JPH11162840A - Exposure apparatus, general control exposure apparatus, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate troubles caused by not preparing original plate files by storing the respective original plate files of various types of original plates which are used for exposure. SOLUTION: When an aligner receives download of reticle information (S201), it generates a reticle file according to the reticle information obtained from a host computer or personal computer, etc., (S113), and it informs the result to the host computer or personal computer, etc. When the automatic generation of reticle file is completed (S113), an information on the generated reticle file is sent to the host computer or personal computer, etc., only while the system is online (S115). The sent information is stored on a disk, etc., of the host computer or personal computer, etc., (S203).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an LSI, a VLSI
The present invention relates to an exposure apparatus such as a semiconductor exposure apparatus for manufacturing a semiconductor device such as a semiconductor device, an integrated control exposure apparatus for integrally controlling these, and a device manufacturing method capable of using the integrated control exposure apparatus.

[0002]

2. Description of the Related Art Conventionally, in a plurality of semiconductor exposure apparatuses used in a lithography process, in order to process a lot in a semiconductor device manufacturing operation quickly and efficiently, a higher order relation of a computer on each exposure apparatus side. Is controlled by a host computer or personal computer. Normally, a job required to perform a certain lot process is selected from a database in which operation parameters are stored, and further, a reticle used in the lot is selected, and then the start of the exposure process is instructed.

[0003] In recent years, as the number of types of semiconductors has become smaller and more diverse, the number of wafers per lot has decreased, the number of lots has tended to increase, and the number of reticles used has also tended to increase. In addition, with the automation of the manufacturing operation of semiconductor devices, there is a tendency that a host computer or a personal computer performs overall control in order to increase the operation rate of each exposure apparatus in a semiconductor factory and to make the clean room unmanned.

Under these circumstances, in order to automate the operation of manufacturing semiconductor devices, increase the operation rate of each exposure apparatus, and measure the unmanned operation in the clean room, the uniqueness of the reticle used in the lot processing is required. A reticle file that stores information must be created in advance. In the conventional case, an operator or an automatic transfer robot conveys a reticle to an exposure apparatus for performing a lot process, and manually creates a reticle file before or after mounting the reticle in the apparatus.

[0005]

However, according to this method, since the reticle file is manually created by the operator, the reticle is mounted, but there is a problem that the reticle file may be forgotten to be created. In this case, a reticle having no reticle file cannot be transported, so that a lot using this reticle cannot be processed and stops. In addition, if the reticle file is created during a certain lot process, the operation rate of the exposure apparatus will not be reduced, but it will not be possible to make the clean room unmanned.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to solve the inconvenience of forgetting to create an original file in an exposure apparatus, an integrated control exposure apparatus, and a device manufacturing method.

[0007]

According to the present invention, there is provided an exposure apparatus for exposing a pattern of an original by referring to an original file having information unique to the original. Storage means for storing or storing the original file of each of various originals; and / or means for generating the original file of an original used for exposure.

In the general control exposure apparatus of the present invention, a plurality of exposure apparatuses for exposing a pattern of an original with reference to an original file having unique information of the original, and a host for integrally controlling these exposure apparatuses. In a general control exposure apparatus including a computer or a personal computer, each exposure apparatus includes a unit for generating the original file of an original used for exposure. Acquires information for generating an original file of the original used for the original file, and transfers information for generating an original file of the generated original file to the host computer or a personal computer. Stores the information for generating this transferred master file. Characterized in that it is intended to provide in response to a request from the exposure apparatus.

Further, the device manufacturing method of the present invention is characterized in that a device is manufactured by using such an exposure apparatus and exposing a pattern of an original onto a substrate according to an original file prepared by the apparatus.

According to this, since exposure can be performed using the original file stored or generated by the apparatus, it is not necessary for the operator to create the original file. Therefore, the inconvenience caused by forgetting to create the original file is eliminated.

[0011]

In a preferred embodiment of the present invention, the storage means stores the generated original file. Further, it has reading means for reading the identification information attached to the used original plate, and specifies and uses the original file in the storage means of the original plate by the read identification information, or the original plate specified by the identification information Generate an original file for Further, the means for generating the original file can acquire information for generating the original file from a host computer or a personal computer that controls the exposure apparatus.
You may make it acquire from various information which an exposure apparatus has. Further, the information for generating the original file provided from the host computer or the personal computer to each exposure apparatus and transferred to the host computer or the personal computer is formed in a format convenient for generating the original file. Thereby, the efficiency of the processing in the exposure apparatus or the integrated control exposure apparatus is improved.

