JPH11124436A - Resin composition and its production and molded product - Google Patents
Resin composition and its production and molded productInfo
- Publication number
- JPH11124436A JPH11124436A JP7609498A JP7609498A JPH11124436A JP H11124436 A JPH11124436 A JP H11124436A JP 7609498 A JP7609498 A JP 7609498A JP 7609498 A JP7609498 A JP 7609498A JP H11124436 A JPH11124436 A JP H11124436A
- Authority
- JP
- Japan
- Prior art keywords
- polycarbosilane
- coating film
- resin composition
- observed
- resistance test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920003257 polycarbosilane Polymers 0.000 claims abstract description 78
- 150000001875 compounds Chemical class 0.000 claims abstract description 46
- 239000000203 mixture Substances 0.000 claims abstract description 42
- 239000004593 Epoxy Substances 0.000 claims abstract description 37
- 230000001678 irradiating effect Effects 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 claims abstract description 5
- 238000005260 corrosion Methods 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 103
- 239000011248 coating agent Substances 0.000 claims description 102
- 238000010438 heat treatment Methods 0.000 claims description 32
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 29
- 239000003063 flame retardant Substances 0.000 claims description 29
- 239000012298 atmosphere Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 11
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 229910018540 Si C Inorganic materials 0.000 claims description 9
- 229910018557 Si O Inorganic materials 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 abstract description 7
- 125000002947 alkylene group Chemical group 0.000 abstract description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 abstract description 4
- ZFIVKAOQEXOYFY-UHFFFAOYSA-N Diepoxybutane Chemical compound C1OC1C1OC1 ZFIVKAOQEXOYFY-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 34
- 239000010935 stainless steel Substances 0.000 description 34
- 239000000463 material Substances 0.000 description 32
- 239000002253 acid Substances 0.000 description 31
- 239000003513 alkali Substances 0.000 description 29
- 239000012300 argon atmosphere Substances 0.000 description 22
- 238000006116 polymerization reaction Methods 0.000 description 21
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 17
- 229920000647 polyepoxide Polymers 0.000 description 17
- 230000008707 rearrangement Effects 0.000 description 17
- 229920000548 poly(silane) polymer Polymers 0.000 description 15
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 12
- 229920003319 Araldite® Polymers 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 125000003944 tolyl group Chemical group 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- -1 metaxylenediamine Chemical compound 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000005481 NMR spectroscopy Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229960001701 chloroform Drugs 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001021 polysulfide Polymers 0.000 description 2
- 239000005077 polysulfide Substances 0.000 description 2
- 150000008117 polysulfides Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 230000010512 thermal transition Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- YQMXOIAIYXXXEE-UHFFFAOYSA-N 1-benzylpyrrolidin-3-ol Chemical compound C1C(O)CCN1CC1=CC=CC=C1 YQMXOIAIYXXXEE-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- IVSPVXKJEGPQJP-UHFFFAOYSA-N 2-silylethylsilane Chemical compound [SiH3]CC[SiH3] IVSPVXKJEGPQJP-UHFFFAOYSA-N 0.000 description 1
- LOYDTBZMMPQJNI-UHFFFAOYSA-N 3a-methyl-5,6-dihydro-4h-2-benzofuran-1,3-dione Chemical compound C1CCC=C2C(=O)OC(=O)C21C LOYDTBZMMPQJNI-UHFFFAOYSA-N 0.000 description 1
- AHIPJALLQVEEQF-UHFFFAOYSA-N 4-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=C1)=CC=C1N(CC1OC1)CC1CO1 AHIPJALLQVEEQF-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical class SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910007991 Si-N Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- 229910006294 Si—N Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000011825 aerospace material Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical compound [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- UIZLQMLDSWKZGC-UHFFFAOYSA-N cadmium helium Chemical compound [He].[Cd] UIZLQMLDSWKZGC-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 238000006298 dechlorination reaction Methods 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- NCQDQONETMHUMY-UHFFFAOYSA-N dichloro(phenyl)borane Chemical compound ClB(Cl)C1=CC=CC=C1 NCQDQONETMHUMY-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910002029 synthetic silica gel Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ポリカルボシラン
とエポキシ化合物を含有する混合物を加熱処理および光
照射処理の少なくとも1つの処理に供することにより得
られる樹脂組成物、その製造方法、樹脂組成物により形
成される成形体およびその製造方法に関する。The present invention relates to a resin composition obtained by subjecting a mixture containing polycarbosilane and an epoxy compound to at least one of a heat treatment and a light irradiation treatment, a method for producing the same, and a resin composition. And a method for producing the same.
【0002】[0002]
【従来の技術】近年、電子材料、電気絶縁材料、一般産
業機器、自動車、エネルギー変換機器、宇宙航空用機器
などの分野において、高温での耐熱性を有する耐熱性樹
脂が求められており、活発な研究開発が行われている。2. Description of the Related Art In recent years, in the fields of electronic materials, electrical insulating materials, general industrial equipment, automobiles, energy conversion equipment, and aerospace equipment, heat-resistant resins having high heat resistance at high temperatures have been demanded. R & D is underway.
