JPH11233810A - Photocoupler and its manufacture - Google Patents
Photocoupler and its manufactureInfo
- Publication number
- JPH11233810A JPH11233810A JP3071098A JP3071098A JPH11233810A JP H11233810 A JPH11233810 A JP H11233810A JP 3071098 A JP3071098 A JP 3071098A JP 3071098 A JP3071098 A JP 3071098A JP H11233810 A JPH11233810 A JP H11233810A
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- transparent gel
- receiving element
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光素子と受光素子
を同一パッケージ内に内装し、これら発光素子と受光素
子とを光結合した光結合素子（フォトカプラ）とその製
造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocoupler in which a light emitting element and a light receiving element are housed in the same package, and the light emitting element and the light receiving element are optically coupled to each other, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】光結合素子は、例えば電気回路でのアイ
ソレーションを得る際に、電気信号を光信号に変換して
発光素子から送出し、この送出された光信号を受光素子
で受光して電気信号に変換する際に利用される。従来、
この種の光結合素子として、発光ダイオード等の発光素
子と、フォトダイオード等の受光素子とを同一パッケー
ジ内に内装し、かつこのパッケージから前記発光素子と
受光素子に電気接続されるリードを導出した構成のもの
が提案されている。図１１（ａ）はこの種の光結合素子
の一例の断面図である。リードフレーム３１に設けられ
たそれぞれ対をなす外部導出リード３２，３３にタブ３
２ｃ，３３ｃが一体に形成されている。そして、前記各
タブ３２ｃ，３３ｃにはそれぞれ発光素子３４、受光素
子３５の各チップが搭載され、また各チップの電極パッ
ドはボンディングワイヤ３６，３７により図には示され
ない他方の外部導出リードに電気接続されている。そし
て、前記発光素子３４及び受光素子３５をポッティング
法等を用いて透明樹脂３８で被覆し、かつその外側をト
ランスファーモールド成形法等を用いて黒色モールド樹
脂３９で封止した構成とされている。この光結合素子で
は、発光素子３４を搭載している外部導出リード３２に
所要の電気信号を印加して発光素子３４を発光させる
と、発光素子３４から出射された光は透明樹脂３８内を
透過した後、黒色モールド樹脂３９との界面において反
射され、受光素子３５において受光される。そして、受
光素子３５において電気信号に変換され、外部導出リー
ド３３から出力されることになる。2. Description of the Related Art When obtaining isolation in an electric circuit, for example, an optical coupling element converts an electric signal into an optical signal and sends it out of a light emitting element. The sent optical signal is received by a light receiving element. Used when converting to electrical signals. Conventionally,
As this kind of optical coupling element, a light emitting element such as a light emitting diode and a light receiving element such as a photodiode are housed in the same package, and leads electrically connected to the light emitting element and the light receiving element are derived from this package. Configurations have been proposed. FIG. 11A is a cross-sectional view of an example of this type of optical coupling element. A tab 3 is attached to each pair of external lead-out leads 32 and 33 provided on the lead frame 31.
2c and 33c are integrally formed. Each of the tabs 32c and 33c has a light-emitting element 34 and a light-receiving element 35 mounted thereon, and the electrode pads of each chip are electrically connected to the other lead-out leads (not shown) by bonding wires 36 and 37. It is connected. The light emitting element 34 and the light receiving element 35 are covered with a transparent resin 38 using a potting method or the like, and the outside thereof is sealed with a black mold resin 39 using a transfer molding method or the like. In this optical coupling element, when a required electric signal is applied to the external lead 32 on which the light emitting element 34 is mounted to cause the light emitting element 34 to emit light, the light emitted from the light emitting element 34 passes through the transparent resin 38. After that, the light is reflected at the interface with the black mold resin 39 and received by the light receiving element 35. The light is converted into an electric signal in the light receiving element 35 and output from the external lead 33.
【０００３】しかしながら、この構成の光結合素子では
透明樹脂３８と黒色モールド樹脂３９との界面における
光反射効率が低く、光信号の伝達効率が低いという問題
がある。このような問題に対し、図１１（ｂ）に示すよ
うな光結合素子が提案されている。なお、同一部分には
同一符号を付してある。この光結合素子では、発光素子
３４と受光素子３５とがリードフレーム３１に搭載され
るとともに、球面に近い外形をした透明ゴム樹脂３８で
被覆され、この透明ゴム樹脂３８の外面に沿って膜状に
高反射ゴム樹脂４０が形成され、さらにその外周部が遮
光性のある黒色モールド樹脂３９により封止されてい
る。この改良された光結合素子では、発光素子３４を発
光させると、発光素子３４から出射された光は透明ゴム
樹脂３８と高反射ゴム樹脂４０との界面において反射さ
れ、受光素子３５において受光される。このため、透明
ゴム樹脂３８と高反射ゴム樹脂４０との界面での光の反
射効率が高められ、光信号の伝達効率に高いものが得ら
れることになる。なお、この種の光結合素子としては、
例えば、実開平７−２２５５５号公報に記載のものがあ
る。However, the optical coupling element having this configuration has a problem that the light reflection efficiency at the interface between the transparent resin 38 and the black mold resin 39 is low, and the transmission efficiency of the optical signal is low. To cope with such a problem, an optical coupling element as shown in FIG. 11B has been proposed. The same parts are denoted by the same reference numerals. In this optical coupling element, a light emitting element 34 and a light receiving element 35 are mounted on a lead frame 31 and are covered with a transparent rubber resin 38 having an outer shape close to a spherical surface. A high-reflection rubber resin 40 is formed, and the outer periphery thereof is sealed with a black mold resin 39 having light-shielding properties. In this improved optical coupling element, when the light emitting element 34 emits light, the light emitted from the light emitting element 34 is reflected at the interface between the transparent rubber resin 38 and the highly reflective rubber resin 40 and received by the light receiving element 35. . For this reason, the reflection efficiency of light at the interface between the transparent rubber resin 38 and the high-reflection rubber resin 40 is increased, and a high optical signal transmission efficiency can be obtained. In addition, as this kind of optical coupling element,
For example, there is one described in Japanese Utility Model Laid-Open Publication No. Hei 7-22555.
【０００４】ところで、図１１（ｂ）に示した光結合素
子の製造方法として、次のような製造方法が提案されて
いる。リードフレーム３１に設けられた２対の外部導出
リード３２，３３に設けられているタブ３２ｃ，３３ｃ
に発光素子３４と受光素子３５を銀ペーストによりダイ
ポンディングする。硬化条件は２００℃，２０秒であ
る。次いで、前記発光素子３４と受光素子３５の電極パ
ッドを金ワイヤ３６，３７で外部導出リード３２，３３
の対をなす他方にワイヤボンディングする。そして、前
記発光素子３４と受光素子３５を覆うように、前記リー
ドフレーム３１の表面側から透明ゴム樹脂３８を塗布す
る。この透明ゴム樹脂３８には、硬化後の硬さ（ＪＩＳ
−Ｃ２１２３−９）が１５〜２５のものが使用される。
その後、前記リードフレーム３１を上下反転し、前記と
同じ透明ゴム樹脂３８を裏面側から塗布する。その上
で、前記透明ゴム樹脂３８を１５０℃，２時間で硬化さ
せる。Incidentally, the following manufacturing method has been proposed as a method for manufacturing the optical coupling element shown in FIG. Tabs 32c, 33c provided on two pairs of external lead-out leads 32, 33 provided on lead frame 31
Then, the light emitting element 34 and the light receiving element 35 are die-bonded with silver paste. Curing conditions are 200 ° C. and 20 seconds. Next, the electrode pads of the light emitting element 34 and the light receiving element 35 are connected to external leads 32 and 33 by gold wires 36 and 37.
Is wire-bonded to the other pair. Then, a transparent rubber resin 38 is applied from the surface side of the lead frame 31 so as to cover the light emitting element 34 and the light receiving element 35. The transparent rubber resin 38 has a hardness after curing (JIS
-C2123-9) of 15 to 25 is used.
Thereafter, the lead frame 31 is turned upside down, and the same transparent rubber resin 38 as described above is applied from the back side. Then, the transparent rubber resin 38 is cured at 150 ° C. for 2 hours.
【０００５】さらに、前記透明ゴム樹脂３８の表面に、
反射材として酸化チタン（ＴｉＯ2）の微粉末を含むシ
リコーン製白色高反射ゴム樹脂４０を塗布し、さらに前
記透明ゴム樹脂の上下を反転させてその裏面にも同じ白
色高反射ゴム樹脂４０を塗布する。この白色高反射ゴム
樹脂４０も硬化後の硬さが１５〜２５のものが用いられ
る。塗布後、１５０℃，２時間で硬化させる。しかる上
で、前記工程までに形成された構体をトランスファーモ
ールド装置の金型内にセットし、黒色モールド樹脂によ
り射出成形を行い、前記白色高反射ゴム樹脂４０の周囲
に前記黒色モールド樹脂３９を成形し、樹脂封止する。
このトランスファーモールド樹脂成形では、１７５℃，
２分の硬化処理を行い、かつそのアフターキュアは１７
５℃，４〜８時間である。Further, on the surface of the transparent rubber resin 38,
A white high-reflection rubber resin 40 made of silicone containing a fine powder of titanium oxide (TiO 2 ) is applied as a reflector, and the same white high-reflection rubber resin 40 is applied on the back surface of the transparent rubber resin by inverting the transparent rubber resin. I do. The white high-reflection rubber resin 40 having a hardness of 15 to 25 after curing is used. After application, the coating is cured at 150 ° C. for 2 hours. Then, the assembly formed up to the above step is set in a mold of a transfer molding apparatus, and injection molding is performed with a black molding resin to form the black molding resin 39 around the white high-reflection rubber resin 40. Then, resin sealing is performed.
