CN106876311A - Carrying device, transport method, exposure device and manufacturing method - Google Patents

Abstract

The conveying device comprises: a first supporting part (3), which supplies gas to one side of the substrate, and can support the substrate by gas suspension; a second supporting part (400), which can support one side of the substrate; a driving part (402), which makes the first and at least one of the second support parts moves so that the first and second support parts approach or contact each other and are arranged in the first direction; and the transfer part moves the first and second support parts arranged by the driving part The supported substrate moves to the other side in the first direction.

Description

Transfer device, transfer method, exposure device, and device manufacturing method

This application is a divisional application of a patent application with an application date of February 17, 2011, an application number of 201180009815.0, and an invention title of "transfer device, transfer method, exposure device, and component manufacturing method".

technical field

The present invention relates to a conveying device, a conveying method, an exposure device, and a device manufacturing method.

This application claims priority based on U.S. Provisional Application Nos. 61/305,355 and 61/305,439 filed on February 17, 2010, and the contents thereof are incorporated herein.

Background technique

In the process of electronic components such as flat panel displays, processing equipment for large substrates such as exposure equipment and inspection equipment is used. In the exposure step and the inspection step using these processing apparatuses, a transfer apparatus as disclosed in the following patent documents for transferring a large substrate (for example, a glass substrate) to the processing apparatus is used.

[Patent Document]

[Patent Document 1] Japanese Unexamined Patent Publication No. 2001-100169

Contents of the invention

In the transfer apparatus for large substrates described above, since a layer of air is interposed between the substrate and the substrate holding portion when the substrate supported by the substrate supporting member is transferred to the substrate holding portion, the substrate after transfer may be deformed, or When the placement position of the substrate on the substrate holder is shifted. If the substrate after the transfer is misplaced or deformed, for example, in an exposure device, there will be a problem of exposure failure such as failure to perform predetermined exposure to an appropriate and correct position on the substrate. When the substrate is misplaced or deformed, for example, the substrate is transferred again in order to solve the problem, which causes a problem that the processing of the substrate is delayed. Also, if the transfer speed of the substrate is lowered, for example, in order not to leave a layer of air after the transfer, the processing of the substrate will be further delayed.

An aspect of the present invention aims to provide a transfer device, a transfer method, an exposure device, and a device manufacturing method capable of transferring a substrate without misalignment or deformation.

According to a first aspect of the present invention, there is provided a transfer device comprising: a first support unit that supplies gas to one side of the substrate, and can support the substrate in suspension by the gas; a second support unit that can support the substrate. The aforementioned one side; the drive unit, which moves at least one of the aforementioned first and second support parts, so that the first and second support parts are close to or contact each other and arranged in the first direction; The substrate supported by one of the aligned first and second support parts moves toward the other side in the first direction.

According to a second aspect of the present invention, there is provided a transfer device comprising: a first support unit that supplies gas to one side of the substrate, and can support the aforementioned substrate by means of the gas; second and third support units that can support The aforementioned one side of the aforementioned substrate; the first drive unit moves at least one of the aforementioned first and second support parts so that the first and second support parts approach or contact each other and are arranged in the first direction; the second drive unit, At least one of the aforementioned first and third supporting parts is moved so that the first and third supporting parts approach or contact each other and are arranged in the second direction; the first transfer part will be arranged in the aforementioned first driving part The aforementioned substrate supported by the aforementioned second supporting portion of the first supporting portion moves toward the side of the aforementioned first supporting portion along the aforementioned first direction; The said board|substrate supported by the said 1st support part moves to the said 3rd support part side along the said 2nd direction.

According to a third aspect of the present invention, there is provided a transfer method for transferring a substrate, which includes: a first support portion capable of levitating and supporting the substrate by a gas supplied to one side of the substrate; and a substrate capable of supporting the substrate. An action of moving at least one of the second supporting parts on one side so that the first and second supporting parts approach or contact each other and align in the first direction; and moving one of the arranged first and second supporting parts An operation of moving the supported substrate to the other side along the first direction.

According to a fourth aspect of the present invention, there is provided a transfer method for transferring a substrate, which includes: a first support portion capable of levitating and supporting the substrate by gas supplied to one side of the substrate; At least one of the second support parts on one side moves so that the first and second support parts approach or contact each other and are arranged in the first direction; The action of moving the aforementioned substrate to the side of the aforementioned first support portion along the aforementioned first direction; moving at least one of the aforementioned first support portion and the third support portion capable of supporting the aforementioned surface of the aforementioned substrate, so that the first and first 3 the operation of the support portions approaching or contacting each other and being aligned in the second direction; and the movement of the substrate supported by the first support portion arranged on the third support portion toward the third support portion in the second direction action.

According to a fifth aspect of the present invention, there is provided a transfer device comprising: a first support unit that supplies gas to one side of the substrate, and can support the substrate in suspension by the gas; and a second support unit that can support the substrate. The aforementioned one side; the drive unit moves at least one of the aforementioned first and second support parts so that the first and second support parts approach or contact each other and arrange them; the transfer unit moves the aforementioned second support parts arranged by the aforementioned drive unit. The substrate supported by the supporting part moves toward the first supporting part along the arrangement direction; the jacking mechanism stops the supply of the gas, supports the substrate placed on the mounting part of the first supporting part, and moves toward the first supporting part. The upper side of the loading unit is lifted; and the carrying-out mechanism carries out the substrate supported above the loading unit by the lifting mechanism from the first supporting unit.

According to a sixth aspect of the present invention, there is provided a transfer method for transferring a substrate, which includes: a first support portion capable of supporting the substrate in suspension by gas supplied to one side of the substrate; and the first support portion capable of supporting the substrate. At least one of the second support parts on one side is moved so that the first and second support parts are close to or contact each other and arranged; the aforementioned substrates supported by the arranged second support parts are moved along the aforementioned arrangement direction to the aforementioned The operation of transferring to the side of the first support portion; the operation of supporting the substrate placed on the mounting portion of the first support portion and pushing up the substrate above the mounting portion by stopping the supply of the gas; An operation of carrying out the substrate above the placement unit from the first support unit.

According to a seventh aspect of the present invention, there is provided an exposure apparatus for exposing a substrate with exposure light, including the transfer device for holding the substrate and moving the substrate to an irradiation area of the exposure light.

According to an eighth aspect of the present invention, there is provided a device manufacturing method including: using the exposure device to transfer the pattern to the substrate; and processing the substrate on which the pattern is transferred according to the pattern.

According to the aspect of the present invention, the transfer of the substrate can be performed without occurrence of placement deviation or deformation.

Description of drawings

FIG. 1 is a cross-sectional plan view showing an overall outline of an exposure apparatus.

Fig. 2 is an external perspective view showing a specific configuration in the chamber.

Fig. 3A is a diagram showing the peripheral configuration of the panel holder.

Fig. 3B is a diagram showing the peripheral configuration of the panel holder.

FIG. 4A is a diagram showing the configuration of main parts of the carrying-in unit.

FIG. 4B is a diagram showing the configuration of main parts of the carrying-in unit.

FIG. 5A is a diagram showing the configuration of main parts of a carry-out unit.

FIG. 5B is a diagram showing the configuration of main parts of the unloading unit.

FIG. 6 is a diagram illustrating a procedure of transferring the substrate to the loading table.

FIG. 7A is an explanatory diagram of a substrate transfer procedure between the plate holder and the carry-out unit.

FIG. 7B is an explanatory diagram of a transfer procedure of the substrate between the plate holder and the carry-out unit.

FIG. 8 is a diagram showing a state in which a substrate is suspended and supported on the loading table.

FIG. 9 is a view explaining a procedure of transferring a substrate on a carrying-in table.

FIG. 10 is a diagram illustrating a step of transferring the substrate to the plate holder side.

FIG. 11 is a diagram illustrating a state in which a substrate is placed on a plate holder.

FIG. 12 is a diagram illustrating a procedure for transferring the substrate to the unloading stage.

FIG. 13 is a diagram showing a state in which a substrate is suspended and supported on the unloading table.

Fig. 14A is a diagram illustrating substrate transfer from the panel holder to the carry-out section side.

FIG. 14B is a view explaining the transfer of the substrate from the plate holder to the carry-out unit side.

FIG. 14C is a view explaining the transfer of the substrate from the plate holder to the carry-out unit side.

FIG. 15 is a view explaining the operation of carrying out the substrate from the carrying out unit.

Fig. 16A is a diagram showing the configuration of a carry-in unit according to the second embodiment.

Fig. 16B is a diagram showing the configuration of a carry-in unit according to the second embodiment.

FIG. 17 is a diagram illustrating a structure for transferring a substrate from the carrying-in unit to the plate holder side.

FIG. 18 is a diagram for explaining steps following FIG. 18 .

Fig. 19 is a diagram showing the configuration of a panel holder according to a third embodiment.

FIG. 20A is a diagram illustrating a configuration for transferring a substrate from the carrying-in unit to the plate holder side.

FIG. 20B is a diagram illustrating a structure for transferring a substrate from the carrying-in unit to the plate holder side.

Fig. 21 is a diagram showing the configuration of the fourth embodiment.

Fig. 22A is a diagram illustrating a transfer operation of a substrate according to the fourth embodiment.

Fig. 22B is a diagram for explaining the transfer operation of the substrate according to the fourth embodiment.

Fig. 22C is a diagram for explaining the transfer operation of the substrate according to the fourth embodiment.

Fig. 22D is a diagram illustrating the transfer operation of the substrate according to the fourth embodiment.

Fig. 23 is a perspective view showing the structure inside the chamber of the fifth embodiment.

Fig. 24A is a plan view showing a schematic configuration of a carry-in/out section.

Fig. 24B is a plan view showing a schematic configuration of the carry-in/out section.

Fig. 25 is a diagram illustrating a loading procedure of a substrate according to the fifth embodiment.

FIG. 26 is a view explaining the transfer of the substrate from the carry-in/in section to the plate holder side.

Fig. 27 is a view explaining the transfer of the board from the board holder to the side of the carry-in/out section.

FIG. 28 is a cross-sectional plan view showing an overall outline of the exposure apparatus.

Fig. 29 is an external perspective view showing a specific configuration inside the chamber.

Fig. 30A is a diagram showing the peripheral configuration of the panel holder.

Fig. 30B is a diagram showing the peripheral configuration of the panel holder.

FIG. 31A is an explanatory diagram of a substrate transfer procedure between the plate holder and the carry-out unit.

FIG. 31B is an explanatory diagram of a substrate transfer procedure between the plate holder and the carry-out unit.

FIG. 32 is a diagram showing a state in which a substrate is suspended and supported on the loading table.

FIG. 33 is a view explaining the procedure of transferring the substrate on the carrying-in table.

Fig. 34 is a diagram illustrating a step of transferring the substrate to the plate holder side.

Fig. 35 is a diagram for explaining the operation of the unloading robot arm.

Fig. 36A is a front view illustrating the operation of carrying out the substrate from the panel holder.

Fig. 36B is a front view illustrating the operation of carrying out the substrate from the panel holder.

Fig. 37 is a side view illustrating the operation of carrying out the substrate from the panel holder.

Fig. 38 is a diagram showing the configuration of the carrying-in section of the third embodiment.

FIG. 39A is a diagram illustrating a structure for transferring a substrate from the carrying-in unit to the plate holder side.

FIG. 39B is a diagram illustrating a structure for transferring a substrate from the carrying-in unit to the plate holder side.

Fig. 40 is a diagram showing the configuration of an exposure apparatus main body according to a fourth embodiment.

Fig. 41 is a diagram showing a plan view of the panel holder.

Fig. 42A is a side sectional view of a plate holder.

Fig. 42B is a side sectional view of the plate holder.

Fig. 43 is a diagram showing the structure of the up and down moving part.

FIG. 44A is a diagram illustrating a structure for transferring a substrate from the carrying-in unit to the plate holder side.

FIG. 44B is a diagram illustrating a configuration for transferring a substrate from the carrying-in unit to the plate holder side.

Fig. 45 is a diagram showing a state in which a substrate is suspended and supported on the loading table.

FIG. 46 is a diagram showing a state where the abutting portion is in contact with the end portion of the substrate.

FIG. 47 is a diagram illustrating a step of moving the substrate from the loading table to the plate holder.

Fig. 48 is a perspective view for explaining the operation of the unloading robot arm.

FIG. 49A is an explanatory diagram of a step of carrying out a substrate from a plate holder.

FIG. 49B is an explanatory diagram of the step of carrying out the substrate from the plate holder.

FIG. 49C is an explanatory diagram of a step of carrying out the substrate from the plate holder.

Fig. 50A is a plan view showing the structure of the adsorption mechanism of the fifth embodiment.

Fig. 50B is a side view showing the structure of the adsorption mechanism of the fifth embodiment.

FIG. 51A is a side view illustrating the operation of carrying out the substrate from the plate holder.

FIG. 51B is a side view illustrating the operation of carrying out the substrate from the plate holder.

Fig. 52A is a diagram showing the configuration of a modified example of the adsorption mechanism.

Fig. 52B is a diagram showing the configuration of a modified example of the adsorption mechanism.

Fig. 53 is a flow chart for explaining an example of a process for a microdevice.

Figure number:

P substrate

K1, K4, K6, K8 suction holes

K2, K3, K5, K7 gas injection holes

K205 opening

1 exposure device

4, 104 Import Department

5 Moving out department

9,109 plate holder

12 Forks

19 Position detection sensor

33 The first moving mechanism

40, 140 Moving in table

42, 149, 249 1st transfer department

43 Second moving mechanism

50 Move out table

52 2nd transfer department

53 The third moving mechanism

142 Roller

148 roller mechanism

150 jacking mechanism

205 Moving out the robotic arm

250 adsorption part

251 Keeping Department

252 position detection sensor

350 adsorption mechanism

351 Maintenance Department

401 Substrate Mounting Table

405 Transfer Department

408 adsorption part

detailed description

Embodiments of the present invention will be described with reference to the drawings. In addition, the present invention is not limited thereto. Hereinafter, an exposure apparatus equipped with the conveyance apparatus of the present invention and performing an exposure process (exposure of a pattern for a liquid crystal display element on a substrate coated with a photosensitive agent) will be described, and an embodiment of the conveyance method and element manufacturing method of the present invention will be described.

