JPH118327A - Semiconductor chip identification code assigning method and semiconductor chip managing method - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To individually identify a plurality of semiconductor chips after dicing from a semiconductor wafer, assembling an IC chip using a lead frame, and identifying the assembled IC chip using an identification code. And make it manageable. A method of assigning a semiconductor chip identification code determines, for example, a wafer number and a position of a chip in the wafer as an identification code of the semiconductor chip for a plurality of semiconductor chips formed on a semiconductor wafer. . When the determined semiconductor chip 5 is cut off from the semiconductor wafer 1 by dicing and mounted on the lead frame 60, a bar code 7 as an identification code is provided at a position near the semiconductor chip 5 mounted on the lead frame 60.
0 is added. When the bar code 70 of the lead frame 60 is read and the IC chip 10 is assembled, the IC chip 1
The bar code 10a corresponding to the read bar code 70 is attached to the back surface 10b of the “0”.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip identification assigning method, a management method, and an identification code which enable individual management of a plurality of semiconductor chips even after the plurality of semiconductor chips on a semiconductor wafer are cut off by dicing. IC chip etc.

[0002]

2. Description of the Related Art A process for manufacturing an IC chip from a semiconductor wafer is roughly divided into a pre-process and a post-process. In a pre-process, a semiconductor wafer is subjected to various processes to form a pattern of a plurality of semiconductor chips. In the last step of the preceding step, a part of the plurality of semiconductor chips or a test portion of the semiconductor wafer is inspected. Thereafter, in a later step, the plurality of semiconductor chips are individually cut off by dicing, mounted on a lead frame, and assembled into an IC chip. The manufactured IC chip is subjected to, for example, product inspection and reliability test as a final step before shipment.

[0003] In general, the quality of IC chips is often controlled on a production lot basis under the same process conditions for a plurality of semiconductor wafers. Therefore, for example, reliability and yield management are often managed in lot units. Alternatively, since an identification number or the like is assigned to the semiconductor wafer, the yield can be reduced for each semiconductor wafer, and reliability can be managed. However, for a very large number of semiconductor chips separated by dicing from a semiconductor wafer, no effective management means has been conventionally taken, and no individual management method has been adopted. For this reason, reliability management of individual semiconductor chips is not performed. The details will be described with reference to FIG.

FIG. 9 is a view for explaining a conventional IC chip assembling process. In this assembly process, IC
A lead frame is used as a chip forming member. After the quality inspection of the semiconductor wafer is performed in the last step of the previous step, the semiconductor wafer is cut into a plurality of semiconductor chips (S101). The cut semiconductor chips are mounted on a lead frame in a preset order (S102). The mounted semiconductor chip is connected to the lead frame with a thin wire such as gold, and fixed (S103).

[0005] Next, the semiconductor chip, the bonding portion, and the like are all molded with resin except for the portion to be the lead portion of the IC chip (S104). After the excess lead frame is cut off and subjected to deburring and forming processing (S105), each IC chip is inspected as the final step of the IC chip assembling step (S106).
If the inspection is successful, the product name, product number, etc. are marked on the surface of the IC chip package (S107).
The C chip is completed. As described above, after the semiconductor wafer is individually cut, a process of assembling an IC chip for each semiconductor chip is performed. However, since a large number of semiconductor chips cannot be individually identified, individual management can be performed. could not.

[0006]

However, even in the same semiconductor wafer, reliability data may differ depending on the position of the semiconductor chip. Therefore, there is a demand for managing reliability data for each semiconductor chip. is there.
Further, in the stage of mounting a semiconductor chip on a lead frame and manufacturing an IC chip, there is a case where it is desired to individually identify the semiconductor chips.

Further, after shipping the IC chip, for example,
Lots or lots of aging or deterioration of the characteristics of multiple semiconductor chips manufactured from a specific semiconductor wafer may occur in large quantities, but since each semiconductor chip is not managed, each IC chip In some cases, follow-up surveys and the like cannot be performed, and prompt and appropriate responses cannot be made.

Accordingly, an object of the present invention is to provide a method and an apparatus capable of individually identifying semiconductor chips even after a plurality of semiconductor chips are separated from a semiconductor wafer by dicing or the like.

Another object of the present invention is to provide an IC chip forming member and an IC chip provided with a code capable of identifying a semiconductor chip.

