. Specifically, the transfer operation of the board | substrate P between the loading part 4 and the plate holder 9, and of the board | substrate P between the plate holder 9 and the carrying out part 5 is carried out. Explain mainly sorghum operation. In addition, in this embodiment, the table 40 for carrying in of the loading part 4 and the table 50 for carrying out of the carrying out part 5 are arrange | positioned in the different position in the same horizontal plane. That is, the table 40 for carrying in and the table 50 for carrying out are arrange | positioned in the position which does not overlap mutually in the state seen from the plane (state seen from the + Z direction shown in FIG. 2).

First, the board | substrate P with which the photosensitive agent was apply | coated to the carrying-in part 4 in the coater developer (not shown) is carried in. At this time, the vertical movement mechanism 49 located below the table 40 for carrying in arrange | positions the board | substrate support pin 49a above the table 40 for carrying in via the through-hole 47. As shown in FIG. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 49a as shown in FIG. 6. The arm part 48 retracts from the carrying-in part 4 after receiving the board | substrate P with the board | substrate support pin 49a by falling. The vertical movement mechanism 49 pulls down the board | substrate support pin 49a which supported the board | substrate P, and the carrying-in operation | movement of the board | substrate P with respect to the loading table 40 is complete | finished. Thereafter, the vacuum pump is driven, so that the substrate P is adsorbed and held on the upper surface of the table 40 for carrying in through the suction hole K4.

Subsequently, as shown in FIG. 7A, the plate holder 9 is moved so as to be close to the table 40 for carrying in of the carry-in part 4. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state in which the plate holder 9 is close in the Y direction. Here, the state where the plate holder 9 and the table 40 for carrying in close proximity means the state separated by the distance which the movement of the board | substrate P performs smoothly at the time of receiving the board | substrate P mentioned later.

Moreover, when arranging the table 40 for carrying in and the plate holder 9, the 2nd moving mechanism 43 can also be driven. In this case, the carrying table 40 and the plate holder 9 can be moved to the delivery position of the board | substrate P for a short time, and the time required for the carrying-in operation of the board | substrate P can be shortened. In this case, the table 50 for carrying out retracts to the position which does not interfere with the table 40 for carrying in.

Moreover, since the board | substrate P is hold | maintained by the upper surface of the table 40 for carrying in through the suction hole K4, the board | substrate P is carried out on the table 40 for carrying in when the 2nd moving mechanism 43 is driven. You can prevent it from moving.

In the present embodiment, as shown in FIG. 7B, when the plate holder 9 and the loading table 40 are brought close to each other, the substrate P is disposed higher than the plate holder 9. That is, the 1st moving mechanism 33 moves the plate holder 9 to the loading table 40 so that the upper surface of the loading table 40 which supports the board | substrate P may be higher than the upper surface of the plate holder 9. Get close. Moreover, the loading table 40 can be raised by the 2nd moving mechanism 43 so that the upper surface of the loading table 40 may become higher than the upper surface of the plate holder 9.

Moreover, the 1st moving mechanism 33 can also be arrange | positioned in the state which contacted the plate holder 9 and the table 40 for carrying in. In this way, the transfer of the board | substrate P between the plate holder 9 and the table 40 for carrying in which are mentioned later can be performed smoothly.

Subsequently, the carry-in table 40 injects gas from the some gas injection hole K3 formed in the upper surface, as shown in FIG. 8, and supports it in the state which floated the board | substrate P through the gas. On the other hand, when receiving the board | substrate P, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface.

The carrying-in part 4 has the board | substrate P floating on the table 40 for carrying in, and as shown in FIG. 9, the contact part 42b is attached to the one end part of the board | substrate P. As shown in FIG. Make contact. The contact part 42b moves the board | substrate P to the plate holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board | substrate P has floated on the table 40 for carrying in, the contact part 42b can slide the board | substrate P to the plate holder 9 side smoothly. In addition, the upper surface of the plate holder 9 is to float and support the board | substrate P as mentioned above. Here, the gas injected from the gas injection holes K3 and K2 may be made to have directivity.

The board | substrate P which slides the upper surface of the table 40 for carrying in by the contact part 42b is smoothly moved to the upper surface of the plate holder 9 as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the plate holder 9, the board | substrate P does not contact the side surface of the plate holder 9, and is smoothly on the plate holder 9 You can move it.

As shown in FIG. 9, the board | substrate P slides in the state in which the position in the X direction is defined in the same figure by the guide pin 36 formed in the periphery of the plate holder 9. As shown in FIG. The contact part 42b moves the board | substrate P until it comes in contact with the positioning pin 37 provided in the downstream side of the board | substrate conveyance direction in the plate holder 9. As shown in FIG. The board | substrate P is prescribed | regulated in the X direction in the figure by the guide pin 36, and is interposed in the positioning pin 37 and the contact part 42b in the Y direction in the figure. The position of is in a prescribed state. The plate holder 9 stops the gas injection from the gas injection hole K2. The board | substrate P is mounted in the state aligned with respect to the board | substrate mounting part 31, as shown in FIG.

However, when placing a board | substrate in a plate holder conventionally, there existed a possibility that the displacement of a board | substrate (position shift | offset from a predetermined mounting position) and deformation | transformation of a board | substrate may occur. As one of the causes of this displacement, for example, it is conceivable that the substrate becomes floating due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is placed. Moreover, as one of the causes which generate | occur | produces a deformation | transformation of a board | substrate, for example, after placing a board | substrate, it can be considered that an airflow is interposed between a board | substrate and a plate holder, and a board | substrate becomes swollen.

On the other hand, in this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as above-mentioned, it is received by the plate holder 9 in a state without a deformation | transformation and a flatness is high. Moreover, since the board | substrate P is mounted to the board | substrate mounting part 31 from the height which was floated and supported, generation | occurrence | production of an airflow or an air layer between the board | substrate P and the board | substrate mounting part 31 is prevented. Therefore, it becomes suppressed that the board | substrate P will be in a swelled state, and it can prevent generation | occurrence | production shift of a board | substrate P and deformation | transformation. Therefore, the board | substrate P can be mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Thereafter, the vacuum pump is driven, so that the substrate P is adsorbed and held on the upper surface of the substrate placing unit 31 through the suction hole K1.

After placing the substrate P on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed to the substrate P mounted on the plate holder 9 via the projection optical system PL.

In the exposure apparatus 1, since the board | substrate P can be mounted favorably on the plate holder 9 as mentioned above, predetermined exposure can be performed at a suitable position on the board | substrate P with high precision, and reliability is possible. This high exposure process can be realized.

In the present embodiment, a coater developer (not shown) is in the middle of performing the exposure treatment on the substrate P, or while transporting the substrate P on which the exposure treatment has been completed to the carrying out portion 5 as described later. The substrate P, after which the photosensitive agent has been applied, can be placed on the loading table 40 of the loading portion 4.

Next, the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure process is demonstrated.

When the exposure process is completed, the plate holder 9 is moved so as to be close to the table 50 for carrying out of the carrying out part 5 as shown in FIG. Specifically, the first moving mechanism 33 is arranged in a state in which the plate holder 9 and the table 50 for carrying out are close to each other along the Y direction. At this time, since the board | substrate P is hold | maintained by suction hole K1, it can prevent that the board | substrate P moves on the board | substrate mounting part 31 at the time of the drive of the 1st movement mechanism 33. As shown in FIG.

Moreover, when arranging the table 50 for carrying out and the plate holder 9, the 3rd moving mechanism 53 can also be driven. In this way, the loading table 40 and the plate holder 9 can be moved to the delivery position of the board | substrate P for a short time, and the time required for the carrying out operation of the board | substrate P can be shortened. In this case, the table 40 for carrying in retracts to the position which does not interfere with the table 50 for carrying out.

In the present embodiment, when the plate holder 9 and the table 50 for carrying out are close to each other, similarly to the case where the plate holder 9 and the table 40 for carrying in with each other are close, they correspond to the transfer destination of the substrate P. FIG. The substrate P is placed higher than the plate holder 9. That is, the 1st moving mechanism 33 moves the plate holder 9 to the table 50 for carrying out so that the upper surface of the plate holder 9 which supports the board | substrate P may become higher than the upper surface of the table 50 for carrying out. Get close. Moreover, the 3rd moving mechanism 53 can also carry out the table 50 for carrying out so that the upper surface of the table 50 for carrying out may become lower than the upper surface of the plate holder 9.

The 1st moving mechanism 33 can also be arrange | positioned in the state which contacted the plate holder 9 and the table 50 for carrying out. In this way, the transfer of the board | substrate P between the plate holder 9 and the table 50 for carrying out which are mentioned later can be performed smoothly.

The plate holder 9 stops the drive of the vacuum pump and releases the suction holding | maintenance with respect to the board | substrate mounting part 31 of the board | substrate P via the suction hole K1. Subsequently, as shown in FIG. 13, the plate holder 9 injects a gas from the some gas injection hole K2 formed in the upper surface of the board | substrate mounting part 31, and floats the board | substrate P through the gas. Support in a state On the other hand, when the carrying out part 5 receives the board | substrate P, it injects gas from several gas injection hole K5 formed in the upper surface of the table 50 for carrying out.

The carrying out part 5 moves the adsorption part 52b of the 2nd conveyance part 52 along the guide part 52a to the side of the board | substrate P which floats on the board | substrate mounting part 31 of the plate holder 9 along the guide part 52a. . The positioning pin 37 presses the edge part of the board | substrate P which floats on the board | substrate mounting part 31 as shown to FIG. 14A. Thereby, the board | substrate P which floats on the board | substrate mounting part 31 slides to the table 50 for carrying out, and contacts the contact part 58 attached to the adsorption | suction part 52b as shown in FIG. 14B. . Thus, by adsorbing the board | substrate P to the contact part 58 side using the positioning pin 37, the suction part 52b is moved to the position which opposes the board | substrate P on the plate holder 9 to the guide part ( There is no need to move along 52a). After the end part of the board | substrate P contacts the contact part 58, the adsorption | suction part 52b adsorbs and hold | maintains the board | substrate P, and is shown in FIG. 14C along the guide part 52a along the guide part 52a. Move along the direction.

At this time, since the board | substrate P is supported in the state which floated on the plate holder 9, the adsorption | suction part 52b can slide the board | substrate P to the table 50 for carrying out smoothly. Moreover, the upper surface of the table 50 for carrying out carries out the floating support of the board | substrate P as mentioned above. Here, the gas injected from the gas injection holes K2 and K5 may be directed.