(first embodiment)

FIG. 1 is a cross-sectional plan view showing a schematic configuration of an exposure apparatus according to this embodiment. As shown in FIG. 1, the exposure apparatus 1 includes an exposure apparatus main body 3 for exposing a pattern for a liquid crystal display element on a substrate, a carrying-in unit 4, and a carrying-out unit 5, which are highly cleaned and housed in a chamber 2 adjusted to a predetermined temperature. . In this embodiment, the substrate is a large glass plate, and the size of one side thereof is, for example, 50 mm or more.

FIG. 2 shows an external perspective view of the specific structure in the chamber 2 . As shown in FIG. 2 , the exposure apparatus main body 3 includes an illumination system (not shown) for illuminating the mask M with exposure light IL, a mask stage (not shown) for holding the mask M on which a pattern for a liquid crystal display element is formed, and is disposed on The projection optical system PL below the mask stage, the plate holder 9 as a substrate holder provided to move two-dimensionally on a base (not shown) disposed below the projection optical system PL, and the plate holder 9 and the first moving mechanism 33 for moving the board holder 9 in the chamber 2 .

In addition, in the following description, the two-dimensional movement relative to the plate holder 9 provided on the base portion (not shown) of the chamber 2 is performed in a horizontal plane, and the X-axis and Y-axis are set in directions orthogonal to each other in the horizontal plane. . The holding surface of the board|substrate P by the plate holder 9 is parallel to a horizontal plane in a reference state (for example, the state at the time of carrying out transfer of the board|substrate P). In addition, the Z axis is set in a direction perpendicular to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis. In addition, each direction around the X-axis, the Y-axis, and the Z-axis is called a θX direction, a θY direction, and a θZ direction, respectively.

The first moving mechanism 33 has a moving mechanism body 35 and a holding portion 34 arranged on the moving mechanism body 35 and holding the plate holder 9 . The moving mechanism main body 35 is non-contact supported on a guide surface (base) not shown via a gas bearing, and can move in the XY direction on the guide surface. With such a configuration, the plate holder 9 moves within a predetermined area of the guide surface on the light emitting side (the image plane side of the projection optical system PL) in a state holding the substrate P.

The moving mechanism body 35 can move in the XY plane on the guide surface through the action of a coarse motion system including an actuator such as a linear motor. The holding part 34 can move relative to the moving mechanism body 35 in the Z-axis, θX, and θY directions through the operation of a micro-motion system including an actuator such as a voice coil motor. The holding part 34 can move in the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions in the state of holding the substrate P by the operation of the substrate stage driving system including the coarse motion system and the fine motion system. six directions.

The exposure apparatus 1 performs exposure by a step-and-scan method in a state where a rectangular substrate P is placed on the plate holder 9, and sequentially transfers a pattern formed on the mask M onto the substrate P for a plurality of, for example, four exposures. area (pattern transfer area). That is, in this exposure apparatus 1, the slit-shaped illumination region on the mask M is illuminated by the exposure light IL from the illumination system, and is driven by a controller not shown through a drive system not shown. The mask stage holding the mask M and the plate holder 9 holding the substrate P move in a predetermined scanning direction (here, the Y-axis direction) synchronously, and the pattern of the mask M is transferred to one exposure area on the substrate P , That is, scan exposure. In addition, the exposure apparatus 1 of the present embodiment constitutes a so-called multi-lens type scanning exposure apparatus in which the projection optical system PL has a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to the plurality of projection optical modules.

After the scanning exposure of this one exposure area is complete|finished, the step operation which moves the plate holder 9 by predetermined amount to the scanning start position of one exposure area in the X direction is performed. Next, the exposure apparatus main body 3 sequentially transfers the pattern of the mask M to the four exposure regions by repeating such scanning exposure and stepping operation.

As shown in FIG. 2 , the carrying-in unit 4 is provided with a carrying-in mechanism for supporting one side (lower surface) of the substrate P when the substrate P coated with a photosensitive agent is carried in by a coating and developing machine (not shown) disposed adjacent to the exposure device 1 . A table 40 and a second moving mechanism 43 that moves the table 40 for loading. Moreover, the carrying-in part 4 can adjust the temperature of the board|substrate P carried in to the stage 40 for carrying in.

The second moving mechanism 43 has a moving mechanism main body 45 and a holding portion 44 arranged on the moving mechanism main body 45 and holding the carrying-in table 40 . The moving mechanism main body 45 is non-contact supported on a guide surface (not shown) via a gas bearing, and can move in the XY direction on the guide surface. With such a structure, the stage 40 for carrying in can move in the predetermined area|region of a guide surface in the state which held the board|substrate P. As shown in FIG. In addition, the support of the moving mechanism main body 45 with respect to the guide surface (not shown) is not limited to the support of the gas bearing, and a known guide mechanism (a drive mechanism for the guide surface) other than the gas bearing can be used.

The moving mechanism main body 45 has the same structure as the above-mentioned moving mechanism main body 35, and can move in the XY plane on the guide surface. Moreover, the holding part 44 has the same structure as the above-mentioned holding part 34, and can move relative to the moving mechanism main body 45 in the Z-axis, θX, and θY directions. The holding part 44 is movable in six directions of the X-axis, the Y-axis, the Z-axis, θX, θY, and θZ directions while holding the substrate P.

The unloading unit 5, as shown in FIG. 2 , is equipped with a unloading table 50 that supports one side (lower surface) of the substrate P when the substrate P that has been subjected to exposure processing by the exposure apparatus body 3 is transferred, and a second table 50 that moves the unloading table 50. 3 moving mechanism 53.

The third moving mechanism 53 has a moving mechanism main body 55 and a holding portion 54 arranged on the moving mechanism main body 55 and holding the carrying out table 50 . The moving mechanism main body 55 is non-contact supported on a guide surface (not shown) via a gas bearing, and can move in the XY direction on the guide surface. With this structure, the table 50 for carrying out can move within the predetermined area|region of a guide surface in the state which held the board|substrate P.

The moving mechanism main body 55 has the same structure as the above-mentioned moving mechanism main bodies 35 and 45, and can move in the XY plane on the guide surface. Moreover, the holding part 54 has the same structure as the above-mentioned holding parts 34 and 44, and can move relative to the moving mechanism main body 55 in the Z-axis, θX, and θY directions. The holding part 54 is movable in six directions of the X-axis, the Y-axis, the Z-axis, θX, θY, and θZ directions while holding the substrate P.

Next, the peripheral configuration of the plate holder 9 will be described with reference to FIGS. 3A and 3B . FIG. 3A shows a plan view of the panel holder 9 , and FIG. 3B shows a side view of the panel holder 9 . As shown in FIG. 3A , a substrate mounting portion 31 on which the substrate P is mounted is formed on the plate holder 9 . The upper part of the board|substrate mounting part 31 is made to have favorable flatness to the substantially holding|maintenance surface of the board|substrate P with respect to the plate holder 9. As shown in FIG. Furthermore, a plurality of suction holes K1 are provided on the upper surface of the substrate mounting portion 31 for making the substrate P closely adhere to this surface. Each suction hole K1 is connected to a vacuum pump (not shown).

Further, on the upper surface of the substrate mounting part 31, a plurality of gas injection holes K2 are provided for injecting gas such as air to the lower surface of the substrate P and supporting the substrate P by the gas suspension. Each gas injection hole K2 is connected to an unillustrated gas injection pump. In addition, the suction holes K1 and the gas injection holes K2 are alternately arranged in a grid pattern.

In addition, guide pins 36 for guiding the substrate P when the substrate P is carried in and positioning pins 37 for defining the position of the substrate P relative to the substrate mounting portion 31 of the substrate holder 9 are provided on the peripheral portion of the panel holder 9. . These guide pins 36 and positioning pins 37 are movable together with the plate holder 9 in the exposure apparatus main body 3 .

The board holder 9 is equipped with the position detection sensor 19 which detects the relative position with the table 40 for carrying in, and the table 50 for carrying out in the side part 9a, as shown in FIG. 3B. The position detection sensor 19 includes a distance detection sensor 19a for detecting the relative distance between the loading table 40 and the unloading table 50 and a relative height sensor 19a for detecting the relative height of the loading table 40 and the unloading table 50. The height detection sensor 19b. In addition, recesses are formed at positions corresponding to the position detection sensors 19 in the loading table 40 and the loading table 50 , thereby preventing the position detection sensors 19 from interfering with the loading table 40 and the loading table 50 .

Next, the configuration of main parts of the carrying-in unit 4 will be described with reference to FIGS. 4A and 5B . FIG. 4A shows a plan view of the peripheral structure of the table 40 for carrying in, and FIG. 4B shows a cross-sectional view taken along line AA of FIG. 4A .

As shown in FIGS. 4A and 4B , the carrying-in unit 4 is provided with a first transfer unit 42 that transfers the substrate P from the carrying-in table 40 to the plate holder 9 . The 1st transfer part 42 includes the contact part 42b which contacts the board|substrate P, and the guide part 42a.

Two groove-shaped recesses 40 a formed along one direction (Y direction shown in the figure) are formed on the upper surface of the table 40 for carrying in. The above-mentioned guide part 42a is provided in this recessed part 40a. The contact part 42b mentioned above is attached to the guide part 42a in the state protruding from the upper surface of the table 40 for carrying in. The abutting portion 42b is made of an elastic member such as rubber, and can reduce damage to the substrate P at the time of abutting.

Furthermore, on the upper surface of the table 40 for carrying in, there are provided a plurality of gas injection holes K3 for injecting gas such as air to the lower surface of the substrate P, and supporting the substrate P by the gas suspension. Each gas injection hole K3 is connected to an unillustrated gas injection pump.

In addition, a plurality of suction holes K4 are provided on the upper surface of the table 40 for carrying in so that the substrate P can be brought into close contact with this surface. Each suction hole K4 is connected to a vacuum pump (not shown). The gas injection holes K3 and the suction holes K4 are alternately arranged in a grid along the Y direction. In addition, the gas injection holes K3 and the suction holes K4 are not limited to such a grid arrangement, and may be arranged in various forms (for example, arranged alternately along the Y direction). In addition, the gas injection hole K3 and the suction hole K4 are not limited to being provided independently of each other, and the same hole may also be used as the gas injection hole K3 and the suction hole K4. In this case, each hole can be appropriately switched and connected to a gas injection pump and a vacuum pump.

Also, a through hole 47 is formed in the table 40 for carrying in, and this through hole 47 can be used as a substrate support for a vertical movement mechanism for transferring the substrate P between a coating and developing machine (not shown) as described later. Underwriting through.

Next, the configuration of main parts of the unloading unit 50 will be described with reference to FIGS. 5A and 5B . As shown in FIGS. 5A and 5B , the carry-out unit 50 transfers the substrate P from the plate holder 9 to the second transfer unit 52 for carrying out the stage 50 . The second transfer unit 52 includes a guide unit 52 a and an adsorption unit 52 b that absorbs and holds the substrate P. As shown in FIG.

Two groove-shaped recesses 50a formed along one direction (Y direction shown in the figure) are formed on the upper surface of the table 50 for carrying out. The above-mentioned guide part 52a is provided in this recessed part 50a. The adsorption|suction part 52b mentioned above is attached to the guide part 52a in the state which protruded from the upper surface of the table 50 for carrying out. The suction unit 52b includes, for example, a vacuum suction pad that holds the substrate P by vacuum suction.

Moreover, the contact part 58 which contacts the board|substrate P extruded from the plate holder 9 when a board|substrate is carried out is provided in the adsorption|suction part 52b. The abutting portion 58 is made of an elastic member such as rubber, for example.

In addition, on the upper surface of the table 50 for carrying out, a plurality of gas injection holes K5 for injecting gas such as air to the lower surface of the substrate P to levitate and support the substrate P through the gas are provided. Each gas injection hole K5 is connected to an unillustrated gas injection pump.

In addition, a plurality of suction holes K6 are provided on the upper surface of the table 50 for carrying out so that the board|substrate P can adhere|attach to this surface. Each suction hole K6 is connected to a vacuum pump not shown. In addition, the gas injection holes K5 and the suction holes K6 are alternately arranged in a grid pattern.

In addition, a through hole 57 is formed in the table 50 for carrying out, and this through hole 57 can be used as a substrate support for a vertical movement mechanism for transferring the substrate P between a coating and developing machine (not shown) as described later. Underwriting through.

Next, the operation of the exposure apparatus 1 will be described with reference to FIGS. 6 to 15 . Specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out unit 50 will be mainly described. In addition, in this embodiment, the table 40 for carrying in of the carrying in part 4, and the table 50 for carrying out of the carrying out part 5 are arrange|positioned at the different position in the same horizontal plane. That is, the table 40 for carrying in and the table 50 for carrying out are arrange|positioned at the position which does not overlap each other in planar view (state viewed from +Z direction shown in FIG. 2).

First, the board|substrate P to which the photosensitive agent was coated with the coating developing machine (not shown) is carried in to the carrying-in part 4. As shown in FIG. At this time, the vertical motion mechanism 49 located below the table 40 for carrying in first arranges the substrate support pin 49 a above the table 40 for carrying in through the through hole 47 . Next, an arm portion 48 of a coating and developing machine (not shown) is inserted between the substrate support pins 49a as shown in FIG. 6 . After the arm part 48 descends and the board|substrate P is handed over to the board|substrate support pin 49a, it withdraws from the carrying-in part 4. The up-and-down mechanism 49 lowers the substrate support pin 49 a supporting the substrate P to complete the loading operation of the substrate P to the loading table 40 . Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the carrying-in table 40 through the suction hole K4.

Next, as shown in FIG. 7A , the panel holder 9 moves so as to approach the loading table 40 of the loading section 4 . Specifically, the first moving mechanism 33 arranges the panel holder 9 and the table 40 for carrying in in a state approaching in the Y direction. Here, the state where the plate holder 9 and the loading table 40 are close together refers to a state separated by a distance for smooth movement of the substrate P at the time of transfer of the substrate P described later.

In addition, the second moving mechanism 43 can be driven when the carrying-in table 40 and the panel holder 9 are aligned. In this way, the carrying-in table 40 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the carrying-in operation of the substrate P can be shortened. In this case, the table 50 for carrying out retreats to the position which does not interfere with the table 40 for carrying in.

In addition, since the substrate P is sucked and held on the upper surface of the carrying-in table 40 through the suction hole K4, it is possible to prevent the substrate P from moving on the carrying-in table 40 when the second moving mechanism 43 is driven.