In this transfer molding resin molding, 175 ° C,
After 2 minutes of curing, the after cure is 17
5 ° C., 4 to 8 hours.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前記し
た光結合素子では透明ゴム樹脂３８の外周面での反射率
が向上するために光結合効率が改善されるものの、発光
素子３４と受光素子３５を封止している透明ゴム樹脂３
８及び白色高反射ゴム樹脂４０等の内部樹脂の熱膨張係
数と、その外側に設けられる黒色モールド樹脂３９等の
外部樹脂との熱膨張係数との違いにより、熱応力に伴う
信頼性の低下が生じるという問題がある。すなわち、前
記内部樹脂である透明ゴム樹脂３８や白色高反射ゴム樹
脂４０の熱膨張係数は一般に２５〜３５×１０-5／℃で
あり、かつヤング率は１０〜１５×１０-5Ｎ／ｍ2 であ
るのに対し、外部樹脂である黒色モールド樹脂３９の熱
膨張係数は略１．８×１０-5／℃である。このため、発
光素子３４及び受光素子３５を内部樹脂３８，４０で被
覆した後の前記したトランスファーモールド工程での硬
化処理、アフターキュア処理後の温度降下によって、外
部樹脂３９と内部樹脂３８，４０との間に熱収縮の顕著
な差が生じ、この熱収縮差によって生じる熱応力によっ
て内部樹脂３８，４０と外部樹脂３９との界面のほぼ全
域にわたって剥離が生じ、界面に沿って隙間が発生す
る。この隙間により、発光素子側と受光素子側の外部導
出リード間の絶縁耐圧が低下する。この対策手段とし
て、前記ゴム樹脂３８あるいは４０と黒色モールド樹脂
３９との界面の長さを大きくする、すなわち、前記ゴム
樹脂の量を増やすと同時に、上下面対称形状に塗布する
必要が生じる。こうした従来構造の光結合素子は、塗布
したゴム樹脂の量が多いために光結合素子を実装する際
の高温加熱（ピーク温度２４０℃の赤外半田リフローあ
るいは半田ディップ）によるゴム樹脂と外部樹脂の熱膨
張差（特に、ゴム樹脂の堆積膨張による膨らみ）による
熱応力によって、外部樹脂３９にクラックが生じ易く、
光結合素子の機械的な強度損傷とともに、外観上の見栄
えが低下し、商品品質が低下する。また、ゴム樹脂の量
が多く、上下面対称形状にゴム樹脂が塗布されるため
に、光結合素子の薄型化灯の小型化対応が困難であっ
た。さらに、光信号の伝達効率を高めるために、内部樹
脂を透明ゴム樹脂３８と高反射ゴム樹脂４０の二層構造
としているため、各ゴム樹脂３８，４０の製造工程とし
て２回の樹脂の塗布工程が必要となり、製造工程が煩雑
化するという問題もある。特に、前記したように発光素
子３４と受光素子３５の表裏両面からそれぞれ樹脂３
８，４０を２回ずつ塗布しているため、その工程数は更
に煩雑になる。However, in the above-mentioned optical coupling element, although the optical coupling efficiency is improved because the reflectance on the outer peripheral surface of the transparent rubber resin 38 is improved, the light emitting element 34 and the light receiving element 35 are not used. Transparent rubber resin 3 sealed
8 and white high-reflection rubber resin 40 and the like, and the difference between the coefficient of thermal expansion of the internal resin such as the black mold resin 39 provided outside thereof and the external resin such as the black mold resin 39 causes a decrease in reliability due to thermal stress. There is a problem that arises. That is, the transparent rubber resin 38 or the white high-reflection rubber resin 40 as the internal resin generally has a coefficient of thermal expansion of 25 to 35 × 10 −5 / ° C. and a Young's modulus of 10 to 15 × 10 −5 N / m. On the other hand, the thermal expansion coefficient of the black mold resin 39 as the external resin is about 1.8 × 10 −5 / ° C. For this reason, the outer resin 39 and the inner resins 38, 40 are cured by the curing treatment in the above-described transfer molding step after the light emitting element 34 and the light receiving element 35 are covered with the inner resins 38, 40 and the temperature drop after the after-curing treatment. Between the internal resins 38 and 40 and the external resin 39 due to the thermal stress generated by the thermal contraction difference, and a gap is generated along the interface. Due to this gap, the withstand voltage between the external lead-outs on the light emitting element side and the light receiving element side decreases. As a countermeasure, it is necessary to increase the length of the interface between the rubber resin 38 or 40 and the black mold resin 39, that is, increase the amount of the rubber resin and simultaneously apply the rubber resin in a vertically symmetric shape. In such an optical coupling device having a conventional structure, since the amount of the applied rubber resin is large, the rubber resin and the external resin are heated by high-temperature heating (infrared solder reflow or solder dip at a peak temperature of 240 ° C.) when mounting the optical coupling device. Cracks are likely to occur in the external resin 39 due to thermal stress due to a difference in thermal expansion (particularly, swelling due to rubber resin deposition expansion),
Along with the mechanical strength damage of the optical coupling element, the appearance is reduced and the product quality is reduced. Further, since the amount of the rubber resin is large and the rubber resin is applied in a vertically symmetrical shape, it has been difficult to reduce the size of the light-coupling element thinning lamp. Further, since the internal resin has a two-layer structure of the transparent rubber resin 38 and the high-reflection rubber resin 40 in order to enhance the transmission efficiency of the optical signal, the resin resin 38, 40 is formed by two resin coating steps. Is required, and there is a problem that the manufacturing process is complicated. In particular, as described above, the resin 3 is applied to both the front and back surfaces of the light emitting element 34 and the light receiving element 35.
Since 8, 40 are applied twice, the number of steps is further complicated.
【０００７】本発明の目的は、絶縁耐圧を高め、かつク
ラックの発生を防止するとともに、小型化を実現し、な
おかつ製造工程を複雑化することなく光信号の伝達効率
を高めることを可能にした光結合素子とその製造方法を
提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to increase the withstand voltage, prevent the occurrence of cracks, reduce the size, and increase the transmission efficiency of optical signals without complicating the manufacturing process. An object of the present invention is to provide an optical coupling element and a method for manufacturing the same.
【０００８】本発明の光結合素子は、発光素子と受光素
子を内装するパッケージが、前記発光素子と受光素子を
覆う光透過可能な透明ゲル樹脂と、前記透明ゲル樹脂の
外周部を覆う光反射樹脂とで構成され、かつ前記透明ゲ
ル樹脂の針入度が４５〜６５（ＪＩＳ−Ｋ２２２０）で
あることを特徴とする。また、本発明においては、発光
素子と受光素子を内装するパッケージが、前記発光素子
と受光素子を覆う光透過可能な透明ゲル樹脂と、前記透
明ゲル樹脂の外周部を覆う光反射樹脂と、前記光反射樹
脂の外面に塗布された遮光膜とで構成される。また、前
記発光素子と受光素子は、発光素子で発光された光が前
記透明ゲル樹脂と光反射樹脂との界面で反射されて前記
受光素子で受光される反射型の光結合素子として構成さ
れ、あるいは、発光素子の発光面と受光素子の受光面が
対向配置され、発光素子で発光された光の大部分が直接
に受光素子において受光される光結合素子として構成さ
れる。In the optical coupling element according to the present invention, a package containing a light emitting element and a light receiving element includes a light transmissive transparent gel resin covering the light emitting element and the light receiving element, and a light reflecting resin covering an outer peripheral portion of the transparent gel resin. Resin, and the penetration degree of the transparent gel resin is 45 to 65 (JIS-K2220). Further, in the present invention, a package containing a light emitting element and a light receiving element, a light transmissive transparent gel resin covering the light emitting element and the light receiving element, a light reflecting resin covering an outer peripheral portion of the transparent gel resin, And a light-shielding film applied to the outer surface of the light reflecting resin. Further, the light emitting element and the light receiving element are configured as a reflection type optical coupling element in which light emitted by the light emitting element is reflected at an interface between the transparent gel resin and the light reflecting resin and is received by the light receiving element, Alternatively, the light emitting surface of the light emitting element and the light receiving surface of the light receiving element are arranged to face each other, and the light emitting element is configured as an optical coupling element in which most of the light emitted by the light emitting element is directly received by the light receiving element.
【０００９】また、本発明の光結合素子の製造方法は、
リードフレームに発光素子と受光素子をそれぞれ搭載す
る工程と、前記発光素子と受光素子を覆うように針入度
が４５〜６５（ＪＩＳ−Ｋ２２２０）の光透過性の透明
ゲル樹脂を塗布する工程と、前工程までに形成された構
体をモールド金型内にセットし前記透明ゲル樹脂の外周
部を覆うように光反射樹脂でモールド成形する工程とを
含むことを特徴とする。前記透明ゲル樹脂を塗布する工
程は、発光素子及び受光素子の上方から透明ゲル樹脂を
滴下するポッティング方法であってもよい。また、前記
光反射樹脂の外面に遮光性の塗料を塗布または付着して
遮光膜を形成する工程を含んでいる。Further, a method for manufacturing an optical coupling device according to the present invention comprises:
A step of mounting the light emitting element and the light receiving element on the lead frame, and a step of applying a light transmissive transparent gel resin having a penetration of 45 to 65 (JIS-K2220) so as to cover the light emitting element and the light receiving element. Setting the structure formed up to the previous step in a mold, and molding the light-reflective resin so as to cover the outer peripheral portion of the transparent gel resin. The step of applying the transparent gel resin may be a potting method of dropping the transparent gel resin from above the light emitting element and the light receiving element. Further, the method includes a step of applying or attaching a light-shielding paint to the outer surface of the light-reflective resin to form a light-shielding film.
【００１０】本発明においては、光反射樹脂をモールド
成形してパッケージを形成した後に温度変化に伴う樹脂
の収縮が生じ、光反射樹脂と透明ゲル樹脂との間に熱応
力が生じた場合でも、透明ゲル樹脂はヤング率がゴム樹
脂に対し非常に小さいため（約３００分の１）、透明ゲ
ル樹脂自体の応力が高まるに従って弾性変形し、応力自
体を緩和する。こうした透明ゲル樹脂自体の弾性変形に
より、透明ゲル樹脂と光反射樹脂との界面の広い範囲に
わたって剥離が生じることはない。したがって、剥離が
要因とされる絶縁耐圧の低下が改善される。また、透明
ゲル樹脂の前記した変形により前記熱応力が緩和される
ため、光反射樹脂におけるクラックの発生が防止され、
高品質の光結合素子が得られる。さらに、透明ゲル樹脂
の塗布工程と光反射樹脂のモールド成形工程、及び必要
に応じて遮光膜の形成の工程を付加することで本発明の
光結合素子が製造できるため、製造工程を低減できる。In the present invention, even if the resin is shrunk due to a temperature change after molding the light reflecting resin to form a package, and thermal stress is generated between the light reflecting resin and the transparent gel resin, Since the transparent gel resin has a very low Young's modulus (approximately 1/300) as compared to the rubber resin, the transparent gel resin itself is elastically deformed as the stress of the resin itself increases, and the stress itself is relieved. Due to such elastic deformation of the transparent gel resin itself, peeling does not occur over a wide range of the interface between the transparent gel resin and the light reflecting resin. Therefore, the decrease in the withstand voltage due to the separation is improved. In addition, since the thermal stress is reduced by the deformation of the transparent gel resin, the occurrence of cracks in the light reflecting resin is prevented,
A high quality optical coupling device can be obtained. Furthermore, the optical coupling element of the present invention can be manufactured by adding a transparent gel resin application step, a light reflection resin molding step, and, if necessary, a light shielding film formation step, so that the number of manufacturing steps can be reduced.