[0010]

In order to achieve the above-mentioned object, a method for assigning a semiconductor chip identification code according to the present invention comprises:
A step of determining at least a semiconductor wafer number and a position of the semiconductor chip in the semiconductor wafer as an identification code of the semiconductor chip for a plurality of semiconductor chips formed on the semiconductor wafer; Separated from the wafer, I
Attaching a code corresponding to the identification code as a first identification code to a position near the semiconductor chip mounted on the IC chip formation member when the IC chip formation member is mounted on the IC chip formation member; When assembling chips,
A step of reading the first identification code from the IC chip forming member; and a step of applying a second identification code corresponding to the read first identification code to the assembled IC chip.

A semiconductor chip identification code assigning device of the present invention determines at least a semiconductor wafer number and a position of a semiconductor chip in a semiconductor wafer as a semiconductor chip identification code for a plurality of semiconductor chips formed on a semiconductor wafer. Means, the semiconductor chip having determined the identification code is separated from the semiconductor wafer by dicing,
A first identification unit that attaches a code corresponding to the identification code as a first identification code to a position near the semiconductor chip of the IC chip formation member when attached to the IC chip formation member; Code assembling means, when assembling an IC chip, means for reading the first identification code from the IC chip forming member, and assembling a second identification code corresponding to the read first identification code. A second identification code assigning means attached to the IC chip.

According to the method of the present invention for identifying a semiconductor chip on an IC chip forming member, at least a semiconductor wafer number and a position of the semiconductor chip in the semiconductor wafer are determined for a plurality of semiconductor chips formed on the semiconductor wafer. Determining the identification code of the chip; and, when the semiconductor chip having determined the identification code is separated from the semiconductor wafer by dicing and mounted on the IC chip forming member, the semiconductor chip of the IC chip forming member is Attaching a code corresponding to the identification code as a first identification code to a position in the vicinity of the mounting position so that the semiconductor chip can be identified on the IC chip forming member.

According to the method of the present invention for identifying a semiconductor chip built in an IC chip, at least a semiconductor wafer number and a position of the semiconductor chip in the semiconductor wafer are determined for a plurality of semiconductor chips formed on the semiconductor wafer. Determining the identification code as the identification code, and, when the semiconductor chip having determined the identification code is assembled into an IC chip, attaching a code corresponding to the identification code to the IC chip to identify the semiconductor chip incorporated in the IC chip. Enabling the process.

According to the method for managing a semiconductor chip on an IC chip forming member of the present invention, when inspecting a semiconductor chip mounted on the IC chip forming member, the IC chip forming member has a vicinity of the semiconductor chip mounted. In the position, at least the semiconductor wafer number, the position of the semiconductor chip in the semiconductor wafer, read the code attached as the identification code of the semiconductor chip, the inspection result of the semiconductor chip, for each identification code of the corresponding semiconductor chip to manage.

According to the IC chip management method of the present invention, when inspecting or shipping an IC chip, at least a semiconductor wafer number attached to a predetermined position of the IC chip and an identification indicating a position of the semiconductor chip in the semiconductor wafer are identified. Read the code and check the IC chip inspection result or shipping management data,
Manage for each corresponding identification code.

In the IC chip forming member of the present invention, at least a semiconductor wafer number and a position of the semiconductor chip in the semiconductor wafer are attached as an identification code of the semiconductor chip to a position near the semiconductor chip mounted. Things.

The IC chip according to the present invention is obtained by attaching at least a semiconductor wafer number and a position of the semiconductor chip in the semiconductor wafer to a predetermined position of the IC chip as an identification code of the semiconductor chip.

[0018]

According to the method of assigning a semiconductor chip identification code of the present invention, at least the semiconductor wafer number and the position of the semiconductor chip in the semiconductor wafer are used as the identification code of the semiconductor chip for a plurality of semiconductor chips formed on the semiconductor wafer. It is determined. The semiconductor chip having the determined identification code is separated from the semiconductor wafer by dicing, and
When mounted on the C-chip forming member, a code corresponding to the identification code is attached as a first identification code to a position near the IC chip-forming member where the semiconductor chip is mounted. When assembling an IC chip, the first identification code is read from the IC chip forming member, and a second identification code corresponding to the read first identification code is attached to the assembled IC chip. You.