In a more specific embodiment, a bar code as identification information is attached to an original plate, for example, a reticle cassette, mounted on an exposure apparatus, and the exposure apparatus is provided with a reticle cassette bar code reader as reading means. If so, a reticle file corresponding to the reticle name to be read is automatically generated. If the reticle cassette to be mounted does not have a barcode, or if the exposure apparatus does not have a reticle cassette barcode reader, the operator may specify the reticle name. In any case, a reticle file corresponding to the reticle name is generated based on reticle-specific information corresponding to the reticle from a host computer or a personal computer. Note that the generated reticle file is reflected on a reticle file group stored in the exposure apparatus and is added.

Accordingly, if a reticle is mounted, no problem occurs due to forgetting to create a reticle file, so that a lot using the reticle does not stop because the reticle cannot be transported. Further, since there is no need to create a reticle file on the console screen of the exposure apparatus, the operator does not need to enter the clean room. Therefore, if the reticle is mounted on the exposure apparatus, it is possible to achieve the processing without stopping the lot using the reticle, and it is possible to make the clean room unmanned. Hereinafter, embodiments of the present invention will be described more specifically through examples.

[0014]

FIG. 1 is a perspective view showing the appearance of a semiconductor exposure apparatus according to one embodiment of the present invention. As shown in the figure, this semiconductor exposure apparatus has an EWS main unit 106 having a CPU for controlling the apparatus main body, an EWS display apparatus 102 for displaying predetermined information in the apparatus, and an imaging unit in the apparatus main body. A monitor TV 105 for displaying the obtained image information, an operation panel 103 for making a predetermined input to the device, a console unit including an EWS keyboard 104 and the like are provided. In the figure, 107 is ON
-OFF switch, 108 is an emergency stop switch, 109
Is a switch, a mouse, etc. 110 is a LAN communication cable, 111 is an exhaust duct for generating heat from the console function,
Reference numeral 112 denotes a chamber exhaust device. The semiconductor exposure apparatus main body is installed inside the chamber 101.

The EWS display 102 is of a thin flat type such as EL, plasma, liquid crystal, etc., is accommodated in the entire surface of the chamber 101, and is connected to the EWS main body 106 by a LAN cable 110. Operation panel 10
3. A keyboard 104, a monitor TV 105, and the like are also installed on the front surface of the chamber 101 so that a console operation similar to the conventional console operation can be performed from the front surface of the chamber 101.

FIG. 2 is a diagram showing the internal structure of the apparatus shown in FIG. FIG. 1 shows a stepper as a semiconductor exposure apparatus. In the drawing, reference numeral 202 denotes a reticle, and 203, a wafer. When a light beam emitted from a light source device 204 illuminates the reticle 202 through an illumination optical system 205, a pattern on the reticle 202 is exposed by a projection lens 206 to a photosensitive area on the wafer 203. Can be transferred to layers. The reticle 202 is supported by a reticle stage 207 for holding and moving the reticle 202. Wafer 203
Is exposed while being vacuum-sucked by the wafer chuck 291. The wafer chuck 291 is mounted on the wafer stage 20.
9 allows movement in each axis direction. Above the reticle 202, a reticle optical system 281 for detecting the amount of displacement of the reticle is arranged. Wafer stage 209
(Z) Above, an off-axis microscope 282 is arranged adjacent to the projection lens 206. The main role of the off-axis microscope 282 is to detect the relative position between the internal reference mark and the alignment mark on the wafer 203. A reticle library 220 and a wafer carrier elevator 230, which are peripheral devices, are disposed adjacent to the stepper main body. Necessary reticles and wafers are transferred to the main body by the reticle transfer device 221 and the wafer transfer device 231. When the reticle is transported by the reticle transport device 221 to the reticle library 220 or the main body, the reticle cassette barcode reader 22
2 reads the barcode on the reticle cassette.

