JP2001089638A - Liquid sealing resin composition - Google Patents
Liquid sealing resin compositionInfo
- Publication number
- JP2001089638A JP2001089638A JP26786599A JP26786599A JP2001089638A JP 2001089638 A JP2001089638 A JP 2001089638A JP 26786599 A JP26786599 A JP 26786599A JP 26786599 A JP26786599 A JP 26786599A JP 2001089638 A JP2001089638 A JP 2001089638A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid
- resin composition
- sealing resin
- liquid sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【課題】 封止樹脂にかかる応力が緩和でき、サーマル
クラックテストにおける耐クラック性を向上させるな
ど、半導体の液状封止に好適な液状封止用樹脂組成物を
提供する。
【解決手段】 （Ａ）ビスフェノールＦ型エポキシ樹脂
などのエポキシ樹脂、（Ｂ）カルボキシル基を含有する
液状ＮＢＲなどの液状ゴムでエポキシ樹脂を変性した液
状ゴム変性エポキシ樹脂、（Ｃ）硬化剤、（Ｄ）硬化促
進剤および（Ｅ）充填剤を必須成分とする液状封止用樹
脂組成物であって、−６５℃〜１５０℃のヒートサイク
ルにおける不良発生サイクル数を大幅に改善できる。(57) [Problem] To provide a liquid sealing resin composition suitable for liquid sealing of a semiconductor, for example, capable of relaxing stress applied to a sealing resin and improving crack resistance in a thermal crack test. SOLUTION: (A) an epoxy resin such as a bisphenol F type epoxy resin, (B) a liquid rubber-modified epoxy resin obtained by modifying an epoxy resin with a liquid rubber such as a liquid NBR containing a carboxyl group, (C) a curing agent, A liquid sealing resin composition containing D) a curing accelerator and (E) a filler as essential components, and can significantly improve the number of defective cycles in a heat cycle of -65 ° C to 150 ° C.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体などの液状
封止に好適に使用される液状封止用樹脂組成物に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid sealing resin composition suitably used for liquid sealing of semiconductors and the like.
【０００２】[0002]
【従来の技術】近年、半導体パッケージを封止、実装す
る形態は軽薄短小化傾向にある。それに伴い、封止材と
して一般的に液状封止樹脂が用いられている。2. Description of the Related Art In recent years, the form of sealing and mounting a semiconductor package has been tending to be light and thin. Accordingly, a liquid sealing resin is generally used as a sealing material.
【０００３】しかし、液状封止樹脂では、所要の流動性
を確保する必要から、使用できる樹脂、硬化剤、充填剤
の種類や添加量に制約があり、また従来使用されている
トランスファー成形に使用される封止材に比べ、信頼性
が低い。また、封止樹脂の体積に対する樹脂界面の面積
が相対的に小さいので、透湿量と熱応力の影響が大きく
なるとされている。そのため、ＴＣＴ（サーマルクラッ
クテスト）においてパッケージ・クラック等の不良が発
生しやすい。However, in the case of a liquid sealing resin, the type and amount of a resin, a curing agent, and a filler that can be used are restricted because required fluidity is required. Reliability is lower than the sealing material used. Further, since the area of the resin interface relative to the volume of the sealing resin is relatively small, the influence of the moisture permeability and the thermal stress is said to be large. For this reason, defects such as package cracks are likely to occur in TCT (thermal crack test).
【０００４】[0004]
【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、樹脂にかかる応力が緩和で
き、ＴＣＴにおける耐クラック性を向上させて、半導体
などの液状封止に好適な液状封止用樹脂組成物を提供す
るものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and can reduce stress applied to a resin, improve crack resistance in TCT, and is suitable for liquid sealing of semiconductors and the like. The present invention provides a liquid sealing resin composition.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を進めた結果、エポキシ樹脂に
液状ゴムで変性したエポキシ樹脂を任意の割合で混合し
たものを用いることにより、樹脂の弾性率が低くかつ樹
脂強度が向上して、上記の目的を達成できることを見い
だし、本発明を完成したもである。Means for Solving the Problems The present inventor has made intensive studies to achieve the above object, and as a result, obtained by mixing an epoxy resin modified with a liquid rubber with an epoxy resin at an arbitrary ratio. The present inventors have found that the above object can be achieved by reducing the elastic modulus of the resin and improving the resin strength, and have completed the present invention.