【0003】高温耐熱性樹脂としては、フッ素樹脂、シ
リコーン樹脂、ポリイミド、ポリフェニレンサルファイ
ド、ポリエーテルサルフォンなどの耐熱性高分子が用い
られている。As the high-temperature heat-resistant resin, a heat-resistant polymer such as a fluorine resin, a silicone resin, polyimide, polyphenylene sulfide, and polyether sulfone is used.
【0004】しかしながら、これらの耐熱性高分子は、
一般的に、空気中(或いは酸化性雰囲気中)での高温条
件下では、熱変形し易くかつ酸化され易いために、耐久
性が十分でなく、特に耐ヒートサイクル性に劣るという
欠点を有している。また、基材表面にこれらの耐熱性高
分子により塗膜を形成する場合には、一般に基材と塗膜
との密着性が十分でないという問題点もある。[0004] However, these heat-resistant polymers are
In general, under high temperature conditions in air (or in an oxidizing atmosphere), it is easily deformed by heat and easily oxidized, so that it has a drawback that the durability is not sufficient and the heat cycle resistance is particularly poor. ing. Further, when a coating film is formed on the surface of the substrate with these heat-resistant polymers, there is also a problem that the adhesion between the substrate and the coating film is generally insufficient.
【0005】[0005]
【発明が解決しようとする課題】従って、本発明は、空
気中(或いは酸化性雰囲気中)での高温条件下において
も、耐食性、耐久性に優れ、特に耐ヒートサイクル性に
優れた樹脂組成物および成形物を提供することにある。Accordingly, the present invention provides a resin composition having excellent corrosion resistance and durability, and particularly excellent heat cycle resistance, even under high temperature conditions in the air (or in an oxidizing atmosphere). And a molded product.
【0006】[0006]
【課題を解決するための手段】本発明者は、上記の様な
技術の現状を考慮しつつ研究を進めた結果、ポリカルボ
シランとエポキシ化合物とを含有する樹脂組成物が、上
記課題を解決し得ることを見出し、本発明を完成するに
至った。Means for Solving the Problems The present inventor has conducted researches in consideration of the above-mentioned state of the art, and as a result, a resin composition containing polycarbosilane and an epoxy compound has solved the above-mentioned problems. The inventors have found that the present invention can be performed, and have completed the present invention.
【0007】すなわち、本発明は、下記に示す樹脂組成
物、その製造方法、成形体およびその製造方法を提供す
るものである。That is, the present invention provides the following resin composition, a method for producing the same, a molded article, and a method for producing the same.
【0008】1.ポリカルボシランとエポキシ化合物と
を含有する混合物に対し、加熱処理および光照射処理の
少なくとも1種の処理を行うことにより得られる樹脂組
成物。[0008] 1. A resin composition obtained by subjecting a mixture containing polycarbosilane and an epoxy compound to at least one kind of heat treatment and light irradiation treatment.
【0009】2.ポリカルボシランとエポキシ化合物と
を含有する混合物を不活性ガス雰囲気中で光照射および
/または加熱することにより得られ、ポリカルボシラン
由来のSi-C結合を含み、かつポリカルボシラン成分とエ
ポキシ化合物成分とがそれぞれ変性した部分が、Si-C結
合および/またはSi-O結合を介して結合している上記項
1に記載の樹脂組成物。[0009] 2. A mixture containing polycarbosilane and an epoxy compound is obtained by irradiating light and / or heating in an inert gas atmosphere, contains a polycarbosilane-derived Si-C bond, and contains a polycarbosilane component and an epoxy compound. Item 2. The resin composition according to the above item 1, wherein the parts modified with the components are bonded via a Si-C bond and / or a Si-O bond.
【0010】3.ポリカルボシランとエポキシ化合物と
を含有する混合物を酸素含有ガス雰囲気中で光照射およ
び/または加熱することにより得られ、ポリカルボシラ
ン由来のSi-C結合を含み、かつポリカルボシラン成分と
エポキシ化合物成分とがそれぞれ変性した部分が、Si-C
結合および/またSi-O結合および/または雰囲気中の酸
素が挿入されたSi-O-C結合を介して結合している上記項
1に記載の樹脂組成物。[0010] 3. A mixture containing polycarbosilane and an epoxy compound is obtained by irradiating light and / or heating in an oxygen-containing gas atmosphere, contains a Si-C bond derived from polycarbosilane, and contains a polycarbosilane component and an epoxy compound. The parts where the components have been modified are Si-C
Item 2. The resin composition according to item 1, wherein the resin composition is bonded via a bond and / or a Si—O bond and / or a Si—OC bond into which oxygen in the atmosphere is inserted.
【0011】4.ポリカルボシランが、側鎖にSi-H結合
を有するカルボシランである上記項1、2および3のい
ずれかに記載の樹脂組成物。4. Item 4. The resin composition according to any one of Items 1, 2 and 3, wherein the polycarbosilane is a carbosilane having a Si—H bond in a side chain.
【0012】5.エポキシ化合物とポリカルボシランと
を混合し、得られた混合物に対し、加熱処理および光照
射処理の少なくとも1種の処理を行うことを特徴とする
樹脂組成物の製造方法。5. A method for producing a resin composition, comprising mixing an epoxy compound and polycarbosilane, and subjecting the resulting mixture to at least one kind of heat treatment and light irradiation treatment.