In the present embodiment, as shown in FIG. 7B , when the table 40 for carrying in and the board holder 9 are approached, the board|substrate P is arrange|positioned higher than the board holder 9. As shown in FIG. That is, the first moving mechanism 33 brings the board holder 9 closer to the board holder 9 so that the upper surface of the board holder 9 on which the board P is supported is higher than the upper face of the board holder 9 . In addition, it is also possible to raise the table 40 for carrying in by the 2nd moving mechanism 43 so that the upper surface of the table 40 for carrying in may become higher than the upper surface of the plate holder 9. As shown in FIG.

Moreover, the 1st moving mechanism 33 can arrange|position the plate holder 9 and the table 40 for carrying in in the state which contacted. Thus, the transfer of the board|substrate P between the plate holder 9 mentioned later and the table 40 for carrying in can be performed smoothly.

Next, as shown in FIG. 8 , the carrying-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the board holder 9 receives the board|substrate P, gas is sprayed from the some gas injection hole K2 formed in the upper surface first.

The carrying-in part 4 makes the contact part 42b contact|abut the one end part of the board|substrate P, as shown in FIG. The contact part 42b moves the board|substrate P toward the plate holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board|substrate P is in the state floating on the stage 40 for carrying in, the contact part 42b can slide the board|substrate P to the board|plate holder 9 side smoothly. In addition, the upper surface of the plate holder 9 becomes the floating support board|substrate P as mentioned above. Here, the gas injected from the gas injection holes K3 and K2 may also be directed.

The board|substrate P which slides on the upper surface of the table 40 for carrying in via the contact part 42b is smoothly transferred to the upper surface of the plate holder 9, as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the board holder 9, the board|substrate P can be smoothly transferred to the board holder 9 without contacting the side surface of the board holder 9.

As shown in FIG. 9, the board|substrate P slides in the state prescribed|regulated to the position of the X direction in this figure by the guide pin 36 provided in the peripheral part of the board holder 9. As shown in FIG. The abutting portion 42b moves the substrate P until it abuts against the positioning pin 37 provided on the downstream side in the substrate transfer direction in the plate holder 9 . The board|substrate P is defined by the guide pin 36 at the position of the X direction in this figure, and is pinched by the positioning pin 37 and the contact part 42b, and the position of the Y direction in the figure is defined. The plate holder 9 stops gas injection from the gas injection holes K2. As shown in FIG. 11 , the substrate P is placed in a state aligned with the substrate placing portion 31 .

In addition, conventionally, when a substrate is placed on a plate holder, placement deviation of the substrate (positional deviation from a predetermined placement position) or deformation of the substrate may occur. One of the causes of this mounting deviation may be that, for example, the substrate is in a floating state due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is mounted. In addition, one of the causes of deformation of the substrate may be, for example, that after the substrate is mounted, air is trapped between the substrate and the plate holder, and the substrate is in a swollen state.

On the other hand, in this embodiment, since the board|substrate P is conveyed in the state suspended by the jet of gas as mentioned above, it is transferred to the plate holder 9 in the state of high flatness without distortion. In addition, since the substrate P is placed on the substrate mounting portion 31 from the height of the floating support, it is possible to prevent air stagnation or an air layer from being generated between the substrate P and the substrate mounting portion 31 . Therefore, it is possible to suppress the substrate P from being in a swollen state, and to prevent the substrate P from being misplaced or deformed. Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 9 in the state with high flatness. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 through the suction hole K1.

After the board|substrate P is mounted on the plate holder 9, the mask M is illuminated with the exposure light IL from an illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P mounted on the plate holder 9 through the projection optical system PL.

In the exposure apparatus 1, since the substrate P can be satisfactorily mounted on the plate holder 9 as described above, predetermined exposure can be performed with high precision at an appropriate position on the substrate P, and highly reliable exposure can be realized. deal with.

In the present embodiment, during the exposure process on the substrate P, or during the transfer of the exposed substrate P to the carry-out unit 5 as described later, the coating layer coated with a coating developer (not shown) can be coated. The subsequent substrate P of the photosensitive agent is placed on the loading stage 40 of the loading section 4 .

Next, the unloading operation of unloading the substrate P from the plate holder 9 after the exposure process is completed will be described.

After the exposure process is completed, the plate holder 9 moves so as to approach the carrying-out table 50 of the carrying-out unit 5 as shown in FIG. 12 . Specifically, the first moving mechanism 33 arranges the plate holder 9 and the table 50 for carrying out in a state approaching in the Y direction. At this time, since the substrate P is sucked and held through the suction hole K1 , it is possible to prevent the substrate P from moving on the substrate mounting portion 31 when the first moving mechanism 33 is driven.

In addition, the third moving mechanism 53 can be driven when the table 50 for carrying out and the plate holder 9 are aligned. In this way, the unloading table 50 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the unloading operation of the substrate P can be shortened. In this case, the table 40 for carrying in retreats to the position which does not interfere with the table 50 for carrying out.

In the present embodiment, when the plate holder 9 and the table 50 for carrying out approach, the substrate P is arranged in a plate holding position corresponding to the transfer destination of the substrate P, similarly to when the plate holder 9 and the table 40 for carrying in are approached. With 9 high. That is, the first moving mechanism 33 brings the plate holder 9 closer to the carry-out table 50 such that the upper surface of the plate holder 9 supporting the substrate P is higher than the upper face of the carry-out table 50 . Moreover, it is also possible to lower the table 50 for carrying out by the 3rd moving mechanism 53 so that the upper surface of the table 50 for carrying out may be lower than the upper surface of the board holder 9. As shown in FIG.

The first moving mechanism 33 can also arrange the plate holder 9 and the table 50 for carrying out in a state of being in contact with each other. Thus, the transfer of the board|substrate P between the plate holder 9 mentioned later and the table 50 for carrying out can be performed smoothly.

The plate holder 9 stops the driving of the vacuum pump, and releases the suction and holding of the substrate P passing through the suction hole K1 to the substrate mounting portion 31 . Next, as shown in FIG. 13 , the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31 , and supports the substrate P in a floating state by the gas. On the other hand, when the carry-out unit 5 receives the substrate P, the gas is sprayed from the plurality of gas injection holes K5 formed on the upper surface of the table 50 for carry-out.

The carry-out unit 5 moves the suction unit 52b of the second transfer unit 52 along the guide unit 52a toward the substrate P suspended and supported on the substrate mounting unit 31 of the plate holder 9 . The positioning pin 37 presses the end of the substrate P floating on the substrate mounting portion 31 as shown in FIG. 14A . Thereby, the board|substrate P floating on the board|substrate mounting part 31 slides to the side of the table 50 for carrying out, and contacts the contact part 58 attached to the adsorption part 52b as shown in FIG. 14B. Thus, by sliding the board|substrate P toward the contact part 58 side using the positioning pin 37, it is not necessary to move the adsorption|suction part 52b to the position facing the board|substrate P on the plate holder 9 along the slide part 52a. After the end of the substrate P contacts the abutting portion 58, the adsorption portion 52b, that is, adsorbs and holds the substrate P, moves along the guide portion 52a in the Y direction in the figure as shown in FIG. 14C.

At this time, since the board|substrate P is supported in the state suspended on the plate holder 9, the adsorption|suction part 52b can slide the board|substrate P to the table 50 side for carrying out smoothly. In addition, the upper surface of the table 50 for carrying out becomes a suspension support board|substrate P as mentioned above. Here, the gas injected from the gas injection holes K2 and K5 may also be directed.

The board|substrate P which slides on the upper surface of the board|substrate mounting part 31 by the movement of the adsorption|suction part 52b is smoothly transferred to the upper surface of the table 50 for carrying out. In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the unloading table 50 , the substrate P can be smoothly transferred onto the unloading table 50 without contacting the side surface of the unloading table 50 .

After the movement of the substrate P by the adsorption unit 52b is completed, the carry-out table 50 stops gas injection from the gas injection hole K5, and adsorbs and holds the substrate P through the suction hole K6. The unloading unit 5 drives the third moving mechanism 53 to move the unloading table 50 to the unloading position of the substrate P in a state in which the substrate P is sucked and held.

The exposure apparatus 1 moves the board holder 9 so that the board holder 9 may approach the carrying-in stage 40 of the carrying-in part 4, after transferring the board|substrate P from the board holder 9 to the carrying-out part 5. Next, similarly, the board|substrate P is transferred between the stage 40 for carrying in, and the board holder 9, and the exposure process can be performed on the board|substrate P mounted on the board holder 9.

In the present embodiment, while the next substrate P is being carried in from the carrying-in unit 4 to the plate holder 9, or while the subsequent substrate P is being subjected to exposure processing, the exposure processing carried out and placed on the carrying-out table 50 is completed. The substrate P. At this time, the vertical movement mechanism 60 located below the table 50 for carrying out arrange|positions the board|substrate support pin 60a above the table 50 for carrying out through the through-hole 57. As shown in FIG. Thereby, the board|substrate P is hold|maintained above the table 50 for carrying out by being supported by the board|substrate support pin 60a. Next, as shown in FIG. 15 , an arm portion 48 of a coating and developing machine (not shown) is inserted between the substrate supporting pins 60a. Thereafter, the substrate P is transferred to the arm portion 48 by lowering the substrate support pin 60 a. The arm part 48 moves the board|substrate P in the coater developing machine (not shown), and develops it.

As described above, the plate holder 9 is alternately connected by moving the carrying-in part 4 and the carrying-out part 5 in the same horizontal plane (XY plane), so that the substrate P is carried in and out of the exposure apparatus main body 3 . In this embodiment, since the board holder 9 is moved along the arrangement direction of the carrying-in part 4 and the carrying-out part 5, it is possible to arrange the board holder 9 close to or in contact with the carrying-in part 4 and the carrying-out part 5 in a short time. state. Therefore, the processing time (so-called Takt) accompanying the loading and unloading operation of the substrate P can be shortened.

According to the present embodiment, since the floating-supported substrate P can be slid to be conveyed from the carrying-in portion 4 to the plate holder 9, it is possible to prevent air stagnation or an air layer from occurring between the substrate P and the substrate mounting portion 31, thereby preventing Occurrence of mounting deviation or deformation of the substrate P. Therefore, highly reliable exposure processing can be performed.

In addition, in the first embodiment, when the substrate P is conveyed from the table 40 for carrying in to the plate holder 9, the upper surface of the table 40 for carrying in can be inclined. Specifically, the holder 44 of the second moving mechanism 43 inclines the upper surface of the loading table 40 supporting the substrate P in a state of being suspended by the gas injection from the gas injection hole K3 toward the plate holder 9 side (θY). Thereby, the board|substrate P can be moved to the board|plate holder 9 side using the dead weight of the board|substrate P.

Moreover, it is also possible to incline the upper surface of the board holder 9 when conveying the board|substrate P from the board holder 9 to the table 50 for carrying out. Specifically, the holding portion 34 of the first moving mechanism 33 inclines the upper surface of the plate holder 9 that supports the substrate P in a state of being suspended by the gas jet from the gas jet hole K2 toward the unloading table 50 (θY). Thereby, the said board|substrate P can be moved to the table 50 side for carrying out by utilizing the dead weight of the board|substrate P. As shown in FIG.

(Second Embodiment)

Next, the configuration of the second embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 1st Embodiment, and description is abbreviate|omitted. In the second embodiment, the configuration of the first transfer unit 149 in the carrying-in unit 104 is different from that of the first embodiment.

16A and 16B are diagrams showing the structure of the carrying-in section 104 of this embodiment. FIG. 16A shows a top view of the carrying-in section 104. diagram.

The first transfer unit 149 of the carrying-in unit 104 according to the present embodiment has a roller mechanism 148 instead of a configuration in which the substrate P is floated and supported by injecting gas onto one surface of the substrate P, as shown in FIGS. 16A and 16B .

On one end side of the table 140 for carrying in, a plurality of notches 141 are formed as shown in FIG. 16A . Rollers 142 constituting the above-mentioned roller mechanism 148 , which are rotatable about shafts 143 , are respectively supported on the notches 141 . The roller 142 can rotate itself by a drive mechanism not shown. As shown in FIG. 16B , the roller mechanism 148 is configured so that the roller 142 can contact the substrate P or be separated from the substrate P. As shown in FIG.

According to this configuration, the roller mechanism 148 can rotate the substrate P in a predetermined direction while bringing the plurality of rollers 142 into contact with the lower surface of the substrate P supported on the table 140 for carrying in, so that the substrate P can be moved to the plate holder. 9 side moves. As a material for forming the roller 142, an elastic member such as rubber that generates a large frictional force with the substrate P can be used. By constituting the roller 142 using such an elastic member, damage (scratches, etc.) to the substrate P can be prevented. Moreover, only the said suction hole K4 is provided in the upper surface of the table 140 for carrying in.

Next, the operation of the exposure apparatus 1 of this embodiment will be described. Specifically, the transfer operation of the board|substrate P between the carrying-in part 104 and the board|plate holder 9 which differs from 1st Embodiment is demonstrated.

First, the board|substrate P to which the photosensitive agent was coated with the coating developing machine (not shown) is carried in to the carrying-in part 104. As shown in FIG. The board|substrate P is suction-held on the upper surface of the table 140 for carrying in through the suction hole K4. Thereafter, the panel holder 9 moves so as to approach the loading table 140 (see FIG. 7A ).

Also in this embodiment, it is preferable to bring the board holder 9 close to the board holder 9 so that the upper surface of the board holder 9 on which the substrate P is supported is higher than the board holder 9 (see FIG. 7B ).

However, in the present embodiment, if the upper surface of the table 140 for loading is lower than the upper surface of the board holder 9, at least the upper surface of the roller 142 is higher than the upper surface of the board holder 9, and the substrate mounted on the roller 142 can be lifted. P is reliably conveyed from the loading table 140 side to the plate holder 9 side.

Next, as shown in FIG. 17 , the table 140 for carrying in rotates the roller 142 of the roller mechanism 148 in contact with the lower surface of the board|substrate P in a predetermined direction. On the other hand, when the board holder 9 receives the board|substrate P, gas is sprayed from the some gas injection hole K2 formed in the upper surface first. The board|substrate P slides smoothly toward the board|plate holder 9 side by the friction force with the roller 142. As shown in FIG.

Here, the plate holder 9 which is the transfer destination of the substrate P floats and supports the substrate P on the substrate mounting part 31 by injecting gas from the gas injection holes K2 .

Therefore, the board|substrate P which slides on the upper surface of the table 140 for carrying in by the roller mechanism 148 is smoothly transferred to the upper surface of the plate holder 9. As shown in FIG.