【０００６】即ち、本発明は、（Ａ）エポキシ樹脂、
（Ｂ）カルボキシル基を含有する液状ゴムでエポキシ樹
脂を変性した液状ゴム変性エポキシ樹脂、（Ｃ）硬化剤
（Ｄ）硬化促進剤および（Ｅ）充填剤を必須成分とする
ことを特徴とする液状封止用樹脂組成物である。That is, the present invention provides (A) an epoxy resin,
(B) a liquid rubber comprising a liquid rubber-modified epoxy resin obtained by modifying an epoxy resin with a liquid rubber containing a carboxyl group, (C) a curing agent, (D) a curing accelerator, and (E) a filler as essential components. It is a sealing resin composition.
【０００７】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【０００８】本発明に用いる（Ａ）エポキシ樹脂として
は、１分子中に２個以上のエポキシ基を有する、硬化可
能なエポキシ樹脂であればよく、例えば、ビスフェノー
ルＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹
脂、ビスフェノールＡＤ型エポキシ樹脂、ノボラック型
エポキシ樹脂、グリシジルエステル型エポキシ樹脂、脂
環式エポキシ樹脂等の液状のものが挙げられ、これらの
エポキシ樹脂は、単独又は２種以上混合して使用するこ
とができる。さらに上記のエポキシ樹脂にＮＢＲまたは
ＣＴＢＮなどのようなカルボキシル基を含有する液状ゴ
ムと少量の触媒を加え、加熱攪拌し、ゴム変性した
（Ｂ）液状ゴム変性エポキシ樹脂を必須成分として任意
の割合で混合する。これらの（Ａ）成分及び（Ｂ）成分
のエポキシ樹脂の他に、フェノールノボラック型エポキ
シ樹脂、クレゾールノボラック型エポキシ樹脂、含複素
環エポキシ樹脂、水添型ビスフェノールＡ型エポキシ樹
脂、脂肪族エポキシ樹脂、芳香族、脂肪族もしくは脂環
式のカルボン酸とエピクロルヒドリンとの反応によって
得られるエポキシ樹脂、スピロ環含有エポキシ樹脂等を
適宜併用することができる。The epoxy resin (A) used in the present invention may be a curable epoxy resin having two or more epoxy groups in one molecule, such as a bisphenol A epoxy resin and a bisphenol F epoxy resin. Resins, bisphenol AD type epoxy resin, novolak type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin, etc. in liquid form, and these epoxy resins may be used alone or in combination of two or more. Can be. Further, a liquid rubber having a carboxyl group such as NBR or CTBN and a small amount of a catalyst are added to the above epoxy resin, and the mixture is heated and stirred, and the rubber-modified (B) liquid rubber-modified epoxy resin is used as an essential component at an arbitrary ratio. Mix. In addition to the epoxy resins (A) and (B), phenol novolak epoxy resin, cresol novolak epoxy resin, heterocyclic epoxy resin, hydrogenated bisphenol A epoxy resin, aliphatic epoxy resin, An epoxy resin obtained by reacting an aromatic, aliphatic or alicyclic carboxylic acid with epichlorohydrin, a spiro ring-containing epoxy resin, and the like can be appropriately used in combination.
【０００９】本発明に用いる（Ｃ）硬化剤としては、前
記した（Ａ）、（Ｂ）等のエポキシ樹脂と反応し、硬化
可能なものであれば、いかなるものでも使用でき、例え
ば、メチルヘキサヒドロフタル酸無水物、ノボラックフ
ェノール樹脂、無水フタル酸誘導体等が挙げられる。こ
れらは硬化を阻害しない範囲において単独又は２種以上
混合して使用することができる。As the curing agent (C) used in the present invention, any curing agent capable of reacting with the above-mentioned epoxy resin (A) or (B) and curing can be used. Hydrophthalic anhydride, novolak phenolic resin, phthalic anhydride derivative and the like can be mentioned. These can be used alone or as a mixture of two or more as long as curing is not inhibited.