【００１１】[0011]
【発明の実施の形態】次に、本発明の実施形態を図面を
参照して説明する。図１は本発明を反射型光結合素子と
して構成した第１の実施形態の一部を破断した斜視図で
あり、また図２（ａ），（ｂ）は内部構造を透視した状
態の平面図とその縦断面図である。この光結合素子は、
銅リードフレーム１１に形成された２対の外部導出リー
ド１２（１２ａ，１２ｂ），１３（１３ａ，１３ｂ）が
平面上で反対方向に向けて対向状態に設けられ、各対で
はそれぞれ一方の外部導出リード１２ａ，１３ａにタブ
１２ｃ，１３ｃが一体に形成されている。そして、前記
各タブにはそれぞれ発光素子１４、受光素子１５の各チ
ップが搭載され、またこれらチップの電極パッドはボン
ディングワイヤ１６，１７により各対の他方の外部導出
リード１２ｂ，１３ｂに電気接続されている。そして、
前記発光素子１４及び受光素子１５は透明ゲル樹脂１８
で被覆され、かつその外側は白色高光反射樹脂１９で封
止されている。前記透明ゲル樹脂１８は、その上面及び
下面の各形状が球面に近い形状であり、好ましくは前記
発光素子１４の発光面と受光素子１５の受光面をそれぞ
れ第１、第２焦点とする回転楕円面として構成される。
また、前記白色高光反射樹脂１９は、その外形状は光結
合素子に要求されるパッケージ形状として構成される。Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partially cutaway perspective view of a first embodiment in which the present invention is configured as a reflection type optical coupling element, and FIGS. 2A and 2B are plan views showing the internal structure in a see-through manner. FIG. This optical coupling element
Two pairs of lead-out leads 12 (12a, 12b) and 13 (13a, 13b) formed on the copper lead frame 11 are provided facing each other in the opposite direction on a plane, and each pair has one lead-out lead. Tabs 12c and 13c are formed integrally with the leads 12a and 13a. Each chip of the light emitting element 14 and the light receiving element 15 is mounted on each of the tabs, and the electrode pads of these chips are electrically connected to the other lead-out leads 12 b and 13 b of each pair by bonding wires 16 and 17. ing. And
The light emitting element 14 and the light receiving element 15 are made of a transparent gel resin 18.
And the outside thereof is sealed with a white high light reflection resin 19. The transparent gel resin 18 has an upper surface and a lower surface each having a shape close to a spherical surface, and preferably a spheroid having a light emitting surface of the light emitting element 14 and a light receiving surface of the light receiving element 15 as first and second focal points, respectively. It is configured as a surface.
The outer shape of the white high light reflection resin 19 is configured as a package shape required for an optical coupling element.
【００１２】図３は、前記第１の実施形態の光結合素子
の製造工程を示すフローチャートである。前記したリー
ドフレーム１１の各対の外部導出リード１２，１３のタ
ブ１２ｃ，１３ｃにそれぞれ発光素子１４と受光素子１
５の各チップを銀ペーストでダイボンディングする（Ｓ
１１）。硬化条件は２００℃，２０秒である。次いで、
発光素子１５及び受光素子１６の各電極パッドと、他方
の外部導出リード１２ｂ，１３ｂとを金ワイヤ１６，１
７でボンディング接続する（Ｓ１２）。しかる上で、前
記発光素子１４及び受光素子１５、ならびに前記各外部
導出リード１２，１３のインナーリード部位を覆う領域
に、上方から透明ゲル樹脂１８を滴下し（Ｓ１３）、そ
の後、１５０℃，２時間で硬化させる（Ｓ１４）。前記
透明ゲル樹脂１８としては、硬化前の流動性（２５±２
℃の室温で１±０．０２ｇの試料を清浄なガラス板上に
滴下し、３０±０．５分放置したときの広がりの最長部
と最短部の平均値）が４０〜５０ｍｍ、硬化物の針入度
が４５〜６５ｍｍ（ＪＩＳ−Ｋ２２２０）（例えば、東
レダウコーニングシリコーン株式会社製，ＪＣＲ−６１
０９）を用いる。この条件により、硬化された透明ゲル
樹脂１８は、ゲル状態が保持されながらも所定の形状保
持性が保有され、しかも硬化の際の表面張力によって前
記したように球面、ないし回転楕円面に近い形状とな
る。FIG. 3 is a flowchart showing a process of manufacturing the optical coupling device according to the first embodiment. The light emitting element 14 and the light receiving element 1 are respectively provided on the tabs 12c and 13c of the external leads 12 and 13 of each pair of the lead frame 11 described above.
5 is die-bonded with silver paste (S
11). Curing conditions are 200 ° C. and 20 seconds. Then
Each of the electrode pads of the light emitting element 15 and the light receiving element 16 and the other external lead 12b, 13b are connected to the gold wire 16, 1
The bonding connection is made in step 7 (S12). Then, a transparent gel resin 18 is dropped from above onto a region covering the light emitting element 14 and the light receiving element 15 and the inner lead portions of the external lead-outs 12 and 13 (S13). It cures in time (S14). As the transparent gel resin 18, the fluidity before curing (25 ± 2
1 ± 0.02 g of a sample was dropped on a clean glass plate at room temperature of 30 ° C., and the average of the longest part and the shortest part of the spread when left for 30 ± 0.5 minutes) was 40 to 50 mm, and the cured product Penetration is 45 to 65 mm (JIS-K2220) (for example, JCR-61 manufactured by Toray Dow Corning Silicone Co., Ltd.)
09) is used. Under these conditions, the cured transparent gel resin 18 retains a predetermined shape while maintaining the gel state, and has a shape close to a spherical surface or a spheroidal surface as described above due to surface tension at the time of curing. Becomes
【００１３】しかる上で、前記透明ゲル樹脂１８で封止
した構体を図外のトランスファモールド装置の金型内に
セットし、白色高光反射樹脂１９を金型内に注入してモ
ールド成形し、所要のパッケージ形状とする（Ｓ１
５）。この白色高光反射樹脂１９としては、透明樹脂中
に反射材としての酸化チタン（ＴｉＯ2 ）の微粉末を添
加したもの、例えば、東芝ケミカル株式会社製、ＫＥ−
９６０Ｍが用いられ、硬化条件として１７５℃，２分、
また１７５℃，４〜８時間のアフターキュアを行う。Then, the assembly sealed with the transparent gel resin 18 is set in a mold of a transfer molding apparatus (not shown), and a white high-light reflecting resin 19 is injected into the mold and molded. (S1)
5). The white high light reflective resin 19 is obtained by adding fine powder of titanium oxide (TiO 2 ) as a reflective material to a transparent resin, for example, KE- manufactured by Toshiba Chemical Corporation.
960M is used, and curing conditions are 175 ° C., 2 minutes,
After-curing is performed at 175 ° C. for 4 to 8 hours.
【００１４】このように製造された光結像素子では、外
部導出リード１２に所要の電力を印加して発光素子１４
を発光すれば、発光素子１４から出射された光は透明ゲ
ル樹脂１８内を透過し、白色高光反射樹脂１９との界面
において反射される。そして、反射された光は受光素子
１５において受光され、外部導出リード１３から電気信
号として出力される。このとき、前記透明ゲル樹脂１８
の外形は球面、ないし回転楕円面に近い形状であるた
め、発光素子１４から出射されて透明ゲル樹脂１８と白
色高光反射樹脂１９との界面で反射される光の大部分は
受光素子１５に向けられることになり、高い光結合効率
を得ることができる。In the optical imaging device manufactured as described above, a required electric power is applied to the external lead 12 and the light emitting device 14 is applied.
Is emitted, the light emitted from the light emitting element 14 passes through the transparent gel resin 18 and is reflected at the interface with the white high light reflection resin 19. The reflected light is received by the light receiving element 15 and is output from the external lead 13 as an electric signal. At this time, the transparent gel resin 18
Has a spherical shape or a shape close to a spheroid, most of the light emitted from the light emitting element 14 and reflected at the interface between the transparent gel resin 18 and the white high-reflection resin 19 is directed to the light receiving element 15. Therefore, high optical coupling efficiency can be obtained.