By the movement of the adsorption | suction part 52b, the board | substrate P which slides the upper surface of the board | substrate mounting part 31 moves to the upper surface of the table 50 for carrying out smoothly. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the table 50 for carrying out, the board | substrate P does not contact the side surface of the table 50 for carrying out, and the table 50 for carrying out smoothly. You can move to the table.

After the movement of the board | substrate P by the adsorption | suction part 52b is complete | finished, the table 50 for carrying out stops the gas injection from the gas injection hole K5, and the board | substrate through the suction hole K6. (P) is adsorbed and held. The carrying out part 5 drives the 3rd moving mechanism 53 in the state which adsorbed-held the board | substrate P, and moves the carrying out table 50 to the carrying out position of the board | substrate P. As shown in FIG.

The exposure apparatus 1 receives the board | substrate P from the plate holder 9 to the carrying out part 5, and then moves the plate holder 9 to the table 40 for carrying in of the carrying in part 4 so that it may approach. And similarly, the board | substrate P is carried out between the table 40 for carrying in and the plate holder 9, and the exposure process can be performed with respect to the board | substrate P mounted on the plate holder 9. As shown in FIG.

In this embodiment, the table for carrying out is carried out while carrying in the following board | substrate P from the carrying-in part 4 to the plate holder 9, or while exposing the next board | substrate P. The substrate P on which the exposure treatment placed on 50) is completed is carried out. At this time, the vertical movement mechanism 60 located below the table 50 for carrying out arrange | positions the board | substrate support pin 60a above the table 50 for carrying out through the through-hole 57. As shown in FIG. Thereby, the board | substrate P is hold | maintained above the table 50 for carrying out by being supported by the board | substrate support pin 60a. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 60a as shown in FIG. 15. Then, the board | substrate P is received by the arm part 48 by lowering the board | substrate support pin 60a. The arm portion 48 moves the substrate P into a coater developer (not shown), and performs development.

In this way, the plate holder 9 is moved in the same horizontal plane (XY plane) with respect to the carrying-in part 4 and the carrying out part 5, and is accessed alternately, so that the plate P of the board | substrate P with respect to the exposure apparatus main body 3 may be made. The carry-out operation can be performed. In this embodiment, since the plate holder 9 is moved along the arrangement direction of the carry-in part 4 and the carry-out part 5, the plate holder 9, the carry-in part 4, and the carry-out part 5 are moved. Arrangement in the proximity or contact state can be performed in a short time. Therefore, the processing time (so-called tact) accompanying the carrying-out operation | movement of the board | substrate P can be shortened.

According to this embodiment, since it can convey to the plate holder 9 from the carrying-in part 4 by sliding the floating support board | substrate P, the airflow between a board | substrate P and the board | substrate mounting part 31 The formation of the air layer can be prevented, and the occurrence of displacement and deformation of the substrate P can be prevented. Therefore, highly reliable exposure process can be performed.

Moreover, in 1st Embodiment, when conveying the board | substrate P from the table 40 for carrying in to the plate holder 9, you may make it incline the upper surface of the table 40 for carrying in. Specifically, the holding part 44 of the 2nd moving mechanism 43 raises the upper surface of the loading table 40 which supports the board | substrate P in the state which floated by the gas injection from the gas injection hole K3. , Incline toward the plate holder 9 side (θY direction). Thereby, the board | substrate P can be moved to the plate holder 9 side using the self weight of the board | substrate P. As shown in FIG.

Moreover, when conveying the board | substrate P from the plate holder 9 to the table 50 for carrying out, you may make it incline the upper surface of the plate holder 9. Specifically, the holding part 34 of the 1st moving mechanism 33 carries out the upper surface of the plate holder 9 which supports the board | substrate P in the state which floated by the gas injection from the gas injection hole K2. Incline toward the table 50 side (θY direction). Thereby, using the own weight of the board | substrate P, the board | substrate P can be moved to the table 50 for carrying out.

(2nd embodiment)

Then, the structure concerning 2nd Embodiment of this invention is demonstrated. In addition, in this embodiment, the same code | symbol is attached | subjected about the element same as the component of 1st Embodiment, and the description is abbreviate | omitted. 2nd Embodiment differs from 1st Embodiment in the structure of the 1st conveyance part 149 in the carrying-in part 104. FIG.

16A and 16B are views showing the configuration of the carry-in part 104 according to the present embodiment, and FIG. 16A is a view showing the planar configuration of the carry-in part 104, and FIG. 16B is a view of FIG. 16A of the carry-in part 104. It is a figure which shows the side cross section as seen from the AA line arrow.

The 1st conveyance part 149 of the carrying-in part 104 which concerns on this embodiment is a roller mechanism 148 instead of the structure which floats and supports by spraying gas to one surface of the board | substrate P, as shown to FIG. 16A and 16B. Has

On one end side of the table 140 for carrying in, as shown to FIG. 16A, the some notch 141 is formed. Each of the notches 141 is rotatably supported by a shaft 143 constituting the roller mechanism 148, and the roller 142 can be rotated by a drive mechanism (not shown). have. As shown in FIG. 16B, the roller mechanism 148 is configured such that the roller 142 is able to contact or be separated from the substrate P.

Based on such a structure, the roller mechanism 148 rotates in the predetermined direction, contacting the lower surface of the board | substrate P supported on the loading table 140, and the board | substrate P, and the board | substrate P ) Can be moved to the plate holder 9 side. As a forming material of the roller 142, elastic members, such as rubber | gum, which generate | occur | produce a big friction force with the board | substrate P, for example can be used. By constituting the roller 142 using such an elastic member, damage to the substrate P (scratches, etc.) can be prevented. Moreover, only the said suction hole K4 is formed in the upper surface of the table 140 for carrying in.

Next, operation | movement of the exposure apparatus 1 in this embodiment is demonstrated. Specifically, the transfer operation of the board | substrate P between the loading part 104 and the plate holder 9 different from 1st Embodiment is demonstrated.

First, the board | substrate P which apply | coated the photosensitive agent in the coater developer (not shown) is carried in to the carrying in part 104. FIG. The board | substrate P is adsorbed-held by the upper surface of the table 140 for carrying in via the suction hole K4. Thereafter, the plate holder 9 is moved so as to be close to the table 140 for carrying in (refer FIG. 7A).

Also in this embodiment, it is preferable to bring the plate holder 9 close to the loading table 140 so that the upper surface of the loading table 140 holding the board | substrate P may become higher than the upper surface of the plate holder 9. (See FIG. 7B).

However, in this embodiment, even if the upper surface of the table 140 for carrying in is lower than the upper surface of the plate holder 9, if at least the upper surface of the roller 142 is higher than the upper surface of the plate holder 9, the roller 142 may be carried out. The board | substrate P lifted up can be reliably conveyed from the table 40 for carrying in to the plate holder 9 side.

Subsequently, the loading table 140 makes the roller 142 of the roller mechanism 148 abut the lower surface of the board | substrate P, as shown in FIG. 17, and rotates it in a predetermined direction. On the other hand, when receiving the board | substrate P, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface. The substrate P smoothly slides toward the plate holder 9 side by the frictional force with the roller 142.

Here, in the plate holder 9 which is the conveyance destination of the board | substrate P, the board | substrate P is floating-supported on the board | substrate mounting part 31 by gas injecting from the gas injection hole K2.

Therefore, the board | substrate P which slides the upper surface of the table 140 for carrying in by the roller mechanism 148 moves to the upper surface of the plate holder 9 smoothly.

As shown in FIG. 18, the board | substrate P slides in the state in which the position in the X direction is defined in the figure by the guide pin 36 formed in the periphery of the plate holder 9. As shown in FIG. The roller mechanism 148 moves the board | substrate P until it contacts the positioning pin 37 provided in the downstream of the board | substrate conveyance direction in the plate holder 9. The board | substrate P is prescribed | regulated in the X direction in the figure by the guide pin 36, and is interposed in the positioning pin 37 and the contact part 42b in the Y direction in the figure. The position of is in a prescribed state. The plate holder 9 stops the gas injection from the gas injection hole K3. Thereby, the board | substrate P is mounted in the state aligned with respect to the board | substrate mounting part 31. As shown in FIG.

Also in this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as mentioned above, it can pass to the plate holder 9 without deformation | transformation, and the plane is high, and the board | substrate P The generation of an air stream or an air layer between the substrate placing unit 31 and the substrate placing unit 31 is prevented. Therefore, the board | substrate P can be mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Therefore, predetermined exposure can be performed with high precision at the appropriate position on the board | substrate P, and high-exposure exposure process can be performed.

In addition, since the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate | omitted.

In the above description, the case where the roller mechanism 148 is employed as the first transfer portion 149 of the carry-in portion 104 will be described. A roller mechanism may be employed as the second transfer portion 52 of the carry-out portion 5. It may be. Moreover, the structure which floats and supports the board | substrate P by gas injection can also be employ | adopted in the loading table 140 similarly to 1st Embodiment. According to this structure, since the board | substrate P is conveyed by the roller mechanism 148 in the state which floated, the board | substrate P can be conveyed to the plate holder 9 side smoothly.

(Third embodiment)

Then, the structure concerning 3rd Embodiment of this invention is demonstrated. In addition, in this embodiment, the same code | symbol is attached | subjected about the element same as the component of 1st, 2nd embodiment, and the description is abbreviate | omitted. The third embodiment mainly differs in that the plate holder 9 includes the first transfer mechanism.

19 is a diagram illustrating a configuration of a plate holder 109 according to the present embodiment. The plate holder 109 which concerns on this embodiment is equipped with the 1st conveyance part 249 which conveys the board | substrate P from the table 40 for carrying in to the plate holder 9, as shown in FIG. This 1st conveyance part 249 includes the adsorption | suction part 250 which adsorbs-holds both sides in the width direction of the board | substrate P. As shown in FIG. This adsorption part 250 is able to move freely in the XY plane along the surface direction of the board | substrate P. As shown in FIG.

Moreover, in this embodiment, the position detection sensor 252 for detecting the position with respect to the board | substrate mounting part 31 of the board | substrate P carried in by the 1st feed part 249 to the periphery of the plate holder 9 is formed. It is. As this position detection sensor 252, a potentiometer can be illustrated, for example, and this invention can use either a contact type or a non-contact type meter.

The adsorption | suction part 250 adsorb | sucks and hold | maintains the edge part of the board | substrate P floatingly supported on the loading table 40 by gas injection from the gas injection hole K3, and as shown in FIG. 20A, the loading table ( 40 is conveyed to the plate holder 9 side. On the other hand, when receiving the board | substrate P, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may be made to have directivity.