【００１０】本発明に用いる（Ｄ）硬化促進剤として
は、１−ベンジル−２−フェニルイミダゾール、２−ヘ
プタデシルイミダゾール、２−フェニル−４，５−ジヒ
ドロキシイミダゾール、２−フェニル−４−メチル−５
−ヒドロキシメチルイミダゾール、２，４−ジアミノ−
６−［２−メチルイミダゾリル−（１）］−エチル−ｓ
−トリアジン、１−シアノエチル−２−ウンデシルイミ
ダゾール、２−エチル−４−メチルイミダゾール、１，
８−ジアザビシクロ［５，４，０］ウンデセン−７等の
アミン系化合物、トリフェニルホスフィン、トリス−
（２，６−ジメトキシフェニル）ホスフィン等のホスフ
ィン系化合物等が挙げられる。The (D) curing accelerator used in the present invention includes 1-benzyl-2-phenylimidazole, 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxyimidazole, 2-phenyl-4-methyl- 5
-Hydroxymethylimidazole, 2,4-diamino-
6- [2-methylimidazolyl- (1)]-ethyl-s
-Triazine, 1-cyanoethyl-2-undecylimidazole, 2-ethyl-4-methylimidazole, 1,
Amine compounds such as 8-diazabicyclo [5,4,0] undecene-7, triphenylphosphine, tris-
And phosphine-based compounds such as (2,6-dimethoxyphenyl) phosphine.
【００１１】本発明に用いる（Ｅ）充填剤としては、溶
融シリカ、粉砕シリカ、タルク、炭酸カルシウム、水酸
化アルミニウム等が挙げられるが、近年の半導体封止用
途では、平均粒径２０μｍ以下の溶融シリカが望まし
く、これらを単独又は２種以上混合して任意の量を組み
合わせて使用することができる。As the filler (E) used in the present invention, fused silica, pulverized silica, talc, calcium carbonate, aluminum hydroxide and the like are listed. Silica is desirable, and these can be used alone or in combination of two or more kinds in an arbitrary amount.
【００１２】本発明の液状封止用樹脂組成物には、上述
したエポキシ樹脂、液状ゴム変性エポキシ樹脂、硬化
剤、硬化促進剤および充填剤を必須成分とするが、本発
明の目的に反しない範囲において、難燃剤、カップリン
グ剤、消泡剤、顔料、染料、その他成分を適宜添加配合
することができる。The liquid sealing resin composition of the present invention contains the above-mentioned epoxy resin, liquid rubber-modified epoxy resin, curing agent, curing accelerator and filler as essential components, but it does not violate the object of the present invention. Within the range, a flame retardant, a coupling agent, an antifoaming agent, a pigment, a dye, and other components can be appropriately added and blended.
【００１３】本発明の液状封止用樹脂組成物は、常法に
従い、上述した各成分を十分混合した後、更に三本ロー
ルにより混練処理を行い、その後、万能混合器などによ
り真空混合処理して、容易に製造することができる。The resin composition for liquid encapsulation of the present invention is prepared by thoroughly mixing the above-mentioned components, kneading with a three-roll mill, and vacuum-mixing with a universal mixer or the like according to a conventional method. And can be easily manufactured.
【００１４】[0014]
【作用】本発明の液状封止用樹脂組成物は、上述したエ
ポキシ樹脂、液状ゴム変性エポキシ樹脂、硬化剤、硬化
促進剤および充填剤を必須成分として使用することによ
って、従来使用されている汎用の樹脂組成物に比べて、
弾性率が低く、強度の高い液状封止用樹脂組成物の提供
が可能となった。The resin composition for liquid encapsulation of the present invention uses the above-mentioned epoxy resin, liquid rubber-modified epoxy resin, curing agent, curing accelerator, and filler as essential components to provide a generally used general-purpose resin. Compared to the resin composition of
It has become possible to provide a liquid sealing resin composition having a low elastic modulus and a high strength.