【００１５】また、前記光結像素子では、内部樹脂とし
ての透明ゲル樹脂１８の熱膨張係数は約３０×１０-5／
℃、外部樹脂の白色高光反射樹脂の熱膨張係数は約１．
７×１０-5／℃であり、熱膨張係数の差は図１１に示さ
れる従来例とほぼ同等である。しかし、硬化物の針入度
が４５〜６５（ＪＩＳ−Ｋ２２２０）の透明ゲル樹脂を
用いているので、透明ゲル樹脂自体のヤング率が低く
（ヤング率，０．０１〜０．４×１０-5Ｎ／ｍ2 ）、白
色高光反射樹脂１９をトランスファーモールドした際の
熱処理工程、及びその後の冷却工程を経た場合において
も、透明ゲル樹脂自体が弾性変形し、応力緩和される。
そのため、透明ゲル樹脂１８と白色高光反射樹脂１９と
の界面における剥離が生じることを防止できる。また、
光結合素子の実装時に加わるような急激な温度差（約２
１５℃）において、熱応力が高まった場合にも、透明ゲ
ル樹脂１８はゲル状態であり、かつヤング率が小さいた
め、容易に形状変形が可能な状態であるため、発生した
熱応力によって透明ゲル樹脂１８の外周面の一部が変形
されて透明ゲル樹脂１８と白色高光反射樹脂１９との界
面の一部が剥離される状態が生じても、界面の広い領域
ないし全部の領域において剥離が生じることはない。し
たがって、透明ゲル樹脂１８と白色高光反射樹脂１９と
の界面は対向する外部導出リード間を跨がる隙間が生じ
ることはなく、外部導出リード１２，１３間の絶縁耐圧
が低下することを防止できる。また、前記したように熱
応力が発生した場合でも透明ゲル樹脂１８の変形によっ
て緩和されるため、外部樹脂としての白色高光反射樹脂
１９にクラックが生じることもなく、外観上の見栄えを
向上して商品品質の高い光結像素子が得られる。さら
に、製造工程においては、１回の透明ゲル樹脂のポッテ
ィング工程と、１回の白色高光反射樹脂のモールド工程
のみでよいため、製造工程が削減できる。ここで、透明
ゲル樹脂の硬化物の針入度が６５よりも高い場合、トラ
ンスファーモールド成形時の加熱（１７５℃）により軟
化するため、トランスファー成形時の白色高光反射樹脂
の融体流により、透明ゲル樹脂が押し流され、所定の形
状が保持できなくなるので好ましくない。また、硬化物
の針入度が４５未満の場合、針入度が小さくなるととも
に透明ゲル樹脂のヤング率が高くなる。透明ゲル樹脂の
ヤング率が高くなるに従って、透明ゲル樹脂と白色高光
反射樹脂との界面の隙間が増して発光素子側と受光素子
側の外部導出リード間の絶縁耐圧が低下するので好まし
くない。以上述べたように、内部樹脂として針入度が４
５〜６５（ＪＩＳ−Ｋ２２２０）の透明ゲル樹脂を用い
ることにより、内部樹脂と外部樹脂の界面の剥離を防止
できるばかりでなく、透明ゲル樹脂の塗布量を低減する
ことができ、光結合素子の薄型化が可能となる。In the optical imaging device, the transparent gel resin 18 as the internal resin has a coefficient of thermal expansion of about 30 × 10 -5 /
° C, the thermal expansion coefficient of the white high light reflective resin as the external resin is about 1.
It is 7 × 10 −5 / ° C., and the difference in thermal expansion coefficient is almost the same as that of the conventional example shown in FIG. However, since a transparent gel resin having a cured product penetration of 45 to 65 (JIS-K2220) is used, the Young's modulus of the transparent gel resin itself is low (Young's modulus, 0.01 to 0.4 × 10 −). 5 N / m 2 ), the transparent gel resin itself is elastically deformed and stress relaxed even after a heat treatment step when transfer molding the white high light reflective resin 19 and a subsequent cooling step.
Therefore, separation at the interface between the transparent gel resin 18 and the white high-light reflective resin 19 can be prevented. Also,
A sharp temperature difference (approximately 2
(15 ° C.), even when the thermal stress increases, the transparent gel resin 18 is in a gel state and has a small Young's modulus, so that it can be easily deformed in shape. Even when a part of the outer peripheral surface of the resin 18 is deformed and a part of the interface between the transparent gel resin 18 and the white high-reflection resin 19 is peeled off, the peeling occurs in a wide area or the whole area of the interface. Never. Therefore, the interface between the transparent gel resin 18 and the white high-reflection resin 19 does not have a gap extending between the external lead-outs facing each other, and the dielectric strength between the external lead-outs 12 and 13 can be prevented from lowering. . Further, even when a thermal stress is generated as described above, since the transparent gel resin 18 is alleviated by the deformation, no crack is generated in the white high-light reflective resin 19 as the external resin, and the external appearance is improved. An optical imaging device with high product quality can be obtained. Furthermore, in the manufacturing process, only one potting process of the transparent gel resin and one molding process of the white high-reflection resin are required, so that the manufacturing process can be reduced. Here, when the penetration of the cured product of the transparent gel resin is higher than 65, the cured product is softened by heating (175 ° C.) during the transfer molding, so that the transparent gel resin is transparent due to the melt flow of the white high light reflection resin during the transfer molding. It is not preferable because the gel resin is washed away and a predetermined shape cannot be maintained. When the penetration of the cured product is less than 45, the penetration becomes small and the Young's modulus of the transparent gel resin becomes high. As the Young's modulus of the transparent gel resin increases, the gap at the interface between the transparent gel resin and the white high-reflection resin increases, and the withstand voltage between the external lead-outs on the light emitting element side and the light receiving element side decreases. As described above, the internal resin has a penetration of 4
By using a transparent gel resin of 5 to 65 (JIS-K2220), not only the separation of the interface between the internal resin and the external resin can be prevented, but also the application amount of the transparent gel resin can be reduced, and the optical coupling element can be reduced. The thickness can be reduced.
【００１６】図４は本発明の第２の実施形態を示してお
り、同図（ａ），（ｂ）は内部構造を透視した状態の平
面図とその縦断面図である。この光結合素子は、第１の
実施形態と同様に反射型光結合素子として構成したもの
であり、等価な部分には同一符号を付してある。２対の
外部導出リード１２，１３のそれぞれのタブ１２ｃ，１
３ｃに発光素子１４、受光素子１５の各チップが搭載さ
れ、かつこれら発光素子１４及び受光素子１５は透明ゲ
ル樹脂１８で被覆され、かつその外側は白色高光反射樹
脂１９で封止されていることは同じである。また、前記
透明ゲル樹脂１８は、その上面及び下面の各形状が球面
に近い形状であり、好ましくは前記発光素子の発光面と
受光素子の受光面をそれぞれ第１、第２焦点とする回転
楕円面として構成され、また、前記白色高光反射樹脂１
９は、その外形状は光結合素子に要求されるパッケージ
形状としての形状に構成されることも同じである。ただ
し、この第２の実施形態では、前記白色高光反射樹脂１
９の外面に黒色インク、あるいは黒色塗料を塗布した遮
光膜１０が形成されている。FIGS. 4A and 4B show a second embodiment of the present invention. FIGS. 4A and 4B are a plan view showing the internal structure in a see-through state and a longitudinal sectional view thereof. This optical coupling element is configured as a reflection type optical coupling element as in the first embodiment, and equivalent parts are denoted by the same reference numerals. Tabs 12c, 1 of each of two pairs of external lead-out leads 12, 13
3c, each chip of the light emitting element 14 and the light receiving element 15 is mounted, and the light emitting element 14 and the light receiving element 15 are covered with a transparent gel resin 18 and the outside thereof is sealed with a white high light reflection resin 19 Is the same. The transparent gel resin 18 has an upper surface and a lower surface each having a shape close to a spherical surface, and preferably, a spheroid having a light emitting surface of the light emitting element and a light receiving surface of the light receiving element as first and second focal points, respectively. Surface, and the white high-light reflective resin 1
9 is also the same in that its outer shape is configured as a package shape required for the optical coupling element. However, in the second embodiment, the white high-light reflecting resin 1
9 is provided with a light-shielding film 10 coated with black ink or black paint.
【００１７】図５は、前記第２の実施形態の光結合素子
の製造工程を示すフローチャートである。前記した銅リ
ードフレーム１１の各対の外部導出リード１２，１３の
タブ１２ｃ，１３ｃにそれぞれ発光素子１４と受光素子
１５の各チップを銀ペーストでダイボンディングする
（Ｓ２１）。硬化条件は２００℃，２０秒である。次い
で、発光素子及び受光素子の各電極パッドと、他方のリ
ードとの金ワイヤ１６，１７でボンディング接続する
（Ｓ２２）。しかる上で、前記発光素子１４及び受光素
子１５を含む領域に、上方から透明ゲル樹脂１８を滴下
し（Ｓ２３）、その後、１５０℃，２時間で硬化させる
（Ｓ２４）。前記透明ゲル樹脂１８としては、硬化前の
流動性が４０〜５０ｍｍ、硬化物の針入度が４５〜６５
（ＪＩＳ−Ｋ２２２０）を用いる。この条件により、硬
化された透明ゲル樹脂１８は、ゲル状態が保持されなが
らも所定の形状保持性が保有され、しかも硬化の際の表
面張力によって前記したように球面、ないし回転楕円面
に近い形状となる。FIG. 5 is a flowchart showing the steps of manufacturing the optical coupling device according to the second embodiment. The chips of the light emitting element 14 and the light receiving element 15 are die-bonded to the tabs 12c and 13c of the pair of external lead-out leads 12 and 13 of the copper lead frame 11 using silver paste (S21). Curing conditions are 200 ° C. and 20 seconds. Next, the respective electrode pads of the light emitting element and the light receiving element are bonded to the other leads by gold wires 16 and 17 (S22). Then, the transparent gel resin 18 is dropped from above onto the region including the light emitting element 14 and the light receiving element 15 (S23), and then cured at 150 ° C. for 2 hours (S24). The transparent gel resin 18 has a fluidity before curing of 40 to 50 mm and a penetration of the cured product of 45 to 65.
(JIS-K2220) is used. Under these conditions, the cured transparent gel resin 18 retains a predetermined shape while maintaining the gel state, and has a shape close to a spherical surface or a spheroidal surface as described above due to surface tension at the time of curing. Becomes
【００１８】しかる上で、前記透明ゲル樹脂１８で封止
した構体をトランスファモールド装置の金型内にセット
し、白色高光反射樹脂１９でモールド成形し、所要のパ
ッケージ形状とする（Ｓ２５）。この白色高光反射樹脂
１９としては、透明樹脂中に反射材としての酸化チタン
（ＴｉＯ2 ）の微粉末を添加したものが用いられ、硬化
条件として１７５℃，２分、また１７５℃，４〜８時間
のアフターキュアを行う。さらに、エポキシ樹脂の含ん
だ黒色インク（常温で硬化するもの、例えば、キーエン
ス株式会社製、ＭＪ−１０）を、インクジェット装置に
より前記白色高光反射樹脂１９の外面に吹き付け、１０
μｍ以下の厚さに塗布する。あるいは、これに代えて、
外部導出リード１２，１３に付着しないようにマスキン
グを施した上で、黒色の粉体塗料（粉体エポキシ樹脂、
例えば、住友ベークライト株式会社製、ＥＣＰ−１９
４）を静電気を利用して前記白色高光反射樹脂の外面に
５〜５０μｍの膜厚に付着し、１５０℃、１時間の加熱
処理を行って硬化させ、定着させるようにしてもよい。
これにより、白色高光反射樹脂１９の外面に遮光膜１０
が形成される（Ｓ２６）。Then, the assembly sealed with the transparent gel resin 18 is set in a mold of a transfer molding apparatus, and is molded with a white high light reflection resin 19 to obtain a required package shape (S25). As the white high-light reflecting resin 19, a resin obtained by adding fine powder of titanium oxide (TiO 2 ) as a reflecting material to a transparent resin is used. The curing conditions are 175 ° C. for 2 minutes, and 175 ° C. for 4 to 8 minutes. Perform after-hour cure. Further, a black ink containing an epoxy resin (which can be cured at room temperature, for example, MJ-10, manufactured by KEYENCE CORPORATION) is sprayed on the outer surface of the white high-reflection resin 19 with an ink jet device, and the
Apply to a thickness of less than μm. Or alternatively,
After masking so as not to adhere to the external lead-out leads 12 and 13, a black powder paint (powder epoxy resin,
For example, ECP-19 manufactured by Sumitomo Bakelite Co., Ltd.
