JPS63126236A - Resin sheathing for electronic component - Google Patents

Abstract

PURPOSE:To realize a prescribed packaging height and to attain a reduction of the height of an electronic part by press molding the sagging parts of sheathing resins. CONSTITUTION:Piezoelectric oscillating elements 4 of piezoelectric ceramic oscillators 1 and the parts of element holding parts 3a of terminals 3 are dipped in a resin bath 5 the prescribed number of times and covered with sheathing resins 6. In a half dried state that a film is formed, the sagging part 6a of the sheathing resin 6 of each piezoelectric ceramic oscillator 1 is pressed to a molding plate 7 together with a frame 2. In this press molding, a distance H ranging from stoppers 3b for substrate packaging molded on the terminals 3 to the molding plate 7 is adjusted in such a way as to become the packaging height in the design of the piezoelectric ceramic oscillators 1. Thereby, the parts of the sagging parts 6a of the sheathing resins 6 are press molded upward and the height thereof is adjusted to the design value. Then, after the oscillator is left for air drying of the sheathing resins, they are stoved and hardened.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a resin packaging method for electronic components, and in particular to an improved resin packaging method for reducing the height of electronic components after resin packaging. Regarding the method.

[Conventional technology]

Conventionally, in the manufacture of electronic components, a method has been adopted in which the durability and insulation properties of the component are improved by covering the electronic component body and the connection portion with the terminal with resin. Conventionally, there has been a resin bath immersion method, the so-called doweling method, as a method for performing this resin exterior coating.As shown in FIG. In this method, the resin is immersed in a resin bath 13 a predetermined number of times, and the adhered exterior resin 14 is air-dried and then baked and hardened.

[Problem that the invention seeks to solve]

However, as shown in FIG. 3, the electronic component 10 coated with resin by the conventional method has a problem in that when it is mounted on a board 15, the height H from the top surface of the board 15 tends to be higher than the design dimension. be. This is because the lower part of the exterior resin that adhered during immersion in the resin bath sag due to its own weight, and is dried and baked to harden with this sagging portion 14a in place. A method of adjusting the viscosity of the resin bath 13 can be considered to reduce the amount of sagging, but it is difficult to obtain a sufficient effect due to the balance with resin adhesion during immersion.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to almost completely correct the sagging of the exterior resin by a mechanical method, and to reduce the mounting height of recent electronic components, which can meet the so-called low-profile demand for electronic components. The object of the present invention is to provide a resin packaging method.

[Means for solving problems]

The present invention provides a resin packaging method for electronic components in which an electronic component body is immersed together with a terminal in a resin bath, and the adhered exterior resin is dried and hardened. It is characterized in that the exterior resin portion is press-molded so that the height of the electronic component becomes a predetermined height.

Here, the timing of press molding in the present invention is preferably at the point when the electronic component is pulled out of the resin bath and a thin film is formed on the outer surface of the exterior resin, so-called half-drying. Moreover, press molding can be realized by various methods, for example, the hanging portion of the exterior resin may be pressed against a molded plate whose surface is processed to be flat.

[Effect]

In the resin packaging method for electronic components according to the present invention, the hanging portions of the packaging resin are mechanically press-molded, so the hangings are reliably corrected and the mounting height is the same as the design value. This makes it possible to achieve a lower height.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a process diagram for explaining a resin packaging method for electronic components according to an embodiment of the present invention.

The method of this embodiment is an example in which a piezoelectric ceramic oscillator is sheathed with resin. In the figure, a piezoelectric ceramic oscillator 1 is attached to a frame 2 with terminals 3. A piezoelectric oscillation element 4 as an electronic component body is connected between the tip portions of the terminals 3.3 by punching with a press machine. Further, 7 is a molded plate which is a feature of this embodiment, and is placed, for example, in the vicinity of the resin bath 5, and its flattened upper surface 7a has a surface for preventing the exterior resin from adhering. For example, it is treated with Teflon (registered trademark).

In the method of this embodiment, first, the piezoelectric ceramic oscillator l
When the piezoelectric oscillation element 4 and the element holding portion 3a portion of the terminal 3 are immersed in a resin bath 5 a predetermined number of times, for example, 3 to 4 times, and taken out from the resin bath 5, the piezoelectric oscillation element 4 and the element holding portion 3a portion of the terminal 3 are is covered with an exterior resin 6. For example, after about 20 minutes, the exterior resin 6
A thin film is formed on the outer surface of the product, causing it to dry out. In addition,
At this time, a hanging portion 6a is formed in the lower part of the exterior resin 6 as in the case of the conventional method (see FIG. 1 (al)).

Next, in the half-dried state with the thin film formed, the hanging portions 6a of the exterior resin 6 of each piezoelectric ceramic oscillator 1 are
The entire frame 2 is pressed against the molding plate 7. Note that, of course, the frame 2 may be fixed and the temporary molding 7 may be raised. In this press molding, the distance H from the board mounting stopper 3b formed on the terminal 3 to the molding plate 7 is adjusted so as to match the designed mounting height of the piezoelectric ceramic oscillator 1.

As a result, the hanging portion 63 of the exterior resin 6
The part is pressed upward and its height is adjusted to the design value (see Figure 1 (bl, (C1)).

After the exterior resin 6 is press-molded, it is left to dry naturally and then baked to harden, as in the conventional method.

As described above, in this embodiment, the piezoelectric ceramic oscillator 1
After being lifted from the resin bath 5, the exterior resin 6 portion is press-molded using a molding temporary, so that the sagging of the exterior resin can be corrected and the mounting height as designed can be secured, resulting in a lower profile of the electronic component. can be realized. Incidentally, in this example, the mounting height could be reduced by about 1 fl compared to the conventional method.

In addition, since the method of this embodiment is a method of mechanically pressing the exterior resin 6 portion with the molding plate 7, the hanging portion 6a is more
The correction is easy and reliable, and the device has a simple structure, so it has the advantage that it can be realized at low cost.

Although the above embodiments have been explained using a piezoelectric ceramic oscillator as an example, the present invention can of course be applied to other electronic components. According to this method, since the hanging portion of the exterior resin is press-molded, a predetermined mounting height can be easily and reliably achieved, and the effect is that it can meet the demand for lower heights of electronic components.

[Brief explanation of the drawing]

Figure 1 1a1. (bl, (C1 is a process diagram for explaining one embodiment of the present invention, and FIGS. 2 and 3 are block diagrams for explaining problems in the conventional method, respectively. In the figures, 1 is Piezoelectric ceramic oscillator (1i child part)
, 3 is a terminal, 3a is a holding part, 4 is a piezoelectric oscillation element (
5 is a resin bath, and 6 is an exterior resin. Figure 1

Claims (1)

[Claims] (1) A resin for an electronic component in which the electronic component body and the connection portion between the body and the terminal are immersed in a resin bath a predetermined number of times, and the exterior resin portion that adheres to it by the immersion is air-dried and then baked to harden. A resin exterior for an electronic component, characterized in that, in the exterior packaging method, the exterior resin portion is press-molded so that the height when the electronic component is mounted on a board is a predetermined size, and then air-dried and baked to harden. Method.