As shown in FIG. 18, the board|substrate P slides in the state prescribed|regulated by the pin 36 for guides provided in the peripheral part of the board|plate holder 9 at the position of the X direction in this figure. The roller mechanism 148 moves the substrate P until it comes into contact with the positioning pin 37 provided on the downstream side in the substrate transfer direction in the plate holder 9 . The board|substrate P is defined by the guide pin 36 at the position of the X direction in this figure, and is pinched by the positioning pin 37 and the contact part 42b, and the position of the Y direction in the figure is defined. The plate holder 9 stops gas injection from the gas injection holes K3. The board|substrate P is placed in the state aligned with the board|substrate placement part 31. As shown in FIG.

Also in this embodiment, since the substrate P is conveyed in a state of being suspended by the jet of gas as described above, it can be transferred to the plate holder 9 in a high flatness state without twisting, and it is possible to prevent the substrate P from being damaged. Air stagnation or an air layer is generated between the board mounting part 31 and the substrate mounting part 31 . Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 9 in the state with high flatness. Therefore, predetermined exposure can be performed with high precision at an appropriate position on the board|substrate P, and the exposure process with high reliability can be realized.

In addition, since the operation|movement of carrying out the board|substrate P from the plate holder 9 after completion|finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate|omitted.

In addition, in the above description, although the roller mechanism 148 was demonstrated as the 1st transfer part 149 of the carry-in part 104, the roller mechanism can also be used as the 2nd transfer part 52 of the carry-out part 5. Moreover, the stage 140 for carrying in can also employ|adopt the structure which suspends and supports the board|substrate P by gas jet similarly to 1st Embodiment. With this configuration, since the substrate P is conveyed by the roller mechanism 148 in a suspended state, the substrate P can be smoothly conveyed toward the plate holder 9 side.

(third embodiment)

Next, the structure of the third embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 1st, 2nd embodiment, and description is abbreviate|omitted. The main difference of the third embodiment is that the plate holder 109 is equipped with a first transfer mechanism.

Fig. 19 is a diagram showing the configuration of the plate holder 109 of this embodiment. The board holder 109 of this embodiment is equipped with the 1st transfer part 249 which transfers the board|substrate P from the table 40 for carrying in to the board holder 109, as shown in FIG. The first transfer unit 249 includes an adsorption unit 250 that absorbs and holds both sides of the substrate P in the width direction. The suction unit 250 can move freely in the XY plane along the direction of the substrate P surface.

Moreover, in this embodiment, the position detection sensor 252 for detecting the position of the board|substrate P carried in by the 1st transfer part 249 with respect to the board|substrate mounting part 31 is provided in the peripheral part of the board|plate holder 109. As shown in FIG. As this position detection sensor 252, for example, a potentiometer can be exemplified, and the present invention can use any counter of a contact method or a non-contact method.

The adsorption unit 250 adsorbs and holds the end of the substrate P suspended and supported on the loading table 40 by the gas injection from the gas injection hole K3, and transfers it from the loading table 40 to the plate holder 109 side as shown in FIG. 20A . . On the other hand, when the board holder 109 receives the board|substrate P, gas is sprayed from the some gas injection hole K2 formed in the upper surface first. At this time, the gas injected from the gas injection holes K2 and K3 can also be directed.

As shown in FIG. 20B , the adsorption unit 250 makes the end of the substrate P contact the position detection sensor 252 , so that the exposure apparatus 1 can detect the positional deviation of the substrate P relative to the substrate mounting unit 31 . In addition, the adsorption unit 250 is configured to be driven based on the detection result of the above-mentioned position detection sensor 252 .

Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the adsorption unit 250 relative to the substrate mounting unit 31 based on the detection result of the position detection sensor 252 .

Also in this embodiment, since the substrate P is conveyed in a state of being suspended by the jet of gas as described above, it can be transferred to the plate holder 109 in a state of high flatness without twisting, and it is possible to prevent damage to the substrate P. Air stagnation or an air layer is generated between the board mounting part 31 and the substrate mounting part 31 . Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 109 in the state with high flatness. Therefore, predetermined exposure can be performed with high precision at an appropriate position on the board|substrate P, and the exposure process with high reliability can be realized.

In addition, since the operation|movement of carrying out the board|substrate P from the plate holder 109 after completion|finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate|omitted.

(fourth embodiment)

Next, the structure of the fourth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 1st Embodiment, and description is abbreviate|omitted. As shown in FIG. 21 , the fourth embodiment is mainly different from the first embodiment in that the table 40 for carrying in a board and the table 50 for carrying out a board are arranged at positions overlapping each other in plan view. That is, when the substrate P is transferred to and from the plate holder 9 , the carrying-in table 40 and the carrying-out table 50 move up and down with respect to the plate holder 9 .

Hereinafter, the transfer operation of the board|substrate P of this embodiment is demonstrated with reference to FIG. 22A, FIG. 22B, and FIG. 22C.

After the exposure process with respect to the board|substrate P mounted on the plate holder 9 is complete|finished, the stage 50 for carrying out is arranged in the state approaching the plate holder 9 along the Y direction. In the present embodiment, as shown in FIG. 22A , the unloading table 50 that is on standby below is raised to a position where the substrate P can be received with respect to the plate holder 9 . At this time, the upper surface of the table 50 for carrying out can also be arrange|positioned lower than the upper surface of the plate holder 9 (refer FIG. 13).

In addition, while the exposure process is performed on the board|substrate P, the next board|substrate P is transferred from the coater developing machine (not shown) to the stage 40 for carrying in. Thereby, the carrying-in stage 40 waits above the plate holder 9 with the next substrate P placed thereon while the substrate P is being carried out from the plate holder 9 to the carrying-out stage 50 .

The plate holder 9 stops the driving of the vacuum pump, and releases the suction and holding of the substrate P passing through the suction hole K1 to the substrate mounting portion 31 . Next, the plate holder 9 injects gas from the gas injection hole K2, and supports the board|substrate P in a floating state by this gas (refer FIG. 14A - FIG. 14C). On the other hand, when the carry-out unit 5 receives the substrate P, the gas is sprayed from the plurality of gas injection holes K5 formed on the upper surface of the table 50 for carry-out. At this time, the gas injected from the gas injection holes K2 and K5 can also be directed.

As shown in FIG. 22B , the carry-out unit 5 moves the substrate P held by the suction unit 52 b in the Y direction in the figure, similarly to the first embodiment. At this time, since the board|substrate P is supported in the state which floated on the plate holder 9, the board|substrate P slides smoothly on the stage 50 for carrying out. In addition, the upper surface of the table 50 for carrying out becomes a suspension support board|substrate P as mentioned above. Therefore, the board|substrate P is smoothly transferred to the upper surface of the table 50 for carrying out.

After the movement of the substrate P is completed, the carry-out table 50 stops the gas injection from the gas injection hole K5, and adsorbs and holds the substrate P through the suction hole K6. The table 50 for carrying out moves the board|substrate P downward, as shown to FIG. 22C, in the state which adsorb|sucked and held the board|substrate P. In addition, when the size of the substrate P is large and is placed in a state protruding from the upper surface of the table 50 for carrying out, the table 50 for carrying out is separated from the plate holder 9 so that the substrate P does not interfere with the plate holder 9 . The above-mentioned descending operation is performed in a state retreating in the +Y direction in the figure.

On the other hand, the unloading table 50 starts the descending operation, and the loading table 40 standing above the plate holder 9 descends to a position where the substrate P can be transferred to the plate holder 9 as shown in FIG. 22C . Thereby, the plate holder 9 and the table 40 for carrying in are arranged in the state approached along the Y direction. At this time, the upper surface of the table 40 for carrying in can also be arrange|positioned lower than the upper surface of the plate holder 9 (refer FIG. 8).

The carrying-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the board holder 9 receives the board|substrate P, gas is sprayed from the some gas injection hole K2 formed in the upper surface first. At this time, the gas injected from the gas injection holes K2 and K5 can also be directed.

The carrying-in part 4 makes the contact part 42b contact|abut the one end part of the board|substrate P in the state which float-supported the board|substrate P on the table 40 for carrying in. The contact part 42b moves the board|substrate P toward the plate holder 9 side by moving along the guide part 42a in the recessed part 40a (refer FIG.9,10).

Since the board|substrate P is in the state suspended on the stage 40 for carrying in, it slides to the side of the board holder 9 smoothly. Moreover, since the upper surface of the plate holder 9 is used to support the substrate P in a floating state as described above, the substrate P is smoothly transferred from the loading table 40 to the plate holder 9 as shown in FIG. 22D .

The board|substrate P can be placed in the state aligned with the predetermined position with respect to the board|substrate mounting part 31 by the guide pin 36 and the positioning pin 37 similarly to 1st Embodiment (refer FIG. 9). Next, the substrate P is exposed to light.

In the present embodiment, the exposed substrate P placed on the carry-out stage 50 is carried out while the substrate P is carried in from the carry-in unit 4 to the plate holder 9 or while the substrate P is subjected to exposure processing.

In this embodiment, the carrying-in part 4 and the carrying-out part 5 move in the height direction (Z direction) with respect to the board holder 9 and alternately successively as mentioned above, and can carry out the operation|movement of carrying in and out the board|substrate P with respect to the exposure apparatus main body 3. Moreover, since the carrying-in unit 4 and the carrying-out unit 5 are on standby above the plate holder 9 when not in use, and can be connected to the plate holder 9 by moving up and down respectively, the processing time accompanying the carrying-in/out operation of the substrate P can be shortened ( The so-called production distance (Takt)).

In addition, in the above-mentioned embodiment, although the first direction in which the table 40 for carrying in and the plate holder 9 are arranged is described to be parallel to the second direction in which the table 50 for carrying out and the plate holder 9 are arranged, the present invention is not limited to Therefore, the present invention can also be applied to the case where the above-mentioned first direction and second direction are different directions (for example, stock exchange).

(fifth embodiment)

Next, the structure of the fifth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 1st Embodiment, and description is abbreviate|omitted. The fifth embodiment is mainly different in that it includes a carry-in section functioning as a carry-in section and a carry-out section.

FIG. 23 shows a perspective view of the internal structure of the chamber, and FIGS. 24A and 24B show a plan view of a schematic structure of the carry-in/out unit 400 .

As shown in FIG. 23 , the carry-in/out unit 400 includes a substrate mounting table 401 and a moving mechanism 402 for moving the substrate mounting table 401 . In addition, the moving mechanism 402 has the same configuration as the first and second moving mechanisms 33 and 43 of the first embodiment. With such a configuration, the substrate stage 401 can move within a predetermined area of the guide surface on the light emitting side (the image plane side of the projection optical system PL) while holding the substrate P. In addition, the substrate stage 401 can also move in the Z-axis direction. Therefore, the substrate mounting table 401 functions as a table for carrying in and a table for carrying out.

As shown in FIGS. 24A and 24B , the carry-in/out unit 400 includes a transfer unit 405 that transfers the substrate P from the substrate mounting table 401 to the plate holder 9 . The transfer unit 405 includes a guide unit 406 and an adsorption unit 408 adsorbed and held on the substrate P. As shown in FIG.

On the upper surface of the substrate mounting table 401, two groove-shaped recesses 401a are formed along one direction (the Y direction shown in the drawing). The above-mentioned guide part 406 is provided in this concave part 401a. The above-described suction unit 408 is attached to the guide unit 406 in a state protruding from the upper surface of the substrate mounting table 401 . The suction unit 408 includes, for example, a vacuum suction pad that holds the substrate P by vacuum suction.

In addition, a plurality of gas injection holes K7 are provided on the upper surface of the substrate mounting table 401 for injecting gas such as air to the lower surface of the substrate P to levitate and support the substrate P through the gas. Each gas injection hole K7 is connected to an unillustrated gas injection pump. Furthermore, a plurality of suction holes K8 are provided on the upper surface of the substrate mounting table 401 for making the substrate P closely adhere to this surface. Each suction hole K8 is connected to a vacuum pump not shown. In addition, the gas injection holes K7 and the suction holes K8 are alternately arranged in a grid pattern.

In addition, a through hole 407 is formed in the substrate mounting table 401, and the through hole 407 can be used as a substrate support for a vertical movement mechanism for transferring the substrate P between a coating and developing machine (not shown) as described later. Underwriting through.

The board holder 9 is provided with the said position detection sensor 19 which detects the relative position with the board|substrate mounting table 401 in the side part similarly to the said embodiment. The position detection sensor 19 includes a distance detection sensor 19a for detecting a relative distance to the substrate mounting table 401 and a height detection sensor 19b for detecting a relative height to the substrate mounting table 401 (see Figure 3B).

Next, the transfer operation of the substrate P between the carry-in/unload unit 400 and the plate holder 9 will be described with reference to the drawings. First, the board|substrate P to which the photosensitive agent was coated with the coating developing machine (not shown) is carried in to the carrying-in/out part 400. As shown in FIG. At this time, the vertical movement mechanism 409 located below the substrate mounting table 401 first arranges the substrate support pin 410 above the substrate mounting table 401 through the through hole 407 . Next, an arm portion 48 of a coating and developing machine (not shown) is inserted between the substrate support pins 410 as shown in FIG. 25 . After the arm part 48 descends, the board|substrate P is handed over to the board|substrate support pin 410, and it withdraws from the carrying-out part 400. The up-and-down mechanism 409 lowers the substrate support pin 410 supporting the substrate P to complete the carrying-in operation of the substrate P to the substrate stage 401 . Thereafter, the substrate P is sucked and held on the upper surface of the substrate stage 401 through the suction hole K8 by driving the vacuum pump.

Next, the plate holder 9 is moved so as to approach the substrate mounting table 401 of the carry-in/out unit 400 . In addition, when the substrate mounting table 401 and the plate holder 9 are aligned, the transfer unit 405 is driven to move the substrate mounting table 401 and the plate holder 9 to the transfer position of the substrate P in a short time, thereby shortening the loading operation of the substrate P. the time required. In this case, since the substrate P is sucked and held on the upper surface of the substrate stage 401 through the suction hole K8, the substrate P can be prevented from moving on the substrate stage 401 when the transfer unit 405 is driven.

In the present embodiment, as shown in FIG. 26 , the plate holder 9 is brought close to the substrate stage 401 so that the upper surface of the substrate stage 401 supporting the substrate P is higher than the upper surface of the plate holder 9 . In addition, by arranging the plate holder 9 and the substrate mounting table 401 in a contact state, the movement distance of the substrate P can be shortened, and the transfer can be performed more smoothly.

