KR102006367B1 - 소성 페이스트 조성물 및 그 용도 - Google Patents
소성 페이스트 조성물 및 그 용도 Download PDFInfo
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- KR102006367B1 KR102006367B1 KR1020167027937A KR20167027937A KR102006367B1 KR 102006367 B1 KR102006367 B1 KR 102006367B1 KR 1020167027937 A KR1020167027937 A KR 1020167027937A KR 20167027937 A KR20167027937 A KR 20167027937A KR 102006367 B1 KR102006367 B1 KR 102006367B1
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- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
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- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
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- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/013—Fillers, pigments or reinforcing additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K3/08—Metals
- C08K2003/0862—Nickel
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- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
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Abstract
Description
Claims (12)
- 하기 일반식 (I)로 표시되는 단량체 (a-1)을 30∼80질량%와, 하기 일반식 (II)로 표시되는 단량체 (a-2)를 20∼70질량%를 포함하는 단량체 혼합물(단량체 혼합물 전체를 100질량%로 한다.)을 공중합시켜 얻어지고, 또한 중량평균 분자량이 2.01×105∼1.5×106인 공중합체(A)를 포함하는 것을 특징으로 하는 소성 페이스트 조성물.
(식 (I) 중, R1은 수소 원자 또는 메틸기를 나타내고, R2는 분지상 탄화 수소기, 직쇄상 탄화 수소기, 환상 구조를 갖는 기 또는 단결합을 나타내고, R3은 수산기, 카복실기, 아미노기, 아마이드기, 아세토아세톡시기, 산무수물기, 설폰산기, 인산기, 싸이올기 및 복소환기로 이루어지는 군으로부터 선택되는 기를 나타내고, n은 1∼6의 정수를 나타내고, n이 2 이상인 경우에는 R3은 동일해도 상이해도 되고, R2가 단결합인 경우 또는 직쇄상 탄화 수소기인 경우에는 R3은 복소환기이며, R2와 R3은 1 또는 2의 결합손에 의해 결합되어 있다.)
(식 (II) 중, R4는 수소 원자 또는 메틸기를 나타내고, R5는 분지상 알킬기, 또는 환상 구조를 갖는 기를 나타낸다.) - 제 1 항에 있어서,
상기 공중합체(A)의 SP값이 7∼10인 것을 특징으로 하는 소성 페이스트 조성물. - 제 1 항에 있어서,
상기 공중합체(A)와,
용제(B)와,
무기 분말(C)을 포함하는 것을 특징으로 하는 소성 페이스트 조성물. - 제 3 항에 있어서,
상기 공중합체(A)와 상기 용제(B)가 하기 식 (III)의 관계를 충족시키는 것을 특징으로 하는 소성 페이스트 조성물.
|(공중합체(A)의 SP값)-(용제(B)의 SP값)|<2···(III) - 제 4 항에 있어서,
분산제(D)를 더 포함하는 것을 특징으로 하는 소성 페이스트 조성물. - 제 5 항에 있어서,
소성 페이스트 조성물 100질량%에 대하여, 상기 공중합체(A)를 1∼20질량% 포함하고, 상기 용제(B)를 20∼70질량% 포함하고, 상기 무기 분말(C)을 20∼70질량% 포함하고, 상기 분산제(D)를 0.01∼5질량% 포함하는 것을 특징으로 하는 소성 페이스트 조성물. - 제 1 항 내지 제 6 항 중 어느 한 항에 있어서,
스크린 인쇄용인 것을 특징으로 하는 소성 페이스트 조성물. - 제 3 항 내지 제 6 항 중 어느 한 항에 기재된 소성 페이스트 조성물을 포함하는 그린 시트.
- 제 3 항 내지 제 6 항 중 어느 한 항에 기재된 소성 페이스트 조성물과 그린 시트의 적층물.
- 제 3 항 내지 제 6 항 중 어느 한 항에 기재된 소성 페이스트 조성물을 사용하여 제조된 적층 세라믹 콘덴서.
