JPH03105906A - Method for mounting electronic parts - Google Patents
Method for mounting electronic partsInfo
- Publication number
- JPH03105906A JPH03105906A JP1244820A JP24482089A JPH03105906A JP H03105906 A JPH03105906 A JP H03105906A JP 1244820 A JP1244820 A JP 1244820A JP 24482089 A JP24482089 A JP 24482089A JP H03105906 A JPH03105906 A JP H03105906A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- powder
- water
- coating
- coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000000843 powder Substances 0.000 claims abstract description 32
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000003973 paint Substances 0.000 claims abstract description 18
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000005871 repellent Substances 0.000 claims description 19
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 230000001846 repelling effect Effects 0.000 claims 1
- 239000000155 melt Substances 0.000 abstract description 3
- 238000007665 sagging Methods 0.000 abstract description 3
- 238000007598 dipping method Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は電子回路に用いるセラミックコンデンサその
他の電子部品の外装方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for packaging ceramic capacitors and other electronic components used in electronic circuits.
〈従来の技術〉
第９図乃至第１２図は従来の電子部品の製造方法を示す
もので、１はセラミックコンデンサ等の素子でありその
表裏に形成した電極２にリード線３を半田付け等の方法
で取着する。<Prior art> Figures 9 to 12 show a conventional method for manufacturing electronic components, in which 1 is an element such as a ceramic capacitor, and lead wires 3 are connected to electrodes 2 formed on the front and back sides of the element by soldering or other means. Attach by method.
次に上記素子１を加熱した後、第１０図のように樹脂粉
体４に素子１を浸漬して、素子１の表面に接触した粉体
４を素子１の温度により溶融せしめて素子１の表面に付
着させる。Next, after heating the element 1, the element 1 is immersed in resin powder 4 as shown in FIG. Adhere to the surface.
この操作を所要回数繰り返した後硬化炉に入れて樹脂を
硬化させ、素子ｌの表面に第１）図のように所要厚みの
外装樹脂５を形成する。After repeating this operation a required number of times, the resin is placed in a curing furnace to harden, and an exterior resin 5 of a required thickness is formed on the surface of the element 1 as shown in Figure 1).
〈発明が解決しようとする課題〉
上記のような電子部品の製造方法において、第１０図の
樹脂の粉体４の浸漬操作により、素子Ｌの表面の全面に
粉体４を付着させるために、素子１の全体より更に上の
方に粉体４のレベル７が達するまで浸漬させることにな
るが、その後の硬化時に粉体樹脂が溶融してその体積が
収縮すると、第１工図のように完或時にリード線３の付
け根の部分まで樹脂が付着して、所謂塗料タレ８を生ず
る。<Problems to be Solved by the Invention> In the method for manufacturing electronic components as described above, in order to adhere the powder 4 to the entire surface of the element L by the immersion operation of the resin powder 4 shown in FIG. The element 1 is immersed until it reaches level 7 of the powder 4 above the entire element 1, but if the powder resin melts and its volume shrinks during subsequent curing, it will become as shown in the first drawing. At the time of completion, the resin adheres to the base of the lead wire 3, causing so-called paint dripping 8.
このように塗料タレ８が生じるとプリント基板にこの電
子部品を実装した場合塗料タレ８のために実装高さが高
くなる。If paint sag 8 occurs in this way, when this electronic component is mounted on a printed circuit board, the mounting height will be increased due to the paint sag 8.
また、実装高さを低くするために、プリント基板の穴に
塗料タレ８を深く挿入して半田付けすると、リード線と
半田の接触面積が著しく小さくなって電気的な接触不良
となったり、半田付け時のエアーが抜けず、穴の部分に
エアーが閉じ込められて半田とリード線が全く接触しな
くなったりして不良品発生の原因となる等の問題がある
。In addition, if the paint dripper 8 is deeply inserted into the hole of the printed circuit board and soldered in order to lower the mounting height, the contact area between the lead wire and the solder will become significantly smaller, resulting in poor electrical contact or soldering. There are problems such as air not being able to escape during attachment, and air being trapped in the holes, resulting in no contact between the solder and the lead wires, resulting in defective products.