The adsorption | suction part 250 contacts the position detection sensor 252 with the edge part of the board | substrate P, as shown in FIG. 20B, and the exposure apparatus 1 with respect to the board | substrate mounting part 31 in the board | substrate P is carried out. Position shift can be detected. Moreover, the adsorption | suction part 250 is comprised so that it may drive based on the detection result of the said position detection sensor 252.

Therefore, the exposure apparatus 1 can correct the position with respect to the board | substrate mounting part 31 of the board | substrate P hold | maintained by the adsorption | suction part 250 based on the detection result of the position detection sensor 252.

Also in this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as mentioned above, it can pass to the plate holder 9 without deformation | transformation, and the plane is high, and the board | substrate P The generation of an air stream or an air layer between the substrate placing unit 31 and the substrate placing unit 31 is prevented. Therefore, the board | substrate P can be mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Therefore, predetermined exposure can be performed with high precision at the appropriate position on the board | substrate P, and high-exposure exposure process can be performed.

In addition, since the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate | omitted.

(4th Embodiment)

Subsequently, a configuration according to a fourth embodiment of the present invention will be described. In addition, in this embodiment, the same code | symbol is attached | subjected about the element same as the component of 1st Embodiment, and the description is abbreviate | omitted. As shown in FIG. 21, the fourth embodiment mainly differs from the first embodiment in that the table 40 for carrying in and the table 50 for carrying out are disposed at positions overlapping each other in a state viewed from a plane. That is, when carrying out the board | substrate P between the plate holder 9, the table 40 for carrying in and the table 50 for carrying out are made to perform the up-down operation | movement with respect to the plate holder 9. As shown in FIG.

Hereinafter, the transfer operation of the substrate P in the present embodiment will be described with reference to FIGS. 22A, 22B, and 22C.

After the exposure process with respect to the board | substrate P mounted on the plate holder 9 is complete | finished, the table 50 for carrying out is arrange | positioned in the state adjacent to the plate holder 9 along the Y direction. In this embodiment, as shown to FIG. 22A, the carrying-out table 50 waiting below with respect to the plate holder 9 is raised to the position which can receive the board | substrate P. As shown in FIG. At this time, the upper surface of the table 50 for carrying out can also be arrange | positioned lower than the upper surface of the plate holder 9 (refer FIG. 13).

In addition, while the exposure process with respect to the board | substrate P is being performed, the following board | substrate P is received in the table 40 for carrying in from a coater developer (not shown). Thereby, while the carrying-out table 40 carries out the board | substrate P from the plate holder 9 to the table 50 for carrying out, the upper side of the plate holder 9 in the state which mounted the next board | substrate P was mounted. Waiting in

The plate holder 9 stops the drive of the vacuum pump and releases the suction holding | maintenance with respect to the board | substrate mounting part 31 of the board | substrate P via the suction hole K1. Subsequently, the plate holder 9 injects gas from the gas injection hole K2 and supports the substrate P in a state where the substrate P is floated through the gas (see FIGS. 14A to 14C). On the other hand, when the carrying out part 5 receives the board | substrate P, it injects gas from several gas injection hole K5 formed in the upper surface of the table 50 for carrying out. At this time, the gas injected from the gas injection holes K2 and K5 may be made to have directivity.

As shown in FIG. 22B, the carrying out part 5 moves the board | substrate P hold | maintained by the adsorption part 52b along the Y direction in the same figure like 1st Embodiment. At this time, since the board | substrate P is supported in the state which floated on the plate holder 9, the board | substrate P slides smoothly on the table 50 for carrying out. Moreover, the upper surface of the table 50 for carrying out carries out the floating support of the board | substrate P as mentioned above. Therefore, the board | substrate P moves to the upper surface of the table 50 for carrying out smoothly.

After the movement of the board | substrate P is complete | finished, the table 50 for carrying out stops gas injection from the gas injection hole K5, and adsorb | sucks and hold | maintains the board | substrate P via the suction hole K6. . The table 50 for carrying out moves the board | substrate P below as shown in FIG. 22C in the state which adsorbed-held the board | substrate P. FIG. In addition, when the size of the board | substrate P is large and it is mounted in the state pushed out from the upper surface of the table 50 for carrying out, the table P for carrying out interferes with the plate holder 9 by the board | substrate P. The lowering operation is performed while retracting in the + Y direction in the figure separated from the plate holder 9 so as not to.

On the other hand, while the table 50 for carrying out starts a lowering operation, as shown in FIG. 22C, the table 40 for carrying in waiting above the plate holder 9 has the board | substrate ( P) is lowered to the position where it is possible. Thereby, the plate holder 9 and the table 40 for carrying in are arrange | positioned in the state which adjoined along the Y direction. At this time, the upper surface of the table 40 for carrying in may be arrange | positioned lower than the upper surface of the plate holder 9 (refer FIG. 8).

The table 40 for carrying in injects gas from the some gas injection hole K3 formed in the upper surface, and supports it in the state which floated the board | substrate P through the gas. On the other hand, when receiving the board | substrate P, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may be made to have directivity.

The carry-in part 4 makes the contact part 42b abut one end of the board | substrate P, in the state which floated and supported the board | substrate P on the table 40 for carrying in. The contact part 42b moves the board | substrate P to the plate holder 9 side by moving along the guide part 42a in the recessed part 40a (refer FIG. 9, 10).

Since the board | substrate P is in the state which floated on the table 40 for carrying in, it slides smoothly to the plate holder 9 side. Moreover, since the upper surface of the plate holder 9 is to support the board | substrate P as mentioned above, the board | substrate P moves from the table 40 for carrying in to the plate holder 9 as shown in FIG. 22D. It will move smoothly.

The board | substrate P can be mounted in the state aligned with the board | substrate mounting part 31 at the predetermined position by the guide pin 36 and the positioning pin 37 similarly to 1st Embodiment (FIG. 9). And the exposure process is performed with respect to the board | substrate P.

In this embodiment, while carrying in the board | substrate P from the carrying-in part 4 to the plate holder 9, or during the exposure process with respect to the board | substrate P, the exposure process mounted on the table 50 for carrying out is completed. The board | substrate P is carried out.

In this embodiment, the board | substrate with respect to the exposure apparatus main body 3 is moved in this way by carrying out the carrying-in part 4 and the carrying out part 5 in the height direction (Z direction) with respect to the plate holder 9 alternately. The carry-out operation of (P) can be performed. Moreover, the carry-in part 4 and the carry-out part 5 are waiting above the plate holder 9 at the time of non-use, and since each can operate up and down, it can access the plate holder 9, The board | substrate P The processing time (so-called tact) associated with the carry-in and out operations of can be shortened.

Moreover, in embodiment mentioned above, the 1st direction in which the table 40 for carrying in and the plate holder 9 are arrange | positioned, and the 2nd direction in which the table 50 for carrying out and the plate holder 9 are arranged become parallel. Although the case was demonstrated, this invention is not limited to this, The invention is applicable also when the said 1st direction and the 2nd direction become a different direction (for example, orthogonal).

(5th Embodiment)

Then, the structure concerning 5th Embodiment of this invention is demonstrated. In addition, in this embodiment, the same code | symbol is attached | subjected about the element same as the component of 1st Embodiment, and the description is abbreviate | omitted. The fifth embodiment mainly differs in that it has a carrying in / out part which functions as a carrying part or a carrying out part.

FIG. 23 is a perspective view showing a configuration inside the chamber, and FIGS. 24A and 24B are plan views showing a schematic configuration of the carrying in / out portion 400.

As shown in FIG. 23, the carrying in / out part 400 is equipped with the board | substrate mounting table 401, and the moving mechanism 402 which moves the board | substrate mounting table 401. As shown in FIG. In addition, the movement mechanism 402 is comprised in the same structure as the 1st, 2nd movement mechanisms 33 and 43 of 1st Embodiment. Based on such a structure, the board | substrate mounting table 401 is movable in the predetermined area | region of the guide surface in the light emission side (image surface side of the projection optical system PL) in the state which hold | maintained the board | substrate P. It is. In addition, the substrate placing table 401 is movable along the Z axis direction. Therefore, the substrate placing table 401 functions as a table for carrying in and a table for carrying out.

As shown to FIG. 24A and 24B, the carrying in / out part 400 is equipped with the conveyance part 405 which conveys the board | substrate P from the board | substrate mounting table 401 to the plate holder 9. As shown to FIG. The transfer part 405 includes a guide part 406 and an adsorption part 408 which is adsorbed and held on the substrate P. As shown in FIG.

On the upper surface of the substrate placing table 401, two groove-like recesses 401a formed along one direction (Y direction shown in the same drawing) are formed. The said guide part 406 is formed in this recessed part 401a. The said adsorption part 408 is attached to the guide part 406 in the state which protruded from the upper surface of the board | substrate mounting table 401. As shown in FIG. The adsorption part 408 contains the vacuum adsorption pad which adsorbs and hold | maintains the board | substrate P by vacuum adsorption, for example.

Moreover, the upper surface of the board | substrate mounting table 401 is provided with the gas injection hole K7 which floats and supports the board | substrate P through the gas by spraying gas, such as air, on the lower surface of the board | substrate P. . Each gas injection hole K7 is connected to the gas injection pump which is not shown in figure. Moreover, the suction hole K8 for contact | adhering the board | substrate P along this surface is provided in the upper surface of the board | substrate mounting table 401 in multiple numbers. Each suction hole K8 is connected to the vacuum pump which is not shown in figure. In addition, the gas injection holes K7 and the suction holes K8 are arranged in a zigzag shape with each other.

The substrate mounting table 401 has a through hole for allowing the substrate support pin of the vertical movement mechanism for passing the substrate P to and from the coater developer (not shown) as described later. 407 is formed.

The plate holder 9 is provided with the said position detection sensor 19 which detects the relative position with the board | substrate mounting table 401 in the side part similarly to embodiment mentioned above. The position detection sensor 19 includes a distance detecting sensor 19a for detecting a relative distance to the substrate placing table 401, and a height detecting sensor 19b for detecting a relative height with respect to the substrate placing table 401. ) (See FIG. 3B).