Next, as shown in FIG. 26, the substrate stage 401 injects gas from a plurality of gas injection holes K7 formed on the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the board holder 9 receives the board|substrate P, gas is sprayed from the some gas injection hole K2 formed in the upper surface first. At this time, the gas injected from the gas injection holes K2 and K7 can also be directed.

The loading/unloading unit 400 sucks and holds one end portion of the substrate P by the suction unit 408 in a state where the substrate P is suspended and supported on the substrate stage 401 . The suction part 408 moves the board|substrate P toward the plate holder 9 side by moving along the guide part 406 in the recessed part 401a (refer FIG.24A and 24B).

Since the substrate P is suspended on the substrate stage 401 , the suction portion 408 b can smoothly slide the substrate P to the plate holder 9 side. In addition, the upper surface of the board holder 9 serves as the floating support board|substrate P as mentioned above.

Therefore, the substrate P slid on the upper surface of the substrate mounting table 401 by the suction unit 408 is smoothly transferred to the upper surface of the plate holder 9 . In this embodiment, since the upper surface of the substrate mounting table 401 is higher than the upper surface of the plate holder 9 as shown in FIG. 26, the substrate P can be smoothly transferred to the plate holder 9 without touching the side surface of the plate holder 9 superior.

The board|substrate P will be in the state aligned with the board|substrate mounting part 31 at a predetermined position by abutting the guide pin 36 and the positioning pin 37 provided in the peripheral part of the plate holder 9 (refer FIG. 9).

Also in this embodiment, since the substrate P is conveyed in a state of being suspended by the jet of gas as described above, it is possible to prevent air stagnation or an air layer between the substrate P and the substrate mounting portion 31, and it is possible to prevent the substrate P from The placement of P is shifted or deformed. Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 9 in the state with high flatness. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 through the suction hole K1. Next, after the board|substrate P is mounted on the plate holder 9, the board|substrate P is subjected to exposure processing.

After the exposure process is completed, the plate holder 9 moves so as to approach the substrate stage 401 of the carry-in/unload unit 400 . In the present embodiment, the plate holder 9 and the substrate mounting table 401 are brought close to each other so that the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401 .

In addition, when the substrate mounting table 401 and the plate holder 9 are aligned, the time required for the unloading operation of the substrate P can be shortened by moving the substrate mounting table 401 . In addition, it is also possible to arrange the plate holder 9 and the substrate mounting table 401 in a contact state. Thereby, since no gap is formed between the plate holder 9 and the substrate mounting table 401, the transfer of the substrate P can be performed smoothly.

The plate holder 9 stops the driving of the vacuum pump, and releases the suction and holding of the substrate P passing through the suction hole K1 to the substrate mounting portion 31 . Next, as shown in FIG. 27 , the plate holder 9 injects gas from a plurality of gas injection holes K2 formed on the upper surface of the substrate mounting portion 31 , and supports the substrate P in a floating state by the gas. On the other hand, when the carry-out unit 5 receives the substrate P, gas is first injected from the plurality of gas injection holes K7 formed on the upper surface of the substrate mounting table 401 . At this time, the gas injected from the gas injection holes K2 and K7 can also be directed.

The carry-in/out unit 400 moves the suction unit 408 of the transfer unit 405 along the guide unit 406 to the side of the substrate P suspended and supported on the substrate mounting unit 31 of the board holder 9 . The suction unit 408 suction-holds the substrate P, and moves the substrate P in the +Y direction in the figure (see FIGS. 24A and 24B ).

At this time, since the substrate P is supported in a state suspended on the plate holder 9 , the suction unit 408 can smoothly slide the substrate P to the substrate stage 401 side. In addition, the upper surface of the substrate mounting table 401 serves as the floating support substrate P as described above.

Therefore, the substrate P slid on the upper surface of the substrate mounting section 31 is smoothly transferred to the upper surface of the substrate mounting table 401 . In this embodiment, since the upper surface of the plate holder 9 is higher than the upper surface of the substrate mounting table 401 , the substrate P can be smoothly transferred onto the substrate mounting table 401 without contacting the side surface of the substrate mounting table 401 .

After the movement of the substrate P by the adsorption unit 408 is completed, the substrate mounting table 401 stops the gas injection from the gas injection hole K7, and adsorbs and holds the substrate P through the suction hole K8. The carry-in/out unit 400 drives the transfer unit 405 to move the substrate stage 401 to the position where the substrate P is carried out in a state where the substrate P is sucked and held.

Next, the exposed substrate P placed on the substrate mounting table 401 is carried out. At this time, the vertical movement mechanism 409 located below the substrate mounting table 401 arranges the substrate support pin 410 above the substrate mounting table 401 through the through hole 407 . Accordingly, the substrate P is held above the substrate stage 401 by being supported by the substrate support pins 410 (see FIG. 25 ). Next, the arm part 48 of a coating developer (not shown) is inserted between the board|substrate support pins 410, and the board|substrate P is transferred to the arm part 48 by lowering the board|substrate support pin 410. The arm part 48 moves the board|substrate P in the coater developing machine (not shown), and develops it.

According to this embodiment, since the substrate P supported by suspension can be slid to be transported from the carry-in/out unit 400 to the plate holder 9, it is possible to prevent air stagnation or an air layer between the substrate P and the substrate mounting unit 31, and prevent Occurrence of mounting deviation or deformation of the substrate P. Therefore, highly reliable exposure processing can be performed. Moreover, since the carrying-in/out unit 400 also serves as the carrying-in unit 4 and the carrying-out unit 5 in the first to third embodiments described above, the device configuration can be simplified.

In addition, in the fifth embodiment, when the substrate P is transferred from the substrate mounting table 401 to the plate holder 9, the upper surface of the substrate mounting table 401 can be inclined. Specifically, the movement mechanism 402 inclines the upper surface of the substrate stage 401 supporting the substrate P in a state of being suspended by the gas injection from the gas injection holes K7 toward the plate holder 9 side (θY). Thereby, the board|substrate P can be moved to the board|plate holder 9 side using the dead weight of the board|substrate P.

In addition, it is also possible to incline the upper surface of the plate holder 9 when the substrate P is transferred from the plate holder 9 to the substrate mounting table 401 . Specifically, the first moving mechanism 33 (holding unit 34 ) inclines the upper surface of the plate holder 9 that supports the substrate P in a state of being suspended by the gas jet from the gas jet hole K2 toward the side of the substrate stage 401 (θY). Thereby, the board|substrate P can be moved to the side of the board|substrate mounting table 401 by utilizing the dead weight of the board|substrate P. As shown in FIG.

In addition, in this embodiment, the roller mechanism 148 shown in 2nd Embodiment can also be employ|adopted as the transfer part 405. FIG. Moreover, as the transfer part 405, the adsorption|suction part 408 which comprises the transfer part 405 can also be provided in the plate holder 9 side as shown in 3rd Embodiment.

(sixth embodiment)

Next, the configuration of the sixth embodiment of the present invention will be described. In addition, in the following description, the same code|symbol is attached|subjected to the same component as the said embodiment, and the description is simplified or omitted.

FIG. 28 is a cross-sectional plan view showing a schematic configuration of the exposure apparatus according to this embodiment, and FIG. 29 is a perspective view showing a schematic configuration of the device in the chamber.

The exposure apparatus 1 is provided with the exposure apparatus main body 3 and the carrying-in part 4, as shown in FIG. 28 similarly to the said embodiment. Moreover, in this embodiment, the exposure apparatus 1 is equipped with the carrying out robot arm 205. As shown in FIG. These are accommodated in a chamber 2 that is highly purified and adjusted to a predetermined temperature.

As shown in FIG. 29, the unloading robot arm 205 has, for example, a horizontal articulated structure, and includes an arm 10 composed of a plurality of parts connected by a vertical joint axis, a fork 12 connected to the front end of the arm 10, and a drive. device 13. The arm portion 10 is movable in, for example, the vertical direction (Z-axis direction) by the driving device 13 . The driving device 13 is driven by a control device not shown in the figure. Thereby, the unloading robot arm 205 takes in the board|substrate P from the board holder 9. As shown in FIG. In addition, the unloading robot arm 205 is not limited to a robot arm of a horizontally articulated structure, and it can also be realized by appropriately adopting or combining a known robot arm (generally, a transport mechanism).

FIG. 30A shows a plan view of the panel holder 9 , and FIG. 30B shows a side view of the panel holder 9 . In this embodiment, as shown in FIG. 30A , a substrate mounting portion 31 on which a substrate P is mounted is formed on the plate holder 9 .

Moreover, in this embodiment, the groove part 30 for accommodating the fork part 12 of the carrying out robot arm 205 at the time of carrying out the board|substrate P is formed in the plate holder 9. As shown in FIG. The groove portion 30 is formed along the moving direction of the fork portion 12 (Y direction in the drawing). The region other than the groove portion 30 on the upper surface of the fork portion 9 constitutes the above-mentioned substrate mounting portion 31 .

In addition, the thickness of the fork portion 12 is smaller than the depth of the groove portion 30 . Thereby, after accommodating the fork part 12 in the groove part 30 as mentioned later, the board|substrate P mounted on the board|substrate mounting part 31 is transferred and mounted on the fork part 12 by raising it.

As in FIG. 3B , as shown in FIG. 30B , the panel holder 9 is equipped with a position detection sensor 19 that detects a relative position to the table 40 for carrying in on the side surface 9 a. The position detection sensor 19 includes a distance detection sensor 19 a for detecting a relative distance to the loading table 40 and a height detection sensor 19 b for detecting a relative height to the loading table 40 . Moreover, a recess is formed in the position corresponding to the position detection sensor 19 in the table 40 for carrying in, By this, the interference of the position detection sensor 19 and the table 40 for carrying in is prevented.

Next, the operation of the exposure apparatus 1 of this embodiment will be described with reference to FIGS. 6 , 11 , and 31A to 34 . Specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out robot 205 will be mainly described.

First, the board|substrate P to which the photosensitive agent was coated with the coating developing machine (not shown) is carried in to the carrying-in part 4. As shown in FIG. At this time, the vertical motion mechanism 49 located below the table 40 for carrying in first arranges the substrate support pin 49 a above the table 40 for carrying in through the through hole 47 . Next, an arm portion 48 of a coating and developing machine (not shown) is inserted between the substrate support pins 49a as shown in FIG. 6 . After the arm part 48 descends and the board|substrate P is handed over to the board|substrate support pin 49a, it withdraws from the carrying-in part 4. The up-and-down mechanism 49 lowers the substrate support pin 49 a supporting the substrate P to complete the loading operation of the substrate P to the loading table 40 . Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the carrying-in table 40 through the suction hole K4.

Next, as shown in FIG. 31A , the panel holder 9 moves so as to approach the loading table 40 of the loading section 4 . In addition, illustration of the unloading robot arm is omitted in FIGS. 31A and 31B .

Specifically, the first moving mechanism 33 arranges the panel holder 9 and the table 40 for carrying in in a state approaching in the Y direction. Here, the state where the plate holder 9 and the loading table 40 are close together refers to a state separated by a distance for smooth movement of the substrate P at the time of transfer of the substrate P described later.

In addition, the second moving mechanism 43 can be driven when the carrying-in table 40 and the panel holder 9 are aligned. In this way, the carrying-in table 40 and the plate holder 9 can be moved to the transfer position of the substrate P in a short time, and the time required for the carrying-in operation of the substrate P can be shortened. At this time, since the substrate P is sucked and held on the upper surface of the carrying-in table 40 through the suction hole K4, it is possible to prevent the substrate P from moving on the carrying-in table 40 when the second moving mechanism 43 is driven.

In the present embodiment, as shown in FIG. 31B , when the plate holder 9 and the loading table 40 are approached, the substrate P is disposed so that the plate holder 9 is high. That is, the first moving mechanism 33 brings the board holder 9 closer to the board holder 9 so that the upper surface of the board holder 9 on which the board P is supported is higher than the upper face of the board holder 9 . In addition, it is also possible to raise the table 40 for carrying in by the 2nd moving mechanism 43 so that the upper surface of the table 40 for carrying in may become higher than the upper surface of the plate holder 9. As shown in FIG.

Moreover, the 1st moving mechanism 33 can arrange|position the plate holder 9 and the table 40 for carrying in in the state which contacted. Thus, the transfer of the board|substrate P between the plate holder 9 mentioned later and the table 40 for carrying in can be performed smoothly.

Next, as shown in FIG. 32 , the carrying-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the board holder 9 receives the board|substrate P, gas is sprayed from the some gas injection hole K2 formed in the upper surface first.

The carrying-in unit 4 brings the abutting portion 42b into contact with one end of the substrate P as shown in FIG. The contact part 42b moves the board|substrate P toward the plate holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board|substrate P is in the state floating on the stage 40 for carrying in, the contact part 42b can slide the board|substrate P to the board|plate holder 9 side smoothly. In addition, the upper surface of the plate holder 9 becomes the floating support board|substrate P as mentioned above. Here, the gas injected from the gas injection holes K3 and K2 may also be directed.

The board|substrate P which slides on the upper surface of the table 40 for carrying in via the contact part 42b is smoothly transferred to the upper surface of the plate holder 9, as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the board holder 9, the board|substrate P can be smoothly transferred to the board holder 9 without contacting the side surface of the board holder 9.

As shown in FIG. 33, the board|substrate P slides in the state prescribed|regulated by the guide pin 36 provided in the peripheral part of the board holder 9 at the position of the X direction in this figure. The abutting portion 42b moves the substrate P until it abuts against the positioning pin 37 provided on the downstream side in the substrate transfer direction in the plate holder 9 . The board|substrate P is defined by the guide pin 36 at the position of the X direction in this figure, and is pinched by the positioning pin 37 and the contact part 42b, and the position of the Y direction in the figure is defined. The plate holder 9 stops gas injection from the gas injection holes K2. As shown in FIG. 11 , the substrate P is placed in a state aligned with the substrate placing portion 31 .

In addition, conventionally, when a substrate is placed on a plate holder, placement deviation of the substrate (positional deviation from a predetermined placement position) or deformation of the substrate may occur. One of the causes of this mounting deviation may be that, for example, the substrate is in a floating state due to a thin air layer generated between the substrate and the plate holder immediately before the substrate is mounted. In addition, one of the causes of deformation of the substrate may be, for example, that after the substrate is mounted, air is trapped between the substrate and the plate holder, and the substrate is in a swollen state.