また、従来から塗料タレを短くするために塗装後或は硬
化後に塗料タレを機械的に除去する方法があるが、除去
工程の増加のためにコストアップとなったり、機械的処
理のためリード線に傷が付いたり、除去した塗装部分の
破断面にクラックが発生して品質不良となる等の問題が
あった。In addition, there is a conventional method of mechanically removing paint sag after painting or curing in order to shorten the amount of paint sag, but this increases the cost due to the additional removal process, and the need for lead wires due to mechanical treatment. There were problems such as scratches on the paint and cracks on the fractured surface of the removed painted part, resulting in poor quality.
その他に最初にリード線３の部分に撥水性材料の塗膜を
形成し、その後、素子１に粉体樹脂塗装を施して外装樹
脂５を形成する方法も案出されているが、これは塗装タ
レをなくす点で非常に有効であるが、第１２図に示すよ
うに撥水性塗料が樹脂塗装前の素子１に付着することが
あり、素子１と外装樹脂５の密着性が低下してａのよう
に沿面リーク等が発生し破壊電圧、信頼性試験等の品質
を著しく劣化させるおそれがある。In addition, a method has been devised in which a coating film of a water-repellent material is first formed on the lead wire 3 portion, and then powder resin coating is applied to the element 1 to form the exterior resin 5. Although it is very effective in eliminating sagging, as shown in Fig. 12, the water-repellent paint may adhere to the element 1 before resin coating, reducing the adhesion between the element 1 and the exterior resin 5. There is a risk that creepage leakage may occur and the quality of breakdown voltage, reliability tests, etc. may be significantly degraded.
又、この問題を回避するために、撥水性材料のリード線
３への塗布精度を高めることは塗布装置が複雑になる点
で問題がある。この発明は、上記のような従来の製造方
法の問題点を解決するために、極めて簡単に塗料タレを
防止できる製造方法を提供することを課題とする。Further, in order to avoid this problem, improving the accuracy of applying the water-repellent material to the lead wire 3 poses a problem in that the application device becomes complicated. In order to solve the problems of the conventional manufacturing method as described above, it is an object of the present invention to provide a manufacturing method that can extremely easily prevent paint dripping.
〈課題を解決するための手段〉
上記の課題を解決するためにこの発明は、素子にリード
線を取着した電子部品の該素子に粉体樹脂からなる下塗
装を施した後、該リード線の部分に撥水性材料の塗膜を
形成し、その後該素子の下塗装上に粉体樹脂塗装を施し
て粉体樹脂塗装後の硬化時に溶融した樹脂をはじいて塗
料タレの発生を防止することを特徴とする方法を提供す
る。<Means for Solving the Problems> In order to solve the above-mentioned problems, the present invention provides an electronic component in which a lead wire is attached to the element, after applying an undercoating made of powder resin to the element, A coating film of a water-repellent material is formed on the part, and then a powder resin coating is applied on the base coating of the element to repel the molten resin during curing after the powder resin coating and prevent the occurrence of paint dripping. Provided is a method characterized by:
く実施例〉
以下、この発明の実施例を添付図面の第１図乃至第８図
に基づいて説明する。Embodiments> Hereinafter, embodiments of the present invention will be described based on FIGS. 1 to 8 of the accompanying drawings.
素子１及び電極２やリード線３は前記従来例と同じであ
る。The element 1, electrodes 2, and lead wires 3 are the same as in the conventional example.
この従来例と同じ素子１を１００〜２００℃に余熱し、
第１図工のように流動浸漬法等の塗装機の粉体樹脂槽中
の樹脂粉体１ｌ中に１〜ｌＯ秒程度浸漬した後引き上げ
ると、樹脂粉体１１が素子１の熱により溶融して同図Ｈ
のように下塗装ｌ３が形成される。The same element 1 as this conventional example is preheated to 100 to 200°C,
As shown in Figure 1, when the resin powder 11 is immersed in 1 liter of resin powder in the powder resin tank of a coating machine using the fluidized dipping method for about 1 to 10 seconds and then pulled out, the resin powder 11 is melted by the heat of the element 1. Figure H
The undercoating l3 is formed as shown in FIG.