Next, the transfer operation of the board | substrate P between the carrying-in / out part 400 and the plate holder 9 is demonstrated, referring drawings. First, the board | substrate P with which the photosensitizer was apply | coated to the carry-in / out part 400 in a coater developer (not shown) is carried in. At this time, the vertical movement mechanism 409 located below the substrate placing table 401 arranges the substrate support pin 410 above the substrate placing table 401 via the through hole 407. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 410 as shown in FIG. 25. The arm part 48 receives the board | substrate P to the board | substrate support pin 410 by descending, and then retracts from the carrying-in / out part 400. The vertical movement mechanism 409 lowers the board | substrate support pin 410 which supported the board | substrate P, and the carrying-in operation | movement of the board | substrate P with respect to the board | substrate mounting table 401 is complete | finished. Thereafter, the vacuum pump is driven, so that the substrate P is adsorbed and held through the suction hole K8 on the upper surface of the substrate placing table 401.

Subsequently, the plate holder 9 is moved to approach the substrate placing table 401 of the carrying in / out portion 400. In addition, when arranging the board | substrate mounting table 401 and the plate holder 9, by driving the conveyance part 405, the board | substrate mounting table 401 and the plate holder 9 are carried out in the delivery position of the board | substrate P in a short time. By moving, the time required for the carrying-in operation of the board | substrate P may be shortened. In this case, since the board | substrate P is attracted and held by the upper surface of the board | substrate mounting table 401 via the suction hole K8, the board | substrate P moves on the board | substrate mounting table 401 at the time of the drive of the conveyance part 405. Discarding is prevented.

In this embodiment, as shown in FIG. 26, the plate holder 9 has the board | substrate mounting table 401 so that the upper surface of the board | substrate mounting table 401 which supports the board | substrate P may become higher than the upper surface of the plate holder 9. Close to In addition, by arranging the plate holder 9 and the substrate placing table 401 in contact with each other, the transfer distance of the substrate P may be shortened so that the transfer may be carried out more smoothly.

Subsequently, the substrate placing table 401 injects gas from the plurality of gas injection holes K7 formed in the upper surface as shown in FIG. 26, and supports the substrate P in a state where the substrate P is floated. On the other hand, when receiving the board | substrate P, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface. At this time, the gas injected from the gas injection holes K2 and K7 may be made to have directivity.

The carrying-in / out part 400 adsorb | sucks and hold | maintains one end part of the board | substrate P by the adsorption part 408 in the state which floated and supported the board | substrate P on the board | substrate mounting table 401. The adsorption part 408 moves the board | substrate P to the plate holder 9 side by moving along the guide part 406 in the recessed part 401a (refer FIG. 24A and 24B).

Since the board | substrate P is in the state which floated on the board | substrate mounting table 401, the adsorption | suction part 408 can slide the board | substrate P to the plate holder 9 side smoothly. In addition, the upper surface of the plate holder 9 is configured to float and support the substrate P as described above.

Therefore, the board | substrate P which slides the upper surface of the board | substrate mounting table 401 by the adsorption part 408 moves to the upper surface of the plate holder 9 smoothly. In this embodiment, as shown in FIG. 26, since the upper surface of the board | substrate mounting table 401 is higher than the upper surface of the plate holder 9, the board | substrate P does not contact the side surface of the plate holder 9, and smoothly plate It can be moved onto the holder 9.

The board | substrate P comes into contact with the board | substrate mounting part 31 in the predetermined position by abutting with the guide pin 36 and the positioning pin 37 formed in the periphery of the plate holder 9. (See Figure 9).

Also in this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as mentioned above, airflow and an air layer are prevented between the board | substrate P and the board | substrate mounting part 31, and a board | substrate is prevented. It is possible to prevent the placement and deformation of (P). Therefore, the board | substrate P can be mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Thereafter, the vacuum pump is driven, so that the substrate P is adsorbed and held through the suction hole K1 on the upper surface of the substrate placing unit 31. And after mounting the board | substrate P to the plate holder 9, it exposes to the board | substrate P.

When the exposure process is completed, the plate holder 9 is moved to approach the substrate placing table 401 of the carrying in / out portion 400. In this embodiment, the plate holder 9 and the substrate placing table 401 are close to each other so that the upper surface of the plate holder 9 is higher than the upper surface of the substrate placing table 401.

Moreover, when arranging the board | substrate mounting table 401 and the plate holder 9, by moving the board | substrate mounting table 401, the time required for the carrying out operation | movement of the board | substrate P can be shortened. Moreover, it can also arrange | position in the state which contacted the plate holder 9 and the board | substrate mounting table 401. In such a case, no gap is formed between the plate holder 9 and the substrate placing table 401, so that the transfer of the substrate P can be performed smoothly.

The plate holder 9 stops the drive of the vacuum pump and releases the suction holding | maintenance with respect to the board | substrate mounting part 31 of the board | substrate P via the suction hole K1. Subsequently, as shown in FIG. 27, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface of the board | substrate mounting part 31, and floats the board | substrate P through the gas. Support in state. On the other hand, when the carrying out part 5 receives the board | substrate P, it injects gas from several gas injection hole K7 formed in the upper surface of the board | substrate mounting table 401. At this time, the gas injected from the gas injection holes K2 and K7 may be made to have directivity.

The carrying in / out part 400 moves the adsorption part 408 of the transfer part 405 along the guide part 406 to the side of the board | substrate P which is floated and supported on the board | substrate mounting part 31 of the plate holder 9. As shown in FIG. The adsorption part 408 adsorb | sucks and hold | maintains the board | substrate P, and moves the board | substrate P along the + Y direction in the same figure (refer FIG. 24A and 24B).

At this time, since the board | substrate P is supported in the state which floated on the plate holder 9, the adsorption | suction part 408 can slide the board | substrate P to the board | substrate mounting table 401 side smoothly. Moreover, the upper surface of the board | substrate mounting table 401 is made to float and support the board | substrate P as mentioned above.

Therefore, the board | substrate P which slides the upper surface of the board | substrate mounting part 31 moves to the upper surface of the board | substrate mounting table 401 smoothly. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the substrate placing table 401, the substrate P does not contact the side surface of the substrate placing table 401, and the substrate placing table 401 is smooth. You can move to the table.

After the movement of the board | substrate P by the adsorption part 408 is complete | finished, the board | substrate mounting table 401 stops the gas injection from the gas injection hole K7, and the board | substrate through the suction hole K8. (P) is adsorbed and held. The carrying in / out part 400 drives the conveyance part 405 in the state which adsorbed-held the board | substrate P, and moves the board | substrate mounting table 401 to the carrying out position of the board | substrate P. As shown in FIG.

Subsequently, the board | substrate P with which the exposure process mounted to the board | substrate mounting table 401 is completed is carried out. At this time, the vertical movement mechanism 409 located below the substrate placing table 401 arranges the substrate support pin 410 above the substrate placing table 401 via the through hole 407. Thereby, the board | substrate P is supported by the board | substrate support pin 410, and is hold | maintained above the board | substrate mounting table 401 (refer FIG. 25). Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 410, and the substrate P is placed on the arm portion 48 by lowering the substrate support pins 410. It is handed down. The arm portion 48 moves the substrate P into a coater developer (not shown), and performs development.

According to this embodiment, since it can convey to the plate holder 9 from the carrying-in / out part 400 by sliding the floating support board | substrate P, the air flow or an air layer between the board | substrate P and the board | substrate mounting part 31 is carried out. This generation can be prevented and the occurrence of displacement and deformation of the substrate P can be prevented. Therefore, highly reliable exposure process can be performed. Moreover, since the carry-in / out part 400 also serves as the carrying-in part 4 and the carrying out part 5 in the said 1st-3rd embodiment, an apparatus structure can be simplified.

In addition, in 5th Embodiment, when conveying the board | substrate P from the board | substrate mounting table 401 to the plate holder 9, you may make it incline the upper surface of the board | substrate mounting table 401. Specifically, the moving mechanism 402 moves the upper surface of the substrate placing table 401 which supports the substrate P in a state floating by gas injection from the gas injection hole K7 to the plate holder 9 side (θY). Direction). Thereby, the board | substrate P can be moved to the plate holder 9 side using the weight of the board | substrate P.

Moreover, when conveying the board | substrate P from the plate holder 9 to the board | substrate mounting table 401, you may make it incline the upper surface of the plate holder 9. Specifically, the first moving mechanism 33 (holding portion 34) is provided with the upper surface of the plate holder 9 for supporting the substrate P in a state of being floated by the gas injection from the gas injection hole K2. It is inclined toward the mounting table 401 side (θY direction). Thereby, the board | substrate P can be moved to the board | substrate mounting table 401 side using the weight of the board | substrate P.

In addition, in this embodiment, the roller mechanism 148 as shown in 2nd Embodiment can also be employ | adopted as the conveyance part 405. FIG. As the transfer section 405, as shown in the third embodiment, an adsorption section 408 constituting the transfer section 405 may be formed on the plate holder 9 side.

(6th Embodiment)

Next, the structure concerning 6th Embodiment of this invention is demonstrated. In addition, in the following description, the same code | symbol is attached | subjected about the element which is the same as or equivalent to the component of embodiment mentioned above, and the description is abbreviate | omitted or abbreviate | omitted.

FIG. 28 is a sectional plan view showing a schematic configuration of an exposure apparatus of the present embodiment, and FIG. 29 is a perspective view illustrating an outline of an apparatus configuration in a chamber.

As in the above-described embodiment, the exposure apparatus 1 is provided with the exposure apparatus main body 3 and the carrying-in part 4 as shown in FIG. Moreover, in this embodiment, the exposure apparatus 1 is equipped with the carrying out robot 205. As shown in FIG. These are contained in the chamber 2 which is highly cleaned and adjusted to a predetermined temperature.

As shown in FIG. 29, the carrying out robot 205 has a horizontal articulated structure, for example, the arm part 10 which consists of a plurality of parts connected via the vertical joint axis, and the tip of this arm part 10 is shown. And a fork portion 12 and a drive device 13 connected thereto. The arm part 10 is movable by the drive apparatus 13 in an up-down direction (Z-axis direction), for example. The drive of the drive apparatus 13 is controlled by the control apparatus which is not shown in figure. As a result, the carrying out robot 205 receives the substrate P from the plate holder 9. In addition, the carrying out robot 205 is not limited to the robot of a horizontal articulated structure, It can implement | achieve by employ | adopting or combining a well-known robot (generally a conveyance mechanism) suitably.

FIG. 30A is a diagram illustrating a planar configuration of the plate holder 9, and FIG. 30B is a diagram illustrating a side configuration of the plate holder 9. In this embodiment, as shown to FIG. 30A, the board holder 9 is provided with the board | substrate mounting part 31 in which the board | substrate P is mounted.