4) may be attached to the outer surface of the white high-light reflective resin to a thickness of 5 to 50 μm by using static electricity, and may be cured by performing a heat treatment at 150 ° C. for one hour to fix the resin.
Thereby, the light shielding film 10 is formed on the outer surface of the white high light reflection resin 19.
Is formed (S26).
【００１９】このように製造された光結像素子において
も、第１の実施形態と同様に、外部導出リード１２に所
要の電力を印加して発光素子を発光すれば、発光素子１
４から出射された光は透明ゲル樹脂１８内を透過し、白
色高光反射樹脂１９との界面において反射される。そし
て、反射された光は受光素子１５において受光され、外
部導出リード１３から電気信号として出力される。ま
た、前記透明ゲル樹脂１８の外形は球面、ないし回転楕
円面に近い形状であるため、発光素子１４から出射され
て透明ゲル樹脂１８と白色高光反射樹脂１９との界面で
反射される光の大部分は受光素子１５に向けられること
になり、高い光結合効率を得ることができる。さらに、
この実施形態では、白色高光反射樹脂１９の外面に黒色
インクや黒色塗料からなる遮光膜１０が形成されている
ため、光結合素子の外部から高輝度の外部光が入射され
た場合でも、この外部光が素子内の受光素子１５にまで
透過されることはなく、受光素子１５におけるＳ／Ｎ比
に高いものが得られる。In the optical imaging device manufactured as described above, similarly to the first embodiment, when the required power is applied to the external lead 12 and the light emitting device emits light, the light emitting device 1
The light emitted from 4 is transmitted through the transparent gel resin 18 and is reflected at the interface with the white high-light reflective resin 19. The reflected light is received by the light receiving element 15 and is output from the external lead 13 as an electric signal. Further, since the outer shape of the transparent gel resin 18 is a spherical shape or a shape close to a spheroid, a large amount of light emitted from the light emitting element 14 and reflected at the interface between the transparent gel resin 18 and the white high light reflective resin 19 is obtained. The portion is directed to the light receiving element 15, and high optical coupling efficiency can be obtained. further,
In this embodiment, since the light-shielding film 10 made of black ink or black paint is formed on the outer surface of the white high-light reflective resin 19, even when external light of high brightness is incident from outside the optical coupling element, this external light Light is not transmitted to the light receiving element 15 in the element, and a light receiving element 15 having a high S / N ratio can be obtained.
【００２０】また、この第２の実施形態の光結像素子に
おいても、内部樹脂としての透明ゲル樹脂１８の熱膨張
係数は約３０×１０-5／℃、外部樹脂の白色高光反射樹
脂の熱膨張係数は約１．７×１０-5／℃であり、熱膨張
係数の差は図１１に示される従来例とほぼ同等である。
しかし、硬化物の針入度が４５〜６５（ＪＩＳ−Ｋ２２
２０）の透明ゲル樹脂を用いているので、透明ゲル樹脂
自体のヤング率が低く（ヤング率，０．０１〜０．４×
１０-5Ｎ／ｍ2 ）、白色高光反射樹脂１９をトランスフ
ァーモールドした際の熱処理工程、及びその後の冷却工
程を経た場合においても、透明ゲル樹脂自体が弾性変形
し、応力緩和される。そのため、透明ゲル樹脂１８と白
色高光反射樹脂１９との界面における剥離が生じること
を防止できる。また、光結合素子の実装時に加わるよう
な急激な温度差（約２１５℃）において、熱応力が高ま
った場合にも、透明ゲル樹脂１８はゲル状態であり、か
つヤング率が小さいため、透明ゲル樹脂１８と白色高光
反射樹脂１９との界面に対向する外部導出リード１２，
１３間を跨がる隙間が生じることはなく、絶縁耐圧が低
下することを防止できる。また、前記したように熱応力
が発生した場合でも透明ゲル樹脂１８の変形によって緩
和されるため、外部樹脂としての白色高光反射樹脂１９
にクラックが生じることもなく、外観上の見栄えを向上
して商品品質の高い光結像素子が得られる。さらに、製
造工程においては、１回の透明ゲル樹脂のポッティング
工程と、１回の白色高光反射樹脂のモールド工程に、遮
光膜の塗布工程が付加されるのみであるため、製造を容
易に行うことができる。また、遮光膜１０は厚さが５０
μｍ以下となるように薄く形成されることから、光結合
素子の本体厚さ（樹脂の総厚さ）にほとんど影響なく外
来光の遮光性に優れた光結合素子を得ることができる。Also in the optical imaging device of the second embodiment, the thermal expansion coefficient of the transparent gel resin 18 as the internal resin is about 30 × 10 -5 / ° C., and the thermal expansion coefficient of the white high-light reflective resin as the external resin. The expansion coefficient is about 1.7 × 10 −5 / ° C., and the difference between the coefficients of thermal expansion is almost the same as the conventional example shown in FIG.
However, the penetration of the cured product is 45 to 65 (JIS-K22
Since the transparent gel resin of (20) is used, the Young's modulus of the transparent gel resin itself is low (Young's modulus, 0.01 to 0.4 ×
10 -5 N / m 2 ), the transparent gel resin itself is elastically deformed and stress is relaxed even after a heat treatment step when transfer molding the white high light reflection resin 19 and a cooling step thereafter. Therefore, separation at the interface between the transparent gel resin 18 and the white high-light reflective resin 19 can be prevented. Further, even when the thermal stress is increased due to a sudden temperature difference (approximately 215 ° C.) applied when mounting the optical coupling element, the transparent gel resin 18 is in a gel state and has a small Young's modulus. An external lead 12 facing the interface between the resin 18 and the white high-light reflecting resin 19;
Thus, no gap is formed across the gaps 13, and a decrease in the dielectric strength can be prevented. Further, even when a thermal stress is generated as described above, since the transparent gel resin 18 is alleviated by the deformation, the white high light reflecting resin 19 as an external resin is used.
Cracks do not occur, and the appearance of the optical imaging device is improved and the product quality is high. Furthermore, in the manufacturing process, a light-shielding film coating process is only added to one transparent gel resin potting process and one white high-light reflective resin molding process. Can be. The light-shielding film 10 has a thickness of 50.
Since the optical coupling element is formed thin so as to be not more than μm, it is possible to obtain an optical coupling element having excellent light-shielding properties for extraneous light without substantially affecting the thickness of the main body of the optical coupling element (total thickness of the resin).
【００２１】図６は本発明の第３の実施形態の一部を破
断した斜視図であり、図７（ａ），（ｂ）は内部構造を
透視した状態の平面図とその縦断面図である。この光結
合素子は、発光素子と受光素子とを対向配置した構成で
あり、それぞれ異なる銅リードフレーム２１Ａ，２１Ｂ
で形成された２対の外部導出リード２２（２２ａ，２２
ｂ），２３（２３ａ，２３ｂ）のそれぞれのタブ２２
ｃ，２３ｃは板厚方向に曲げ形成されて、板厚方向に所
要の間隔で対峙されている。そして、前記各タブ２２
ｃ，２３ｃにそれぞれ発光素子２４、受光素子２５の各
チップが搭載され、かつそれぞれ金ワイヤ２６，２７に
よって各対の他方の外部導出リード２２ｂ，２３ｂに接
続されている。そして、これらの発光素子２４及び受光
素子２５は前記タブ間に充填された透明ゲル樹脂２８で
被覆され、かつその外側は白色高光反射樹脂２９で封止
されている。また、前記透明ゲル樹脂は、その側面は自
身の表面張力によって凹面状に形成されている。FIG. 6 is a partially cutaway perspective view of a third embodiment of the present invention. FIGS. 7A and 7B are a plan view showing the internal structure in a see-through state and a longitudinal sectional view thereof. is there. This optical coupling element has a configuration in which a light emitting element and a light receiving element are arranged to face each other, and different copper lead frames 21A and 21B, respectively.
The pair of external leads 22 (22a, 22a) formed by
b) and 23 (23a, 23b)
c and 23c are bent in the plate thickness direction and face each other at required intervals in the plate thickness direction. Then, each of the tabs 22
The chips of the light emitting element 24 and the light receiving element 25 are mounted on c and 23c, respectively, and are connected to the other external lead-out leads 22b and 23b of each pair by gold wires 26 and 27, respectively. The light emitting element 24 and the light receiving element 25 are covered with a transparent gel resin 28 filled between the tabs, and the outside thereof is sealed with a white high light reflection resin 29. The transparent gel resin has a side surface formed in a concave shape by its own surface tension.
【００２２】図８は、前記第３の実施形態の光結合素子
の製造工程を示すフローチャートである。対をなす２枚
の銅リードフレーム２１Ａ，２１Ｂの各外部導出リード
２２，２３に設けられているタブ２２ｃ，２３ｃにそれ
ぞれ発光素子２４と受光素子２５の各チップを銀ペース
トでダイボンディングする（Ｓ３１）。硬化条件は２０
０℃，２０秒である。次いで、発光素子２４及び受光素
子２５の各電極パッドと、他方の外部導出リード２２
ｂ，２３ｂとを金ワイヤ２６，２７でボンディング接続
する（Ｓ３２）。その上で前記発光素子２４と受光素子
２５が対向配置されるように、前記各リードフレーム２
１Ａ，２１Ｂを板厚方向に重ね合わせる。しかる上で、
前記発光素子２４及び受光素子２５の対向間に、側方か
ら透明ゲル樹脂２８を塗布して各タブ間に充填し（Ｓ３
３）、その後、１５０℃，２時間で硬化させる（Ｓ３
４）。前記透明ゲル樹脂２８としては、硬化前の流動性
が４０〜５０ｍｍ、硬化物の針入度が４５〜６５（ＪＩ
Ｓ−Ｋ２２２０）を用いる。この条件により、硬化され
た透明ゲル樹脂２４は、ゲル状態が保持されながらも所
定の形状保持性が保有され、しかも硬化の際の表面張力
によって前記したように側面が凹面状に形成される。FIG. 8 is a flowchart showing the steps of manufacturing the optical coupling device according to the third embodiment. The respective chips of the light emitting element 24 and the light receiving element 25 are die-bonded to the tabs 22c and 23c provided on the external lead 22 and 23 of the two copper lead frames 21A and 21B, respectively, with silver paste (S31). ). Curing condition is 20
0 ° C., 20 seconds. Next, each electrode pad of the light emitting element 24 and the light receiving element 25 and the other external lead 22
b and 23b are bonded by gold wires 26 and 27 (S32). Then, each of the lead frames 2 is arranged such that the light emitting element 24 and the light receiving element 25 are opposed to each other.
