JPH11167873A - Fine barrier rib forming method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To from a barrier rib with high dimensional accuracy in a simple process, and sufficiently accommodate for forming a fine pattern and a large screen by using a metal wire which is insulated or not insulated as a core material of a fine barrier rib and covering the metal wire with a barrier rib material. SOLUTION: Tabular fixing jigs 11, 12 and metal wire fixing means 13, 14 arranged at equal intervals according to the intervals of the fine barrier rib to be formed in each lower part of plane fixing jigs 11, 12 are used in the method for arranging a metal wire 3 having a rectangular cross section on a glass substrate 1. In this method, a plurality of metal wires 3 are stretched between the fixing jigs 11, 12, and fixed with the metal wire fixing means 13, 14. The fixed metal wires 3 having the rectangular cross section are placed on the glass substrate 1 so as to adhere closely to it and arranged. By arranging the fixing jigs 11, 12, a plurality of metal wires 3 can be stuck to the glass substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming fine partition walls provided on glass substrates of various display panels including a plasma display panel.

[0002]

2. Description of the Related Art The basic structure of a plasma display panel, which is also applied to a wall-mounted television, is, for example,
FIG. 8 shows the outline. That is, the front panel A and the rear panel B are overlapped so that the striped electrodes A1 and B1 provided on both panels face each other at right angles, and discharge occurs in the striped or grid-shaped partition C at the intersection. Causes light emission.

The partition C is provided to prevent light crosstalk and to provide a screen contrast, and is very fine. For example, in the case of a stripe-shaped partition wall C, it is required that the partition wall C be formed to have a width of about 30 μm, a height of about 200 μm, and an interval of about 100 μm over the entire panel. Then, a phosphor is applied to the inside of the partition C having such fine dimensions, and an inert gas such as Ne or Xe is sealed therein. Therefore, in addition to the formation of a fine pattern which is naturally required from the viewpoint of obtaining a complicated and clear image, the amount of the phosphor applied is kept constant, and the front panel A and the rear panel B on which the partition walls C are formed are separated. From the viewpoint of preventing the leakage of the inert gas through close contact, the dimensional accuracy of the partition wall C is required to be high.

Conventionally, as a method of forming such a partition, a screen printing method or a sand blast method has been adopted. The screen printing method is a method in which a partition material such as a glass paste is printed on a glass substrate, and the operation of drying is repeated about ten times by adjusting the position of the screen each time, and is a method of forming the partition by so-called overprinting. is there. In the sand blast method, a partition material such as a glass paste is applied to the entire surface of a glass substrate, then coated with a photoresist, the photoresist coating film is exposed and developed, and then a portion not covered with a resist pattern is formed. Is sand blasted to form partition walls.

[0005]

In the above-mentioned conventional method of forming the partition walls by the screen printing method, the alignment of the screen and the distortion of the screen each time make it difficult to form a fine pattern and enlarge the screen. . Further, in a conventional method of forming a partition by sandblasting,
The fact that the blast depth tends to be non-uniform makes it difficult to form a fine pattern and enlarge the screen. Further, in any of the above methods, it takes a long time to increase the dimensional accuracy of the partition walls, which is a factor that increases the manufacturing cost.

Therefore, an object of the present invention is to form a partition having high dimensional accuracy by a simple method, and particularly suitable as a partition for a substrate for a plasma display panel, and to sufficiently cope with a fine pattern and a large screen. It is an object of the present invention to provide a method for forming a fine partition which can be performed.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, have used an insulated or non-insulated metal wire as a core material of a fine partition wall. It has been found that the above object can be achieved by coating with a partition wall material. Further, the form of coating of the metal wire with the partition material is such that (a) the metal wire is simply placed on the glass substrate, and the metal wire and the surface of the glass substrate where the metal wire is not placed are formed of the partition material. Even when the metal wire is disposed on the glass substrate, the metal wire is adhered onto the glass substrate, and the metal wire is collectively coated with the partition material as described above. , (C)
Even if the metal wire is arranged and adhered on the glass substrate and only the metal wire is covered with the partition wall material, (d) if the metal wire used is insulated, it is arranged on the glass substrate Even if the upper surface of the metal wire is covered only with the partition wall material, (e) if the metal wire to be used is not insulated, it is arranged and bonded on a glass substrate, It has been found that the above object can be achieved even when the partition wall material coated only on the upper surface of the metal wire is coated on the side surface. The present invention has been completed based on these findings.