Moreover, in this embodiment, the plate holder 9 is provided with the groove part 30 for accommodating the fork part 12 of the unloading robot 205 at the time of carrying out the board | substrate P. As shown in FIG. This groove portion 30 is formed along the moving direction of the fork portion 12 (Y direction in the drawing). Regions other than the groove part 30 in the upper surface of the plate holder 9 comprise the said board | substrate mounting part 31. As shown in FIG.

In addition, the thickness of the fork portion 12 is smaller than the depth of the groove portion 30. Thereby, after receiving the fork part 12 in the groove part 30 so that it may mention later, the board | substrate P mounted on the board | substrate mounting part 31 will be received by the fork part 12, and will be mounted. .

3B, the plate holder 9 is equipped with the position detection sensor 19 which detects the relative position with the table 40 for carrying in in the side surface part 9a as shown in FIG. The position detection sensor 19 includes a distance detecting sensor 19a for detecting a relative distance to the table 40 for carrying in, and a height detecting sensor 19b for detecting a relative height for the table 40 for carrying in. ) Moreover, the recessed part is formed in the position corresponding to the position detection sensor 19 in the loading table 40, and it prevents the position detection sensor 19 and the loading table 40 from interfering. .

Next, operation | movement of the exposure apparatus 1 in this embodiment is demonstrated, referring FIGS. 6, 11, 31A-34. Specifically, the transfer operation of the board | substrate P between the carrying-in part 4 and the plate holder 9, and of the board | substrate P between the plate holder 9 and the carrying out robot 205 is carried out. Explain mainly sorghum operation

First, the board | substrate P with which the photosensitive agent was apply | coated to the carrying-in part 4 in the coater developer (not shown) is carried in. At this time, the vertical movement mechanism 49 located below the table 40 for carrying in arrange | positions the board | substrate support pin 49a above the table 40 for carrying in via the through-hole 47. As shown in FIG. Subsequently, the arm portion 48 of the coater developer (not shown) is inserted between the substrate support pins 49a as shown in FIG. 6. The arm part 48 descends from the carrying-in part 4 after receiving the board | substrate P to the board | substrate support pin 49a by falling. The vertical movement mechanism 49 pulls down the board | substrate support pin 49a which supported the board | substrate P, and the carrying-in operation | movement of the board | substrate P with respect to the loading table 40 is complete | finished. Thereafter, the vacuum pump is driven, whereby the substrate P is adsorbed and held on the upper surface of the table 40 for carrying in via the suction hole K4.

Subsequently, as shown in FIG. 31A, the plate holder 9 is moved so as to be close to the table 40 for carrying in of the loading part 4. As shown in FIG. In addition, illustration of a carrying robot is abbreviate | omitted in FIG. 31A and 31B.

Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state in which the plate holder 9 is close in the Y direction. Here, the state where the plate holder 9 and the table 40 for carrying in close proximity means the state separated | separated by the distance which the movement of the board | substrate P runs smoothly at the time of receiving the board | substrate P mentioned later.

Moreover, when arranging the table 40 for carrying in and the plate holder 9, the 2nd moving mechanism 43 can also be driven. In this case, the carrying table 40 and the plate holder 9 can be moved to the delivery position of the board | substrate P for a short time, and the time required for the carrying-in operation of the board | substrate P can be shortened. At this time, since the board | substrate P is attracted and hold | maintained on the upper surface of the table 40 for carrying in via the suction hole K4, the board | substrate P is carried in at the time of the drive of the 2nd movement mechanism 43, and the table 40 for carrying in is possible. You can prevent it from moving.

In the present embodiment, as shown in FIG. 31B, when the plate holder 9 and the table 40 for carrying in close to each other, the substrate P is disposed higher than the plate holder 9. That is, the 1st moving mechanism 33 moves the plate holder 9 to the loading table 40 so that the upper surface of the loading table 40 which supports the board | substrate P may be higher than the upper surface of the plate holder 9. Get close. Moreover, the loading table 40 can be raised by the 2nd moving mechanism 43 so that the upper surface of the loading table 40 may become higher than the upper surface of the plate holder 9.

Moreover, the 1st moving mechanism 33 can also be arrange | positioned in the state which contacted the plate holder 9 and the table 40 for carrying in. In this way, the transfer of the board | substrate P between the plate holder 9 and the table 40 for carrying in which are mentioned later can be performed smoothly.

Subsequently, the carry-in table 40 injects gas from the some gas injection hole K3 formed in the upper surface, as shown in FIG. 32, and supports it in the state which floated the board | substrate P through the gas. On the other hand, when receiving the board | substrate P, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface.

The carry-in part 4 makes the contact part 42b abut the one end part of the board | substrate P, as shown in FIG. 33, in the state which floated and supported the board | substrate P on the table 40 for carrying in. The contact part 42b moves the board | substrate P to the plate holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board | substrate P has floated on the table 40 for carrying in, the contact part 42b can slide the board | substrate P to the plate holder 9 side smoothly. In addition, the upper surface of the plate holder 9 is configured to float and support the substrate P as described above. Here, the gas injected from the gas injection holes K3 and K2 may be directed.

The board | substrate P which slides the upper surface of the table 40 for carrying in by the contact part 42b is moved to the upper surface of the plate holder 9 smoothly, as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the plate holder 9, the board | substrate P does not contact the side surface of the plate holder 9, and is smoothly on the plate holder 9 You can move it.

As shown in FIG. 33, the board | substrate P slides in the state in which the position in the X direction is defined in the figure by the guide pin 36 formed in the periphery of the plate holder 9. As shown in FIG. The contact part 42b moves the board | substrate P until it comes in contact with the positioning pin 37 formed in the downstream of the board | substrate conveyance direction in the plate holder 9. As shown in FIG. The board | substrate P is prescribed | regulated in the X direction in the figure by the guide pin 36, and is interposed in the positioning pin 37 and the contact part 42b in the Y direction in the figure. The position of is in a prescribed state. The plate holder 9 stops the gas injection from the gas injection hole K2. The board | substrate P is mounted in the state aligned with respect to the board | substrate mounting part 31, as shown in FIG.

However, when placing a board | substrate in a plate holder conventionally, there existed a possibility of the displacement of a board | substrate (position shift | offset from a predetermined mounting position), and deformation | transformation of a board | substrate. As one of the causes of this displacement, for example, it is conceivable that the substrate becomes floating by a thin air layer generated between the substrate and the plate holder immediately before the substrate is placed. In addition, as one of the causes of the deformation of the substrate, for example, after placing the substrate, it is conceivable that the substrate is inflated due to an air flow interposed between the substrate and the plate holder.

On the other hand, in this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as above-mentioned, it is received by the plate holder 9 in a state without a deformation | transformation and a flatness is high. Moreover, since the board | substrate P is mounted to the board | substrate mounting part 31 from the height which was floated and supported, generation | occurrence | production of an airflow or an air layer between the board | substrate P and the board | substrate mounting part 31 is prevented. Therefore, it becomes suppressed that the board | substrate P will be in a swelled state, and it can prevent generation | occurrence | production shift of a board | substrate P and deformation | transformation. Therefore, the board | substrate P can be mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Thereafter, the vacuum pump is driven, so that the substrate P is adsorbed and held through the suction hole K1 on the upper surface of the substrate placing unit 31.

After placing the substrate P on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed to the substrate P mounted on the plate holder 9 via the projection optical system PL.

As mentioned above, since the board | substrate P is favorably mounted on the plate holder 9, the exposure apparatus 1 can perform predetermined | prescribed exposure in the high-precision position on the board | substrate P with high precision, and it has high reliability. The exposure process can be realized.

In this embodiment, a coater developer (not shown) is carried out in the middle of performing the exposure process on the substrate P or while the carrying-out robot 205 conveys the substrate P on which the exposure process is completed as described later. The substrate P, after which the photosensitive agent has been applied, can be placed on the loading table 40 of the loading portion 4.

Next, the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure process is demonstrated.

Specifically, the method of carrying out the board | substrate P by the carrying out robot 205 is demonstrated. 35 is a perspective view for explaining the operation of the carrying-out robot 205, FIGS. 36A and 36B are cross-sectional configuration views when viewed from the Y-axis direction when the substrate P is taken out from the plate holder 9, and FIG. 37. Is a side view when the operation | movement which carries out the board | substrate P from the plate holder 9 is seen from the X-axis direction. In addition, only the fork part 12 is shown in FIG. 35, and the whole structure of the carrying-out robot 205 is abbreviate | omitted. In addition, in FIG. 36A and 36B, the illustration of the fork part 12 which supports the board | substrate P is simplified for convenience.

When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, as shown in FIG. 35, the unloading robot 205 inserts the fork portion 12 into the groove portion 30 formed in the plate holder 9 on the side of the -Y direction.

And the drive apparatus 13 makes the fork part 12 abut on the lower surface of the board | substrate P, as shown in FIG. 36A by moving the fork part 12 upwards by predetermined amount. Moreover, as shown in FIG. 36B, the fork part 12 is moved further upwards, and raises the board | substrate P to the upper side of the plate holder 9, and separates it from the board | substrate mounting part 31. FIG.

Moreover, the carrying out robot 205 raises (retracts) the fork part 12 to the height which does not contact the table 40 for carrying in of the loading part 4 which mounted the board | substrate P after the photosensitive agent was apply | coated. . After the fork portion 12 is raised to a position where the substrate P does not contact the substrate P on the loading table 40, the loading table 40 of the loading portion 4 is plate holder 9 as shown in FIG. 37. It moves so that it may approach to and conveys the board | substrate P to the plate holder 9 side as mentioned above.

While the board | substrate P is conveyed from the loading part 4 to the plate holder 9, the carrying out robot 205 moves the board | substrate P mounted in the fork part 12 into a coater developer (not shown). Let's do it. As mentioned above, the carrying out operation | movement of the board | substrate P from the exposure apparatus main body 3 is completed.

Thus, according to this embodiment, since it can convey from the carrying-in part 4 to the plate holder 9 by sliding the floating support board | substrate P, air between the board | substrate P and the board | substrate mounting part 31 is carried out. It is possible to prevent the occurrence of air flow and air layer, and to prevent the displacement and deformation of the substrate P. Therefore, highly reliable exposure process can be performed.

Moreover, in this embodiment, since the board | substrate P is carried in by sliding to the plate holder 9 side from the loading part 4 using gas injection, the tact time is longer compared with the board | substrate loading to the plate holder using the conventional tray. Lose.