1A and 21B are overlapped in the thickness direction. In doing so,
A transparent gel resin 28 is applied from the side between the opposing light emitting elements 24 and the light receiving elements 25 and is filled between the tabs (S3).
3) Then, it is cured at 150 ° C. for 2 hours (S3)
4). As the transparent gel resin 28, the fluidity before curing is 40 to 50 mm, and the penetration of the cured product is 45 to 65 (JI
SK-2220). Under these conditions, the cured transparent gel resin 24 retains a predetermined shape while maintaining the gel state, and has a concave side surface as described above due to surface tension during curing.
【００２３】しかる上で、前記透明ゲル樹脂２８で封止
した構体を図外のトランスファーモールド装置の金型内
にセットし、白色高光反射樹脂２９でモールド成形し、
所要のパッケージ形状とする（Ｓ３５）。この白色高光
反射樹脂２９としては、透明樹脂中に反射材としての酸
化チタン（ＴｉＯ2 ）の微粉末を添加したものが用いら
れ、硬化条件として１７５℃，２分、また１７５℃，４
〜８時間のアフターキュアを行う。Then, the assembly sealed with the transparent gel resin 28 is set in a mold of a transfer molding apparatus (not shown), and molded with a white high-light reflective resin 29,
The required package shape is set (S35). As the white high-light reflection resin 29, a resin obtained by adding fine powder of titanium oxide (TiO 2 ) as a reflection material to a transparent resin is used. The curing conditions are 175 ° C., 2 minutes, and 175 ° C., 4 minutes.
After-cure for ~ 8 hours.
【００２４】このように製造された光結像素子では、外
部導出リード２２に所要の電力を印加して発光素子２４
を発光すれば、発光素子２４から出射された光は透明ゲ
ル樹脂２８内を透過して受光素子２５にまで至り、受光
素子２５において受光され、外部導出リード２３から電
気信号として出力される。このとき、発光素子２４から
出射された光の一部は透明ゲル樹脂２８と白色高光反射
樹脂２９との界面で反射された後に受光素子２５におい
て受光されることになり、高い光結合効率を得ることが
できる。In the optical imaging device manufactured as described above, a required power is applied to the external lead 22 and the light emitting device 24 is applied.
When the light is emitted, the light emitted from the light emitting element 24 passes through the transparent gel resin 28 and reaches the light receiving element 25, is received by the light receiving element 25, and is output from the external lead 23 as an electric signal. At this time, a part of the light emitted from the light emitting element 24 is received by the light receiving element 25 after being reflected at the interface between the transparent gel resin 28 and the white high-light reflective resin 29, and high optical coupling efficiency is obtained. be able to.
【００２５】この第３の実施形態の光結像素子において
も、内部樹脂としての透明ゲル樹脂１８の熱膨張係数は
約３０×１０-5／℃、外部樹脂の白色高光反射樹脂の熱
膨張係数は約１．７×１０-5／℃であり、熱膨張係数の
差は図１１に示される従来例とほぼ同等である。しか
し、硬化物の針入度が４５〜６５（ＪＩＳ−Ｋ２２２
０）の透明ゲル樹脂を用いているので、透明ゲル樹脂自
体のヤング率が低く（ヤング率，０．０１〜０．４×１
０-5Ｎ／ｍ2 ）、白色高光反射樹脂１９をトランスファ
ーモールドした際の熱処理工程、及びその後の冷却工程
を経た場合においても、透明ゲル樹脂自体が弾性変形
し、応力緩和される。そのため、透明ゲル樹脂１８と白
色高光反射樹脂１９との界面における剥離が生じること
を防止できる。また、光結合素子の実装時に加わるよう
な急激な温度差（約２１５℃）において、熱応力が高ま
った場合にも、透明ゲル樹脂１８はゲル状態であり、か
つヤング率が小さいため、透明ゲル樹脂１８と白色高光
反射樹脂１９との界面に対向する外部導出リード１２，
１３間を跨がる隙間が生じることはなく、絶縁耐圧が低
下することを防止できる。また、前記したように熱応力
が発生した場合でも透明ゲル樹脂２８によって緩和され
るため、白色高光反射樹脂２９にクラックが生じること
もなく、外観上の見栄えを向上して商品品質の高い光結
像素子が得られる。さらに、製造工程においては、１回
の透明ゲル樹脂の塗布工程と、１回の白色高光反射樹脂
のモールド工程でよいため、製造を容易に行うことがで
きる。Also in the optical imaging device of the third embodiment, the coefficient of thermal expansion of the transparent gel resin 18 as the internal resin is about 30 × 10 -5 / ° C., and the coefficient of thermal expansion of the white high light reflective resin as the external resin. Is about 1.7 × 10 −5 / ° C., and the difference in thermal expansion coefficient is almost the same as that of the conventional example shown in FIG. However, the penetration of the cured product is 45 to 65 (JIS-K222
0), the transparent gel resin itself has a low Young's modulus (Young's modulus, 0.01 to 0.4 × 1).
0 -5 N / m 2 ), the transparent gel resin itself is elastically deformed and stress relaxed even after a heat treatment step when transfer molding the white high light reflective resin 19 and a subsequent cooling step. Therefore, separation at the interface between the transparent gel resin 18 and the white high-light reflective resin 19 can be prevented. Further, even when the thermal stress is increased due to a sudden temperature difference (approximately 215 ° C.) applied when mounting the optical coupling element, the transparent gel resin 18 is in a gel state and has a small Young's modulus. An external lead 12 facing the interface between the resin 18 and the white high-light reflecting resin 19;
Thus, no gap is formed across the gaps 13, and a decrease in the dielectric strength can be prevented. Further, even when a thermal stress is generated as described above, since the transparent gel resin 28 reduces the thermal stress, no cracks are generated in the white high-light reflective resin 29, the appearance is improved, and the light An image element is obtained. Further, in the manufacturing process, only one application process of the transparent gel resin and one molding process of the white high-reflection resin are required, so that the manufacturing can be easily performed.
【００２６】図９は本発明の第４の実施形態を示してお
り、同図（ａ），（ｂ）は内部構造を透視した状態の平
面図とその縦断面図である。この光結合素子は、前記第
３の実施形態と同じ対向型とした構成であり、等価な部
分には同一符号を付してある。２対の外部導出リード２
２，２３のそれぞれのタブ２２ｃ，２３ｃは板厚方向に
曲げ形成されて、所要の間隔で対峙されている。そし
て、前記各タブ２２ｃ，２３ｃにそれぞれ発光素子２
４、受光素子２５の各チップが搭載され、かつこれら発
光素子２４及び受光素子２５は前記タブ間に充填された
透明ゲル樹脂２８で被覆され、かつその外側は白色高光
反射樹脂２９で封止されている。また、前記透明ゲル樹
脂２８は、その側面は自身の表面張力によって凹面状に
形成されている。さらに、前記白色高光反射樹脂２９の
外面に黒色インク、あるいは黒色塗料を塗布した遮光膜
２０が形成されている。FIG. 9 shows a fourth embodiment of the present invention. FIGS. 9 (a) and 9 (b) are a plan view showing the internal structure in a see-through state and a longitudinal sectional view thereof. This optical coupling element has the same facing configuration as that of the third embodiment, and the same reference numerals are given to the equivalent parts. 2 pairs of external leads 2
Each of the tabs 22c and 23c is bent in the plate thickness direction and faces each other at a required interval. The light emitting element 2 is provided on each of the tabs 22c and 23c.
4. Each chip of the light receiving element 25 is mounted, and the light emitting element 24 and the light receiving element 25 are covered with the transparent gel resin 28 filled between the tabs, and the outside thereof is sealed with the white high light reflection resin 29. ing. The transparent gel resin 28 has a side surface formed in a concave shape by its own surface tension. Further, a light-shielding film 20 coated with black ink or black paint is formed on the outer surface of the white high-light reflective resin 29.
【００２７】図１０は、前記第４の実施形態の光結合素
子の製造工程を示すフローチャートである。対をなす２
枚の銅リードフレーム２１Ａ，２１Ｂの各外部導出リー
ドに設けられているタブ２２ｃ，２３ｃにそれぞれ発光
素子２４と受光素子２５の各チップを銀ペーストでダイ
ボンディングする（Ｓ４１）。硬化条件は２００℃，２
０秒である。次いで、発光素子２４及び受光素子２５の
各電極パッドと、他方の外部導出リード２２ｂ，２３ｂ
とを金ワイヤ２６，２７でボンディング接続し（Ｓ４
２）、その上で前記発光素子２４と受光素子２５が対向
配置されるように、前記各リードフレーム２１Ａ，２１
Ｂを板厚方向に重ね合わせる。しかる上で、前記発光素
子２４及び受光素子２５の対向間に、側方から透明ゲル
樹脂２８を塗布し、両タブ２２ｃ，２３ｃ間に充填させ
（Ｓ４３）、その後、１５０℃，２時間で硬化させる
（Ｓ４４）。前記透明ゲル樹脂２８としては、硬化前の
流動性が４０〜５０ｍｍ、硬化物の針入度が４５〜６５
（ＪＩＳ−Ｋ２２２０）を用いる。この条件により、硬
化された透明ゲル樹脂２８は、ゲル状態が保持されなが
らも所定の形状保持性が保有され、しかも硬化の際の表
面張力によって前記したように側面が凹面状に形成され
る。FIG. 10 is a flowchart showing the steps of manufacturing the optical coupling device according to the fourth embodiment. Pair 2
The respective chips of the light emitting element 24 and the light receiving element 25 are die-bonded to the tabs 22c and 23c provided on the external lead-outs of the copper lead frames 21A and 21B using silver paste (S41). Curing conditions are 200 ° C, 2
0 seconds. Next, the respective electrode pads of the light emitting element 24 and the light receiving element 25 and the other external lead-out leads 22b, 23b
Are bonded by gold wires 26 and 27 (S4
2) The lead frames 21A, 21A are arranged such that the light emitting element 24 and the light receiving element 25 are disposed opposite to each other.
