JPS6415962A - Mounting substrate for integrated circuit chip - Google Patents
Mounting substrate for integrated circuit chipInfo
- Publication number
- JPS6415962A JPS6415962A JP62170923A JP17092387A JPS6415962A JP S6415962 A JPS6415962 A JP S6415962A JP 62170923 A JP62170923 A JP 62170923A JP 17092387 A JP17092387 A JP 17092387A JP S6415962 A JPS6415962 A JP S6415962A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- substrate
- equal
- signal wiring
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 10
- 239000000463 material Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000012212 insulator Substances 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- BYDQGSVXQDOSJJ-UHFFFAOYSA-N [Ge].[Au] Chemical compound [Ge].[Au] BYDQGSVXQDOSJJ-UHFFFAOYSA-N 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000007779 soft material Substances 0.000 abstract 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To restrain the noise generated by switching of logic gates, within a small range, by making the thickness of an insulator in a power supply substrate have a value smaller than or equal to a specified value, or making the relative permittivity of the insulator larger than or equal to a specified value. CONSTITUTION:A mounting substrate 100 for integrated circuit chip comprizes a signal wiring substrate 200 and a power supply substrate 300. The signal wiring substrate 200 is made of, e.g. alumina ceramic. At the lower part of the signal wiring substrate, columnar pins which are made of soft material like soft copper and have cylindrical pedestals, are electrically connected to through holes 5 in the signal wiring substrate, by using bonding material like gold-germanium. In the power supply substrate 300, a plurality of copper plates several hundreds mum in thickness are laminated by using either insulative material several tens mum in thickness whose relative permittivity is about 4.7, or insulative material less than or equal to about 100mum in thickness whose relative permittivity is more than or equal to about 50. The power supply substrate is provided with engaging holes 7 for inserting a pin. After a pin is inserted, both of them are electrically connected by using low melting metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62170923A JPS6415962A (en) | 1987-07-10 | 1987-07-10 | Mounting substrate for integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62170923A JPS6415962A (en) | 1987-07-10 | 1987-07-10 | Mounting substrate for integrated circuit chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6415962A true JPS6415962A (en) | 1989-01-19 |
Family
ID=15913861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62170923A Pending JPS6415962A (en) | 1987-07-10 | 1987-07-10 | Mounting substrate for integrated circuit chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6415962A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6496377B1 (en) | 1994-08-08 | 2002-12-17 | Coopertechnologies Company | Vehicle electric power distribution system |
-
1987
- 1987-07-10 JP JP62170923A patent/JPS6415962A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6496377B1 (en) | 1994-08-08 | 2002-12-17 | Coopertechnologies Company | Vehicle electric power distribution system |
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