【００１５】[0015]
【発明の実施の形態】次に、本発明を実施例によって具
体的に説明する。本発明は、これらの実施例によって限
定されるものではない。以下の実施例および比較例にお
いて「部」とは「重量部」を意味する。Next, the present invention will be specifically described with reference to examples. The present invention is not limited by these examples. In the following Examples and Comparative Examples, “parts” means “parts by weight”.
【００１６】実施例１ ビスフェノールＦ型エポキシ樹脂ＹＬ９８３Ｕ（油化シ
ェル社製、商品名）６５部、液状ＮＢＲのＤＮ６０１
（日本ゼオン社製、商品名）３５部、および触媒ＴＰＰ
（ケイ・アイ・化成社製、商品名）０．７部を加熱攪拌
し、ＮＢＲ変性エポキシ樹脂を製造した。次に、ビスフ
ェノールＦ型エポキシ樹脂ＹＬ９８３Ｕ（油化シェル社
製、商品名）７０部、上記のＮＢＲ変性エポキシ樹脂３
０部、メチルテトラヒドロ無水フタル酸ＱＨ２００（日
本ゼオン社製、商品名）９０部、溶融シリカとしてＵＳ
Ｖ−１０（龍森社製商品名、平均粒径７μｍ）６５０
部、カップリング剤Ａ−１８７（日本ユニカー社製、商
品名）２．０部および硬化促進剤ノバキュアーＨＸ３９
４１（旭化成工業社製、商品名）１０部を混練し、真空
脱気して液状封止用樹脂組成物を製造した。Example 1 Bisphenol F type epoxy resin YL983U (trade name, manufactured by Yuka Shell Co., Ltd.) 65 parts, liquid NBR DN601
(Zeon Corporation, trade name) 35 parts and catalyst TPP
0.7 parts (manufactured by KI Chemical Co., Ltd., trade name) were heated and stirred to produce an NBR-modified epoxy resin. Next, 70 parts of a bisphenol F type epoxy resin YL983U (trade name, manufactured by Yuka Shell Co., Ltd.) and the above NBR-modified epoxy resin 3
0 parts, methyltetrahydrophthalic anhydride QH200 (manufactured by Zeon Corporation, trade name) 90 parts, fused silica US
V-10 (trade name, manufactured by Tatsumori Co., average particle size 7 μm) 650
Parts, coupling agent A-187 (manufactured by Nippon Unicar Co., Ltd., trade name) 2.0 parts and curing accelerator NOVACURE HX39
10 parts (manufactured by Asahi Kasei Kogyo Co., Ltd.) were kneaded and vacuum degassed to produce a liquid sealing resin composition.
【００１７】比較例１ ビスフェノールＦ型エポキシ樹脂ＹＬ９８３Ｕ（油化シ
ェル社製、商品名）１００部、メチルテトラヒドロ無水
フタル酸ＱＨ２００（日本ゼオン社製、商品名）１００
部、溶融シリカとしてＵＳＶ−１０（龍森社製商品名、
平均粒径７μｍ）６５０部、カップリング剤Ａ−１８７
（日本ユニカー社製、商品名）２．０部および硬化促進
剤ノバキュアーＨＸ３９４１（旭化成工業社製、商品
名）１０部を混練し、真空脱気して液状封止用樹脂組成
物を製造した。Comparative Example 1 100 parts of bisphenol F type epoxy resin YL983U (trade name, manufactured by Yuka Shell Co., Ltd.), 100 parts of methyltetrahydrophthalic anhydride QH200 (trade name, manufactured by Zeon Corporation)
Part, fused silica USV-10 (trade name, manufactured by Tatsumori)
650 parts of coupling agent A-187
2.0 parts (manufactured by Nippon Unicar, trade name) and 10 parts of a curing accelerator Novacure HX3941 (manufactured by Asahi Kasei Kogyo Co., Ltd.) were kneaded and degassed under vacuum to produce a liquid sealing resin composition.
