JPH11172077A - Resin composition for semiconductor sealing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a resin compsn. improved in mechanical properties and stability by using an epoxy resin as the base resin and by incorporating a filler (e.g. fused silica) and an aminosilane coupling agent into the same. SOLUTION: This compsn. is prepd. by dispersing 100 pts.wt. epoxy resin, a cure catalyst (e.g. 1-benzyl-2-phenylimidazole), 170-190 pts.wt. filler (e.g. fused silica having an average particle size of 1-20 μm), an aminosilane coupling agent (e.g. γ-aminopropyltrimethoxysilane) in an amt. of 0.8-1.2 wt.% of the filler, and optionally a flexibilizer, another inorg. filler, an antifoaming agent, a flame retardant, etc., in a solvent (e.g. propylene glycol methyl ether acetate). The epoxy resin pref. comprises a dicyclopentadiene epoxy resin and a brominated novolak epoxy resin in a wt. ratio of (60/40)-(50/50), and pref., the compsn. is compounded, as the other resin component, with a dicyclopentadiene phenol resin in an amt. of 50-70 wt.% based on 100 wt.pts. of the epoxy resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for semiconductor encapsulation, and more particularly to TAB (Tape Automated Bondon).
g) a liquid semiconductor encapsulating resin composition suitable as an encapsulating material or the like.

[0002]

2. Description of the Related Art In recent years, in TAB and the like, it has been widely practiced to locally mold a semiconductor chip mounted on a wiring substrate with a liquid sealing resin composition by a potting method.

[0003] Such a liquid encapsulating resin composition is prepared by blending a curing catalyst or the like with an epoxy resin, and adding a fused silica to the epoxy resin for the purpose of improving heat dissipation and reducing stress applied to a semiconductor chip. Is blended as a filler,
In order to improve the adhesion at the interface between the fused silica and the resin, a compound containing a coupling agent is generally used. Conventionally, this coupling agent includes epoxy silane coupling agents such as γ-glycidoxypropyltrimethoxysilane and γ-glycidoxypropylmethyldimethoxysilane from the viewpoint of compatibility with the epoxy resin. Used.

[0004]

However, in such a composition, if the coupling agent is not sufficiently adsorbed on the filler surface, the curing catalyst reacts with the filler surface or the coupling agent and the activity is impaired. As a result, the mechanical properties of the cured product may be reduced. However, the conventional epoxy-based silane coupling agent has a problem that the adsorption to the surface of the fused silica is insufficient, so that the activity of the curing catalyst is deactivated or reduced, and a cured product having good mechanical properties cannot be obtained. was there.

[0005] The present invention has been made in view of such circumstances, and it is desirable to suppress the deactivation or reduction of the activity of a curing catalyst as much as possible because the coupling agent has a good adsorptivity to the filler surface. It is an object of the present invention to provide a resin composition for semiconductor encapsulation which can improve the mechanical properties of a cured product and stabilize the cured product.

[0006]

Means for Solving the Problems As a result of diligent studies to achieve the above object, the present invention has found that the above object can be achieved by using an amino silane coupling agent as a coupling agent. The present invention has been completed.

In other words, the resin composition for semiconductor encapsulation of the present invention is a resin composition for semiconductor encapsulation containing an epoxy resin as a base resin and containing fused silica as a filler, wherein an amino-based silane coupling agent is compounded. It is characterized by.

Hereinafter, the present invention will be described in detail.

[0009] The resin composition for semiconductor encapsulation of the present invention basically comprises (A) an epoxy resin, (B) a curing catalyst,
It is obtained by uniformly dispersing (C) a filler, (D) a coupling agent, and various additives blended as necessary in (E) a solvent.

As the epoxy resin of the component (A),
(A) a dicyclopentadiene type epoxy resin, and (b)
It is desirable to use a novolak type brominated epoxy resin together,
The mixing ratio (a) :( b) is desirably in the range of 60:40 to 50:50 by weight. These epoxy resins (a) and (b) may be either solid or liquid, and are not particularly limited.

When the epoxy resins (a) and (b) are used in combination, a liquid monoepoxy resin or the like may be further blended in the present invention. Further, as a resin component other than the epoxy resin, a dicyclopentadiene-type phenol resin may be blended, and in this case, the blending amount is 50 to 100 parts by weight of the epoxy resin.
A range of 70 parts by weight is suitable. By blending dicyclopentadiene type phenol resin, excellent heat resistance,
Moisture absorption properties, electrical properties, adhesion and the like can be imparted to the cured product.

The curing catalyst of the component (B) can be appropriately selected from those known as epoxy resin curing catalysts, and can be used as the epoxy resin of the component (A). When using an epoxy resin in combination, 1-benzyl-2-phenylimidazole, 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6- [2-methylimidazolyl- (1)]-ethyl-S-triazine, 1-cyanoethyl-2-undecylimidazole, 2 Use of an imidazole compound such as -ethyl-4-methylimidazole is desirable from the viewpoint of storage stability and the like. To illustrate a commercially available product, for example, 1B2PZ, C ₁₁ Z -CNZ (or, Shikoku Chemicals Corporation, trade name) and the like.

The filler of component (C) used in the present invention is a fused silica, and it is particularly desirable to use a filler having an average particle diameter of 1 to 20 μm from the viewpoint of coating operation.
Examples of commercially available products include MK-04 (trade name, manufactured by Nippon Chemical Industry Co., Ltd.) and SE-5 (trade name, manufactured by Tokuyama Corporation). Fused silica is usually added per 100 parts by weight of the resin component.
It is blended in the range of 170 to 190 parts by weight.