That is, according to the present invention,
On a glass substrate, a plurality of insulated or non-insulated metal wires are arranged at predetermined intervals in a certain direction, and the metal wires are adhered to or not adhered to the glass substrate. A method for forming a fine partition, which comprises applying a partition material and then curing the partition material is provided. According to a second aspect of the present invention, a plurality of insulated or non-insulated metal wires are arranged at predetermined intervals in a certain direction on a glass substrate, and the metal wires are bonded to the glass substrate. A method of forming a fine partition, characterized by applying a partition material to the upper surface of the metal wire and then curing the partition material.

According to the present invention, as described above, a metal wire is disposed on a glass substrate, the metal wire is adhered to the glass substrate as necessary, and a partition material is applied to the entire surface or the metal wire portion. By a simple method of curing the partition wall material, fine partition walls can be easily formed with high dimensional accuracy so as to sufficiently cope with a fine pattern and a large screen. Further, according to the present invention, as described above, a metal wire is arranged on a glass substrate, the metal wire is adhered to the glass substrate as needed, and a partition wall material is applied to an upper surface portion of the metal wire. By a simple method of curing the partition wall material, fine partition walls can be easily formed with high dimensional accuracy so as to sufficiently cope with a fine pattern and a large screen.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In carrying out the present invention, first, a plurality of metal wires are arranged on a glass substrate at predetermined intervals in a predetermined direction. The metal wire to be placed on the glass substrate is used as a core material for forming fine partition walls, and even if it is a metal wire that has been subjected to insulation treatment, it is a metal wire that has a non-insulated metal surface exposed. There may be. The metal constituting these metal wires is not particularly limited as long as it has good dimensional accuracy and is not easily deformed, and examples thereof include copper, iron, and aluminum. Examples of the insulation treatment of the insulated metal wire include alumite treatment, insulation plating, and the like.

In the present invention, the cross-sectional shape in the width direction of the formed fine partition wall and its size basically depend on the cross-sectional shape in the width direction of the metal wire used as the core material and its size. Therefore, the cross-sectional shape and the size of the metal wire are appropriately selected according to the desired cross-sectional shape and the size of the fine partition to be formed. Generally, the cross-sectional shape of the metal wire is preferably a square or a rectangle. The size of the cross section of the metal wire is appropriately selected in consideration of the desired size of the cross section of the fine partition wall and the thickness of the coating layer after curing of the applied partition wall material. Furthermore, the length of the metal wire is appropriately selected according to the length of the glass substrate in the arrangement direction.

The method of arranging the metal wires on the glass substrate is not particularly limited, but generally, the method shown in FIGS. 6 and 7 is preferably applied. That is, in FIG. 6, 1 is a glass substrate, 3 is a metal wire having a rectangular cross section, 11 and 12 are flat fixing jigs, and 13 and 14 are fixing jigs 11 and 12.
Metal wire fixing means provided at equal intervals below each of them in accordance with the intervals of the fine partition walls to be formed. In the method as shown in FIG. 6, a plurality of metal wires 3 are bridged between fixing jigs 11 and 12 and
And fixed at 14. The plurality of thus fixed metal wires 3 are placed on the glass substrate 1 in close contact with each other,
A plurality of metal wires 3 are arranged on the glass substrate 1. At this time, by arranging the fixing jigs 11 and 12 as shown in FIG. 7, a plurality of metal wires 3 can be crimped to the glass substrate 1.

[0013] The adhesion of the metal wire on the glass substrate is as follows.
Generally, when a metal wire is arranged on a glass substrate, it is performed using an adhesive. That is, for example, when arranging a plurality of metal wires 3 on the glass substrate 1 by the method shown in FIG. 6, the plurality of metal wires 3 are bridged between the fixing jigs 11 and 12 to fix the metal wires. Means 13 and 14
After the adhesive is applied to the lower surfaces of the plurality of metal wires 3 thus fixed, the plurality of metal wires 3 are placed on the glass substrate 1 in close contact with each other.
Can be glued on top. Examples of the adhesive used for the bonding include an inorganic adhesive such as a vitreous adhesive. If necessary, a barrier rib material used for forming a fine barrier rib described later can also be used as the adhesive.

In the embodiment of the present invention, the metal wire is then arranged as described above, and a barrier rib material is applied to the glass substrate bonded as required. The application of this partition material
According to the first invention, regardless of whether or not the metal wire is adhered to the glass substrate, the metal wire and the glass substrate surface of the portion where the metal wire is not arranged may be coated with the partition wall material at once. good. In the case where the metal wire is bonded to the glass substrate and the used metal wire is insulated, the partition wall material may be applied only to the upper surface of the metal wire according to the second invention.