On the other hand, in this embodiment, the fork part 12 of the carrying-out robot 205 is inserted into the groove part 30, the board | substrate P is lifted from the lower surface, and the board | substrate P is removed from the plate holder 9 in the state. Since the carrying-in part 4 can carry the next board | substrate P into the plate holder 9, the whole tact time required for carrying out of the board | substrate P with respect to the plate holder 9 using the conventional tray is carried out. It can be roughly equivalent to the case. Therefore, the board | substrate P can be carried in to the plate holder 9 in a favorable state, without increasing the tact time at the time of carrying in / out of the board | substrate P. FIG.

Moreover, when conveying the board | substrate P from the table 40 for carrying in to the plate holder 9 in this embodiment, you may make it incline the upper surface of the table 40 for carrying in. Specifically, the holding part 44 of the 2nd moving mechanism 43 raises the upper surface of the loading table 40 which supports the board | substrate P in the state which floated by the gas injection from the gas injection hole K3. The plate holder 9 is inclined to the side (θY direction). Thereby, the board | substrate P can be moved to the plate holder 9 side using the weight of the board | substrate P.

(7th Embodiment)

Then, the structure concerning 7th Embodiment of this invention is demonstrated. In addition, in this embodiment, the same code | symbol is attached | subjected about the element same as the component of 6th embodiment, and the description is abbreviate | omitted. The 7th embodiment differs from the 6th embodiment in the structure of a carrying-in part.

In this embodiment, the carry-in part 104 is the same as that demonstrated using FIG. 16A and 16B.

In addition, the operation | movement of the exposure apparatus 1 in this embodiment is also the same as that demonstrated using FIG. 17 and FIG.

In this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as mentioned above, it can pass to the plate holder 9 without deformation | transformation, and the plane is high, and the board | substrate P ) And the formation of an air stream or an air layer between the substrate placing part 31 are prevented. Therefore, the board | substrate P can be mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Therefore, predetermined exposure can be performed with high precision at the appropriate position on the board | substrate P, and high-exposure exposure process can be performed.

(8th Embodiment)

Next, the structure concerning 8th Embodiment of this invention is demonstrated. In addition, in this embodiment, the same code | symbol is attached | subjected about the element similar to the component of 6th, 7th embodiment, and the description is abbreviate | omitted. The eighth embodiment is mainly different from the sixth and seventh embodiments in that the plate holder 9 includes a transfer section.

38 is a diagram illustrating a configuration of a plate holder 109 according to the present embodiment. The plate holder 109 which concerns on this embodiment is equipped with the 1st conveyance part 249 which conveys the board | substrate P from the table 40 for carrying in to the plate holder 9, as shown in FIG. This 1st conveyance part 249 includes the adsorption | suction part 250 which adsorbs-holds both sides in the width direction of the board | substrate P. As shown in FIG. This adsorption part 250 is able to move freely in the XY plane along the surface direction of the board | substrate P. As shown in FIG.

Moreover, in this embodiment, the position detection sensor 252 for detecting the position with respect to the board | substrate mounting part 31 of the board | substrate P carried in by the 1st feed part 249 to the periphery of the plate holder 9 is formed. It is. As this position detection sensor 252, a potentiometer can be illustrated, for example, and this invention can use any meter of a contact system or a non-contact system.

The adsorption | suction part 250 adsorb | sucks and hold | maintains the edge part of the board | substrate P floatingly supported on the loading table 40 by the gas injection from the gas injection hole K3, and as shown in FIG. 39A, the loading table ( 40 is conveyed to the plate holder 9 side. On the other hand, when receiving the board | substrate P, the plate holder 9 injects gas from the some gas injection hole K2 formed in the upper surface. At this time, the gas injected from the gas injection holes K2 and K3 may be made to have directivity.

The adsorption | suction part 250 contacts the position detection sensor 252 with the edge part of the board | substrate P, as shown in FIG. 39B, and the exposure apparatus 1 with respect to the board | substrate mounting part 31 in the board | substrate P is carried out. Position shift can be detected. Moreover, the adsorption | suction part 250 is comprised so that it may drive based on the detection result of the said position detection sensor 252.

Therefore, the exposure apparatus 1 can correct the position with respect to the board | substrate mounting part 31 of the board | substrate P hold | maintained by the adsorption | suction part 250 based on the detection result of the position detection sensor 252.

Also in this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as mentioned above, it can pass to the plate holder 9 without deformation | transformation and a high planar view, and the board | substrate P The generation of an air stream or an air layer between the substrate placing unit 31 and the substrate placing unit 31 is prevented. Therefore, the board | substrate P can be mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Therefore, predetermined exposure can be performed with high precision at the appropriate position on the board | substrate P, and high-exposure exposure process can be performed.

In addition, since the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate | omitted.

(Ninth embodiment)

Subsequently, a configuration according to a ninth embodiment of the present invention will be described. In addition, in this embodiment, the same code | symbol is attached | subjected about the element same as the component of 6th-8th embodiment, and the description is abbreviate | omitted. 9th Embodiment mainly differs in the structure of the exposure apparatus main body from 6th-8th embodiment. 40 is a perspective view illustrating a schematic configuration of an exposure apparatus main body 3 according to the present embodiment.

As shown in FIG. 40, the exposure apparatus main body 3 of this embodiment is equipped with the plate holder 9, the board | substrate lift mechanism 150 formed in the plate holder 9, and the 1st moving mechanism 33. As shown in FIG. Doing. The substrate lift mechanism 150 is for lifting the substrate P upward when the substrate P is carried out.

FIG. 41 is a view showing a planar configuration of the plate holder 9, FIGS. 42A and 42B are side cross-sectional views in the plate holder 9, FIG. 42A is a view showing a state before the transfer of the substrate, and FIG. 42B is It is a figure which shows the state after the receipt of a board | substrate.

As shown in FIGS. 41, 42A, and 42B, the lift mechanism 150 includes a plurality of substrate supporting members 151 for supporting the substrate P, and an up and down operating portion for vertically moving the substrate supporting members 151. 152 (refer FIG. 43).

The board | substrate supporting member 151 is the 1st linear member 119 hypothesized about the axial part (up-and-down moving member) 155 in the X direction (1st direction) in FIG. 41, and the Y direction (in FIG. 41). 2nd linear member 120 hypothetically installed in the 2nd direction, and is formed in substantially grid form as a whole. These first linear members 119 and second linear members (second temporary portions) 120 are welded to each other or combined in a lattice form here. Each board | substrate supporting member 151 is hypothesized between the several axial part 155 (for example, six in this embodiment).

Each lattice shape constituting each substrate support member 151 has a plurality of substantially rectangular openings 121 each smaller than the substrate P. As shown in FIG. In addition, the shape of the board | substrate supporting member 151 is not limited to the shape shown in FIG. 41, For example, the single frame-shaped frame in which only the opening part 121 was formed may be sufficient.

In this embodiment, four board | substrate support members 151 are arrange | positioned in the state which provided the clearance gap S along the extension direction (Y direction shown in FIG. 41) of the 2nd linear member 120. As shown in FIG. The gap S between such substrate support members 151 is for constituting a space into which the fork portion 12 is inserted at the time of carrying out the substrate P from the plate holder 9 as described later.

Moreover, as a formation material of the board | substrate support member 151 (1st linear member 119 and the 2nd linear member 120), when the board | substrate support member 151 supported the board | substrate P, It is preferable to use the material which can suppress the curvature by self weight, for example, various synthetic resins or a metal can be used. Specifically, nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, stainless steel, etc. are mentioned. Fiber reinforced plastics include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic).

As illustrated in FIG. 43, the vertical operation unit 152 includes a shaft portion (up and down member) 155, and a drive device 153 for vertically driving the shaft portion 155. The drive device 153 is formed with respect to each shaft part 155, and each shaft part 155 performs an up-down operation independently by this.

Based on this structure, the board | substrate support member 151 is the board | substrate mounting part 31 of the plate holder 9 according to the vertical movement of the up-down operation part 152 (shaft part 155) as shown to FIG. 42A and FIG. 42B. ) Up and down operation.

On the other hand, the recessed part 130 for accommodating the board | substrate support member 151 is formed in the plate holder 9. The recess 130 is formed in a lattice shape corresponding to the frame structure of the substrate support member 151. The area | region (partial mounting part) other than the recessed part 130 in the upper surface of the plate holder 9 comprises the board | substrate mounting part 31 holding the board | substrate P. As shown in FIG.

The thickness of the substrate support member 151 is smaller than the depth of the recess 130. As a result, as shown in FIG. 42B, the substrate supporting member 151 is accommodated in the recess 130 so that only the substrate P placed on the substrate supporting member 151 is received and placed on the substrate placing unit 31. It is.

Moreover, the board | substrate mounting part 31 is completed so that the substantially holding surface of the plate holder 9 with respect to the board | substrate P may have a favorable top view. In addition, the substrate P is sprayed on the substrate holding surface (upper surface) of the substrate placing part 31 by injecting air (gas) during the suction port for bringing the substrate P into close contact with the surface, or at the time of carrying in the substrate described later. The opening part K205 which functions as a gas injection port which floats and supports this surface is formed. The vacuum pump and the gas injection pump which are not shown are respectively connected to the opening part K205, The opening part K205 can be made to function as a suction port or an injection port as mentioned above by switching the drive of these pumps.

A guide pin 36 for guiding the substrate P at the time of loading the substrate P into the peripheral portion of the plate holder 9, and a substrate P with respect to the substrate placing portion 31 of the plate holder 9. A positioning pin 37 is provided which defines the position of () (see FIGS. 44A and 44B). These guide pins 36 and the positioning pins 37 are movable within the exposure apparatus main body 3 together with the plate holder 9.

Next, operation | movement of the exposure apparatus 1 of this embodiment is demonstrated, referring FIGS. 44A-50B. Specifically, the transfer operation of the board | substrate P between the carrying-in part 4 and the plate holder 9, and of the board | substrate P between the plate holder 9 and the carrying out robot 205 is carried out. Explain mainly sorghum operation

First, similarly to 6th Embodiment, the board | substrate P to which the photosensitive agent was apply | coated to the carrying-in part 4 in the coater developer (not shown) is carried in. At this time, the board | substrate P is adsorbed-held by the suction hole K4 on the upper surface of the table 40 for carrying in.