B is overlapped in the thickness direction. Then, a transparent gel resin 28 is applied from the side between the opposing light-emitting elements 24 and the light-receiving elements 25 and filled between the two tabs 22c and 23c (S43), and then cured at 150 ° C. for 2 hours. (S44). As the transparent gel resin 28, the fluidity before curing is 40 to 50 mm, and the penetration of the cured product is 45 to 65.
(JIS-K2220) is used. Under these conditions, the cured transparent gel resin 28 retains a predetermined shape while maintaining the gel state, and has a concave side surface as described above due to surface tension during curing.
【００２８】しかる上で、前記透明ゲル樹脂２８で封止
した構体を図外のトランスファーモールド装置の金型内
にセットし、白色高光反射樹脂２９でモールド成形し、
所要のパッケージ形状とする（Ｓ４５）。この白色高光
反射樹脂２９としては、透明樹脂中に反射材としての酸
化チタン（ＴｉＯ2 ）の微粉末を添加したものが用いら
れ、硬化条件として１７５℃，２分、また１７５℃，４
〜８時間のアフターキュアを行う。さらに、第２の実施
形態と同様に、エポキシ樹脂を含んだ黒色インクを、イ
ンクジェット装置により前記白色高光反射樹脂２９の外
面に吹き付け、１０μｍ以下の厚さに塗布する。あるい
は、これに代えて、外部導出リードに付着しないように
マスキングを施した上で、黒色の粉体塗料を静電気を利
用して前記白色高光反射樹脂の外面に５〜５０μｍの膜
厚に付着し、１５０℃、１時間の加熱処理を行って硬化
させ、定着させる。これにより、白色高光反射樹脂２９
の外面に遮光膜２０が形成される（Ｓ４６）。Then, the assembly sealed with the transparent gel resin 28 is set in a mold of a transfer molding apparatus (not shown), and molded with a white high-light reflective resin 29.
The required package shape is set (S45). As the white high-light reflection resin 29, a resin obtained by adding fine powder of titanium oxide (TiO 2 ) as a reflection material to a transparent resin is used. The curing conditions are 175 ° C., 2 minutes, and 175 ° C., 4 minutes.
After-cure for ~ 8 hours. Further, similarly to the second embodiment, a black ink containing an epoxy resin is sprayed on the outer surface of the white high-light reflective resin 29 by an ink jet device and applied to a thickness of 10 μm or less. Alternatively, after masking is performed so as not to adhere to the external lead-out lead, black powder paint is adhered to the outer surface of the white high light reflective resin to a thickness of 5 to 50 μm using static electricity. A heat treatment is performed at 150 ° C. for one hour to cure and fix. Thereby, the white high light reflective resin 29
Is formed on the outer surface of the substrate (S46).
【００２９】このように製造された光結像素子では、外
部導出リード２２に所要の電力を印加して発光素子２４
を発光すれば、発光素子２４から出射された光は透明ゲ
ル樹脂２８内を透過して受光素子２５で受光され、外部
導出リード２３から電気信号として出力される。このと
き、発光素子２４から出射された光の一部は透明ゲル樹
脂２８と白色高光反射樹脂２９との界面で反射されて受
光素子において受光されることになり、高い光結合効率
を得ることができる。さらに、この第４の実施形態で
は、白色高光反射樹脂２９の外面に黒色インクや黒色塗
料からなる遮光膜２０が形成されているため、光結合素
子の外部から高輝度の外部光が入射された場合でも、こ
の外部光が素子内の受光素子２５にまで透過されること
はなく、受光素子におけるＳ／Ｎ比に高いものが得られ
る。In the optical imaging device manufactured as described above, the required power is applied to the external lead 22 and the light emitting device 24 is applied.
Is emitted, the light emitted from the light emitting element 24 passes through the transparent gel resin 28, is received by the light receiving element 25, and is output as an electric signal from the external lead 23. At this time, a part of the light emitted from the light emitting element 24 is reflected at the interface between the transparent gel resin 28 and the white high light reflective resin 29 and is received by the light receiving element, so that high optical coupling efficiency can be obtained. it can. Further, in the fourth embodiment, since the light-shielding film 20 made of black ink or black paint is formed on the outer surface of the white high-light reflective resin 29, high-luminance external light is incident from outside the optical coupling element. Even in this case, the external light is not transmitted to the light receiving element 25 in the element, and a light receiving element having a high S / N ratio can be obtained.
【００３０】この第４の実施形態の光結像素子において
も、内部樹脂としての透明ゲル樹脂１８の熱膨張係数は
約３０×１０-5／℃、外部樹脂の白色高光反射樹脂の熱
膨張係数は約１．７×１０-5／℃であり、熱膨張係数の
差は図１１に示される従来例とほぼ同等である。しか
し、硬化物の針入度が４５〜６５（ＪＩＳ−Ｋ２２２
０）の透明ゲル樹脂を用いているので、透明ゲル樹脂自
体のヤング率が低く（ヤング率，０．０１〜０．４×１
０-5Ｎ／ｍ2 ）、白色高光反射樹脂１９をトランスファ
ーモールドした際の熱処理工程、及びその後の冷却工程
を経た場合においても、透明ゲル樹脂自体が弾性変形
し、応力緩和される。そのため、透明ゲル樹脂１８と白
色高光反射樹脂１９との界面における剥離が生じること
を防止できる。また、光結合素子の実装時に加わるよう
な急激な温度差（約２１５℃）において、熱応力が高ま
った場合にも、透明ゲル樹脂１８はゲル状態であり、か
つヤング率が小さいため、透明ゲル樹脂１８と白色高光
反射樹脂１９との界面に対向する外部導出リード１２，
１３間を跨がる隙間が生じることはなく、絶縁耐圧が低
下することを防止できる。また、前記したように熱応力
が発生した場合でも透明ゲル樹脂２８によって緩和され
るため、白色高光反射樹脂２９にクラックが生じること
もなく、外観上の見栄えを向上して商品品質の高い光結
像素子が得られる。さらに、製造工程においては、１回
の透明ゲル樹脂の塗布工程、１回の白色高光反射樹脂の
モールド工程、１回の黒色塗料の塗布工程でよいため、
製造を容易に行うことができる。Also in the optical imaging device of the fourth embodiment, the thermal expansion coefficient of the transparent gel resin 18 as the internal resin is about 30 × 10 −5 / ° C., and the thermal expansion coefficient of the white high light reflective resin as the external resin. Is about 1.7 × 10 −5 / ° C., and the difference in thermal expansion coefficient is almost the same as that of the conventional example shown in FIG. However, the penetration of the cured product is 45 to 65 (JIS-K222
0), the transparent gel resin itself has a low Young's modulus (Young's modulus, 0.01 to 0.4 × 1).
0 -5 N / m 2 ), the transparent gel resin itself is elastically deformed and stress relaxed even after a heat treatment step when transfer molding the white high light reflective resin 19 and a subsequent cooling step. Therefore, separation at the interface between the transparent gel resin 18 and the white high-light reflective resin 19 can be prevented. Further, even when the thermal stress is increased due to a sudden temperature difference (approximately 215 ° C.) applied when mounting the optical coupling element, the transparent gel resin 18 is in a gel state and has a small Young's modulus. An external lead 12 facing the interface between the resin 18 and the white high-light reflecting resin 19;
Thus, no gap is formed across the gaps 13, and a decrease in the dielectric strength can be prevented. Further, even when a thermal stress is generated as described above, since the transparent gel resin 28 reduces the thermal stress, no cracks are generated in the white high-light reflective resin 29, the appearance is improved, and the light An image element is obtained. Furthermore, in the manufacturing process, one process of applying the transparent gel resin, one process of molding the white high-light reflective resin, and one process of applying the black paint are sufficient.
It can be easily manufactured.
【００３１】なお、前記各実施形態に用いられる透明ゲ
ル樹脂、白色高光反射樹脂、黒色インク及び黒色塗料は
一例を示したものにすぎず、前記以外の樹脂や塗料を用
いることも可能である。また、製造工程における各種条
件も、製造する光結合素子の規格や使用する素材に応じ
て適宜変更されるべきものであることも言うまでもな
い。The transparent gel resin, white high-reflection resin, black ink and black paint used in the above embodiments are merely examples, and other resins and paints can be used. Needless to say, various conditions in the manufacturing process should be appropriately changed according to the standard of the optical coupling element to be manufactured and the material to be used.
【００３２】[0032]
【発明の効果】以上説明したように本発明は、発光素子
と受光素子を透明ゲル樹脂で覆い、かつその外周部を光
反射樹脂で覆ったパッケージ構造であるため、パッケー
ジを形成した後に温度変化に伴う樹脂の収縮が生じ、光
反射樹脂と透明ゲル樹脂との間に熱応力が生じた場合で
も、透明ゲル樹脂自体が弾性変形して応力緩和するた
め、透明ゲル樹脂と光反射樹脂との界面の広い範囲にわ
たって剥離が生じることはない。したがって、剥離が要
因とされる絶縁耐圧の低下が改善される。また、透明ゲ
ル樹脂の前記した変形により前記熱応力が緩和されるた
め、光反射樹脂におけるクラックの発生が防止され、高
品質の光結合素子が得られる。また、本発明の製造方法
では、透明ゲル樹脂の塗布工程と光反射樹脂のモールド
成形工程で光結合素子が形成でき、また必要に応じて遮
光膜の形成の工程を付加することで光結合素子が製造で
きるため、透明樹脂を複数回塗布する工程が不要とな
り、製造工程数を削減して製造を容易なものにできる効
果もある。As described above, the present invention has a package structure in which a light emitting element and a light receiving element are covered with a transparent gel resin and the outer periphery thereof is covered with a light reflecting resin. Even when thermal stress occurs between the light-reflective resin and the transparent gel resin due to the shrinkage of the resin, the transparent gel resin itself elastically deforms and relaxes the stress. No delamination occurs over a large area of the interface. Therefore, the decrease in the withstand voltage due to the separation is improved. In addition, since the thermal stress is reduced by the deformation of the transparent gel resin, the occurrence of cracks in the light reflecting resin is prevented, and a high-quality optical coupling element can be obtained. Further, in the manufacturing method of the present invention, the optical coupling element can be formed by the step of applying the transparent gel resin and the step of molding the light reflecting resin, and the optical coupling element can be formed by adding a step of forming a light shielding film as necessary. Can be manufactured, so that the step of applying the transparent resin a plurality of times becomes unnecessary, and the number of manufacturing steps can be reduced to facilitate manufacturing.