【００１８】実施例１および比較例１によって製造した
液状封止用樹脂組成物について、液状樹脂特性および硬
化物特性（粘度、ガラス転移点、線膨張係数、曲げ強
さ、曲げ弾性率）を試験した。また、これらの液状樹脂
組成物を用いてモデル素子を封止し、これを加熱硬化さ
せ、試験片を作成した。この試験片を−６５℃及び１５
０℃にそれぞれ３０分間放置するヒートサイクルによ
り、不良が発生するまでのサイクル数を測定した。評価
結果を表１に示す。The resin compositions for liquid encapsulation produced in Example 1 and Comparative Example 1 were tested for liquid resin properties and cured product properties (viscosity, glass transition point, linear expansion coefficient, flexural strength, flexural modulus). did. Further, a model element was sealed using these liquid resin compositions, and this was heated and cured to prepare a test piece. The test specimen was placed at -65 ° C and 15 ° C.
The number of cycles until a failure occurred was measured by a heat cycle in which each was left at 0 ° C. for 30 minutes. Table 1 shows the evaluation results.
【００１９】[0019]
【表１】 表１から、実施例で得られた液状封止用樹脂組成物は、
比較例のそれに比べ、曲げ強さの大きい硬化物が得ら
れ、ＴＣＴにおける信頼性も向上することが確認され
た。[Table 1] From Table 1, the liquid sealing resin composition obtained in the examples,
It was confirmed that a cured product having higher bending strength was obtained as compared with that of the comparative example, and that the reliability in TCT was also improved.
【００２０】[0020]
【発明の効果】以上の説明および表１から明らかなよう
に、本発明の液状封止用樹脂組成物は、液状ゴム変性エ
ポキシ樹脂を配合したことにより、半導体パッケージの
強度が大きくＴＣＴにおける信頼性の高いものである。
従って、本発明の液状封止用樹脂組成物によれば、信頼
性の高い半導体装置を得ることができる。As apparent from the above description and Table 1, the resin composition for liquid encapsulation of the present invention, which contains a liquid rubber-modified epoxy resin, has high strength in a semiconductor package and high reliability in TCT. Is high.
Therefore, according to the liquid sealing resin composition of the present invention, a highly reliable semiconductor device can be obtained.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０９Ｋ 3/10 Ｃ０９Ｋ 3/10 Ｑ Ｅ Ｈ０１Ｌ 23/29 Ｈ０１Ｌ 23/30 Ｒ 23/31 Ｆターム(参考） 4H017 AA03 AA04 AA27 AA31 AB01 AB08 AC16 AD02 AE05 4J002 CC032 CD021 CD051 CD061 CD091 CD201 DE148 DE238 DJ018 DJ048 EL136 EQ017 EU117 EW137 FD018 FD090 FD130 FD142 FD146 FD157 FD200 GJ02 GQ05 HA05 4J036 AD01 AD08 AF01 AF06 AG01 AJ08 CD04 DA01 DA02 DA05 DB15 DB21 DB22 DC41 DC46 DD07 FA03 FA05 FB07 JA07 KA01 4M109 AA01 CA05 EA02 EA05 EA06 EB02 EB03 EB04 EB06 EB07 EB08 EB09 EB12 EB13 EC03 EC04 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C09K 3/10 C09K 3/10 Q E H01L 23/29 H01L 23/30 R 23/31 F term (reference) 4H017 AA03 AA04 AA27 AA31 AB01 AB08 AC16 AD02 AE05 4J002 CC032 CD021 CD051 CD061 CD091 CD201 DE148 DE238 DJ018 DJ048 EL136 EQ017 EU117 EW137 FD018 FD090 FD130 FD142 FD146 FD157 FD200 GJ02 GQ05 DA05 AD01 AF01 DA01 AD05 DC46 DD07 FA03 FA05 FB07 JA07 KA01 4M109 AA01 CA05 EA02 EA05 EA06 EB02 EB03 EB04 EB06 EB07 EB08 EB09 EB12 EB13 EC03 EC04
Claims (1)
ル基を含有する液状ゴムでエポキシ樹脂を変性した液状
ゴム変性エポキシ樹脂、（Ｃ）硬化剤（Ｄ）硬化促進剤
および（Ｅ）充填剤を必須成分とすることを特徴とする
液状封止用樹脂組成物。1. An epoxy resin, (B) a liquid rubber-modified epoxy resin obtained by modifying an epoxy resin with a liquid rubber containing a carboxyl group, (C) a curing agent, (D) a curing accelerator, and (E) a filler. A liquid resin composition for sealing, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26786599A JP2001089638A (en) | 1999-09-22 | 1999-09-22 | Liquid sealing resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26786599A JP2001089638A (en) | 1999-09-22 | 1999-09-22 | Liquid sealing resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001089638A true JP2001089638A (en) | 2001-04-03 |