According to the semiconductor chip identification code providing apparatus of the present invention, at least the semiconductor wafer number and the position of the semiconductor chip in the semiconductor wafer are used as the semiconductor chip identification code for a plurality of semiconductor chips formed on the semiconductor wafer. Determined by the determining means. When the semiconductor chip for which the identification code is determined is separated from the semiconductor wafer by dicing and mounted on the IC chip forming member, a first identification is provided at a position near the IC chip forming member on the IC chip forming member. A code corresponding to the identification code is assigned as a first identification code by the code assigning means. When assembling an IC chip, the means for reading the first identification code reads the first identification code from the IC chip forming member,
The second identification code corresponding to the read first identification code is attached to the assembled IC chip by the second identification code providing means.

According to the method of the present invention for identifying a semiconductor chip on an IC chip forming member, at least the semiconductor wafer number and the position of the semiconductor chip in the semiconductor wafer are determined for a plurality of semiconductor chips formed on the semiconductor wafer. ,
It is determined as the identification code of the semiconductor chip. When the semiconductor chip for which the identification code is determined is separated from the semiconductor wafer by dicing and mounted on an IC chip forming member, the IC chip forming member is provided with the identification code at a position near the semiconductor chip mounting. The corresponding code is assigned as the first identification code, and the semiconductor chip can be identified on the IC chip forming member.

According to the method of the present invention for identifying a semiconductor chip incorporated in an IC chip, at least the semiconductor wafer number and the position of the semiconductor chip in the semiconductor wafer are determined for a plurality of semiconductor chips formed on the semiconductor wafer. It is determined as the identification code of the semiconductor chip. When the semiconductor chip for which the identification code is determined is assembled into an IC chip, a code corresponding to the identification code is attached to the IC chip, and the semiconductor chip built in the IC chip can be identified.

According to the method of managing a semiconductor chip on an IC chip forming member of the present invention, when the semiconductor chip mounted on the IC chip forming member is inspected, the vicinity of the IC chip forming member where the semiconductor chip is mounted is inspected. At least the semiconductor wafer number, the position of the semiconductor chip in the semiconductor wafer, and the code assigned as the identification code of the semiconductor chip are read. The inspection result of the semiconductor chip is managed for each identification code of the corresponding semiconductor chip.

According to the IC chip management method of the present invention, I
When the C chip is inspected or shipped, at least a semiconductor wafer number attached to a predetermined position of the IC chip,
An identification code indicating the position of the semiconductor chip in the semiconductor wafer is read. The inspection result or shipping management data of the IC chip is managed for each corresponding identification code.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method and apparatus for assigning a semiconductor chip identification code according to the present invention, a semiconductor chip and an IC will be described below.
One embodiment of a chip management method, an IC chip, and the like will be described in detail with reference to FIGS. In this embodiment, a lead frame is used as an IC chip forming member.

FIG. 1 is a diagram for explaining an outline of a manufacturing process of a semiconductor chip and an IC chip. The manufacturing process of a semiconductor chip and an IC chip is roughly divided into a pre-process and a post-process. As shown in FIG. 1, the semiconductor wafer 1
To form a pattern of a plurality of semiconductor chips by performing various processes, and a step of inspecting the same. The post-process includes a process of dicing the semiconductor wafer 1, taking out the semiconductor chip 5 from the diced semiconductor wafer 3, and assembling it into an IC chip, and a process of inspecting the IC chip. Further, after the post-process,
There is a shipping management process for managing shipping of a product incorporating a C chip or an IC chip.

FIG. 2 is a diagram for explaining a process of a method of assigning a semiconductor chip identification code and a method of managing a semiconductor chip and an IC chip according to one embodiment of the present invention. FIG.
FIG. 1 is a block diagram for explaining an outline of an identification code management device according to an embodiment of the present invention. FIG. 4 is a plan view illustrating a state where an identification code is attached to a lead frame on which a semiconductor chip is mounted. FIG. 5 is a plan view exemplifying a state after the identification code attached to the lead frame is transferred to the back surface of the package after the molding is completed. FIG. 6 is a perspective view of an IC chip according to an embodiment of the present invention in which a bar code is attached as an identification code on the back surface of the package.

The device configuration of the data management device 7 having the semiconductor chip identification code providing device 8 according to one embodiment of the present invention will be described. The data management device 7 includes an identification code providing device 8, a semiconductor chip and IC chip data management unit 73, and a storage unit 75 for temporarily storing an identification code and storing test result data. At first,
The device configuration of the identification code providing device 8 will be described. The identification code providing device 8 is a device that provides an identification code to the semiconductor chip 5 and the IC chip 10, and includes an identification code determining unit 82, an identification code reading unit 83, a first identification code providing unit 84, and a second identification code providing unit 84. It has four means of identification code providing means 85 and a central control unit 71.
The processing contents of each means will be described below.