- 제 1 항 내지 제 6 항 중 어느 한 항에 기재된 소성 페이스트 조성물을 기재에 도포하는 공정과,
도포된 상기 소성 페이스트 조성물을 건조시키는 공정과,
건조시킨 상기 소성 페이스트 조성물과 기재의 적층물을 소성하는 공정을 포함하는 소성체의 제조 방법. - 제 11 항에 기재된 소성체의 제조 방법에 의해 얻어지는 소성체.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014113186 | 2014-05-30 | ||
| JPJP-P-2014-113186 | 2014-05-30 | ||
| PCT/JP2015/063427 WO2015182353A1 (ja) | 2014-05-30 | 2015-05-11 | 焼成ペースト組成物およびその用途 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170013203A KR20170013203A (ko) | 2017-02-06 |
| KR102006367B1 true KR102006367B1 (ko) | 2019-08-01 |
Family
ID=54698693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167027937A Active KR102006367B1 (ko) | 2014-05-30 | 2015-05-11 | 소성 페이스트 조성물 및 그 용도 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20170198115A1 (ko) |
| JP (1) | JP6473447B2 (ko) |
| KR (1) | KR102006367B1 (ko) |
| CN (1) | CN106414598B (ko) |
| WO (1) | WO2015182353A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2021075208A1 (ko) * | 2019-10-18 | 2021-04-22 | ||
| CN112062895A (zh) * | 2020-08-06 | 2020-12-11 | 无锡亚星新材料科技有限公司 | 一种烧结浆液用树脂及其制备方法 |
| CN116313222A (zh) * | 2023-03-07 | 2023-06-23 | 成都宏科电子科技有限公司 | 一种通用型表面导电浆料及其制备方法和应用 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005216767A (ja) * | 2004-01-30 | 2005-08-11 | Jsr Corp | プラズマディスプレイパネル用無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネルの製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11286564A (ja) * | 1998-04-01 | 1999-10-19 | Nippon Shokubai Co Ltd | 樹脂組成物 |
| JP2001307548A (ja) * | 2000-04-19 | 2001-11-02 | Murata Mfg Co Ltd | 導電性ペーストおよびセラミック電子部品 |
| JP2002080675A (ja) * | 2000-09-08 | 2002-03-19 | Mitsubishi Rayon Co Ltd | 焼成型ペースト用アクリル系バインダー樹脂組成物 |
| JP2003128730A (ja) * | 2001-10-18 | 2003-05-08 | Otsuka Chem Co Ltd | 紫外線吸収性重合体、積層材及びガラス代替部材 |
| JP2005011579A (ja) * | 2003-06-17 | 2005-01-13 | Jsr Corp | プラズマディスプレイパネル用転写フィルム並びにプラズマディスプレイパネルおよびその製造方法 |
| JP2006228777A (ja) * | 2005-02-15 | 2006-08-31 | Kyocera Corp | 導体ペースト及び配線基板の製造方法 |
| EP2088172B1 (en) * | 2006-11-24 | 2014-11-05 | Mitsubishi Rayon Co., Ltd. | Stabilizer for polyolefin resin and stabilized polyolefin resin composition |
| JP5091700B2 (ja) * | 2008-01-30 | 2012-12-05 | 積水化学工業株式会社 | 積層セラミックコンデンサ内部電極用導電ペースト |
| KR20120066942A (ko) | 2010-12-15 | 2012-06-25 | 삼성전기주식회사 | 내부전극용 도전성 페이스트 조성물, 이를 이용한 적층 세라믹 전자부품 및 이의 제조방법 |
| WO2014084273A1 (ja) * | 2012-11-30 | 2014-06-05 | 綜研化学株式会社 | ペースト組成物、ならびに焼成体およびその製造方法 |
| JP2015059196A (ja) * | 2013-09-20 | 2015-03-30 | 綜研化学株式会社 | 焼成ペースト用共重合体および焼成ペースト組成物 |
-
2015
- 2015-05-11 JP JP2016523404A patent/JP6473447B2/ja active Active
- 2015-05-11 WO PCT/JP2015/063427 patent/WO2015182353A1/ja not_active Ceased
- 2015-05-11 KR KR1020167027937A patent/KR102006367B1/ko active Active
- 2015-05-11 CN CN201580028480.5A patent/CN106414598B/zh active Active
- 2015-05-11 US US15/314,665 patent/US20170198115A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005216767A (ja) * | 2004-01-30 | 2005-08-11 | Jsr Corp | プラズマディスプレイパネル用無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネルの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170013203A (ko) | 2017-02-06 |
| CN106414598A (zh) | 2017-02-15 |
| JPWO2015182353A1 (ja) | 2017-04-20 |
| WO2015182353A1 (ja) | 2015-12-03 |
| US20170198115A1 (en) | 2017-07-13 |
| CN106414598B (zh) | 2019-08-20 |
| JP6473447B2 (ja) | 2019-02-20 |
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