On the other hand, in this embodiment, since the board|substrate P is conveyed in the state suspended by the jet of gas as mentioned above, it is transferred to the plate holder 9 in the state of high flatness without distortion. In addition, since the substrate P is placed on the substrate mounting portion 31 from the height of the floating support, it is possible to prevent air stagnation or an air layer from being generated between the substrate P and the substrate mounting portion 31 . Therefore, it is possible to suppress the substrate P from being in a swollen state, and to prevent the substrate P from being misplaced or deformed. Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 9 in the state with high flatness. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 through the suction hole K1.

After the board|substrate P is mounted on the plate holder 9, the mask M is illuminated with the exposure light IL from an illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P mounted on the plate holder 9 through the projection optical system PL.

Since the board|substrate P can be satisfactorily mounted on the plate holder 9 as mentioned above, predetermined exposure can be performed with high precision at the appropriate position on the board|substrate P, and highly reliable exposure processing can be realizable.

In this embodiment, during the exposure process on the substrate P, or as described later, while the exposed substrate P is transported by the unloading robot arm 205, the coating layer coated with a coating developer (not shown) can be coated. The subsequent substrate P of the photosensitive agent is placed on the loading stage 40 of the loading section 4 .

Next, the unloading operation of unloading the substrate P from the plate holder 9 after the exposure process is completed will be described.

Specifically, a method for unloading the substrate P by the unloading robot arm 205 will be described. 35 is a perspective view for explaining the action of the unloading robot arm 205. FIGS. 36A and 36B are cross-sectional structural views viewed from the Y-axis direction when the substrate P is unloaded from the plate holder 9. FIG. 37 shows the substrate P viewed from the X-axis direction. A side view of the plate holder 9 during the unloading operation. In addition, only the fork part 12 is shown in FIG. 35, and the whole structure of the carrying out robot arm 205 is abbreviate|omitted. In addition, in FIGS. 36A and 36B , the illustration of the fork portion 12 supporting the substrate P is simplified for convenience of description.

After the exposure process is completed, the suction of the suction hole K1 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9 . Next, the unloading robot arm 205 inserts the fork 12 into the groove 30 formed in the plate holder 9 from the −Y direction side as shown in FIG. 35 .

Next, the driving device 13 moves the fork 12 upward by a predetermined amount, thereby bringing the fork 12 into contact with the lower surface of the substrate P as shown in FIG. 36A . In addition, as shown in FIG. 36B , the fork 12 moves further upward, whereby the substrate P is lifted up above the plate holder 9 and separated from the substrate mounting portion 31 .

Furthermore, the unloading robot arm 205 raises (retreats) the fork 12 to a height that does not contact the loading table 40 of the loading section 4 (the next substrate P on which the photosensitive agent is applied is placed). After the fork portion 12 has risen until it does not contact the substrate P on the loading table 40, as shown in FIG. Holder 9 side transfer.

While the substrate P is being conveyed from the carry-in unit 4 to the plate holder 9 , the carry-out robot arm 205 moves the substrate P placed on the fork 12 into a coating and developing machine (not shown). In this manner, the unloading operation of the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the board P supported by the suspension can be slid to be transported from the loading unit 4 to the board holder 9, it is possible to prevent air stagnation or an air layer from occurring between the board P and the board mounting unit 31. , it is possible to prevent the substrate P from being misplaced or deformed. Therefore, highly reliable exposure processing can be performed.

In addition, in this embodiment, since the substrate P is slid and loaded from the loading unit 4 to the plate holder 9 using the gas jet, the lead time is longer than that of loading the substrate into the plate holder 9 using a conventional tray. .

On the other hand, in the present embodiment, since the fork 12 of the unloading robot arm 205 can be inserted into the groove portion 30 and the substrate P can be pushed up from below to move the substrate P from the plate holder 9, it can be moved by the carrying-in portion 4 Since the next substrate P is carried into the board holder 9, the overall lead time required for carrying the board P into and out of the board holder 9 can be substantially the same as when using a conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the lead time when carrying the substrate P in and out.

In addition, in this embodiment, when the board|substrate P is conveyed from the table 40 for carrying in to the plate holder 9, the upper surface of the table 40 for carrying in can be made to incline. Specifically, the holder 44 of the second moving mechanism 43 inclines the upper surface of the loading table 40 supporting the substrate P in a state of being suspended by the gas injection from the gas injection hole K3 toward the plate holder 9 side (θY). Thereby, the board|substrate P can be moved to the board|plate holder 9 side using the dead weight of the board|substrate P.

(seventh embodiment)

Next, the structure of the seventh embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 6th Embodiment, and description is abbreviate|omitted. The seventh embodiment differs from the sixth embodiment in the configuration of the carrying-in unit.

In this embodiment, the carrying-in part 104 is the same as what was demonstrated using FIG. 16A and FIG. 16B.

Moreover, the operation|movement of the exposure apparatus 1 in this embodiment is the same as what demonstrated using FIG.17 and FIG.18.

In this embodiment, since the substrate P is transported in a state of being suspended by the jet of gas as described above, it can be transferred to the plate holder 9 in a high flatness state without twisting, and it is possible to prevent the substrate P from being placed on the substrate. Air stagnation or an air layer is generated between the placement parts 31. Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 9 in the state with high flatness. Therefore, predetermined exposure can be performed with high precision at an appropriate position on the board|substrate P, and the exposure process with high reliability can be realized.

(eighth embodiment)

Next, the structure of the eighth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 6th and 7th embodiment, and description is abbreviate|omitted. The main difference between the eighth embodiment and the sixth and seventh embodiments is that the plate holder 109 includes a transfer unit.

FIG. 38 is a diagram showing the structure of the plate holder 109 of this embodiment. The plate holder 109 of this embodiment is provided with the 1st transfer part 249 which transfers the board|substrate P from the table 40 for carrying in to the plate holder 109, as shown in FIG. The first transfer unit 249 includes an adsorption unit 250 that absorbs and holds both sides of the substrate P in the width direction. The suction unit 250 can move freely in the XY plane along the direction of the substrate P surface.

Moreover, in this embodiment, the position detection sensor 252 for detecting the position of the board|substrate P carried in by the 1st transfer part 249 with respect to the board|substrate mounting part 31 is provided in the peripheral part of the board|plate holder 109. As shown in FIG. As this position detection sensor 252, for example, a potentiometer can be exemplified, and the present invention can use any counter of a contact method or a non-contact method.

The adsorption unit 250 adsorbs and holds the end of the substrate P suspended and supported on the loading table 40 by the gas injection from the gas injection hole K3, and transfers it from the loading table 40 to the plate holder 109 side as shown in FIG. 39A . . On the other hand, when the board holder 109 receives the board|substrate P, gas is sprayed from the some gas injection hole K2 formed in the upper surface first. At this time, the gas injected from the gas injection holes K2 and K3 can also be directed.

As shown in FIG. 39B , the adsorption unit 250 makes the end of the substrate P contact the position detection sensor 252 , so that the exposure apparatus 1 can detect the positional deviation of the substrate P relative to the substrate mounting unit 31 . In addition, the adsorption unit 250 is configured to be driven based on the detection result of the above-mentioned position detection sensor 252 .

Therefore, the exposure apparatus 1 can correct the position of the substrate P held by the adsorption unit 250 relative to the substrate mounting unit 31 based on the detection result of the position detection sensor 252 .

Also in this embodiment, since the substrate P is conveyed in a state of being suspended by the jet of gas as described above, it can be transferred to the plate holder 109 in a state of high flatness without twisting, and it is possible to prevent damage to the substrate P. Air stagnation or an air layer is generated between the board mounting part 31 and the substrate mounting part 31 . Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 109 in the state with high flatness. Therefore, predetermined exposure can be performed with high precision at an appropriate position on the board|substrate P, and the exposure process with high reliability can be realized.

In addition, since the operation|movement of carrying out the board|substrate P from the plate holder 109 after completion|finish of an exposure process is the same as that of 1st Embodiment, the description is abbreviate|omitted.

(ninth embodiment)

Next, the structure of the ninth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 6th - 8th embodiment, and description is abbreviate|omitted. The main difference between the ninth embodiment and the sixth to eighth embodiments is the configuration of the exposure apparatus. FIG. 40 is a perspective view showing a schematic configuration of the exposure apparatus main body 3 of this embodiment.

As shown in FIG. 40 , the exposure apparatus main body 3 of the present embodiment includes a plate holder 9 , a substrate lifting mechanism 150 provided on the plate holder 9 , and a first moving mechanism 33 . The substrate lifting mechanism 150 is used to lift the substrate P upward when the substrate P is carried out.

FIG. 41 shows a plan view of the panel holder 9. FIGS. 42A and 42B are side sectional views of the panel holder 9. FIG. 42A is a diagram showing the state before the substrate is handed over, and FIG. 42B is a diagram showing the state after the substrate is handed over. picture.

As shown in FIGS. 41 , 42A, and 42B, the substrate lifting mechanism 150 includes a plurality of substrate support members 151 that support the substrate P and a vertical motion unit 152 that moves the substrate support members 151 up and down (see FIG. 43 ).

The substrate support member 151 includes a first linear member 119 erected in the X direction (first direction) in FIG. 41 and a second linear member 119 erected in the Y direction (second direction) in FIG. The linear member 120 is generally formed in a lattice shape as a whole. The first linear member 119 and the second linear member (second erecting portion) 120 are welded to each other here, or combined in a grid. Each substrate support member 151 is spanned between a plurality of (for example, six in this embodiment) shaft portions 155 .

Each lattice shape constituting each substrate supporting member 151 has a plurality of substantially rectangular openings 121 smaller than the substrate P. As shown in FIG. In addition, the shape of the board|substrate support member 151 is not limited to the shape shown in FIG. 41, For example, the frame-shaped single frame which formed only one opening part 121 may be sufficient.

In the present embodiment, the four substrate supporting members 151 are arranged with a gap S in the direction in which the second linear member 120 extends (the Y direction shown in FIG. 41 ). The gap S between the substrate support members 151 is used to form a space for inserting the fork 12 when the substrate P is carried out from the board holder 9 as will be described later.

In addition, as the forming material of the substrate support member 151 (the first linear member 119 and the second linear member 120), it is preferable to use a material capable of suppressing the deflection of the substrate P due to its own weight when the substrate support member 151 supports the substrate P. , for example various synthetic resins or metals can be used. Specifically, nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber-reinforced plastic, stainless steel, etc. are mentioned. Examples of fiber-reinforced plastics include GFRP (Glass Fiber Reinforced Plastic: glass fiber reinforced plastic) and CFRP (Carbon Fiber Reinforced Plastic: carbon fiber reinforced plastic).

The vertical movement part 152 has the shaft part (up-and-down movement member) 155, and the drive device 153 which drives this shaft part 155 up and down, as shown in FIG. The driving device 153 is provided for each shaft part 155, whereby each shaft part 155 moves up and down independently.

Based on this configuration, as shown in FIGS. 42A and 42B , the substrate supporting member 151 moves up and down with respect to the substrate mounting portion 31 of the plate holder 9 as the vertical movement portion 152 (shaft portion 155 ) moves up and down.

On the other hand, a recess 130 for accommodating the substrate supporting member 151 is formed in the board holder 9 . The recesses 130 are provided in a lattice shape corresponding to the frame structure of the substrate supporting member 151 . The area (partial mounting portion) other than the concave portion 130 on the upper surface of the board holder 9 constitutes the substrate mounting portion 31 that holds the substrate P. As shown in FIG.

The thickness of the substrate supporting member 151 is smaller than the depth of the concave portion 130 . Thereby, as shown in FIG. 42B , the substrate P placed only on the substrate support member 151 by the substrate support member 151 being accommodated in the concave portion 130 is transferred to the substrate placement unit 31 and placed thereon.

Moreover, the board|substrate mounting part 31 is made to have favorable flatness to the substantially holding|maintenance surface of the board|substrate P with respect to the plate holder 9. As shown in FIG. In addition, a suction port for bringing the substrate P into close contact with the substrate P is formed on the substrate holding surface (upper surface) of the substrate mounting part 31, or the substrate is sucked by blowing air (gas) when the substrate is carried in, which will be described later. P is suspended and supported on the opening K205 of the function of the gas injection port on this surface. A vacuum pump and a gas injection pump (not shown) are respectively connected to the opening K205, and the opening K205 functions as a suction port or an ejection port as described above by switching the driving of these pumps.

A guide pin 36 for guiding the substrate P when the substrate P is carried in and a positioning pin 37 for defining the position of the substrate P relative to the substrate mounting portion 31 of the substrate holder 9 are provided on the peripheral portion of the panel holder 9 (refer to 44A and 44B). These guide pins 36 and positioning pins 37 are movable together with the plate holder 9 in the exposure apparatus main body 3 .

Next, the operation of the exposure apparatus 1 of this embodiment will be described with reference to FIGS. 44A to 50B. Specifically, the transfer operation of the substrate P between the carry-in unit 4 and the plate holder 9 and the transfer operation of the substrate P between the plate holder 9 and the carry-out robot 205 will be mainly described.

First, similarly to the sixth embodiment, the substrate P coated with a photosensitive agent by a coating developer (not shown) is loaded into the loading unit 4 . At this time, at this time, the board|substrate P is suction-held on the upper surface of the table 40 for carrying in through the suction hole K4.

Next, as shown in FIG. 44A , the panel holder 9 moves so as to approach the loading table 40 of the loading section 4 . In addition, illustration of the unloading robot arm is omitted in FIGS. 44A and 44B . Specifically, the first moving mechanism 33 arranges the panel holder 9 and the table 40 for carrying in in a state approaching in the Y direction. At this time, by driving the second moving mechanism 43 to move the carrying-in table 40 and the plate holder 9 to the transfer position of the substrate P in a short time, the time required for the carrying-in operation of the substrate P is shortened. In addition, since the substrate P is suction-held on the upper surface of the carrying-in table 40 through the suction hole K4 , it is possible to prevent the substrate P from moving on the carrying-in table 40 when the second moving mechanism 43 is driven.

In this embodiment, as shown in FIG. 44B , the first moving mechanism 33 brings the board holder 9 closer to the board holder 9 so that the upper surface of the board holder 9 supporting the substrate P is higher than the board holder 9 . In addition, it is also possible to raise the table 40 for carrying in by the 2nd moving mechanism 43 so that the upper surface of the table 40 for carrying in may become higher than the upper surface of the plate holder 9. As shown in FIG. In addition, the first moving mechanism 33 can also smoothly transfer the substrate P by arranging the plate holder 9 and the carrying-in table 40 in a contact state.