In the preceding process, the identification code determining means 82
This is a means for determining a manufacturing lot number, a semiconductor wafer number, and a coordinate position of each semiconductor chip 5 in the semiconductor wafer 1 as an identification code of the semiconductor chip 5.

After the semiconductor chip 5 is molded and the package surface of the IC chip 10 is established, the identification code reading means 83 reads the bar code 70 on the lead frame 60 using the first bar code reader 83a. In the final inspection process and shipping management process, IC
Bar code 10a on back surface 10b of package of chip 10
Is read using the second barcode reader 83b. In the present embodiment, a conventional optical sensor type bar code reader is used as the bar code reader. However, the bar code reader may be read using a CCD camera instead. Since the barcode 70 is extremely fine, a barcode reader that can reliably recognize and read the barcode 70 and that can easily cope with automation and high functionality is required.

After the individual semiconductor chips 5 whose identification codes have been determined are mounted on the lead frame 60, the first identification code providing means 84 moves the semiconductor chips 5 to positions near the semiconductor chips 5 mounted. This is means for giving a code corresponding to the identification code in the form of a barcode 70 using the first barcode writer 84a. Instead of the first barcode writer 84a, a seal in which an identification code corresponding to the barcode 70 is written may be created and attached to the lead frame 60 to be used as the identification code of the semiconductor chip 5. The direction in which the barcode 70 is attached is not limited to the example illustrated in FIG. 4 as long as the direction is easy to read by the first barcode reader 83a.

The second identification code providing means 85 writes a code corresponding to the bar code 70 read by the identification code reading means 82 on the back surface 10b of the package of the IC chip 10 using a second bar code writer 85a. This is a means for giving in the form of 10a. Note that the bar code 10a also has a second
Instead of the bar code writer 85a, a seal in which an identification code corresponding to the bar code 10a is written may be created and attached to the back surface 10b of the package to be used as the identification code of the semiconductor chip 5. Further, the size and format of the barcode 10 a may be different from those of the barcode 70. Further, the direction in which the barcode 10a is attached is not limited to the example illustrated in FIG. 5 as long as the direction is easy to read by a barcode reader such as an inspection process and a shipping management process.

The configuration of the semiconductor chip and IC chip data management unit 73 will be described. The semiconductor chip and IC chip data management unit 73 associates the identification codes of the individual semiconductor chips 5 and IC chips 10 assigned by the identification code providing device 8 with the inspection result data inspected by an inspection unit (not shown). The data is stored in the storage unit 75 of the data management device 7 and various data of the semiconductor chip 5 and the IC chip 10 are managed. The inspection unit has a first inspection unit for inspecting the electrical characteristics of the semiconductor chip 5 and a second inspection unit for inspecting the electric characteristics of the IC chip 10.

Next, the identification code providing method, the semiconductor chip and the IC chip identification method, the semiconductor chip and the IC chip management method of the present invention, and the lead frame with the identification code and the IC chip with the identification code will be described with reference to FIG. A detailed description will be given based on a flowchart showing the steps of manufacturing a chip and an IC chip.

In the preceding step, the identification code determining means 82 in the identification code providing device 8 determines, for example, the manufacturing lot number (LLL), the semiconductor wafer number (WWW), and the semiconductor wafer 1 in the semiconductor wafer 1. For example, the coordinate position (XX-
YY) is determined as the identification code of the semiconductor chip 5. The determined identification code is, for example, an identification code (LL
L-WWW-XX-YY) and the like are stored in the storage unit 75 in the data management device 7. As a result, it is possible to easily identify in which lot the individual semiconductor chips 5 are manufactured and in which semiconductor wafers in the lots and in which positions on the semiconductor wafers are formed. Conversely, the individual semiconductor chips 5 can be easily specified by the identification codes.

After the identification code is determined, the semiconductor wafer 1 is cut into individual semiconductor chips 5 in a dicing process (S1). The cut semiconductor chips 5 are mounted on the lead frame 60 in a preset order (S21). After the mounting of the semiconductor chip 5 is completed, the first identification code providing means 84 uses a first bar code writer 84a to position the semiconductor chip 5 at a position near the semiconductor chip 5 on the lead frame 60 as shown in FIG. A barcode 70 corresponding to the identification code of the chip 5 is provided (S22).