【0013】6.上記項1〜4のいずれかに記載のポリ
カルボシランとエポキシ化合物からなる樹脂組成物の成
形体。6. Item 5. A molded article of a resin composition comprising the polycarbosilane according to any one of Items 1 to 4 and an epoxy compound.
【0014】7.成形体の形態が、塗膜である上記項6
に記載の成形体。7. Item 6 wherein the form of the molded article is a coating film.
The molded article according to the above.
【0015】8.ポリカルボシランとエポキシ化合物と
を含有する混合物を基材表面に塗布した後、加熱処理お
よび光照射処理の少なくとも1種の処理を行うことによ
り、塗膜を硬化させることを特徴とする製品乃至物品の
製造方法。[8] A product or article wherein a mixture containing polycarbosilane and an epoxy compound is applied to a substrate surface, and then at least one of heat treatment and light irradiation treatment is performed to cure the coating film. Manufacturing method.
【0016】9.上記項8に記載の方法により得られた
硬化塗膜を有する製品乃至物品。9. Item 9. A product or article having a cured coating film obtained by the method according to Item 8.
【0017】10.硬化塗膜が、耐熱性、耐食性および
難燃性表面保護膜である上記項9に記載の製品乃至物
品。10. Item 10. The product or article according to Item 9, wherein the cured coating film is a heat-resistant, corrosion-resistant, and flame-retardant surface protective film.
【0018】[0018]
【発明の実施の形態】本明細書において使用する「アル
キル基」、「アルケニル基」、「アリール基」、「アル
キレン基」および「組成物」は、以下に定義する意味を
有する。BEST MODE FOR CARRYING OUT THE INVENTION As used herein, "alkyl group", "alkenyl group", "aryl group", "alkylene group" and "composition" have the meanings defined below.
【0019】「アルキル基」とは、1価の直鎖状、環状
または分岐状の炭素数1〜14の脂肪族炭化水素基をい
う。The term "alkyl group" refers to a monovalent linear, cyclic or branched aliphatic hydrocarbon group having 1 to 14 carbon atoms.
【0020】「アルケニル基」とは、少なくとも1つの
炭素−炭素二重結合を有する1価の直鎖状、環状または
分岐状の炭素数1〜14の脂肪族炭化水素基をいう。The term "alkenyl group" refers to a monovalent linear, cyclic or branched C1-C14 aliphatic hydrocarbon group having at least one carbon-carbon double bond.
【0021】「アリール基」とは、少なくとも1つの置
換基を有するか或いは置換基を有しない芳香族炭化水素
基をいう。"Aryl group" refers to an aromatic hydrocarbon group having at least one substituent or no substituent.
【0022】「アルキレン基」とは、2価の直鎖状、環
状または分岐状の炭素数1〜14の脂肪族炭化水素基を
いう。The term "alkylene group" refers to a divalent linear, cyclic or branched aliphatic hydrocarbon group having 1 to 14 carbon atoms.
【0023】「組成物」とは、2成分以上の化合物間の
一部または全部に化学的結合が存在する物質または材料
をいう。The term "composition" refers to a substance or material in which a chemical bond exists partially or entirely between two or more compounds.
【0024】本発明の樹脂組成物の製造において用いら
れるポリカルボシランとしては、Si-C結合を有する直鎖
状、環状、分岐状の化合物であれば特に限定されない。
カルボポリシランは、分子内にSi-O結合、Si-N結合、Si
-O-M結合(M=Ti、Zr)およびSi-B結合の少なくとも1つ
を含有していても良い。The polycarbosilane used in the production of the resin composition of the present invention is not particularly limited as long as it is a linear, cyclic or branched compound having a Si—C bond.
Carbopolysilane has Si-O bond, Si-N bond, Si
It may contain at least one of an -OM bond (M = Ti, Zr) and a Si-B bond.
【0025】このようなポリカルボシランとしては、例
えば、下記の一般式(1)で表される繰り返し単位を有
する直鎖状、分岐状または環状化合物を挙げることがで
きる。As such a polycarbosilane, for example, a linear, branched or cyclic compound having a repeating unit represented by the following general formula (1) can be exemplified.
【0026】[0026]
【化1】 Embedded image
【0027】(式中、R1は水素原子、アルキル基、アル
ケニル基、アリールアルキル基、アリール基、アルコキ
シ基、水酸基、フェノール性水酸基、アミノ基またはシ
リル基であり、R2はアルキル基、アルケニル基、アリー
ルアルキル基、アリール基、アルコキシ基、水酸基、フ
ェノール性水酸基、アミノ基またはシリル基であり、x
はアルキレン基であり、nは1〜10000であり、R1、R2お
よびxはそれぞれ全ての繰り返し単位において同一でも
2つ以上が異なっていてもよい。) ポリカルボシラン化合物としては、側鎖にSi-Hなどの反
応性基を有する化合物が、好ましい。Wherein R 1 is a hydrogen atom, an alkyl group, an alkenyl group, an arylalkyl group, an aryl group, an alkoxy group, a hydroxyl group, a phenolic hydroxyl group, an amino group or a silyl group, and R 2 is an alkyl group, an alkenyl group. Group, arylalkyl group, aryl group, alkoxy group, hydroxyl group, phenolic hydroxyl group, amino group or silyl group, x
Is an alkylene group, n is 1 to 10000, and R 1 , R 2 and x may be the same or different in all the repeating units. As the polycarbosilane compound, a compound having a reactive group such as Si-H in a side chain is preferable.