Subsequently, as shown in FIG. 44A, the plate holder 9 is moved so that the table 40 for carrying in of the carrying-in part 4 may be approached. In addition, illustration of a carrying robot is abbreviate | omitted in FIG. 44A and 44B. Specifically, the first moving mechanism 33 arranges the plate holder 9 and the loading table 40 in a state in which the plate holder 9 is close in the Y direction. At this time, by driving the second moving mechanism 43, the loading table 40 and the plate holder 9 are moved to the receiving position of the substrate P for a short time, so that the time required for the loading operation of the substrate P is adjusted. It can be shortened. In addition, since the board | substrate P is attracted and held by the upper surface of the table 40 for carrying in via the suction hole K4, the board | substrate P is carried in at the time of the drive of the 2nd movement mechanism 43, and the table 40 for carrying in is possible. There is no case to move on.

In this embodiment, as shown to FIG. 44B, the 1st moving mechanism 33 has the plate holder 9 so that the upper surface of the table 40 for carrying in which the board | substrate P is supporting may become higher than the upper surface of the plate holder 9. ) Is brought close to the table 40 for carrying in. Moreover, the loading table 40 can be raised by the 2nd moving mechanism 43 so that the upper surface of the loading table 40 may become higher than the upper surface of the plate holder 9. Moreover, the 1st moving mechanism 33 may be arrange | positioned in the state which contacted the plate holder 9 and the table 40 for carrying in, and can carry out the smoothing of the board | substrate P by this.

Subsequently, as shown in FIG. 45, the loading table 40 injects gas from the some gas injection hole K3 formed in the upper surface, and is supported in the state which floated the board | substrate P through the gas. On the other hand, when receiving the board | substrate P, the plate holder 9 drives the gas injection pump which is not shown in figure, and injects air from the opening part K205 formed in the board | substrate mounting part 31. FIG.

The carrying-in part 4 makes the contact part 42b abut the one edge part of the board | substrate P, as shown in FIG. 46, in the state which floated and supported the board | substrate P on the table 40 for carrying in. The contact part 42b moves along the guide part 42a in the recessed part 40a, and moves the board | substrate P to the plate holder 9 side.

Since the board | substrate P has floated on the table 40 for carrying in, the contact part 42b can slide the board | substrate P to the plate holder 9 side smoothly. In addition, the upper surface of the plate holder 9 is to float and support the board | substrate P as mentioned above. Here, you may make it give directivity to the gas injected from the gas injection hole K3 and the opening part K205.

The board | substrate P which slides the upper surface of the table 40 for carrying in by the contact part 42b is moved to the upper surface of the plate holder 9 smoothly, as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the plate holder 9, the board | substrate P does not contact the side surface of the plate holder 9, and is smoothly on the plate holder 9 You can move it.

The board | substrate P is prescribed | regulated in the X direction in the figure by the guide pin 36, and is interposed in the positioning pin 37 and the contact part 42b in the Y direction in the figure. The position of is in a prescribed state. The plate holder 9 stops gas injection from the opening K205. Thereby, the board | substrate P is mounted in the state aligned with respect to the board | substrate mounting part 31. As shown in FIG.

In this embodiment, since the board | substrate P is conveyed in the state which floated by the injection of gas as above-mentioned, it is received by the plate holder 9 in a state without deformation and a high plan view. Moreover, since the board | substrate P is mounted to the board | substrate mounting part 31 from the height which was floated and supported, generation | occurrence | production of an airflow or an air layer between the board | substrate P and the board | substrate mounting part 31 is prevented. Therefore, it becomes suppressed that the board | substrate P will be in a swelled state, and it can prevent generation | occurrence | production shift of a board | substrate P and deformation | transformation. Therefore, the board | substrate P is mounted in the state in which the top view is high in the predetermined position with respect to the plate holder 9. As shown in FIG. Thereafter, the vacuum pump is driven, so that the substrate P is adsorbed and held on the upper surface of the substrate placing portion 31 via the opening portion K205.

After placing the substrate P on the plate holder 9, the mask M is illuminated by the exposure light IL from the illumination system. The pattern of the mask M illuminated by the exposure light IL is projected and exposed on the substrate P mounted on the plate holder 9 via the projection optical system PL.

In the exposure apparatus 1 according to the present embodiment, since the substrate P is placed on the plate holder 9 satisfactorily as described above, the predetermined exposure can be performed at a proper position on the substrate P with high accuracy. Therefore, highly reliable exposure processing can be realized.

Next, the carrying out operation | movement of the board | substrate P from the plate holder 9 after completion | finish of exposure process is demonstrated.

Specifically, the method of carrying out the board | substrate P by the carrying out robot 205 is demonstrated. 48 is a perspective view for explaining the operation of the carrying-out robot 205, and FIGS. 49A, 49B, and 49C are cross-sectional views when viewed from the Y-axis direction when the substrate P is taken out from the plate holder 9; It is also. In addition, only the fork part 12 is shown in FIG. 48, and the whole structure of the carrying-out robot 205 is abbreviate | omitted. In this embodiment, it corresponds to the shape of the lift mechanism 150, and the board | substrate support part in the fork part 12 differs from the said embodiment. In addition, in FIG. 49A, 49B, and 49C, illustration of the fork part 12 which supports the board | substrate P is simplified for convenience.

When the exposure process ends, adsorption through the opening K205 by the vacuum pump is released, and adsorption of the substrate P by the plate holder 9 is released. Subsequently, the lift mechanism 150 drives the shaft portion 155 to raise the substrate support member 151. At this time, as shown to FIG. 49A, the board | substrate P mounted on the board | substrate mounting part 31 with the board | substrate support member 151 is lifted upwards. At this time, since the board | substrate P is lifted upward by being supported by the some board | substrate support member 151, generation | occurrence | production of peeling charging can be prevented. Moreover, since the board | substrate P can be supported by a wide surface compared with the case where the board | substrate P is lifted with a pin like conventionally, the curvature amount which arises in the board | substrate P can be reduced, Cracks can be prevented.

The carrying-out robot 205 drives the fork part 12, and the clearance gap S between the board | substrate support member 151 arrange | positioned above the board | substrate mounting part 31, and the X-axis direction both ends as shown in FIG. The fork portion 12 is moved from the side of the -Y direction toward, to insert the fork portion 12 into the gap S and both ends (FIG. 49B).

And when the drive device 13 moves the fork part 12 upwards by predetermined amount, the fork part 12 abuts on the lower surface of the board | substrate P. As shown in FIG. Moreover, when the fork part 12 is moved upwards, as shown to FIG. 49C, the board | substrate P will be lifted upward of the plate holder 9, and will be spaced apart from the lift mechanism 150. FIG.

The lift mechanism 150 accommodates the substrate support member 151 in the recess 130 after the substrate P is separated. After accommodating the board | substrate support member 151 in the recessed part 130, the plate holder 9 is moved so that it may be close to the table 40 for carrying in of the loading part 4, and the board | substrate P was carried out as mentioned above. ) Is conveyed to the plate holder 9 side.

While the board | substrate P is conveyed from the loading part 4 to the plate holder 9, the carrying out robot 205 moves the board | substrate P mounted in the fork part 12 into a coater developer (not shown). Let's do it. As mentioned above, the carrying out operation | movement of the board | substrate P from the exposure apparatus main body 3 is completed.

Thus, according to this embodiment, since it conveys to the plate holder 9 from the carrying-in part 4 by sliding the floating board | substrate P, generation | occurrence | production of the displacement and deformation | transformation of the board | substrate P can be prevented. Moreover, also in this embodiment, the total tact time required for carrying in / out of the board | substrate P with respect to the plate holder 9 can be made substantially the same as the case where the conventional tray is used. Therefore, the board | substrate P can be carried in to the plate holder 9 in a favorable state, without increasing the tact time at the time of carrying in / out of the board | substrate P. FIG.

Moreover, in the said embodiment, although the case where the opening part K205 as a gas injection opening was formed only in the board | substrate mounting part 31 was demonstrated, a gas injection opening can also be provided in the upper surface of the board | substrate supporting member 151. FIG. In this case, when the substrate P is brought into the plate holder 9, the amount of gas injected onto the substrate conveying surface increases, so that the substrate P can be conveyed more smoothly.

(10th embodiment)

Then, the structure concerning 10th embodiment of this invention is demonstrated. In addition, in this embodiment, the same code | symbol is attached | subjected about the element same as the component of 6th embodiment, and the description is abbreviate | omitted. The tenth embodiment mainly differs from the above embodiment in that a suction mechanism for adsorbing the substrate P in a non-contact state is provided as a means for carrying out the substrate P from the plate holder 9.

The adsorption mechanism holds the substrate P, lifts the substrate P upward from the substrate placing portion 31 of the plate holder 9, and moves the substrate P into the coater developer (not shown). 50A shows the configuration of the adsorption face, and FIG. 50B is a diagram showing the overall configuration of the adsorption mechanism.

50A and 50B, the adsorption mechanism 350 includes a plurality of holding portions 351 for holding the substrate P in a non-contact state, a base portion 352 holding these holding portions 351, and And a drive mechanism 355 capable of moving the base portion 352, and a base portion 352. The base portion 352 is a plate member having a size substantially the same as that of the substrate P. As shown in FIG. The holding | maintenance part 351 is arrange | positioned regularly on the base part 352, and can hold | maintain the board | substrate P favorably by this.

As the holding part 351, what is called a Bernoulli chuck was used. The holding | maintenance part 351 produces negative pressure between the board | substrate P by injecting compressed air between the board | substrate P. FIG. Thereby, the pressing force which presses the board | substrate P to the holding part 351 side is generated. On the other hand, when the clearance gap with the board | substrate P becomes small in the holding | maintenance part 351, the flow velocity of compressed air will fall, and the pressure between the holding | maintenance part 351 and the board | substrate P will raise. As a result, a force to separate the substrate P from the holding portion 351 is generated. The holding part 351 injects compressed air to balance these two forces, thereby holding the substrate P in a state in which the distance between the substrate P and the holding part 351 is kept constant, that is, in a non-contact state. I can keep it.

Next, operation | movement of the exposure apparatus 1 is demonstrated, referring drawings. In addition, since the receiving operation of the board | substrate P between the carrying-in part 4 and the plate holder 9 is the same as that of 1st Embodiment, description is abbreviate | omitted.

Hereinafter, the operation | movement which carries out the board | substrate P from the plate holder 9 is demonstrated. Specifically, the method of carrying out the board | substrate P from the plate holder 9 by the said adsorption mechanism 350 is demonstrated. 51A and 51B are side views when the operation | movement which carries out the board | substrate P from the plate holder 9 is seen from the X-axis direction.

When the exposure process is completed, the suction of the suction hole K1 by the vacuum pump is released, and the suction of the substrate P by the plate holder 9 is released. Subsequently, the suction mechanism 350 moves upward of the plate holder 9. And the adsorption | suction mechanism 350 descends to the position which can hold | maintain the board | substrate P as shown in FIG. 51A. And the some surface holding part 351 hold | maintains the upper surface of the board | substrate P in a non-contact state. At this time, the plurality of holding portions 351 can hold the substrate P by simultaneously driving or sequentially driving.