As described above, in the semiconductor chip identification code providing method of the present invention, the bar code 70 is provided on the lead frame 60. Thereby, the lead frame 6
This means that a production lot number of the semiconductor chip 5, a semiconductor wafer number, and an identification code indicating the position of the semiconductor chip in the semiconductor wafer are provided in the form of a barcode 70 on the reference numeral 0.

Further, by reading the bar code 70 by using the first bar code reader 83a of the identification code reading means 83, the individual semiconductor chips 5 are manufactured in which lots, At which position on the semiconductor wafer the semiconductor wafer is formed can be easily identified. As described above, in the semiconductor chip identification method of the present invention, the individual semiconductor chips 5 can be identified by reading the barcode 70 attached to the lead frame 60.

In this embodiment, the bar code 70 is used as the identification code in order to automate the reading of the bar code 70 in the molding process.
The order of the operations of mounting the semiconductor chip 5 in the mounting step (S21) and the operation of providing the identification code (S22) is not limited to this. That is, after attaching the identification code (S22), the mounting of the semiconductor chip 5 (S21) may be performed.

After the bar code 70 is provided on the lead frame 60, when the first inspection means inspects the semiconductor chip 5, the identification code reading means 83 uses the first bar code reader 83a to read the bar code 70. Is read, and the inspection result data of each semiconductor chip 5 and the barcode 70 are associated with each other, transferred to the data management device 7, and stored in the storage unit 75. Thereby, the inspection result data of each semiconductor chip 5 is managed for each barcode 70. Therefore, the bar code 7 on the lead frame 60
By reading 0, the inspection result data of each semiconductor chip 5 can be easily taken out at any time. As described above, in the semiconductor chip management method of the present invention, the inspection result data of the semiconductor chip 5 and the barcode 70 are managed in association with each other.

The lead frame with the identification code of the present invention manufactured through the above steps will be described with reference to FIG. In the lead frame 60 with the identification code of the present invention, the identification code (LLL) is placed by the first identification code providing means 84 at a position near the semiconductor chip 5 is mounted.
-WWW-XX-YY) in the form of a barcode 70. The bar code 70 may be provided at any position as long as it is near the mounting position of the semiconductor chip 5 on the lead frame.

Lead frame 6 with identification code of the present invention
0 indicates the production lot number (LLL) of the semiconductor wafer 1 for the semiconductor chip 5 by reading the bar code 70 on the lead frame 60 using the first bar code reader 83 a of the identification code reading means 83. The number (WWW) and the coordinate position (XX-YY) in the semiconductor wafer 1 can be identified with respect to other semiconductor chips, and the inspection result data by the first inspection unit can be easily taken out. be able to.

The manufacturing process of the IC chip 10 after the formation of the lead frame 60 with the identification code will be described below. After mounting, the semiconductor chip 5 is wire-bonded on the lead frame 60 (S3). After the completion of the wire bonding, as shown in FIG. 5, the whole is molded with resin except for the portion 60a to be the lead portion 10c of the IC chip 10, and the semiconductor chip 5 is sealed as the IC chip 10 (S41). . The molding is completed,
When the package surface as the IC chip 10 is established, the identification code reading means 83
The first barcode reader 83a reads the barcode 70 attached to 0 (S42) and temporarily stores it. Thereafter, as shown in FIGS. 5 and 6, the second identification code providing means 85 moves the package back surface 10 of the IC chip 10.
The bar code 10a corresponding to the stored bar code 70 is assigned to the bar code b using the second bar code writer 85a (S43).

As described above, in the IC chip identification code providing method of the present invention, the bar code 10a is provided on the back surface 10b of the package of the IC chip 10. This allows I
The IC chip 1 is placed on the back surface 10b of the package
The identification code indicating the manufacturing lot number, the semiconductor wafer number, and the position of the semiconductor chip in the semiconductor wafer of the semiconductor chip 5 contained in the semiconductor chip 5 is attached in the form of a barcode 10a.

By reading the bar code 10a using the second bar code reader 83b of the identification code reading means 83, the semiconductor chip 5 built in the IC chip 10 is manufactured in any lot, and Which of the semiconductor wafers is formed and at which position on the semiconductor wafer it is formed can be easily identified. As described above, in the IC chip identification method of the present invention, by reading the bar code 10a attached to the package back surface 10b of the IC chip 10, each IC chip can be identified.