【0028】本発明で使用するポリカルボシランは、相
当するポリシランの熱転移(機能材料,14,1981(1981))、
開環重合法(J.Org.Chem.,30,2618(1965))、脱塩素法
(J.Org.Chem.,29,1601(1964))などにより、調製し得
る。熱転移に使用するポリシランとしては、例えば、下
記一般式(1-A)で示される直鎖状ポリシランおよび環状
ポリシランが挙げられる。The polycarbosilane used in the present invention may be a polycarbosilane having a heat transition (functional material, 14, 1981 (1981)) of the corresponding polysilane.
It can be prepared by a ring-opening polymerization method (J. Org. Chem., 30, 2618 (1965)), a dechlorination method (J. Org. Chem., 29, 1601 (1964)), or the like. Examples of the polysilane used for the heat transfer include a linear polysilane and a cyclic polysilane represented by the following general formula (1-A).
【0029】(R2Si)m (1-A) (式中、Rは、同一或いは相異なって、水素原子、アル
キル基、アルケニル基、アリールアルキル基、アリール
基、アルコキシ基、水酸基、フェニル基またはアミノ基
であり、Rの少なくとも1つは、アルキル基、アルケニ
ル基、アリールアルキル基、アリール基またはフェニル
基である。mは、2〜1000である。) 本発明による樹脂組成物の製造において用いられるエポ
キシ化合物としては、化学構造内に少なくとも1つのエ
ポキシ基を有する直鎖状、環状または分岐状の化合物で
あれば、特に限定されない。このような化合物として
は、例えば、1,2,3,4-ジエポキシブタン、1,4-シクロヘ
キサンジメタノールジグリシジルエーテル、N,N-ジグリ
シジル-4-グリシジルオキシアニリン、1,2,5,6-ジエポ
キシシクロオクタン、および以下に挙げるようなエポキ
シ化合物などを挙げることができる。(R 2 Si) m (1-A) (wherein R is the same or different and is a hydrogen atom, an alkyl group, an alkenyl group, an arylalkyl group, an aryl group, an alkoxy group, a hydroxyl group, a phenyl group Or an amino group, and at least one of R is an alkyl group, an alkenyl group, an arylalkyl group, an aryl group or a phenyl group, m is 2 to 1000.) In the production of the resin composition according to the present invention, The epoxy compound to be used is not particularly limited as long as it is a linear, cyclic or branched compound having at least one epoxy group in the chemical structure. Such compounds include, for example, 1,2,3,4-diepoxybutane, 1,4-cyclohexanedimethanol diglycidyl ether, N, N-diglycidyl-4-glycidyloxyaniline, 1,2,5, Examples thereof include 6-diepoxycyclooctane and the following epoxy compounds.
【0030】[0030]
【化2】 Embedded image
【0031】[0031]
【化3】 Embedded image
【0032】[0032]
【化4】 Embedded image
【0033】[0033]
【化5】 Embedded image
【0034】[0034]
【化6】 Embedded image
【0035】本発明による樹脂組成物の製造に際し、ポ
リカルボシランとエポキシ化合物とからなる混合物(以
下単に「混合物」ということがある)中の両者の配合割
合は、エポキシ化合物1重量部に対してポリカルボシラ
ン0.01〜100重量部程度であり、好ましくは0.05〜20重
量部程度であり、より好ましくは0.1〜10重量部程度で
ある。In the production of the resin composition according to the present invention, the mixture ratio of the mixture of polycarbosilane and epoxy compound (hereinafter sometimes simply referred to as “mixture”) is 1 part by weight of the epoxy compound. Polycarbosilane is about 0.01 to 100 parts by weight, preferably about 0.05 to 20 parts by weight, and more preferably about 0.1 to 10 parts by weight.
【0036】本発明の樹脂組成物の製造における上記混
合物の加熱処理温度は、通常40〜450℃程度であり、好
ましくは100〜400℃程度であり、より好ましくは150〜4
00℃程度であり、特に好ましくは220〜400℃程度であ
る。加熱処理時間は、1分間〜48時間程度であり、好ま
しくは3分間〜24時間程度であり、より好ましくは5分間
〜18時間程度である。上記温度までの昇温速度は、特に
限定されるものではないが、0.1〜10℃/分程度が好まし
い。加熱は、窒素、アルゴンなどの不活性ガス雰囲気中
或いは空気などの酸素含有ガス雰囲気中で行う。The heat treatment temperature of the mixture in the production of the resin composition of the present invention is usually about 40 to 450 ° C., preferably about 100 to 400 ° C., and more preferably about 150 to 4 ° C.