The chamber 101 is mainly composed of an air conditioner 210 for controlling the temperature of air, a filter box 213 for forming a uniform flow of clean air by passing fine foreign matters, and a booth 214 for shutting off the environment of the apparatus from the outside. Have been. In the chamber 101, air whose temperature has been adjusted by the cooler 215 and the reheat heater 216 in the air-conditioned air chamber 210 is supplied to the booth 214 by the blower 217 via the air filter g. The air supplied to the booth 214 is returned to the air conditioner room 210 from the return port ra.
And circulates in the chamber 101. Normally, this chamber 101 is not strictly a complete circulation system, and about 10% of the circulating air amount outside the booth 214 is supplied to the outside air provided in the air conditioner room 210 in order to always maintain a positive pressure inside the booth 214. It is introduced from the mouth oa via a blower. In this way, the chamber 101 makes it possible to keep the temperature of the environment where the apparatus is placed at a constant level and keep the air clean. The light source device 204 is provided with an intake port sa and an exhaust port ea in preparation for cooling of the ultra-high pressure mercury lamp and generation of toxic gas at the time of laser abnormality, and a part of the air in the booth 214 passes through the light source device 204 to be air-conditioned. The air is forcibly exhausted to factory equipment via a dedicated exhaust fan provided in the machine room 210. Further, a chemical adsorption filter cf for removing chemical substances in the air is provided so as to be connected to the outside air introduction port oa and the return port ra of the air conditioner room 210, respectively.

FIG. 3 is a block diagram showing an electric circuit configuration of the apparatus shown in FIG. In the figure, reference numeral 321 denotes a main unit C built in the EWS main unit 106, which controls the entire apparatus.
It is a PU and comprises a central processing unit such as a microcomputer or a minicomputer. 322 is a wafer stage driving device, and 323 is the off-axis microscope 28.
2 is an alignment detection system, 324 is a reticle stage driving device, 325 is an illumination system such as the light source device 204, 3
26 is a shutter driving device, 327 is a focus detection system,
Reference numeral 328 denotes a Z drive, which is a main body CPU 32
1 is controlled. 329 is the reticle transport device 2
21, a transfer system such as a wafer transfer device 231. 330
Is a console unit having the display 102, the keyboard 104, etc., for giving various commands and parameters relating to the operation of the exposure apparatus to the main body CPU 321. That is, it is for exchanging information with the operator. 331 is a console CPU and 332 is an external memory for storing parameters and the like.

FIG. 4 is a diagram showing an example of a screen for creating a reticle file in a conventional example for comparison with the present embodiment. The operator selects a screen for creating a reticle file using input means of the apparatus (the touch panel 103, the keyboard 104, a mouse (not shown), or the like). This allows
The screen (window) shown in FIG. 4 is displayed on the display (and touch panel) 102. In the display contents shown in FIG. 4, "/ canon / default" displayed in the field of "Reticle File"
t. "rf" is the name of the reticle file to be created / edited, and "Reticle Prc Fil"
"/ canon / d" displayed in the "e" field
efault. “rpr” is the name of a reticle process-related file, and “0” displayed in the “Select” field is an example of the reticle serial number.
The R ") button only allows the user to confirm the contents of each parameter and not to write. Of the display contents shown in FIG.
The load (“Load Reticle”) button is used to select a reticle file to be edited.
A create (“CreateReticle”) button is a button for selecting when a reticle file is newly created, and an edit (“EditReticle”) button is a button for editing the reticle file, and a save (“SAVE”) button. The) button is a button for writing the created / edited reticle file to the disc, and the end (“EXIT”) button is a button for ending this screen. Editing the screen shown in FIG. 4 (“Edit R
By pressing the “button”, a screen (window) shown in FIG. 5 is displayed on the display (and the touch panel) 102.

FIG. 5 is a diagram showing an example of a reticle parameter selection screen in a conventional example. In the display content shown in FIG. 5, the design (“Reticle Design”
n)) button is used to edit design-related parameters of the reticle, and is used for processing ("Retic").
The “le Process” button is a button for editing reticle process-related parameters, the data (“Reticle Data”) button is a button for editing reticle data-related parameters, and a measurement (“Auto Measurement”) is performed. ) Button is a button for editing parameters related to the measurement data of the reticle, and as an example, a process (“Reticle Process”) shown in the screen of FIG.
By pressing the button, a screen (window) shown in FIG. 6 is displayed on the display (and touch panel) 102.