In this embodiment, the bar code 10
a is attached to the back surface 10b of the package of the IC chip 10. However, if there is a space for attaching a bar code on the other package surface and the position is easy to read in the subsequent inspection process or shipping management process, the other than the package back surface 10b May be attached to the surface. In this embodiment, the barcode 10a is used as the identification code. The reason is that the barcode 10a is automatically read in the inspection process and the shipping management process so that various data can be quickly and accurately managed by the computer.

The molding operation (S41) in the molding step and the identification code reading operation (S42)
Is not limited to this. That is, the identification code may be read first (S42), stored once, and the molding operation (S41) may be performed.

After the bar code 10a is attached to the back surface 10b of the package of the IC chip 10, the unnecessary lead frame 60 is trimmed and subjected to deburring and forming (S5). After the lead cut forming is completed, the second inspection means performs a final inspection before shipping the IC chip 10 (S61). When the inspection is completed, the identification code reading means 83 reads the bar code 10a using the second bar code reader 83b (S62), and the individual I codes are read.
Inspection result data of C chip and read bar code 10
a to the data management device 7 (S6).
3) Store in the storage unit 75.

The IC chip inspection in the inspection process (S6
Regarding 1) and the identification code reading operation (S62), the order of the operations is not limited to this. That is, first, the identification code may be read (S62), and then the IC chip may be inspected (S61). IC in final inspection process
If the chip 10 passes the inspection, a product name, a product number, and the like are marked on the package surface of the IC chip 10 (S7), and the IC chip is completed and is shipped to the market through a shipping management process.

When managing shipment of the IC chip 10 in the shipment management process, the shipment confirmation means (not shown)
The shipment confirmation inspection is performed on the C chip 10. As in the final inspection step of the IC chip 10 described above, the identification code reading means 83 reads the bar code 10a using the second bar code reader 83b, and
Is transferred to the data management device 7 in association with the read barcode 10a and the read barcode 10a, and stored in the storage unit 75.

By the processing in the final inspection step and the shipment management step, the inspection result data and the shipment confirmation data of each IC chip 10 are managed for each bar code 10a. Therefore, the package back surface 10 of the IC chip 10
By reading the bar code 10a of b, the inspection result data and the shipment confirmation data of each IC chip 10 can be easily taken out at any time. As described above, in the IC chip management method of the present invention, the inspection result data and the shipment confirmation data of the semiconductor chip 5 built in the IC chip 10 are managed in association with the barcode 10a.

An IC chip with an identification code according to the present invention manufactured through all the manufacturing steps and the shipping control step described above will be described with reference to FIG. The semiconductor chip 5 is built in the IC chip 10 with the identification code of the present invention. The identification code (LLL-WWW-XX-YY) is applied to the bar code 10a on the back surface 10b of the package of the IC chip 10 by the second identification code providing means 85.
Is given in the form of Note that the place where the barcode 10a is provided may be any surface as long as it is a package surface having a size capable of providing the barcode 10a.

IC chip 10 with identification code of the present invention
Reads the bar code 10a on the back surface 10b of the package using the second bar code reader 83b of the identification code reading means 83, thereby obtaining the manufacturing lot number of the semiconductor wafer 1 for the semiconductor chip 5 built in the IC chip 10 ( LLL), the semiconductor wafer number (WWW), and the coordinate position (XX-YY) in the semiconductor wafer 1
Can be distinguished from other IC chips, and
Inspection result data by the second inspection means can also be easily taken out.

The identification code assigned to the lead frame and the identification code assigned to the IC chip according to one embodiment of the present invention can be written in a relatively small space, and can be easily performed by conventional existing technology. The barcode was used because the identification code can be read and the reading can be easily automated. However, the identification code attached to the IC chip is not limited to only the barcode. For example, as shown in FIG. 7, a Karla code may be used as the identification code, or as shown in FIG. 8, alphanumeric characters may be used as the identification code. FIG. 7 is a perspective view of an IC chip according to another embodiment of the present invention in which a color code is provided as an identification code on the back surface of the package. FIG. FIG. 10 is a perspective view of an IC chip according to another embodiment.

When the color code is used, it can be easily read by a conventional technique similar to a bar code.
It is easy to achieve automatic reading, but since the code is two-dimensional, a slightly larger space is required as compared to a barcode. When using alphanumeric characters as the identification code,
Automation of reading is somewhat difficult, but visibility is good,
Since the information can be read without a special device, even when the device is shipped and sold on the market, information on the problem is relatively easily collected. Therefore, as the identification code, it is preferable to use a code that can be easily assigned and read even in a narrow place, and that can be automatically read by an existing technology relatively easily.