この時点ではリード線３に一定長の塗装タレが生じてい
る。At this point, a certain length of paint sag has occurred on the lead wire 3.
次に、上記の下塗装１３を施したもののリード線３に撥
水性材料の塗膜を形成する。このような塗膜の形成には
第２図のように、撥水性材料を外周に付着させたローラ
ーｌ５をリード線３の付け根の部分に転がして付着させ
る方法、又は第３図のように撥水性材料の液ｌ６中に浸
漬する方法、或は第４図のように撥水性材料１７をノズ
ルｌ８からリード線３に向けて噴射して付着させる方法
等がある。Next, a coating film of a water-repellent material is formed on the lead wire 3 that has been coated with the above-mentioned undercoat 13. To form such a coating film, there is a method of rolling a roller 15 with a water-repellent material on the outer periphery to the base of the lead wire 3 as shown in Fig. 2, or a repellent method as shown in Fig. 3. There is a method of immersing the lead wire 3 in a liquid 16 of an aqueous material, or a method of spraying a water-repellent material 17 toward the lead wire 3 from a nozzle 18 as shown in FIG.
上記撥水性材料としてはフッ素系、シリコン系等のもの
が用いられる。As the water-repellent material, a fluorine-based material, a silicon-based material, or the like is used.
第５図のように、形成される塗膜ｌ４の形状はリード線
３の部分のみが好ましいが、素子１に及んで形成されて
もよい。As shown in FIG. 5, the shape of the coating film 14 to be formed is preferably only on the lead wire 3 portion, but it may be formed over the element 1 as well.
上記のように撥水性材料の塗膜１４を形成したちのを、
再び１００〜２００℃に余熱し、第６図のように流動浸
漬法塗装機の粉体樹脂槽中の樹脂粉体ｌ１中に１〜１０
秒程度浸漬した後引き上げると樹脂粉体が熱により溶融
して第７図のように外装樹脂ｌ７が形成される。After forming the coating film 14 of the water-repellent material as described above,
Preheat again to 100-200°C, and add 1 to 10% of the resin powder l1 in the powder resin tank of the fluidized dip coating machine as shown in Figure 6.
When the resin powder is immersed for about a second and then pulled up, the resin powder is melted by heat and an exterior resin 17 is formed as shown in FIG.
この粉体樹脂槽中ヘの浸漬引き上げは必要により繰返し
行なわれる。This immersion and lifting into the powder resin bath is repeated as necessary.
この外装樹脂１７はリード線３の部分には撥水性材料の
塗膜１４によりはじかれて付着しない。その結果、下塗
装ｌ３により生じていた塗装タレは、他に付着した外装
樹脂ｌ７により吸収されたようになり、最終的には塗装
タレ０のちのが得られる。This exterior resin 17 is repelled by the coating film 14 of the water-repellent material and does not adhere to the lead wire 3 portion. As a result, the paint sag caused by the undercoat 13 is absorbed by the exterior resin 17 that has adhered to other parts, and finally a coating with zero sag is obtained.
その後、硬化炉に入れて加熱硬化させると第８図のよう
な塗装タレのない外装樹脂１９が施された製品が完成さ
れる。この電子部品をプリント基板に実装せしめた場合
、リード線３は基板の穴に充分に挿入されると共に、充
分な電気的接触をもって電極に接続されるので、実装の
場合、従来品より低くなる。Thereafter, the product is placed in a curing furnace and heated and cured to complete a product coated with exterior resin 19 without paint sag as shown in FIG. When this electronic component is mounted on a printed circuit board, the lead wires 3 are fully inserted into the holes of the board and connected to the electrodes with sufficient electrical contact, so that the mounting cost is lower than that of conventional products.
〈発明の効果〉
この発明方法は上記のように、電子部品の素子に予め粉
体樹脂による下塗装を施した後、リード様の部分に撥水
性材料の塗膜を形成し、その後、粉体樹脂塗装による外
装を施すことにより塗装タレがない電子部品が得られる
ちのである。従って、この発明による部品のリード線を
プリント基板の穴に挿入した後の半田付けにおいて、塗
料タレによる半田付け妨害やエアー封正による半田付け
不良がなくなり半田付けの信頼性が向上する。<Effects of the Invention> As described above, in the method of this invention, after an element of an electronic component is pre-coated with a powder resin, a coating film of a water-repellent material is formed on the lead-like part, and then a powder resin coating is applied. By applying resin coating to the exterior, it is possible to obtain electronic components without paint sagging. Therefore, during soldering after the lead wire of the component according to the present invention is inserted into a hole in a printed circuit board, there will be no interference with soldering due to paint dripping or poor soldering due to air sealing, and the reliability of soldering will be improved.