FIG. 6 is a diagram showing an example of a reticle process selection screen in a conventional example. The bar code (“Bar Code / RT / et”) is displayed in the display contents shown in FIG.
c)) button is a button for editing parameters related to barcode and reticle transmittance. By pressing this button, the display (and touch panel) 10
The screen (window) shown in FIG.

FIG. 7 is a view showing an example of a reticle process setting screen in a conventional example. In the display contents shown in FIG. 7, each name (“Reticle Si
ze "," Reticle Barcode "," Ca
Settete Barcode ”,“ Auto RT
Switch ”,“ RT Sampling Pitch ”
h X & Y ") is a reticle-specific parameter,
Each field on the right side of the screen indicates the value of each parameter. When the corresponding field is clicked, if there are two options (for example, “No” and “Yes”),
The value is switched on the field, and if there are three or more options, a field for selection is displayed. If an alphanumeric key is required instead of an option, an alphanumeric key (not shown) is displayed. Usually, the operator operates the other parameters (“Reticle Design”, “Reticl”) in the same manner as the procedure up to the parameter setting on the screen shown in FIG. 7 (the operation from FIG. 5 to FIG. 7).
e Data "," Auto Measurement
After the setting of “Data”), the save (“SAVE”) button on the screen shown in FIG. 4 is pressed, and writing to the disc is performed.

Next, the operation of the apparatus according to this embodiment shown in FIG.
That is, the operation of automatically generating a reticle file will be described with reference to FIGS. FIG. 8 shows a semiconductor manufacturing apparatus
It is a sequence flow of reticle file automatic generation between hosts. As shown in the figure, the sequence starts when the operator executes a reticle carry-in command from a screen (not shown) on the display (and touch panel) 102 to mount the reticle on the exposure apparatus.

First, in step S101, if the exposure apparatus is equipped with a reticle cassette barcode reader and the reticle cassette to be mounted has a barcode, the reticle is transported by the reticle transport device 221 to the reticle library 220 or the main body. , The bar code on the reticle cassette is read by the reticle cassette bar code reader 222. If a reticle cassette barcode reader is not provided or a barcode is not attached on the reticle cassette, the reticle name is specified when the reticle carry-in command is executed.

After that, when a reticle is mounted on the reticle library 220 (step S103), step S103 is performed.
At 105, it is determined whether a reticle file of the mounted reticle exists in the external memory 332 or not.
If a reticle file already exists, the process directly proceeds to step S115. If no reticle file exists, the process proceeds to step S107, and it is determined whether the exposure apparatus is operating online with a host computer or a personal computer.

If the online operation is not being performed, the process proceeds to step S111, and since reticle information cannot be obtained from a host computer or a personal computer, a reticle file is automatically generated in the exposure apparatus. The reticle file generated here may be created based on the default value (default value) of each parameter held in the device,
A specific reticle file held in the apparatus may be copied and created. When the reticle file automatic generation process in step S111 ends, the process proceeds to S115.

If it is determined in step S107 that online driving is in progress, the process proceeds to step S109, where the reticle name is reported to the host computer or personal computer to obtain reticle information. Step S1
When the reticle name is reported from the exposure apparatus in step 09, the host computer or personal computer downloads reticle information corresponding to the reported reticle name to the exposure apparatus in step S201. The format of the data downloaded to the exposure apparatus in step S201 and the format of the data reported from the exposure apparatus to the host computer or the personal computer in step S115 are described in the reticle information between the semiconductor manufacturing apparatus and the host shown in FIG. This will be described later in the description of data showing an example.

When the exposure apparatus receives the download of the reticle information in step S201, the exposure apparatus generates a reticle file based on the reticle information obtained from the host computer or the personal computer in step S113, and stores the result. Report to the host computer or personal computer. When the process of automatically generating a reticle file in step S113 ends, the process proceeds to step S115, and information on the generated reticle file is reported to a host computer or a personal computer only during online operation. The reticle information reported here is stored in its disk or the like by the host computer or personal computer in step S203.