The temperature is about 00 ° C, particularly preferably about 220 to 400 ° C. The heat treatment time is about 1 minute to 48 hours, preferably about 3 minutes to 24 hours, and more preferably about 5 minutes to 18 hours. The heating rate up to the above temperature is not particularly limited, but is preferably about 0.1 to 10 ° C / min. The heating is performed in an atmosphere of an inert gas such as nitrogen or argon, or in an atmosphere of an oxygen-containing gas such as air.
【0037】また、上記の加熱処理に代えて、或いは加
熱処理とともに、或いは加熱処理の前または後に光照射
を行うことができる。混合物に対する光照射の光源とし
ては、蛍光灯、低圧水銀ランプ、高圧水銀ランプ、水素
ランプ、重水素ランプ、ハロゲンランプ、ヘリウム−ネ
オンレーザー、アルゴンレーザー、窒素レーザー、ヘリ
ウム−カドミウムレーザー、色素レーザーなどが用いら
れる。光照射波長は、通常220〜700nm程度であり、より
好ましくは220〜400nm程度である。光照射時間は、通常
5秒〜120分程度、好ましくは20秒〜30分程度である。光
照射も、窒素、アルゴンなどの不活性ガス雰囲気中或い
は空気などの酸素含有ガス雰囲気中で行う。Light irradiation can be performed instead of, together with, or before or after the heat treatment. Light sources for light irradiation of the mixture include fluorescent lamps, low-pressure mercury lamps, high-pressure mercury lamps, hydrogen lamps, deuterium lamps, halogen lamps, helium-neon lasers, argon lasers, nitrogen lasers, helium-cadmium lasers, dye lasers, and the like. Used. The light irradiation wavelength is usually about 220 to 700 nm, more preferably about 220 to 400 nm. Light irradiation time is usually
It is about 5 seconds to 120 minutes, preferably about 20 seconds to 30 minutes. Light irradiation is also performed in an inert gas atmosphere such as nitrogen or argon or an oxygen-containing gas atmosphere such as air.
【0038】また、混合物の加熱および/または光照射
に先立って、100℃未満の温度で予備的加熱を行うこと
により、揮発分を留去し或いは硬化反応を一部進行させ
ても良い。Further, prior to heating and / or light irradiation of the mixture, preliminary heating may be performed at a temperature of less than 100 ° C. to distill off volatile components or partially advance the curing reaction.
【0039】ポリカルボシラン化合物とエポキシ化合物
との混合物を加熱処理および/または光照射処理するこ
とにより、不活性ガス雰囲気中では、下記反応式に示す
ように、ポリカルボシランの少なくとも1つのケイ素
と、エポキシ化合物の開環により変性したエポキシ基の
少なくとも1つの炭素との間での結合(Si-C結合)および
/または少なくとも1つの酸素との間での結合(Si-O結
合)を形成する。By subjecting the mixture of the polycarbosilane compound and the epoxy compound to a heat treatment and / or a light irradiation treatment, at least one silicon of the polycarbosilane is reacted in an inert gas atmosphere as shown in the following reaction formula. Forming a bond between at least one carbon of the epoxy group modified by ring opening of the epoxy compound (Si-C bond) and / or a bond between at least one oxygen (Si-O bond) .
【0040】[0040]
【化7】 Embedded image
【0041】また、上記に規定した温度条件下に、酸素
含有ガス雰囲気中で混合物を加熱処理および/または光
照射処理する場合には、下記反応式に示す様に、上記の
ケイ素−炭素間およびケイ素−酸素間の結合に加え、さ
らに雰囲気中の酸素を取り込んだSi-O結合を介して、ポ
リカルボシラン成分と変性エポキシ化合物成分とが結合
(Si-O-C結合)する場合もある。When the mixture is subjected to a heat treatment and / or a light irradiation treatment in an oxygen-containing gas atmosphere under the above-defined temperature conditions, the above-described silicon-carbon and In addition to the silicon-oxygen bond, the polycarbosilane component is bonded to the modified epoxy compound component via a Si-O bond that incorporates oxygen in the atmosphere.
(Si-OC bond) in some cases.