Next, as shown in FIG. 45 , the carrying-in table 40 injects gas from a plurality of gas injection holes K3 formed on the upper surface, and supports the substrate P in a floating state by the gas. On the other hand, when the plate holder 9 receives the substrate P, a gas injection pump (not shown) is first driven to inject air from the opening K205 provided in the substrate mounting portion 31 .

The carrying-in part 4 brings the board|substrate P into contact|abutment with the one end part of the board|substrate P as shown in FIG. The contact part 42b moves the board|substrate P toward the plate holder 9 side by moving along the guide part 42a in the recessed part 40a.

Since the board|substrate P is in the state floating on the stage 40 for carrying in, the contact part 42b can slide the board|substrate P to the board|plate holder 9 side smoothly. In addition, the upper surface of the plate holder 9 becomes the floating support board|substrate P as mentioned above. Here, the gas injected from the gas injection hole K3 and the opening K205 may also be directed.

The board|substrate P which slides on the upper surface of the table 40 for carrying in via the contact part 42b is smoothly transferred to the upper surface of the plate holder 9, as shown in FIG. In this embodiment, since the upper surface of the table 40 for carrying in is higher than the upper surface of the board holder 9, the board|substrate P can be smoothly transferred to the board holder 9 without contacting the side surface of the board holder 9.

The board|substrate P is defined by the guide pin 36 at the position of the X direction in this figure, and is pinched by the positioning pin 37 and the contact part 42b, and the position of the Y direction in the figure is defined. The plate holder 9 stops gas injection from the opening K205. Thereby, the board|substrate P is mounted in the state aligned with respect to the board|substrate mounting part 31. As shown in FIG.

In this embodiment, since the board|substrate P is conveyed in the state suspended by the jet of gas as mentioned above, it is transferred to the plate holder 9 in the state of high flatness without distortion. In addition, since the substrate P is placed on the substrate mounting portion 31 from the height of the floating support, it is possible to prevent air stagnation or an air layer from being generated between the substrate P and the substrate mounting portion 31 . Therefore, it is possible to suppress the substrate P from being in a swollen state, and to prevent the substrate P from being misplaced or deformed. Therefore, the board|substrate P can be mounted in the predetermined position with respect to the plate holder 9 in the state with high flatness. Thereafter, by driving the vacuum pump, the substrate P is sucked and held on the upper surface of the substrate mounting portion 31 through the opening K205.

After the board|substrate P is mounted on the plate holder 9, the mask M is illuminated with the exposure light IL from an illumination system. The pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P mounted on the plate holder 9 through the projection optical system PL.

The exposure apparatus 1 of the present embodiment, since the substrate P can be satisfactorily placed on the plate holder 9 as described above, can perform predetermined exposure with high precision at an appropriate position on the substrate P, and can achieve reliability. High exposure processing.

Next, the unloading operation of unloading the substrate P from the plate holder 9 after the exposure process is completed will be described.

Specifically, a method for unloading the substrate P by the unloading robot arm 205 will be described. 48 is a perspective view for explaining the operation of the unloading robot arm 205, and FIG. 49A, FIG. 49B, and FIG. 49C are cross-sectional configuration diagrams when viewed from the Y-axis direction when the substrate P is unloaded from the plate holder 9. In addition, only the fork part 12 is shown in FIG. 48, and the whole structure of the carrying out robot arm 205 is abbreviate|omitted. In this embodiment, the substrate supporting portion in the fork portion 12 is different from the above-described embodiment in accordance with the shape of the jacking mechanism 150 . In addition, in FIGS. 49A, 49B, and 49C, the illustration of the fork portion 12 supporting the substrate P is simplified for convenience of description.

After the exposure process is completed, the suction of the substrate P by the plate holder 9 is released by releasing the suction through the opening K205 of the vacuum pump. Next, the jacking mechanism 150 raises the substrate support member 151 to drive the shaft portion 155 . At this time, as shown in FIG. 49A , the substrate P placed on the substrate mounting portion 31 together with the substrate supporting member 151 is pushed upward. At this time, since the substrate P is supported upward by the plurality of substrate supporting members 151, it is possible to prevent the occurrence of peeling electrification. In addition, since the substrate P can be supported on a wider surface than the conventional case where the substrate P is pushed up by pins, the amount of deflection of the substrate P can be reduced, and cracks on the substrate P can be prevented.

The unloading robot arm 205 drives the fork part 12, and as shown in FIG. Then, the fork 12 is inserted into the gap S and both ends (FIG. 49B).

Next, the driving device 13 moves the fork 12 upward by a predetermined amount, so that the fork 12 comes into contact with the lower surface of the substrate P. As shown in FIG. Further moving the fork 12 upward, the substrate P is lifted up above the board holder 9 and separated from the lifting mechanism 150 .

The lifting mechanism 150 accommodates the substrate support member 151 in the recess 130 after the substrate P is separated. After the substrate supporting member 151 is accommodated in the concave portion 130 , the board holder 9 moves so as to approach the loading table 40 of the loading unit 4 , and the substrate P is conveyed toward the board holder 9 as described above.

While the substrate P is being conveyed from the carry-in unit 4 to the plate holder 9 , the carry-out robot arm 205 moves the substrate P placed on the fork 12 into a coating and developing machine (not shown). In this manner, the unloading operation of the substrate P from the exposure apparatus main body 3 is completed.

As described above, according to the present embodiment, since the floating-supported substrate P can be slid and conveyed from the carrying-in unit 4 to the plate holder 9 , it is possible to prevent the substrate P from being misplaced or deformed. Also in the present embodiment, the overall lead time required for carrying in and out of the substrate P to the plate holder 9 can be substantially the same as when using a conventional tray. Therefore, the substrate P can be carried into the plate holder 9 in a good state without increasing the lead time when carrying the substrate P in and out.

In addition, in the above embodiment, the case where the opening K205 as the gas injection port is formed only in the substrate mounting portion 31 has been described, but the gas injection port can also be formed on the upper surface of the substrate supporting member 151 . In this way, since the amount of gas sprayed onto the substrate conveyance surface increases when the substrate P is carried into the plate holder 9, the substrate P can be conveyed more smoothly.

(tenth embodiment)

Next, the structure of the tenth embodiment of the present invention will be described. In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the component of 6th Embodiment, and description is abbreviate|omitted. The main point of difference between the tenth embodiment and the above-mentioned embodiments is that a suction mechanism for suctioning the substrate P in a non-contact state is provided as means for carrying out the substrate P from the plate holder 9 .

The suction mechanism holds the substrate P, lifts the substrate P upward from the substrate mounting portion 31 of the plate holder 9, and moves it to a coating and developing machine (not shown). FIG. 50A shows the structure of the suction surface, and FIG. 50B shows a diagram of the overall structure of the suction mechanism.

As shown in FIGS. 50A and 50B , the adsorption mechanism 350 includes a plurality of holding portions 351 holding the substrate P in a non-contact state, a base portion 352 holding the holding portions 351 , and a drive mechanism 355 capable of moving the base portion 352 . The base portion 352 is a plate-like member having substantially the same size as the substrate P. As shown in FIG. The holding parts 351 are regularly arranged on the base part 352, whereby the substrate P can be well held.

A so-called Benoy chuck is used as the holding portion 351 . The holding part 351 generates a negative pressure between the substrate P and the substrate P by injecting compressed air. Thereby, a pressing force for pressing the substrate P against the holding portion 351 side is generated. On the other hand, when the gap between the holding part 351 and the substrate P becomes smaller, the flow velocity of the compressed air decreases, and the pressure between the holding part 351 and the substrate P increases. This generates a force for separating the substrate P from the holding portion 351 . The holding part 351 balances the above-mentioned two forces by injecting compressed air, thereby holding the substrate P with a constant distance between the substrate P and the holding part 351 , that is, in a non-contact state.

Next, the operation of the exposure apparatus 1 will be described with reference to the drawings. In addition, since the transfer operation|movement of the board|substrate P between the carrying-in part 4 and the plate holder 9 is the same as that of 1st Embodiment, description is abbreviate|omitted.

Hereinafter, the operation of carrying out the substrate P from the plate holder 9 will be described. Specifically, a method for carrying out the substrate P from the plate holder 9 by the suction mechanism 350 will be described. 51A and 51B are side views when the operation of carrying out the substrate P from the plate holder 9 is seen from the X-axis direction.

After the exposure process is completed, the suction of the suction hole K1 of the vacuum pump is released to release the suction of the substrate P by the plate holder 9 . Next, the suction mechanism 350 moves above the board holder 9 . Next, the suction mechanism 350 descends to a position where the holding portion 351 can hold the substrate P, as shown in FIG. 51A . Next, the upper surface of the substrate P is held in a non-contact state by a plurality of holding portions 351 . At this time, the plurality of holding parts 351 can be driven simultaneously or sequentially to hold the substrate P. As shown in FIG.

The suction mechanism 350 lifts the substrate P up above the plate holder 9 by the drive mechanism 355 in a state where the substrate P is held by the plurality of holding portions 351 , and leaves the substrate P from the substrate mounting portion 31 as shown in FIG. 51B . At this time, since the holding portion 351 is not in contact with the substrate P, no suction marks remain on the substrate P.

After the suction mechanism 350 rises to a position where it does not contact the substrate P on the carrying-in table 40 , the carrying-in table 40 of the carrying-in unit 4 moves so as to approach the plate holder 9 . Next, similarly to the above-mentioned embodiment, the board|substrate P is conveyed to the board|plate holder 9 from the table 40 for carrying in in the state of floating support.

The adsorption mechanism 350 moves the substrate P held by the holding unit 351 to a coating and developing machine (not shown) while the substrate P is carried in from the carrying-in unit 4 to the plate holder 9 . As described above, the unloading operation of the substrate P from the exposure apparatus main body 3 is completed.

In addition, as shown in FIGS. 52A and 52B , a support member 353 for supporting the lower surface of the substrate P can also be provided around the base portion 352 . The support member 353 is constituted by a frame-shaped member surrounding the substrate P, and has a plurality of protruding portions 354 protruding in the plane direction of the substrate P. As shown in FIG. The protruding portion 354 abuts against the lower surface of the substrate P. As shown in FIG. With this configuration, when holding a large substrate that may cause depression of the substrate P, since the peripheral end portion of the substrate P is supported by the protruding portion 354, even when a large substrate is held, the substrate P can be prevented from being compressed. and the substrate P can be held in a state of high flatness by the holding portion 351 .

Moreover, as the substrate P of the above-mentioned embodiment, not only a glass substrate for a display element, but also a semiconductor wafer for semiconductor element manufacturing, a ceramic wafer for a thin-film magnetic head, or a mask or reticle used in an exposure device may be used. The original version of the chip (synthetic quartz, silicon wafer), etc.

In addition, as the exposure apparatus, it is applicable to a step-and-scan type exposure apparatus ( In addition to the scanning stepper), it can also be applied to the projection exposure of the step-and-repeat method in which the pattern of the mask M is exposed once and the substrate P is moved step by step in a state where the mask M and the substrate P are stationary. device (stepper).

In addition, the present invention can also be applied to a double-stage exposure apparatus having a plurality of substrate stages as disclosed in US Patent No. 6,341,007, US Patent No. 6,208,407, and US Patent No. 6,262,796.

In addition, the present invention can also be applied to a substrate stage equipped with a holding substrate as disclosed in U.S. Patent No. 6,897,963, European Patent Application No. 1713,113, and a reference member and a reference member on which a reference mark is formed without holding a substrate. /or exposure device for measurement stages of various photoelectric sensors. In addition, an exposure apparatus including a plurality of substrate stages and a measurement stage may also be used.

In addition, in the above-mentioned embodiment, although a light-transmissive mask having a predetermined light-shielding pattern (or phase pattern, or light-reduction pattern) formed on a light-transmitting substrate is used, it is also possible to replace this mask and use, for example, the US Patent No. Publication No. 6778257 discloses a variable shape mask (also known as an electronic mask, an active mask or an image generator) for forming a transmission pattern or a reflection pattern, or a light-emitting pattern according to the electronic data of the pattern to be exposed. Moreover, instead of the variable shaping mask provided with the non-emissive image display element, a pattern forming device including a self-luminous image display element may be provided.

The exposure apparatus of the above-mentioned embodiment is manufactured by assembling various subsystems (including each constituent element) so as to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to ensure these various precisions, before and after assembly, various optical systems are adjusted to achieve optical precision, various mechanical systems are adjusted to achieve mechanical precision, and various electrical systems are adjusted to achieve Electrical precision adjustment. The assembly process from various subsystems to exposure equipment includes mechanical connection, wiring connection of circuit, piping connection of pneumatic circuit, etc. Of course, before the assembly process from various subsystems to the exposure device, there are individual assembly processes for each sub-system. After the assembly process of various subsystems to the exposure device is completed, comprehensive adjustments are made to ensure the overall accuracy of the exposure device EX. In addition, it is preferable to manufacture the exposure apparatus in a clean room where temperature, cleanliness, and the like are controlled.

For micro-elements such as semiconductor elements, as shown in Figure 53, through the step 201 of performing the function and performance design of the micro-element, the step 202 of making a mask (reticle) according to this design step, and the step of manufacturing the substrate of the element base material 203, including the substrate processing step 204 of performing substrate processing (exposure processing, including the operation of exposing the substrate with exposure light using a mask pattern and the operation of developing the substrate after exposure) according to the above-mentioned embodiment, and the component assembly step (including cutting steps, bonding steps, packaging steps, etc.) 205, and inspection steps 206, etc. In addition, step 204 includes the operation of forming an exposure pattern layer (layer of developed photosensitive agent) corresponding to the pattern of the mask by developing the photosensitive agent, and processing the substrate through the exposed pattern layer.

In addition, the requirements of each of the above-described embodiments and modifications can be appropriately combined. In addition, there are cases where some constituent elements are not used. In addition, within the scope permitted by laws and regulations, all publications and US patent disclosures related to the exposure apparatus and the like cited in the above-mentioned embodiments and modifications are incorporated as part of the description herein.