The stored reticle information can be used by another exposure apparatus. In other words, if another reticle is mounted on the reticle after that, and the lithography apparatus performs the processing from steps S101 to S105, and determines in step S105 that the predetermined reticle file does not exist in the exposure apparatus, As described above, the reticle name may be reported in step S109. At this time, the reticle information stored in step S203 described above is transferred to step S203 in the other exposure apparatus.
201 can be used.

FIG. 9 shows data showing an example of reticle information transmitted and received between the semiconductor manufacturing apparatus (exposure apparatus) and the host. The reticle information used when downloading from the host computer or personal computer to the exposure apparatus in step S201 or when reporting from the exposure apparatus to the host computer or personal computer in step S115 is, for example, as shown in FIG. 901
("[EDITRETICLE: START]") and a syntax 902 ("[EDITRETTICLE: EN]
D] ").

The contents of the data are as follows:
2 (“CREATE / canon / default.r
f / canon / test. rf ”). In this example, to create a new reticle file, the reticle file name of the copy source is set to“ / canon / default ”.
t. rf ", and set the copy destination reticle file name to" / canon / test. rf ".

The following syntax 903 (“[DESIGN: ST
ART] ”to 905 (“ [DESIGN: EN
D] ") is a part for designating reticle design-related parameters. Here, the syntax 904 (" a014 ") is used.
0101: 1 ”) (the part before“: ”= a
0140101) is a parameter ID, and the latter part (the part after “:” = 1) is a parameter value.
The parameter ID is a unique number assigned to each parameter, and the parameter ID (a01
40101) is “Reticle Alignment Mark T” of the reticle design-related parameters.
The parameter value is a set value of each parameter, and the parameter value (1) of the syntax 904 is the reticle design-related parameter “R”.
Eticle AlignmentMark Type
The other values of the parameter value are “0”, “None” and “2” are “FRA2.” The reticle design described above. Related parameters include the parameters described above (“Reticle Alignment Mark”).
There are multiple parameters other than Type "),
All parameters may be described in a format similar to the syntax 904, or only some parameters may be described.

The following syntax 906 (“[PROCESS: S
TART]) to 907 (“[PROCESS: EN
D] ") is a part for specifying process-related parameters of the reticle, and has a syntax 908 (" [[DATA: S
TART])) to 909 ("[DATA: EN
D] ") is a part for designating parameters related to reticle data, and has a syntax 910 (" [AUTO MEA ").
SURMENT: START] ") to 911 (" [A
Until UTO MEASURMENT: END] ")
This part specifies parameters related to the measurement data of the reticle. In these syntaxes, all parameters may be described in a format similar to the syntax 904 described above,
Only some parameters may be described.

As described above, in the apparatus shown in FIG. 1, if the reticle is mounted, the reticle file will not be forgotten to be created by the automatic reticle file generation function. The reticle is not stopped because it cannot be transported. Further, since there is no need to create a reticle file on the console screen of the exposure apparatus, there is no need for the operator to enter the clean room.

Next, an example of manufacturing a device that can use the above-described exposure apparatus will be described. FIG. 10 shows a micro device (a semiconductor chip such as an IC or an LSI, a liquid crystal panel,
2 shows a flow of manufacturing a CCD, a thin-film magnetic head, a micromachine, and the like. In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. on the other hand,
In step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 11 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In step 5 (resist processing), a resist is applied to the wafer.
Step 16 (exposure) uses the above-described exposure apparatus or exposure method to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer. Step 17
In (development), the exposed wafer is developed. Step 18
In (etching), portions other than the developed resist image are scraped off. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

According to this, it is possible to manufacture a large-sized device, which was conventionally difficult to manufacture, at low cost.

[0038]

As described above, according to the present invention,
The inconvenience caused by forgetting to create the original file can be solved. In other words, if the original plate is mounted on the exposure apparatus, the processing can be performed without stopping the processing of the lot using the original plate. In addition, the clean room can be unmanned.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an appearance of a semiconductor exposure apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing the internal structure of the device of FIG.

FIG. 3 is a block diagram showing an electric circuit configuration of the device shown in FIG.

FIG. 4 is a diagram showing an example of a reticle file creation screen in a conventional example.

FIG. 5 is a diagram showing an example of a reticle parameter selection screen in the conventional example of FIG. 4;

6 is a diagram showing an example of a reticle process selection screen in the conventional example of FIG.