The coupling agent of component (D) used in the present invention is an amino-based silane coupling agent, specifically, γ-aminopropyltrimethoxysilane and γ-aminopropyltriethoxysilane. , N-
(Β-aminoethyl) -γ-aminopropyltrimethoxysilane, N- (β-aminoethyl) -γ-aminopropylmethyldimethoxysilane and the like are used. Examples of commercially available products include, for example, Y-9669 (trade name, manufactured by Nippon Unicar). Such an amino-based silane coupling agent exhibits excellent adsorptivity to fused silica, in particular, fused silica having an average particle diameter of 1 to 20 μm as described above, and suppresses the deactivation or reduction of the activity of the curing catalyst. And has the effect of improving the mechanical properties of the cured product. The amino-based silane coupling agent is preferably added in an amount of 0.8 to 1.2 parts by weight per 100 parts by weight of the filler (C).

Next, examples of the solvent of the component (E) include Naphtha No. 2, Naphtha No. 3, propylene glycol methyl ether acetate and the like. These may be used alone or as a mixture of two or more. May be used.

The composition of the present invention may contain, if necessary, a flexibility-imparting agent, an inorganic filler, an antifoaming agent, a flame retardant, a pigment, a dye, and other additives without impairing the effects of the present invention. It can be blended in the range. When the epoxy resins (a) and (b) are used in combination as the epoxy resin of the component (A), it is desirable to blend an internal cyclized polybutadiene as a flexibility-imparting agent. When specific examples of other additives are used, examples of the inorganic filler include talc, calcium carbonate, and aluminum hydroxide. These may be used alone, or 2
You may mix and use a seed or more.

In the resin composition for encapsulating a semiconductor of the present invention, the use of an amino-based silane coupling agent as a coupling agent suppresses the deactivation or reduction of the activity of a curing catalyst, and reduces the mechanical properties of the cured product. Improve and stabilize characteristics.

[0018]

Next, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples. In the following examples and comparative examples, “parts” indicates “parts by weight”.

EXAMPLE 1 55 parts of dicyclopentadiene type epoxy resin HP7200 (trade name, manufactured by Dainippon Ink and Chemicals, Inc.), novolak type brominated epoxy resin BREN-S (trade name, manufactured by Nippon Kayaku Kogyo Co., Ltd.) 45
Parts, phenolic resin DPP-M (trade name, manufactured by Nippon Petrochemical Co., Ltd.) 60 parts, internal cyclized polybutadiene E-1800-6.5 (trade name, manufactured by Nippon Petrochemical Co., Ltd.) 25 parts, Naphtha 3 as solvent
60 parts, 60 parts of propylene glycol methyl ether acetate, 280 parts of Silstar MK-04 (average particle size: 6 μm, trade name of Nippon Petrochemical) as fused silica, 10 parts of 1B2PZ (trade name of Shikoku Chemicals) as curing catalyst Then, 3.0 parts of Y9669 (trade name, manufactured by Nippon Unicar Co., Ltd.) as a silane coupling agent and 13 parts of antimony trioxide as a flame retardant aid were uniformly mixed to produce a liquid semiconductor encapsulating resin composition.

Example 2 55 parts of dicyclopentadiene type epoxy resin HP7200, 45 parts of novolak type brominated epoxy resin BREN-S, 60 parts of phenolic resin DPP-M, internal cyclized polybutadiene E-1
800-6.5 20 parts, Solvent Naphtha No. 3 60 parts, propylene glycol methyl ether acetate 60 parts, SE-5 as fused silica (average particle diameter 6 μm, trade name, manufactured by Tokuyama Corporation) 30
0 parts, C ₁₁ Z-CN (Shikoku Chemicals Corporation, trade name) as a curing catalyst 8 parts, Y9669 3.0 parts silane coupling agent,
Then, 13 parts of antimony trioxide as a flame retardant auxiliary was uniformly mixed to produce a liquid semiconductor sealing resin composition.

Comparative Example A liquid semiconductor encapsulating resin composition was produced in the same manner and in the same manner as in Example 1 except that A-187 (trade name, manufactured by Nippon Unicar Co., Ltd.) was used as the silane coupling agent.

Next, the liquid encapsulating resin compositions obtained in Examples 1 and 2 and Comparative Example were cured by heating (100 ° C.).
× 15 minutes + 120 ° C. × 15 minutes + 150 ° C. × 2 hours). Table 1 shows the results.

The storage stability of each resin composition for semiconductor encapsulation was evaluated based on the change in adhesive strength 100 hours after post-cure. Table 2 shows the results.

[0024]

[Table 1]

[Table 2] As is clear from these tables, the encapsulating resin composition according to the present invention using the amino-based silane coupling agent as the coupling agent has good adhesive strength even after long-term storage. .

[0025]

As described above, according to the resin composition for semiconductor encapsulation of the present invention, the deactivation or reduction of the activity of the curing catalyst can be suppressed by using a specific coupling agent. Thus, the mechanical properties of the cured product can be improved and stabilized.

[0026]

Claims (3)

[Claims] 1. A resin composition for semiconductor encapsulation, comprising an epoxy resin as a base resin and a fused silica as a filler, wherein an amino-based silane coupling agent is blended. 2. The resin composition for semiconductor encapsulation according to claim 1, wherein the fused silica has an average particle size of 1 to 20 μm. 3. The resin composition for semiconductor encapsulation according to claim 1, wherein the amino-based silane coupling agent comprises:
γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N- (β-aminoethyl) -γ
-Aminopropyltrimethoxysilane, and N- (β-
A resin composition for semiconductor encapsulation, which is at least one member selected from the group consisting of (aminoethyl) -γ-aminopropylmethyldimethoxysilane.