【0042】[0042]
【化8】 Embedded image
【0043】本発明においては、混合物の硬化促進剤を
添加することもできる。添加する硬化促進剤としては、
1,2-ジシリルエタン、エチルシリケートおよびメチルシ
リケートなどのポリアルコキシシラン類などのケイ素化
合物;テトラアルコキシチタンなどのチタン化合物;フ
ェニルジクロロボランなどのホウ素化合物;ベンゾイル
パーオキサイド、tert-ブチルパーオキサイド、アゾイ
ソブチロニトリルなどのラジカルを発生する化合物;ト
リスメトキシアルミニウム、トリスフェノキシアルミニ
ウムなどの有機アルミニウム化合物;トリエチルアミ
ン、ピリジン、ジエチレントリアミン、トリエチレンテ
トラミン、メタキシレンジアミン、ジアミノジフェニル
メタン、トリス(ジメチルアミノメチル)フェノール、
2-エチル-4-メチルイミダゾールなどのアミン化合物;
ダイマー酸ポリアミドなどのアミド化合物;無水フタル
酸、テトラヒドロメチル無水フタル酸、ヘキサヒドロ無
水フタル酸、無水トリメリット酸、無水メチルナジック
酸などの酸無水物;フェノールノボラックなどのフェノ
ール類;ポリサルファイドなどのメルカプタン化合物;
3フッ化ホウ素・エチルアミン錯体などのルイス酸錯体
化合物;クロロホルム、ジクロロメタン、トリクロロメ
タンなどのハロゲン化物;ナトリウムエトキシドなどの
塩基性化合物などを挙げることができる。In the present invention, a curing accelerator for the mixture may be added. As the curing accelerator to be added,
Silicon compounds such as polyalkoxysilanes such as 1,2-disilylethane, ethylsilicate and methylsilicate; titanium compounds such as tetraalkoxytitanium; boron compounds such as phenyldichloroborane; benzoyl peroxide, tert-butyl peroxide, azoiso Compounds which generate radicals such as butyronitrile; organic aluminum compounds such as trismethoxyaluminum and trisphenoxyaluminum; triethylamine, pyridine, diethylenetriamine, triethylenetetramine, metaxylenediamine, diaminodiphenylmethane, tris (dimethylaminomethyl) phenol,
Amine compounds such as 2-ethyl-4-methylimidazole;
Amide compounds such as dimer acid polyamide; acid anhydrides such as phthalic anhydride, tetrahydromethyl phthalic anhydride, hexahydrophthalic anhydride, trimellitic anhydride, and methylnadic anhydride; phenols such as phenol novolak; mercaptan compounds such as polysulfide ;
Lewis acid complex compounds such as boron trifluoride / ethylamine complex; halides such as chloroform, dichloromethane, and trichloromethane; and basic compounds such as sodium ethoxide.
【0044】硬化促進剤の量は、ポリカルボシラン100
重量部に対して、通常0.01〜50重量部程度、好ましくは
0.1〜20重量部程度である。The amount of the curing accelerator is 100 parts of polycarbosilane.
Parts by weight, usually about 0.01 to 50 parts by weight, preferably
It is about 0.1 to 20 parts by weight.
【0045】光照射処理を行う場合には、混合物に対
し、光酸発生剤を配合することができる。光酸発生剤と
しては、例えば、ピリジニウム塩(N-エトキシ-2-メチル
ピリジニウム-ヘキサフルオロフォスフェート、N-エト
キシ-4-フェニルピリジニウム-ヘキサフルオロフォスフ
ェートなど)、スルホニウム塩(例えば、“サンエイドSI
-60L”、“サンエイドSI-80L”、“サンエイドSI-100
L”などの商標名により、三新化学工業(株)から市販さ
れている)、フェロセン系(例えば、“イルガキュア26
1”の商標名により、チバ・スペシャルティー・ケミカ
ルズ社から市販されている)、トリアジン系(例えば、
“トリアジンA”、“トリアジンA”などの商標名によ
り、日本シイベルヘグナー社から市販されている)、ヨ
ードニウム塩(例えば、“BBI-101”、“BBI-101”など
の商標名により、みどり化学(株)から市販されている)
などを用いることができる。さらに、ベンゾフェノンお
よびその誘導体、o-ベンゾイル安息香酸エステルおよび
その誘導体、アセトフェノンおよびその誘導体、ベンゾ
イン、ベンゾインエーテルおよびその誘導体、キサント
ンおよびその誘導体、チオキサントンおよびその誘導
体、ジスルフィド化合物、キノン系化合物、ハロゲン化
炭化水素基含有化合物、アミン類並びに色素などの光増
感剤を添加し得る。When performing the light irradiation treatment, a photoacid generator can be blended with the mixture. Examples of the photoacid generator include pyridinium salts (such as N-ethoxy-2-methylpyridinium-hexafluorophosphate and N-ethoxy-4-phenylpyridinium-hexafluorophosphate), and sulfonium salts (for example, “San-Aid SI
-60L ”,“ San-Aid SI-80L ”,“ San-Aid SI-100
L ”or the like, commercially available from Sanshin Chemical Industry Co., Ltd.), ferrocene-based (for example,“ Irgacure 26 ”).
1 ", commercially available from Ciba Specialty Chemicals, Inc., triazines (e.g.,
Commercially available from Nihon SiberHegner under the trade names such as “Triazine A” and “Triazine A”, iodonium salts (eg, “BBI-101” and “BBI-101” under the trade names Midori Chemical ( (Commercially available from Co., Ltd.)
Etc. can be used. Furthermore, benzophenone and its derivatives, o-benzoyl benzoate and its derivatives, acetophenone and its derivatives, benzoin, benzoin ether and its derivatives, xanthone and its derivatives, thioxanthone and its derivatives, disulfide compounds, quinone compounds, halogenated carbonized Photosensitizers such as hydrogen-containing compounds, amines and dyes may be added.