As the partition wall material to be applied, a partition wall material such as a silicon-containing polymer forming composition, an inorganic binder or a glass paste can be used. If necessary, a dark colorant such as black may be added to the partition wall material so as to be advantageous in obtaining the contrast of the display panel.

Examples of the above-mentioned silicon-containing polymer-forming composition include those which undergo a crosslinking reaction at room temperature or under heating to be cured to form a ceramic-like silicon-containing polymer film. Examples thereof include an organic material containing a polysiloxane as a main component and a crosslinking agent and a curing catalyst, and specific examples thereof include heatless glass (HEATLESS GLASS) -6.
00 series (trade name; sold by Homer Technology Co., Ltd.). Other examples of the silicon-containing polymer-forming composition include inorganic compounds containing a thermosetting inorganic silazane such as perhydropolysilazane as a component. Specific examples thereof include Tonen polysilazane (trade name: Tonen) (Co., Ltd.). Further, examples of inorganic binders include those containing ceramic powder, cement such as alumina cement, water glass, and the like, and specific examples thereof include MR-100 series of Red Proof (trade name; ( Co., Ltd.).

As a method of applying the partition wall material, a casting method, a brush coating method, a spray coating method, a dipping method and the like can be applied. In addition, when applying the partition wall material, it is generally appropriate that the thickness of the coating film of the partition wall material is such that the thickness of the coating layer after curing the partition wall material is about tens to several μm. is there.

In the practice of the present invention, after the partition material is applied as described above, the partition material is cured. Thus, a desired fine partition wall is formed. The curing of the partition wall material can be performed at room temperature or under heating by appropriately selecting the curing conditions according to the type of the partition wall material used.

Hereinafter, examples (a) to (e) of a glass substrate on which fine partition walls are formed according to the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view in the width direction of an example (a) in which a rectangular metal wire that is not subjected to insulation treatment is arranged according to the first invention, and a fine partition is formed by collectively coating with a partition material. FIG. 2 is a cross-sectional view in the width direction of an example (b) in the case where a rectangular metal wire insulated according to the first invention is arranged, and a fine partition is formed by collectively coating with a partition material. 3 is a width direction of the example (c) in which a rectangular metal wire not insulated according to the first invention is arranged and adhered on a glass substrate, and is collectively covered with a partition material to form a fine partition. FIG. FIG. 4 shows an example (d) in which a rectangular metal wire insulated according to the second invention is arranged and adhered on a glass substrate, and only the upper surface of the metal wire is covered with a partition material to form a fine partition. FIG. 5 is a cross-sectional view in the width direction of FIG. 5, and FIG.
FIG. 9B is a cross-sectional view in the width direction of an example (e) in a case where the upper surface of the metal wire is adhered and the upper surface of the metal wire is covered with the material to hang down from the upper surface to both side surfaces of the metal wire to form fine partition walls. 1 to 5, 1 is a glass substrate, 2 is a fine partition formed on the glass substrate 1, 3 is a metal wire having a rectangular cross section, 4 is a coating layer after the partition material is cured, and 5 is an insulating layer , 6 is an adhesive layer, 7
Is a cured coating layer formed by hanging from the upper surface of the metal wire to both sides.

[0020]

EXAMPLE 1 An uninsulated copper wire having a longitudinal section of about 200 μm in length and about 60 μm in width was used for a flat fixing jig shown in FIG. 6. , Copper wire spacing about 160μm
The copper wire thus fixed was placed on a glass substrate by closely attaching the copper wire thus fixed to the glass substrate. Then, on the copper wire and on the surface of the glass substrate where the copper wire is not arranged, a product name sold by Homer Technology Co., Ltd .; heatless glass (GS-600-1) is used as a partition wall material. The composition was applied by a brush coating method, and the above-mentioned partition wall material was heated and cured at about 130 ° C. for 20 to 30 minutes to form fine partition walls on a glass substrate. The formed fine partition had a cross section in the width direction of the structure as shown in FIG. 1, and the thickness of the coating layer of the partition material after curing was about 8 μm.

Example 2 The procedure of Example 1 was repeated, except that an alumite-insulated aluminum wire was used in place of the uninsulated copper wire. Was formed. The formed fine partition has a cross section in the width direction of the structure as shown in FIG. 2, and is a trade name as a partition material after curing; the thickness of a coating layer of heatless glass (GS-600-1) The length was about 8 μm.