【図１】本発明の第１の実施形態の一部を破断した斜視
図である。FIG. 1 is a partially cutaway perspective view of a first embodiment of the present invention.
【図２】第１の実施形態の透視平面図とその縦断面図で
ある。FIG. 2 is a perspective plan view and a longitudinal sectional view of the first embodiment.
【図３】第１の実施形態の光結合素子の製造方法を工程
順に示すフロー図である。FIG. 3 is a flowchart showing a method of manufacturing the optical coupling element according to the first embodiment in the order of steps.
【図４】第２の実施形態の透視平面図とその縦断面図で
ある。FIG. 4 is a perspective plan view and a longitudinal sectional view of a second embodiment.
【図５】第２の実施形態の光結合素子の製造方法を工程
順に示すフロー図である。FIG. 5 is a flowchart showing a method of manufacturing the optical coupling element according to the second embodiment in the order of steps.
【図６】本発明の第３の実施形態の一部を破断した斜視
図である。FIG. 6 is a partially broken perspective view of a third embodiment of the present invention.
【図７】第３の実施形態の透視平面図とその縦断面図で
ある。FIG. 7 is a perspective plan view and a longitudinal sectional view of a third embodiment.
【図８】第３の実施形態の光結合素子の製造方法を工程
順に示すフロー図である。FIG. 8 is a flowchart showing a method of manufacturing the optical coupling device according to the third embodiment in the order of steps.
【図９】第４の実施形態の透視平面図とその縦線断面図
である。FIG. 9 is a perspective plan view of a fourth embodiment and a vertical sectional view thereof.
【図１０】第４の実施形態の光結合素子の製造方法を工
程順に示すフロー図である。FIG. 10 is a flowchart showing a method of manufacturing an optical coupling device according to a fourth embodiment in the order of steps.
【図１１】従来の光結合素子の一例とその改善例のそれ
ぞれの断面図である。FIG. 11 is a cross-sectional view of an example of a conventional optical coupling element and an example of an improvement thereof.
１１，２１Ａ，２１Ｂ リードフレーム １２，１３，２２，２３ 外部導出リード １４，２４ 発光素子 １５，２５ 受光素子 １６，１７，２６，２７ 金ワイヤ １８，２８ 透明ゲル樹脂 １９，２９ 白色高光反射樹脂 １０，２０ 遮光膜 11, 21A, 21B Lead frame 12, 13, 22, 23 Outer leads 14, 24 Light emitting element 15, 25 Light receiving element 16, 17, 26, 27 Gold wire 18, 28 Transparent gel resin 19, 29 White high light reflective resin 10 , 20 Light shielding film
Claims (7)
ジされ、前記発光素子で発光された光を前記受光素子で
受光する光結合素子において、前記パッケージは、前記
発光素子と受光素子を覆う光透過可能な透明ゲル樹脂
と、前記透明ゲル樹脂の外周部を覆う光反射樹脂とで構
成され、前記透明ゲル樹脂の針入度が４５〜６５（ＪＩ
Ｓ−Ｋ２２２０）であることを特徴とする光結合素子。1. An optical coupling element in which a light emitting element and a light receiving element are integrally packaged, and the light emitted by the light emitting element is received by the light receiving element, wherein the package covers the light emitting element and the light receiving element. The transparent gel resin includes a transparent gel resin that can pass therethrough, and a light reflecting resin that covers an outer peripheral portion of the transparent gel resin. The penetration of the transparent gel resin is 45 to 65 (JI
SK2220).
ジされ、前記発光素子で発光された光を前記受光素子で
受光する光結合素子において、前記パッケージは、前記
発光素子と受光素子を覆う光透過可能な透明ゲル樹脂
と、前記透明ゲル樹脂の外周部を覆う光反射樹脂と、前
記光反射樹脂の外面に形成された遮光膜とで構成されて
いることを特徴とする光結合素子。2. A light-coupling element in which a light-emitting element and a light-receiving element are integrally packaged, and the light emitted by the light-emitting element is received by the light-receiving element. An optical coupling element, comprising: a transparent gel resin that can pass therethrough; a light reflecting resin covering an outer peripheral portion of the transparent gel resin; and a light shielding film formed on an outer surface of the light reflecting resin.
ゲル樹脂と光反射樹脂との界面で反射されて前記受光素
子で受光される反射型の光結合素子として構成される請
求項１または２に記載の光結合素子。3. A reflection type optical coupling element in which light emitted by the light emitting element is reflected at an interface between the transparent gel resin and the light reflecting resin and is received by the light receiving element. 3. The optical coupling element according to 2.
受光面が対向配置され、前記発光素子で発光された光の
大部分が直接に前記受光素子において受光される請求項
１または２に記載の光結合素子。4. The light-receiving element according to claim 1, wherein a light-emitting surface of the light-emitting element and a light-receiving surface of the light-receiving element are arranged to face each other, and most of light emitted by the light-emitting element is directly received by the light-receiving element. The optical coupling device as described in the above.
それぞれ搭載する工程と、前記発光素子と受光素子を覆
うように針入度が４５〜６５（ＪＩＳ−Ｋ２２２０）の
光透過性の透明ゲル樹脂を塗布する工程と、前工程まで
に形成された構体をモールド金型内にセットし前記透明
ゲル樹脂の外周部を覆うように光反射樹脂でモールド成
形する工程とを含むことを特徴とする光結合素子の製造
方法。5. A step of mounting a light emitting element and a light receiving element on a lead frame, and a transparent gel resin having a penetration of 45 to 65 (JIS-K2220) so as to cover the light emitting element and the light receiving element. And a step of setting the structure formed up to the previous step in a mold and molding with a light-reflecting resin so as to cover the outer peripheral portion of the transparent gel resin. A method for manufacturing a coupling element.
それぞれ搭載する工程と、前記発光素子と受光素子を覆
うように光透過性の透明ゲル樹脂を塗布する工程と、前
工程までに形成された構体をモールド金型内にセットし
前記透明ゲル樹脂の外周部を覆うように光反射樹脂でモ
ールド成形する工程と、前記光反射樹脂の外面に遮光性
の塗料を塗布または付着して遮光膜を形成する工程を含
むことを特徴とする光結合素子の製造方法。6. A step of mounting a light emitting element and a light receiving element on a lead frame, a step of applying a light transmissive transparent gel resin so as to cover the light emitting element and the light receiving element, and a step formed before the preceding step. Setting the assembly in a mold and molding with a light-reflecting resin so as to cover the outer periphery of the transparent gel resin; and coating or adhering a light-shielding paint on the outer surface of the light-reflection resin to form a light-shielding film. A method for manufacturing an optical coupling element, comprising a step of forming.
光素子及び受光素子の上方から透明ゲル樹脂を滴下する
ポッティング方法である請求項５または６に記載の光結
合素子の製造方法。7. The method for manufacturing an optical coupling device according to claim 5, wherein the step of applying the transparent gel resin is a potting method of dropping the transparent gel resin from above the light emitting element and the light receiving element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03071098A JP3523047B2 (en) | 1998-02-13 | 1998-02-13 | Optical coupling device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03071098A JP3523047B2 (en) | 1998-02-13 | 1998-02-13 | Optical coupling device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11233810A true JPH11233810A (en) | 1999-08-27 |
| JP3523047B2 JP3523047B2 (en) | 2004-04-26 |
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ID=12311214
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|---|---|---|---|
| JP03071098A Expired - Fee Related JP3523047B2 (en) | 1998-02-13 | 1998-02-13 | Optical coupling device and method of manufacturing the same |
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| JP2003515939A (en) * | 1999-11-26 | 2003-05-07 | センター ナショナル デ ラ レシェルシェ サイエンティフィック（シーエヌアールエス） | High voltage hybrid circuit |
| US7629660B2 (en) | 2005-06-02 | 2009-12-08 | Infineon Technologies Ag | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof |
| US7847301B2 (en) * | 2004-12-08 | 2010-12-07 | Agilent Technologies, Inc. | Electronic microcircuit having internal light enhancement |
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| US8729512B2 (en) | 2011-03-04 | 2014-05-20 | Renesas Electronics Corporation | Optical coupling element and method for manufacturing the same |
| US10483424B2 (en) | 2015-03-02 | 2019-11-19 | Kabushiki Kaisha Toshiba | Signal coupling device |
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1998
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003515939A (en) * | 1999-11-26 | 2003-05-07 | センター ナショナル デ ラ レシェルシェ サイエンティフィック（シーエヌアールエス） | High voltage hybrid circuit |
| US7847301B2 (en) * | 2004-12-08 | 2010-12-07 | Agilent Technologies, Inc. | Electronic microcircuit having internal light enhancement |
| US7629660B2 (en) | 2005-06-02 | 2009-12-08 | Infineon Technologies Ag | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof |
| DE102005025754B4 (en) * | 2005-06-02 | 2019-08-08 | Infineon Technologies Ag | Semiconductor sensor component with a sensor chip and method for producing semiconductor sensor components |
| EP2365648A2 (en) * | 2010-03-01 | 2011-09-14 | Omron Co., Ltd. | Optical coupler and producing method thereof |
| JP2011181647A (en) * | 2010-03-01 | 2011-09-15 | Omron Corp | Optical coupler and producing method thereof |
| CN102194813A (en) * | 2010-03-01 | 2011-09-21 | 欧姆龙株式会社 | Optical coupler and producing method thereof |
| US8729512B2 (en) | 2011-03-04 | 2014-05-20 | Renesas Electronics Corporation | Optical coupling element and method for manufacturing the same |
| US10483424B2 (en) | 2015-03-02 | 2019-11-19 | Kabushiki Kaisha Toshiba | Signal coupling device |
| US11430926B2 (en) | 2015-03-02 | 2022-08-30 | Kabushiki Kaisha Toshiba | Signal coupling device |
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| JP3523047B2 (en) | 2004-04-26 |
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