【0046】本発明の樹脂組成物には、必要に応じて、
1種または2種以上の無機系充填剤を配合することがで
きる。無機系充填剤の具体例としては、ケイ砂、石英、
ノバキュライト、ケイ藻土などのシリカ系;合成無定形
シリカなどのシリカ系;カオリナイト、雲母、滑石、ウ
ォラストナイト、アスベスト、ケイ酸カルシウム、ケイ
酸アルミニウムなどのケイ酸塩;ガラス粉末、ガラス
球、中空ガラス球、ガラスフレーク、泡ガラス球などの
ガラス体;窒化ホウ素、炭化ホウ素、窒化アルミニウ
ム、炭化アルミニウム、窒化ケイ素、炭化ケイ素、ホウ
化チタン、窒化チタン、炭化チタンなどの非酸化物系無
機物;炭酸カルシウム;酸化亜鉛、アルミナ、マグネシ
ア、ジルコニア、酸化チタン、酸化ベリリウムなどの金
属酸化物;硫酸バリウム、二硫化モリブデン、二硫化タ
ングステン、フッ化炭素などのその他の無機物;アルミ
ニウム、ブロンズ、鉛、ステンレススチール、亜鉛など
の金属粉末;カーボンブラック、コークス、黒鉛、熱分
解炭素、中空カーボン球などのカーボン体などが挙げら
れる。In the resin composition of the present invention, if necessary,
One or more inorganic fillers can be blended. Specific examples of the inorganic filler include silica sand, quartz,
Silicas such as novacurite and diatomaceous earth; silicas such as synthetic amorphous silica; silicates such as kaolinite, mica, talc, wollastonite, asbestos, calcium silicate, aluminum silicate; glass powder, glass spheres , Hollow glass spheres, glass flakes, foamed glass spheres, and other glass bodies; non-oxide inorganic substances such as boron nitride, boron carbide, aluminum nitride, aluminum carbide, silicon nitride, silicon carbide, titanium boride, titanium nitride, and titanium carbide Calcium oxide; metal oxides such as zinc oxide, alumina, magnesia, zirconia, titanium oxide, beryllium oxide; other inorganic substances such as barium sulfate, molybdenum disulfide, tungsten disulfide, and carbon fluoride; aluminum, bronze, lead, Metal powders such as stainless steel and zinc; carbon Rack, coke, graphite, pyrolytic carbon, and the like carbon material such as a hollow carbon spheres.
【0047】これら充填剤は、繊維状、針状(ウィスカ
ーを含む)、粒状、鱗片状など種々の形状のものを単独
または2種以上混合して用いることができる。These fillers may be of various shapes such as fibrous, needle-like (including whisker), granular, scale-like, or may be used alone or in combination of two or more.
【0048】さらに、本発明の樹脂組成物には、必要に
応じて、三酸化アンチモンなどの難燃助剤;天然ワック
ス類、合成ワックス類、直鎖脂肪酸やその金属塩、酸ア
ミド類、エステル類、パラフィン類などの離型剤;カー
ボンブラック、二酸化チタンなどの顔料;エステル類、
ポリオール、ポリサルファイド、ウレタンプレポリマー
などの可塑剤;カルボキシル基末端ブタジエン−アクリ
ロニトリル共重合ゴム、エチレン−酢酸ビニル共重合体
などの液状ゴム;シランカップリング剤やチタン系カッ
プリング剤などの表面改質剤;シリコーンオイル、シリ
コーンゴム、各種プラスチック粉末、各種エンジニアリ
ングプラスチック粉末、ABS樹脂やMBS樹脂の粉末などの
低応力化剤などを適宜添加することができる。Further, the resin composition of the present invention may contain, if necessary, a flame retardant auxiliary such as antimony trioxide; natural waxes, synthetic waxes, linear fatty acids and metal salts thereof, acid amides, esters. Release agents such as alcohols and paraffins; pigments such as carbon black and titanium dioxide; esters;
Plasticizers such as polyols, polysulfides and urethane prepolymers; liquid rubbers such as carboxyl-terminated butadiene-acrylonitrile copolymer rubbers and ethylene-vinyl acetate copolymers; surface modifiers such as silane coupling agents and titanium coupling agents Low-stress agents such as silicone oil, silicone rubber, various plastic powders, various engineering plastic powders, and ABS resin and MBS resin powders can be appropriately added.
【0049】さらにまた、本発明の樹脂組成物には、必
要に応じて、流動調整剤、レベリング剤、消泡剤、帯電
防止剤、紫外線吸収剤、分散剤などを含み得る。Further, the resin composition of the present invention may contain a flow regulator, a leveling agent, an antifoaming agent, an antistatic agent, an ultraviolet absorber, a dispersant, and the like, if necessary.
【0050】上記の硬化促進剤、光酸発生剤、光増感
剤、充填剤などの添加物を使用する場合には、混合前の
ポリカルボシランおよび/またはエポキシ化合物に或い
は加熱処理および/光照射処理前の両者の混合物に添加
すればよい。When additives such as the above-mentioned curing accelerators, photoacid generators, photosensitizers and fillers are used, polycarbosilane and / or epoxy compounds before mixing or heat treatment and / or What is necessary is just to add to the mixture of both before irradiation treatment.
【0051】本発明の樹脂組成物からなる成形体は、シ
ート状、フィルム状、ペレット状、塗膜、塊状、粉状な
どの任意の形状乃至形態とすることができる。The molded article made of the resin composition of the present invention can be in any shape or form such as a sheet, a film, a pellet, a coating, a lump, and a powder.