7 and 8, the identification code is set to IC.
Although it is provided on the back surface of the chip package, in either case, the space may be provided on the front surface or side surface of the package as long as a space for providing the identification code can be secured.
Further, the direction of each identification code given to the IC chip is not limited to only the longitudinal direction of the IC chip illustrated in FIGS.

Further, in one embodiment of the present invention, a lead frame is used as an IC chip forming member, but instead of a lead frame, a TAB (TAPE AUTOMATED BONDINN
G) Tape may be used. At this time, when patterning the raw TAB tape, an identification code such as a barcode or a color code may be formed in advance on the mask pattern, and this may be used as the identification code of the semiconductor chip. This eliminates the need to assign an identification code to the lead frame, thereby simplifying the configuration of the data management device. Further, since the identification code reading means can be provided at a necessary position in the upstream process, the management of the manufacturing process in accordance with the manufacturing process can be realized.

[0057]

According to the method and apparatus for assigning a semiconductor chip identification code of the present invention, it is possible to identify a manufacturing lot, a semiconductor wafer number, and individual semiconductor chips for a plurality of semiconductor chips on a semiconductor wafer. Therefore, the semiconductor chip contained in the IC chip can be identified and managed not only at the subsequent IC chip manufacturing stage but also after the shipment of the IC chip or after assembling into a certain product.

According to the management method and apparatus for each semiconductor chip of the present invention, management can be performed at various stages for each semiconductor chip. Therefore, for example, inspection results can be managed for each semiconductor chip. In particular, since the identification code of a semiconductor chip can be identified as a manufacturing lot number, a semiconductor wafer number, or the like, it is possible to track the conditions at the manufacturing stage.

According to the IC chip forming member having the identification code of the semiconductor chip of the present invention, the semiconductor chips mounted on the IC chip forming member can be individually identified in the IC chip manufacturing stage.

According to the IC chip of the present invention, the semiconductor chip built in the IC chip can be identified from the outside.
In particular, since the identification code of the semiconductor chip can identify the manufacturing lot number, the number of the semiconductor wafer, and the like, when a failure occurs in the IC chip, the conditions at the manufacturing stage can be tracked.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining an outline of a manufacturing process of a semiconductor chip and an IC chip.

FIG. 2 is a diagram for explaining a process of a method of assigning a semiconductor chip identification code and a method of managing a semiconductor chip and an IC chip according to an embodiment of the present invention.

FIG. 3 is a block diagram illustrating an outline of an identification code management device according to an embodiment of the present invention.

FIG. 4 is a plan view illustrating a state where an identification code is attached to a lead frame on which a semiconductor chip is mounted.

FIG. 5 is a plan view illustrating a state after an identification code attached to a lead frame is transferred to the back surface of a package after molding is completed.

FIG. 6 is a perspective view of an IC chip according to an embodiment of the present invention in which a bar code is provided as an identification code on the back surface of the package.

FIG. 7 is a perspective view of an IC chip according to another embodiment of the present invention in which a color code is attached as an identification code to the back surface of a package.

FIG. 8 is a perspective view of an IC chip according to another embodiment of the present invention, in which alphanumeric characters are added as identification codes to the back surface of the package.

FIG. 9 is a view for explaining a process of a conventional IC chip assembling step.

[Explanation of symbols]

1 ... semiconductor wafer, 3 ... semiconductor wafer after dicing,
5 semiconductor chip, 7 data management device, 8 identification code assigning device, 9 data management unit, 10, 20, 30 ... I
C chip, 10a: bar code, 20a: carla code, 30a: alphanumeric identification code, 10b, 20b, 30
b: IC package back surface, 10c, 20c, 30c ... I
C chip lead section, 60: lead frame, 60a: IC chip lead section before trimming, 70: barcode on the lead frame, 71: central control section, 73: data management section, 75: storage section, 82: identification code Determining means, 83
.. Identification code reading means, 83a first bar code reader, 83b second bar code reader, 84 first identification code providing means, 84a first bar code writer, 85
... Second identification code providing means, 85a ... Second bar code writer

Claims (21)