The suction mechanism 350 lifts the board | substrate P upward of the plate holder 9 by the drive mechanism 355 in the state which hold | maintained the board | substrate P by the some holding | maintenance part 251, FIG. 51B. As shown to below, it separates from the board | substrate mounting part 31. As shown to FIG. At this time, since the holding | maintenance part 351 is non-contact with the board | substrate P, the adsorption trace does not remain on the board | substrate P.

After the adsorption mechanism 350 is raised to a position where it does not contact the substrate P on the loading table 40, the loading table 40 of the loading portion 4 is moved to approach the plate holder 9. And it conveys to the plate holder 9 from the table 40 for carrying in in the state which floated and supported the board | substrate P similarly to the said embodiment.

While the substrate P is being conveyed from the carrying in portion 4 to the plate holder 9, the suction mechanism 350 moves the substrate P held by the holding portion 351 into a coater developer (not shown). Let's do it. As described above, the carrying out operation of the substrate P from the exposure apparatus main body 3 is completed.

Moreover, as shown to FIG. 52A and 52B, the support member 353 which supports the lower surface of the board | substrate P can also be formed around the base part 352. FIG. The support member 353 consists of a frame-shaped member surrounding the periphery of the board | substrate P, and has a plurality of elongate part 354 extended in the surface direction of the board | substrate P. As shown in FIG. This elongate part 354 is made to contact the lower surface of the board | substrate P. As shown in FIG. According to this structure, when holding the large board | substrate with which the deflection of the board | substrate P may occur, since the main end part of the board | substrate P is supported by the elongate part 354, a large board | substrate is hold | maintained. Even if it does, the holding | maintenance part 351 can hold | maintain the board | substrate P in the state in which the top view is high, preventing the deflection from occurring in the edge part of the board | substrate P.

The substrate P of the above-described embodiment is not only a glass substrate for display devices, but also a semiconductor wafer for semiconductor device manufacture, a ceramic wafer for thin film magnetic heads, or an original plate of a mask or reticle used in an exposure apparatus ( Synthetic quartz, silicon wafer) and the like.

Moreover, as an exposure apparatus, the step-and-scan method of scanning and exposing the board | substrate P with the exposure light IL through the pattern of the mask M by making the mask M and the board | substrate P move synchronously. In addition to the scanning exposure apparatus (scanning stepper), the step and repeat for collectively exposing the pattern of the mask M in a state where the mask M and the substrate P are stopped and stepping the substrate P in sequence It can also be applied to a projection exposure apparatus (stepper) of the system.

The present invention is also applicable to a twin stage type exposure apparatus having a plurality of substrate stages, as disclosed in U.S. Patent No. 6341007, U.S. Pat.

In addition, the present invention provides a substrate stage for holding a substrate, a reference member on which a reference mark is formed without holding the substrate, and / or various photoelectric sensors, as disclosed in US Pat. No. 6897963, EP 1713113, and the like. It is applicable also to the exposure apparatus provided with the measurement stage mounted. Moreover, the exposure apparatus provided with the some board | substrate stage and the measurement stage can be employ | adopted.

Moreover, in the above-mentioned embodiment, although the light transmissive mask which provided the predetermined light-shielding pattern (or phase pattern and photosensitive pattern) was used on the light transmissive board | substrate, US Patent No. 6778257 specification replaces this mask, for example. As disclosed in, a variable shaping mask (also referred to as an electronic mask, an active mask, or an image generator) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on the electronic data of the pattern to be exposed may be used. Moreover, you may provide the pattern forming apparatus containing a self-luminous type image display element instead of the variable shaping mask provided with a non-emission type image display element.

The exposure apparatus of the above-mentioned embodiment is manufactured by assembling various subsystems containing each component so that predetermined mechanical precision, electrical precision, and optical precision may be maintained. In order to secure these various precisions, before and after this assembly, adjustments for achieving optical precision for various optical systems, adjustments for achieving mechanical precision for various mechanical systems, and adjustments for achieving electrical precision for various electric systems are performed. Is done. The assembling process from the various sub-systems to the exposure apparatus includes mechanical connection of various sub-systems, wiring connection of an electric circuit, piping connection of an air pressure circuit, and the like. It goes without saying that there is an assembling step for each subsystem before the assembling step from these various subsystems to the exposure apparatus. When the assembly process to the exposure apparatus of various subsystems is complete | finished, comprehensive adjustment is made and various precision as the whole exposure apparatus is ensured. In addition, it is preferable to perform manufacture of exposure apparatus in the clean room where temperature, a clean degree, etc. were managed.

Microdevices, such as a semiconductor device, manufacture the board | substrate which is a base material of a device in step 201 which performs the function and performance design of a microdevice, the step 202 which manufactures the mask (reticle) based on this design step, as shown in FIG. The substrate processing including the substrate process (exposure process) which includes exposing the board | substrate with exposure light using the pattern of a mask, and developing the exposed board | substrate (photosensitive agent) according to step 203, above-mentioned embodiment. Step 204, device assembly step (including processing processes such as dicing process, bonding process, package process, etc.) 205, inspection step 206 and the like. Further, in step 204, the photosensitive agent is developed to form an exposure pattern layer (layer of developed photosensitive agent) corresponding to the pattern of the mask, and to process the substrate through the exposure pattern layer.

In addition, the requirement of embodiment mentioned above and a modification can be combined suitably. In addition, some components may not be used. In addition, as long as permitted by law, all publications relating to the exposure apparatus and the like cited in the above-described embodiments and modified examples and the disclosure of US patents are incorporated as part of the main text.

P… Substrates, K1, K4, K6, K8... Suction hole, K2, K3, K5, K7... Gas injection hole, K205... Opening, 1... Exposure apparatus 4, 104... Carry-in part 5... Carry-out unit 9, 109. Plate holder, 12... Fork portion 19... Position detection sensor, 33... First moving mechanism, 40, 140... Table for import, 42, 149, 249... First conveying section 43... Second moving mechanism, 50... Table, 52. Second conveying section 53... Third moving mechanism, 109... Plate holder, 142... Roller 148... Roller mechanism, 149... First transfer section 150... Lift mechanism 205... Export robot, 250... Adsorption unit, 251... Holding unit, 252... Position detection sensor, 350... Adsorption mechanism, 351. Holding unit, 401... Substrate placing table, 405... Conveying unit, 408... Adsorption part

Claims (18)

A first support part which supplies a gas to a first substrate and is capable of floating the first substrate through the gas;
A lift mechanism for supporting the first substrate mounted on the mounting portion of the first support portion and lifting the mounting portion upward;
A second support portion for supplying gas to a second substrate different from the first substrate, and capable of floating the second substrate through the gas;
A carrying-in mechanism for bringing the second substrate lifted up and supported by the second support portion into the placing portion between the first substrate and the placing portion, which is also lifted above the placing portion by the lift mechanism; ,
The said carrying in mechanism moves the said 2nd board | substrate supported by the at least one support part of the said 1st support part and the said 2nd support part, and conveys it to the said mounting part. The method of claim 1,
The said lift mechanism contains the holding part which hold | maintains and raises a said 1st board | substrate. The method of claim 1,
The said lift mechanism is a conveying apparatus which non-contactingly maintains the upper surface different from the lower surface supported by the said mounting part among the said 1st board | substrates. The method of claim 3, wherein
The said lift mechanism contacts a 1st holding part which hold | maintains the said upper surface in the center part of a said 1st board | substrate, and the said lower surface in outer side rather than the said center part of the said 1st board | substrate hold | maintained by the said 1st holding part. The conveying apparatus which has a 2nd holding part which can be supported. The method of claim 3, wherein
The carry-in mechanism carries in the said 2nd board | substrate between the said 1st board | substrate and the said mounting part hold | maintained at the height which does not contact the said 2nd board | substrate by the said lift mechanism. The method of claim 4, wherein
The said lift mechanism carries out the said 1st board | substrate in the state which hold | maintained the upper surface of the said 1st board | substrate non-contactedly by the said 1st holding part. The method of claim 1,
The said 2nd support part is a conveying apparatus arrange | positioned so that the upper surface of a said 2nd support part may become a position higher than the upper surface of the said mounting part. The method of claim 2,
The said lifting mechanism is equipped with the said holding part in multiple numbers. The method of claim 2,
The said lift mechanism includes a drive part which drives the said holding part which hold | maintains the said 1st board | substrate to move to a position different from a said 1st support part. The method of claim 1,
A conveying apparatus provided with a relative position detection part which detects the relative position of a said 1st support part and a said 2nd support part. The conveying apparatus of any one of Claims 1-10,
And a projection optical system for projecting a predetermined pattern onto the second substrate carried in the placement unit. The method of claim 11,
The said 1st board | substrate and the said 2nd board | substrate are used for a flat panel display apparatus. The method of claim 12,
The exposure apparatus of the said 1st board | substrate and the said 2nd board | substrate whose length of at least one side is 500 mm or more. A first step of supporting a first substrate, which is floated and supported by the placing portion of the first supporting portion, and lifting it above the placing portion;
And a second step of bringing a second substrate, which is floated and supported on a second support portion, into the placement portion between the first substrate, which is also lifted above the placement portion, and the placement portion,
The said 2nd process WHEREIN: The conveying method of moving the said 2nd board | substrate supported on the at least one support part of the said 1st support part and the said 2nd support part, and carrying it in the said mounting part. The method of claim 14,
In the said 1st process, the conveyance method of holding a non-contact upper surface different from the lower surface supported by the said mounting part among the said 1st board | substrates. The method of claim 15,
The said 1st process WHEREIN: The conveyance method of carrying out noncontact holding of the said upper surface in the center part of a said 1st board | substrate, and carrying out contact support of the said lower surface in the outer side than the said center part of a said 1st board | substrate. The exposure method including the 3rd process of projecting a predetermined pattern with respect to the said 2nd board | substrate carried in the said mounting part by the conveyance method as described in any one of Claims 14-16. The exposure method of Claim 17 exposes the said 2nd board | substrate with which the photosensitizer was apply | coated, and transfers the said predetermined pattern to the said 2nd board | substrate,
Developing the photosensitive agent exposed by the exposure to form an exposure pattern layer corresponding to the predetermined pattern;
A device manufacturing method comprising processing the second substrate through the exposure pattern layer.

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