Claims (66)

1. A conveying device comprising: The first support unit supplies gas to one side of the substrate, and can support the substrate in suspension by the gas; a second supporting portion capable of supporting the one side of the substrate; a drive unit that moves at least one of the first and second support parts so that the first and second support parts approach or contact each other and align in the first direction; and The transfer unit moves the substrate supported by one of the first and second support units arranged by the driving unit toward the other side in the first direction. 2. The conveying device according to claim 1, wherein the drive unit is supported by one of the first and second support parts aligned in the first direction. The substrate is disposed at a position higher than the other of the first and second support parts. 3. The transfer device according to claim 2, wherein the driving unit arranges the first and second support units in the first direction so as to support the first and second support units of the substrate. The upper surface of one of the support parts is arranged at a position higher than the upper surface of the other of the first and second support parts. 4. The conveyance device according to any one of claims 1 to 3, wherein the drive unit is provided at least partially integrally with the second support unit. 5. The conveying device according to any one of claims 1 to 4, wherein at least a part of the drive unit is provided so as to be able to move integrally with the first support unit. 6. The transfer device according to any one of claims 1 to 5, wherein the second support unit supplies gas to the one surface of the substrate, and can support the substrate in suspension by the gas. 7. The conveying device according to any one of claims 1 to 6, wherein the first and second support parts are arranged so that at least a part thereof overlaps each other in plan view, and the drive part makes the first and second support parts overlap each other in plan view. The second support part moves at least in the vertical direction. 8. The transfer device according to any one of claims 1 to 7, wherein the transfer unit has a roller mechanism that rotates in contact with the lower surface of the substrate and defines the pair of the substrate with respect to the second substrate. The position regulation part of the position of the 1st or 2nd support part; The roller mechanism moves the substrate so that the position specifying portion abuts against it. 9. The conveying device according to any one of claims 1 to 7, wherein the transfer unit has a suction mechanism for suction-holding the end of the substrate and detects the alignment of the substrate with the first or second substrate. 2. a position detection unit for the position of the support unit; The suction mechanism moves the substrate based on a detection result of the position detection unit. 10. The transfer device according to any one of claims 1 to 9, comprising a tilting mechanism that tilts the upper surface of the first or second support portion that supports the substrate. 11. The transport device according to any one of claims 1 to 10, further comprising a position detection unit that detects a relative position between the first support unit and the second support unit. 12. A conveying device comprising: The first support unit supplies gas to one side of the substrate, and can support the substrate in suspension by the gas; the second and third supporting parts are capable of supporting the one side of the substrate; a first driving part that moves at least one of the first and second support parts so that the first and second support parts approach or contact each other and align in the first direction; a second driving part that moves at least one of the first and third support parts so that the first and third support parts approach or contact each other and align in the second direction; The first transfer unit moves the substrate supported by the second support unit arranged on the first support unit by the first driving unit toward the first support unit in the first direction. ;as well as The second transfer unit moves the substrate supported by the first support unit arranged on the third support unit by the second driving unit toward the third support unit in the second direction. . 13. The conveying device according to claim 12, wherein the first drive unit aligns the first and second support units in the first direction so that the second support unit supports the second support unit. The substrate is disposed at a position higher than the first support portion. 14. The transfer device according to claim 13, wherein the first driving unit arranges the first and second support units in the first direction to form the second support supporting the substrate. The upper part of the upper part is disposed at a position higher than the upper part of the first support part. 15. The conveying device according to any one of claims 12 to 14, wherein the second drive unit arranges the first and third support units in the second direction so that the first The substrate supported by the support portion is disposed at a position higher than that of the third support portion. 16. The transfer device according to claim 15, wherein the second driving unit arranges the first and third support units in the second direction so as to form the first support supporting the substrate. The upper part of the upper part is disposed at a position higher than the upper part of the third support part. 17. The conveying device according to any one of claims 12 to 16, wherein, the first driving part is configured such that at least a part is integrated with the second supporting part; The second drive unit is provided at least partially integrally with the third support unit. 18. The conveying device according to any one of claims 12 to 17, wherein the first and second drive units are respectively provided so that at least a part thereof can move integrally with the first support unit. 19. The transport device according to any one of claims 12 to 18, wherein the second and third support parts are arranged at different positions within the same horizontal plane. 20. The conveying device according to any one of claims 12 to 19, wherein the second and third support parts are arranged so that at least a part thereof overlaps each other in plan view, and the first and second drive parts, The second and third supporting parts are respectively moved in at least a vertical direction. 21. The transfer device according to any one of claims 12 to 20, wherein at least one of the second support portion and the third support portion supplies gas to the one side of the substrate, and can The substrate is supported by the gas suspension. 22. The conveying device according to any one of claims 12 to 21, comprising a first tilting mechanism for tilting the upper surface of the second support portion supporting the substrate, and a first tilting mechanism for tilting the upper surface of the second support portion for supporting the substrate. The second tilting mechanism for tilting the upper surface of the first supporting portion. 23. The conveying device according to any one of claims 12 to 22, further comprising a position detection unit that detects a relative position between the first support unit and the second or third support unit. 24. The transfer device according to any one of claims 12 to 23, wherein at least one of the first transfer unit and the second transfer unit has a roller that rotates in contact with the lower surface of the substrate a mechanism, and a position specifying unit that specifies a position of the substrate as a moving destination of the substrate with respect to the first support unit or the second support unit; The roller mechanism moves the substrate so that the position specifying portion abuts against it. 25. The transfer device according to any one of claims 12 to 23, wherein at least one of the first transfer unit and the second transfer unit has an adsorption mechanism for adsorbing and holding the end of the substrate, and a position detecting unit for detecting a position of the substrate relative to the first support unit or the second support unit as a moving destination of the substrate; The suction mechanism moves the substrate based on a detection result of the position detection unit. 26. The conveying device according to any one of claims 12 to 25, wherein the first drive unit aligns the first direction of the first and second support parts with the direction of the second drive unit. The second direction in which the first and third support portions are aligned is parallel. 27. The transfer device according to any one of claims 1 to 20, wherein the substrate is placed on the upper surface after the first support portion stops the supply of the gas. 28. A conveying method, conveying a substrate, comprising: At least one of the first support part capable of levitatingly supporting the substrate by the gas supplied to one surface of the substrate and the second support part capable of supporting the one surface of the substrate is moved, so that the first and An action in which the second support parts approach or contact each other and are aligned in the first direction; and An operation of moving the substrate supported by one of the aligned first and second support parts toward the other side in the first direction. 29. The transfer method according to claim 28, wherein the first and second support parts are arranged in the first direction so that the substrate supported by one of the first and second support parts is arranged. at a position higher than the other of the first and second supporting parts. 30. A conveying method, conveying a substrate, comprising: At least one of the first support part capable of levitatingly supporting the substrate and the second support part capable of supporting the one surface of the substrate is moved by the gas supplied to one surface of the substrate, so that the first and first 2. The action of the supporting parts approaching or contacting each other and being arranged in the first direction; An operation of moving the substrate supported by the second support portion arranged on the first support portion toward the first support portion side in the first direction; An operation of moving at least one of the first support part and the third support part capable of supporting the one surface of the substrate so that the first and third support parts approach or contact each other and are arranged in a second direction; as well as An operation of moving the substrate supported by the first support portion arranged on the third support portion toward the third support portion in the second direction. 31. The conveyance method according to claim 30, wherein the first and second support parts are arranged in the first direction so that the substrate supported by the second support part is arranged at a position smaller than that of the first support part. 1 The position where the supporting part is high. 32. The conveyance method according to claim 30 or 31, wherein the first and third support parts are arranged in the second direction so that the substrate supported by the first support part is arranged at a position smaller than that of the first support part. Describe the high position of the third supporting part. 33. The conveyance method according to any one of claims 30 to 32, wherein the first support portion is disposed opposite to the second support portion and the third support portion at different positions in the same horizontal plane , moving along the arrangement direction of the second support portion and the third support portion. 34. The conveying method according to any one of claims 30 to 32, wherein the first supporting portion and the first supporting portion are arranged so that at least a part thereof overlaps each other in plan view and are arranged at different positions in the vertical direction. The second and third support parts are relatively moved to align the first and second or third support parts. 35. An exposure device for exposing a substrate with exposure light, comprising: The transfer device according to any one of claims 1 to 27, which holds the substrate and moves the substrate to the irradiation area of the exposure light. 36. A method of manufacturing an element, comprising: exposing the substrate coated with a photosensitive agent by using the exposure device according to claim 35, so as to transfer the pattern on the substrate; an action of developing the photosensitive agent exposed by the exposure to form an exposed pattern layer corresponding to the pattern; and The operation of processing the substrate through the exposure pattern layer. 37. A conveying device comprising: The first support unit supplies gas to one side of the substrate, and can support the substrate in suspension by the gas; a second supporting portion capable of supporting the one side of the substrate; a drive unit that moves at least one of the first and second support parts so that the first and second support parts approach or contact each other and align; a transfer unit for moving the substrates supported by the second support unit aligned by the driving unit toward the first support unit side along the arrangement direction; a lifting mechanism supporting the substrate placed on the mounting portion of the first support portion due to the stop of the supply of the gas, and pushing up the substrate above the mounting portion; and The unloading mechanism unloads the substrate supported above the placement section by the lifting mechanism from the first support section. 38. The conveying device according to claim 37, wherein the jacking mechanism includes: a plurality of movable members that move up and down the placing portion; and at least one support member erected on at least two of the movable members and capable of supporting the substrate; The movable member moves up and down such that a contact portion of the support member with the substrate protrudes and sinks into the mounting portion. 39. The conveying device according to claim 38, wherein the support member includes a plurality of first erection portions erected in the first direction relative to at least two of the movable members and a plurality of first erection portions erected in the second direction. The 2 erection parts are formed in a lattice shape. 40. The transport device according to claim 39, wherein the plurality of support members are arranged in the longitudinal direction of the lattice shape along the first direction, and are arranged at intervals from each other along the second direction. 41. The transport device according to any one of claims 38 to 40, wherein the movable member is provided so as to protrude from the first support portion. 42. The conveyance device according to any one of claims 38 to 41, wherein the support member is housed in a position different from that of the placement part in the first support part. 43. The conveying device according to claim 42, wherein the loading portion includes a plurality of partial loading portions partitioned by groove-shaped recesses formed on the first supporting portion; The support member is housed in the recess. 44. The transfer device according to claim 43, wherein the movable member is provided to protrude from the recess. 45. The transfer device according to any one of claims 38 to 44, wherein the carrying-out mechanism includes a fork that receives the substrate supported by the supporting member. 46. The conveying device according to claim 45, wherein the jacking mechanism has a plurality of the supporting members; The fork supports the substrate between adjacent support members. 47. The conveying device according to claim 37, wherein the loading portion includes a plurality of partial loading portions partitioned by groove-shaped recesses formed on the first supporting portion; The jacking mechanism includes a fork that lifts up while being inserted into the concave portion, and supports the lower surface of the substrate. 48. The conveying device according to claim 47, wherein the jacking mechanism includes: a driving part that drives a fork that supports the substrate to move to a position different from that of the first supporting part, the jacking The mechanism doubles as the moving-out mechanism. 49. The transfer device according to claim 37, wherein the lifting mechanism includes a holding portion that holds the substrate and raises it. 50. The transfer device according to claim 49, wherein the holding portion holds the substrate in a non-contact state. 51. The transfer device according to claim 49 or 50, wherein the jacking mechanism has a plurality of the holding parts. 52. The transfer device according to any one of claims 49 to 51, wherein the jacking mechanism includes a support member that supports an end portion of the substrate. 53. The conveying device according to any one of claims 49 to 52, wherein the jacking mechanism includes: a driving portion that drives and holds the holding portion of the substrate to move to the first Where the support parts are at different positions, the jacking mechanism also serves as the carrying-out mechanism. 54. The transfer device according to any one of claims 37 to 53, wherein the drive unit arranges the first and second support parts so that the substrate supported by the second support part , arranged at a position higher than the first support portion. 55. The transfer device according to claim 54, wherein the drive unit arranges the first and second support parts so that the upper part of the second support part that supports the substrate is arranged at a lower position. A position where the upper surface of the first support portion is high. 56. The conveyance device according to any one of claims 37 to 55, wherein the drive unit is provided at least partially integrally with the second support unit. 57. The conveying device according to any one of claims 37 to 56, wherein at least a part of the drive unit is provided so as to be able to move integrally with the first support unit. 58. The transfer device according to any one of claims 37 to 57, wherein the second support unit supplies gas to the one surface of the substrate, and can support the substrate by floating with the gas. 59. The transfer device according to any one of claims 37 to 58, wherein the transfer unit has a roller mechanism that rotates in a state of contacting the lower surface of the substrate and a pair of the substrate that defines the substrate. A position specifying part for the position of the first or second support part; The roller mechanism moves the substrate so that the position specifying portion abuts against it. 60. The transfer device according to any one of claims 37 to 59, wherein the transfer unit has a suction mechanism for sucking and holding the end of the substrate and detecting the alignment of the substrate with the first or second substrate. 2. a position detection unit for the position of the support unit; The suction mechanism moves the substrate based on a detection result of the position detection unit. 61. The transfer device according to any one of claims 37 to 60, comprising a tilting mechanism that tilts the upper surface of the first or second support portion that supports the substrate. 62. The transport device according to any one of claims 37 to 61, further comprising a relative position detection unit that detects a relative position between the first support unit and the second support unit. 63. A conveying method, conveying a substrate, comprising: moving at least one of a first support portion capable of levitatingly supporting the substrate by gas supplied to one surface of the substrate and a second support portion capable of supporting the one surface of the substrate, so that the first and second 2 The action of the supporting parts approaching or touching each other and arranging them; An operation of transferring the substrates supported by the arranged second support parts to the side of the first support part along the arrangement direction; An operation of supporting the substrate placed on the mounting portion of the first support portion and pushing up the mounting portion by stopping the supply of the gas; and An operation of carrying out the substrate supported above the placement unit from the first support unit. 64. The transfer method according to claim 63, wherein the first and second support parts are arranged so that the substrate supported by the second support part is higher than the first support part. 65. An exposure device for exposing a substrate with exposure light, comprising: The transfer device according to any one of claims 37 to 62, which holds the substrate and moves the substrate to the irradiation area of the exposure light. 66. A method of manufacturing a component, comprising: using the exposure device described in claim 65 to expose the substrate coated with a photosensitive agent to transfer a pattern on the substrate; an action of developing the photosensitive agent exposed by the exposure to form an exposed pattern layer corresponding to the pattern; and The operation of processing the substrate through the exposure pattern layer.