[Claims] 1. A step of determining at least a semiconductor wafer number and a position of a semiconductor chip in a semiconductor wafer as a semiconductor chip identification code for a plurality of semiconductor chips formed on a semiconductor wafer; When the chip is cut off from the semiconductor wafer by dicing and mounted on the IC chip forming member, a code corresponding to the identification code is placed at a position near the semiconductor chip mounted on the IC chip forming member. Attaching the first identification code as a first identification code; reading the first identification code from the IC chip forming member when assembling an IC chip; and a second identification code corresponding to the read first identification code. Applying the method to an assembled IC chip. 2. The semiconductor chip identification code assigning method according to claim 1, wherein in the identification code determination step, a production lot number of a semiconductor wafer is added to the identification code. 3. The method according to claim 2, wherein the first identification code is a bar code. 4. The method according to claim 2, wherein the second identification code is a bar code. 5. The method according to claim 2, wherein the second identification code is a color code. 6. The method according to claim 2, wherein the second identification code is an alphanumeric character. 7. A means for determining at least a semiconductor wafer number and a position of a semiconductor chip in a semiconductor wafer as a semiconductor chip identification code for a plurality of semiconductor chips formed on a semiconductor wafer, and a semiconductor for which the identification code is determined. When the chip is cut off from the semiconductor wafer by dicing and mounted on the IC chip forming member, a code corresponding to the identification code is placed at a position near the semiconductor chip mounted on the IC chip forming member. The first attached to the first identification code
Means for reading the first identification code from the IC chip forming member when assembling an IC chip; and assembling a second identification code corresponding to the read first identification code. And a second identification code assigning means attached to the attached IC chip. 8. The apparatus according to claim 7, wherein said determining means determines an identification code by adding a production lot number of the semiconductor wafer to said identification code. 9. A step of determining at least a semiconductor wafer number and a position of a semiconductor chip in the semiconductor wafer as a semiconductor chip identification code for a plurality of semiconductor chips formed on the semiconductor wafer; When the chip is cut off from the semiconductor wafer by dicing and mounted on the IC chip forming member, a code corresponding to the identification code is placed at a position near the semiconductor chip mounted on the IC chip forming member. Attached as the first identification code,
Making the semiconductor chip identifiable on the IC chip forming member. A method for identifying a semiconductor chip on an IC chip forming member. 10. A step of determining at least a semiconductor wafer number and a position of a semiconductor chip in the semiconductor wafer as a semiconductor chip identification code for a plurality of semiconductor chips formed on the semiconductor wafer; When the chip is assembled into an IC chip, the code corresponding to the identification code is
Making the semiconductor chip embedded in the IC chip identifiable by attaching to the C chip. A method for identifying a semiconductor chip embedded in an IC chip. 11. When inspecting a semiconductor chip mounted on an IC chip forming member, the IC chip forming member includes:
At least in the vicinity of the position where the semiconductor chip is mounted, at least the semiconductor wafer number, the position of the semiconductor chip in the semiconductor wafer, the code attached as the identification code of the semiconductor chip is read, and the inspection result data of the semiconductor chip is read. A method of managing a semiconductor chip on an IC chip forming member for managing each identification code of a corresponding semiconductor chip. 12. When inspecting or shipping an IC chip,
At least a semiconductor wafer number and an identification code indicating the position of the semiconductor chip in the semiconductor wafer attached to a predetermined position of the IC chip are read, and the inspection result or shipping management data of the IC chip is read for each corresponding identification code. Manage IC chip management method. 13. An IC chip forming member, wherein at least a semiconductor wafer number and a position of the semiconductor chip in the semiconductor wafer are attached as a semiconductor chip identification code at a position near the semiconductor chip. 14. The IC chip forming member according to claim 13, wherein a manufacturing lot number of the semiconductor wafer is added to the identification code. 15. The IC chip forming member according to claim 13, wherein the identification code is a bar code. 16. The IC chip forming member according to claim 13, wherein a lead frame is used as the IC chip forming member. 17. An IC chip having an identification code of a semiconductor chip in which at least a semiconductor wafer number and a position of the semiconductor chip in the semiconductor wafer are assigned as predetermined identification codes of the semiconductor chip at predetermined positions of the IC chip. 18. The IC chip according to claim 17, wherein a manufacturing lot number of the semiconductor wafer is added to the identification code. 19. The IC chip according to claim 17, wherein the identification code is a bar code. 20. The IC chip according to claim 17, wherein the identification code is a Carla code. 21. The IC chip according to claim 17, wherein the identification code is an alphanumeric character.