FIG. 7 is a diagram showing an example of a reticle process setting screen in the conventional example of FIG. 4;

8 is a flowchart showing an automatic reticle file generation operation between the semiconductor manufacturing apparatus and the host in the apparatus shown in FIG.

9 is a diagram showing an example of data of reticle information transmitted and received between a semiconductor manufacturing apparatus and a host in the apparatus of FIG.

FIG. 10 is a flowchart illustrating an example of manufacturing a device that can use the apparatus of the present invention.

FIG. 11 is a detailed flowchart of the wafer process of FIG. 10;

[Explanation of symbols]

101: temperature control chamber, 102: display device for EWS, 103: operation panel, 104: keyboard for EWS, 105: monitor TV, 106: EWS body, 10
7: ON-OFF switch, 108: emergency stop switch, 109: various switches, mouse, etc. 110: LAN
Communication cable, 111: exhaust duct, 112: exhaust device, 202: reticle, 203: wafer, 204: light source device, 205: illumination optical system, 206: projection lens, 20
7: reticle stage, 209: wafer stage, 28
1: reticle microscope, 282: off-axis microscope, 2
10: air conditioner room, 213: filter box, 214:
Booth, 217: blower, g: air filter, cf: chemical adsorption filter, oa: outside air inlet, ra: return port, 321: main body CPU, 322: wafer stage drive, 323: alignment detection system, 324: reticle stage Driving device, 325: illumination system, 326: shutter driving device, 327: focus detection system, 328: Z driving device, 329: transport system, 330: console, 331:
Console CPU 332: external memory.

Claims (12)

[Claims] An exposure apparatus for exposing a pattern of an original with reference to an original file having unique information of the original stores or stores the original files of various originals which may be used for exposure. An exposure apparatus, comprising: a storage unit for performing an exposure. 2. An exposure apparatus for performing exposure of a pattern of an original with reference to an original file having unique information of the original, comprising means for generating the original file of an original used for exposure. Exposure apparatus. 3. An exposure apparatus for exposing a pattern of an original with reference to an original file having unique information of the original, storing or storing the original files of various originals which may be used for exposure. An exposure apparatus, comprising: a storage unit for performing an exposure, and a unit for generating the original file of an original used for exposure. 4. The exposure apparatus according to claim 3, wherein the storage unit stores the generated original plate file. 5. The apparatus according to claim 1, further comprising: reading means for reading identification information attached to an original used, wherein an original file in the storage means of the original is specified and used based on the read identification information. 4. The exposure apparatus according to 1 or 3. 6. A reading means for reading identification information attached to an original to be used, wherein said means for generating an original file generates an original file of the original specified by the identification information. The exposure apparatus according to claim 2, 3, or 4, wherein: 7. The apparatus according to claim 2, wherein the means for generating the original file acquires information for generating the original file from a host computer or a personal computer which controls and controls the exposure apparatus. 7. The exposure apparatus according to 3, 4, or 6. 8. The apparatus according to claim 2, wherein the means for generating the original file acquires information for generating the original file from various types of information included in the exposure apparatus. 7. The exposure apparatus according to 6. 9. An overall control comprising a plurality of exposure apparatuses for exposing a pattern of an original with reference to an original file having unique information of the original, and a host computer or a personal computer for integrally controlling these exposure apparatuses. In the exposure apparatus, each exposure apparatus includes means for generating the original file of an original used for exposure, and the original file generation means, from the host computer or a personal computer,
Acquires information for generating an original file of an original used for exposure, and transfers information for generating an original file of the generated original file to the host computer or a personal computer. A general control exposure apparatus, wherein the personal computer stores information for generating the transferred original file and provides the information in response to a request from each exposure apparatus. 10. Information for generating a master file provided from the host computer or personal computer to each exposure apparatus and transferred to the host computer or personal computer is formed in a format convenient for generating the master file. 10. The method according to claim 9, wherein
3. The general control exposure apparatus according to 1. 11. The general control exposure apparatus according to claim 9, wherein said exposure apparatus is the exposure apparatus according to any one of claims 1 to 10. 12. A device manufacturing method, comprising: using the exposure apparatus according to claim 1, exposing a pattern of an original onto a substrate by using an original file prepared by the apparatus to manufacture a device.