Example 3 In Example 1, when a copper wire was placed on a glass substrate using a flat fixing jig shown in FIG. 6, a vitreous adhesive was applied to the lower surface of the copper wire. Except that it was arranged on a glass substrate, the same operation as in Example 1 was performed to form fine partition walls on the glass substrate. The formed fine partition has a cross section in the width direction of the structure as shown in FIG. 3, and is a trade name as a partition material after curing; heatless glass (GS-600)
-1) The thickness of the coating layer was about 8 μm.

Example 4 The aluminum wire of Example 2 was used for fixing at the same line spacing, and a vitreous adhesive was applied and adhered to the lower surface of the thus fixed aluminum wire. Next, heatless glass (GS-600-1) is used as a partition material only on the upper surface of the aluminum wire bonded on the glass substrate.
Was applied by a screen printing method, and the above-mentioned partition wall material was heated and cured at about 130 ° C. for 20 to 30 minutes to form fine partition walls on a glass substrate. The formed fine partition is shown in FIG.
And the thickness of the coating layer of heatless glass (GS-600-1) as a material for the partition wall after curing was about 8 μm.

Example 5 Using the copper wire of Example 1, a vitreous adhesive was applied to the lower surface of the copper wire as in Example 3, and the copper wire was bonded and fixed. Next, heatless glass (GS-600-1) is applied as a partition material to only the upper surface of the copper wire bonded on the glass substrate by screen printing, and the partition material is dripped from the upper surface to both side surfaces. Then, the partition wall material was heated and cured at about 130 ° C. for 20 to 30 minutes to form fine partition walls on the glass substrate. The formed fine partition has a cross section in the width direction of the structure as shown in FIG. 5, and a trade name as a partition material after curing; thickness of a coating layer of heatless glass (GS-600-1) It was about 8 μm.

[0025]

According to the present invention, a metal wire is arranged on a glass substrate, the metal wire is adhered to the glass substrate as necessary, and a partition material is applied to the entire surface or the metal wire portion.
By a simple method of curing the partition wall material, a fine partition wall can be easily formed with high dimensional accuracy so as to sufficiently cope with a fine pattern and a large screen. Further, in the fine partition walls formed according to the present invention, since the partition wall material is used as an extremely thin film covering the metal wire of the core material, the problem of displacement, the generation of bubbles and cracks that occur when the partition wall material is cured is generated. Problems are also suppressed.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view in the width direction showing an example (a) of a glass substrate having fine partition walls formed according to the present invention.

FIG. 2 is a schematic cross-sectional view in the width direction showing an example (b) of a glass substrate having fine partition walls formed according to the present invention.

FIG. 3 is a schematic cross-sectional view in the width direction showing an example (c) of a glass substrate having fine partition walls formed according to the present invention.

FIG. 4 is a schematic cross-sectional view in the width direction showing an example (d) of a glass substrate having fine partition walls formed according to the present invention.

FIG. 5 is a schematic cross-sectional view in the width direction showing an example (e) of a glass substrate having fine partition walls formed according to the present invention.

FIG. 6 is a perspective view schematically showing an example of a method for arranging metal wires on a glass substrate when forming fine partition walls according to the present invention.

FIG. 7 is a front view schematically showing another example of a method for arranging metal lines on a glass substrate when forming fine partition walls according to the present invention.

FIG. 8 is a perspective view schematically showing a structural example of a plasma display panel.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 glass substrate 2 fine partition formed on glass substrate 1 metal wire having a rectangular cross section 4, 7 coating layer after curing of partition material 5 insulating layer 6 adhesive layer 11 flat fixing jig 12 flat Fixing jig 13 Metal wire fixing means 14 Metal wire fixing means A Front panel A1 Striped electrode B Back panel B1 Striped electrode C Partition wall

Claims (5)

[Claims] 1. A method in which a plurality of insulated or uninsulated metal wires are arranged on a glass substrate at predetermined intervals in a predetermined direction, and the metal wires are bonded or bonded to the glass substrate. No, apply a partition material on it,
Then, the method of forming a fine partition wall comprises curing the partition wall material. 2. A plurality of insulated or non-insulated metal wires are arranged on a glass substrate at predetermined intervals in a predetermined direction, and the metal wires are adhered to the glass substrate. Forming a fine partition wall by applying a partition wall material to the upper surface of the substrate and then curing the partition wall material. 3. The method according to claim 1, wherein the cross section of the metal wire in the width direction is a square or a rectangle. 4. The method for forming a fine partition according to claim 1, wherein the partition material is selected from a silicon-containing polymer forming composition, an inorganic binder and a glass paste. 5. The method for forming a fine partition according to claim 1, wherein the fine partition is for a substrate for a plasma display panel.