Family
ID=17450721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26786599A Pending JP2001089638A (en) | 1999-09-22 | 1999-09-22 | Liquid sealing resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001089638A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002100951A1 (en) * | 2001-05-31 | 2002-12-19 | Nippon Petrochemicals Company, Limited | Thermosetting resin composition |
| WO2003000798A1 (en) * | 2001-05-25 | 2003-01-03 | Nippon Petrochemicals Company, Limited | Thermosetting resin composition, process for producing the same, and suspension-form mixture |
| WO2004067600A1 (en) * | 2003-01-30 | 2004-08-12 | Taiyo Yuden Co., Ltd. | Electronic material composition, electronic product and method of using electronic material composition |
| JP2011213871A (en) * | 2010-03-31 | 2011-10-27 | Nippon Steel Chem Co Ltd | Flame retardant epoxy resin composition and cured product of the same |
| JP5487540B2 (en) * | 2005-03-16 | 2014-05-07 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
| KR101556657B1 (en) | 2008-10-23 | 2015-10-26 | 주식회사 두산 | Resin composition, prepreg using same, and printed wiring board |
| WO2016181591A1 (en) * | 2015-05-13 | 2016-11-17 | パナソニックＩｐマネジメント株式会社 | Epoxy resin composition |
| KR20190043971A (en) * | 2017-10-19 | 2019-04-29 | 삼성에스디아이 주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
-
1999
- 1999-09-22 JP JP26786599A patent/JP2001089638A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003000798A1 (en) * | 2001-05-25 | 2003-01-03 | Nippon Petrochemicals Company, Limited | Thermosetting resin composition, process for producing the same, and suspension-form mixture |
| WO2002100951A1 (en) * | 2001-05-31 | 2002-12-19 | Nippon Petrochemicals Company, Limited | Thermosetting resin composition |
| EP1422266A4 (en) * | 2001-05-31 | 2005-04-13 | Nippon Petrochemicals Co Ltd | THERMOSETTING RESIN COMPOSITION |
| WO2004067600A1 (en) * | 2003-01-30 | 2004-08-12 | Taiyo Yuden Co., Ltd. | Electronic material composition, electronic product and method of using electronic material composition |
| JP2004262956A (en) * | 2003-01-30 | 2004-09-24 | Taiyo Yuden Co Ltd | Electronic material composition, electronic article and method of using electronic material composition |
| CN100430427C (en) * | 2003-01-30 | 2008-11-05 | 太阳诱电株式会社 | Electronic material composition, electronic article and method of using electronic material composition |
| JP5487540B2 (en) * | 2005-03-16 | 2014-05-07 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
| KR101556657B1 (en) | 2008-10-23 | 2015-10-26 | 주식회사 두산 | Resin composition, prepreg using same, and printed wiring board |
| JP2011213871A (en) * | 2010-03-31 | 2011-10-27 | Nippon Steel Chem Co Ltd | Flame retardant epoxy resin composition and cured product of the same |
| WO2016181591A1 (en) * | 2015-05-13 | 2016-11-17 | パナソニックＩｐマネジメント株式会社 | Epoxy resin composition |
| KR20190043971A (en) * | 2017-10-19 | 2019-04-29 | 삼성에스디아이 주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
| KR102126050B1 (en) * | 2017-10-19 | 2020-06-23 | 삼성에스디아이 주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same |
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