又、従来の機械的に塗料タレを除去する方法に比較して
リード線の傷や、除去した後の塗装物の破断面にクラッ
クが発生する等のことがなく、機械的除去に比較して作
業が簡単であるからコストが安い。In addition, compared to the conventional method of mechanically removing paint sag, there is no damage to lead wires or cracks on the broken surface of the painted object after removal, and compared to mechanical removal. The cost is low because the work is easy.
更に、撥水性材料の素子への付着がないので、粉体樹脂
塗装の前にリード線に撥水性材料の塗膜を形成する方法
に比較して品質が高い等の効果がある。Furthermore, since there is no adhesion of water-repellent material to the element, there are effects such as higher quality compared to a method in which a coating film of water-repellent material is formed on the lead wire before powder resin coating.
第１図乃至第８図は、この発明の製造方法の実施例を示
すもので、第１図工、■は下塗装の形成手順を示す正面
図、第２図はローラーによる撥水性材料の塗装方法の斜
視図、第３図、第４図は撥水性材料の塗装方法の各例を
示す正面図、第５図は撥水性材料塗膜を形成した状態の
正面図、第６図は樹脂粉体への浸漬状態の正面図、第７
図は外装樹脂を塗装したものの正面図、第８図は外装樹
脂の加熱硬化後の製品の正面図、第９図乃至第ｌ１図は
従来の外装樹脂形成方法を示す正面図、第１２図は他の
外装樹脂成型品の斜視図である。Figures 1 to 8 show an embodiment of the manufacturing method of the present invention, where Figure 1 is a front view showing the procedure for forming an undercoat, and Figure 2 is a method for coating water-repellent material with a roller. , Figures 3 and 4 are front views showing examples of coating methods for water-repellent materials, Figure 5 is a front view of a state in which a water-repellent material coating has been formed, and Figure 6 is a resin powder coating. Front view of the immersion state, No. 7
The figure is a front view of a product coated with exterior resin, Figure 8 is a front view of a product after the exterior resin has been heat-cured, Figures 9 to 11 are front views showing a conventional exterior resin forming method, and Figure 12 is FIG. 3 is a perspective view of another exterior resin molded product.
Claims (1)
からなる下塗装を施した後、該リード線の部分に撥水性
材料の塗膜を形成し、その後該素子の下塗装上に粉体樹
脂塗装を施して粉体樹脂塗装後の硬化時に溶融した樹脂
をはじいて塗料タレの発生を防止することを特徴とする
電子部品の外装方法。After applying a base coat made of powder resin to the element of an electronic component with a lead wire attached to the element, a coating film of a water-repellent material is formed on the lead wire portion, and then a coating film of a water-repellent material is applied to the base coat of the element. A method for packaging electronic parts, characterized by applying powder resin coating and repelling molten resin during curing after powder resin coating to prevent paint dripping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1244820A JPH03105906A (en) | 1989-09-19 | 1989-09-19 | Method for mounting electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1244820A JPH03105906A (en) | 1989-09-19 | 1989-09-19 | Method for mounting electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03105906A true JPH03105906A (en) | 1991-05-02 |
Family
ID=17124439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1244820A Pending JPH03105906A (en) | 1989-09-19 | 1989-09-19 | Method for mounting electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03105906A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100395397B1 (en) * | 2001-08-31 | 2003-08-27 | 서병인 | A method for plating a metal glaze on a ceramic rod and a metal glazed ceramic rod prepared thereby |
-
1989
- 1989-09-19 JP JP1244820A patent/JPH03105906A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100395397B1 (en) * | 2001-08-31 | 2003-08-27 | 서병인 | A method for plating a metal glaze on a ceramic rod and a metal glazed ceramic rod prepared thereby |
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