【0052】本発明によれば、ポリカルボシランとエポ
キシ化合物を含む混合物を基材表面にスプレーコート
法、バーコート法、フローコート法、浸漬法、キャステ
ィング法などの公知の方法により塗布するか、或いは圧
縮成形、注型成形、トランスファー成形、多孔性基材
(セラミック繊維、ガラス繊維、炭素繊維など)への含
浸などを行った後、加熱処理および/または光照射処理
することにより、所望の成形体を得ることができる。According to the present invention, a mixture containing a polycarbosilane and an epoxy compound is applied to a substrate surface by a known method such as a spray coating method, a bar coating method, a flow coating method, a dipping method, a casting method, or the like. Or compression molding, casting molding, transfer molding, porous substrate
(Ceramic fiber, glass fiber, carbon fiber, etc.), and then heat treatment and / or light irradiation treatment can obtain a desired molded product.
【0053】混合物の基材表面への塗布は、有機溶媒溶
液の形態で行うこともできる。この様な有機溶媒として
は、特に限定されるものではないが、テトラヒドロフラ
ン、キシレン、トルエン、ベンゼン、エタノール、ブタ
ノール、ジメトキシシラン、ジメチルアセトアミド、ジ
メチルホルムアミド、メチルセロソルブ、ブチルセロソ
ルブ、ジエチレングリコールモノエチルエーテル、ジエ
チレングリコールモノブチルエーテル、ジメチルスルホ
キシド、フェノール類などが例示される。溶液中の混合
物濃度も特に限定されないが、通常1〜60w/v%程度であ
り、より好ましくは10〜40w/v%程度である。The application of the mixture to the surface of the substrate can be carried out in the form of an organic solvent solution. Such organic solvents are not particularly limited, but include tetrahydrofuran, xylene, toluene, benzene, ethanol, butanol, dimethoxysilane, dimethylacetamide, dimethylformamide, methylcellosolve, butylcellosolve, diethylene glycol monoethyl ether, diethylene glycol mono Examples thereof include butyl ether, dimethyl sulfoxide, and phenols. The concentration of the mixture in the solution is not particularly limited, but is usually about 1 to 60 w / v%, and more preferably about 10 to 40 w / v%.
【0054】基材としては、所定の加熱処理および/光
照射に耐える材料であれば特に特に限定されず、金属、
セラミックス、ガラス、プラスチックなどを用いること
ができる。The substrate is not particularly limited as long as it can withstand a predetermined heat treatment and / or light irradiation.
Ceramics, glass, plastics, and the like can be used.
【0055】[0055]
【発明の効果】本発明による樹脂組成物および成形体
は、耐熱性、耐ヒートサイクル性、耐酸性、耐アルカリ
性、耐有機溶剤性、耐水性、耐湿性、難燃性、撥水性、
絶縁性、成膜性、塗膜状態での基材との密着性、加工
性、成形性などに優れている。The resin composition and the molded article according to the present invention have heat resistance, heat cycle resistance, acid resistance, alkali resistance, organic solvent resistance, water resistance, moisture resistance, flame retardancy, water repellency,
It has excellent insulation properties, film-forming properties, adhesion to a substrate in the state of a coating film, workability, moldability, and the like.
【0056】また、基材に本発明樹脂組成物によりコー
ティングされた物品乃至製品には、樹脂組成物自体の優
れた物性を備えた塗膜が形成される。この様な物品乃至
製品は、種々の厳しい環境条件においても、高度の耐熱
性、耐ヒートサイクル性、耐酸性、耐アルカリ性、耐有
機溶剤性、耐水性、耐湿性、難燃性、撥水性、絶縁性、
成膜性、塗膜密着性などの優れた特性を発揮する。In addition, an article or product in which a substrate is coated with the resin composition of the present invention is formed with a coating film having excellent physical properties of the resin composition itself. Such articles or products have high heat resistance, heat cycle resistance, acid resistance, alkali resistance, organic solvent resistance, water resistance, moisture resistance, flame retardancy, water repellency, even under various severe environmental conditions. Insulation,
Demonstrates excellent properties such as film formability and coating film adhesion.
【0057】本発明の樹脂組成物および成形体は、塗
料、電気機器の絶縁材、電線被覆材、電子機器の封止
材、プリント配線基板用の絶縁膜や配線絶縁膜や保護
膜、液晶配向膜、摺動部材、自動車部品材料、航空・宇
宙用材料、インキ、接着材、粘着材などの耐熱用途、耐
食用途、難燃用途などに適している。The resin composition and the molded article of the present invention can be used as a paint, an insulating material for electric equipment, a covering material for electric wires, a sealing material for electronic equipment, an insulating film for a printed wiring board, a wiring insulating film or a protective film, a liquid crystal alignment. Suitable for heat-resistant applications such as films, sliding members, automotive parts materials, aerospace materials, inks, adhesives, adhesives, etc., corrosion-resistant applications, and flame-retardant applications.
【0058】本発明樹脂組成物から得られる材料は、エ
ポキシ樹脂のみを硬化させた材料に比して、耐熱性、耐
ヒートサイクル性、耐酸性、耐水性、耐湿性、難燃性、
撥水性などに優れている。また、ポリカルボシランのみ
を硬化させた材料に比して、加工性、成形性、成膜性な
どに優れている。The material obtained from the resin composition of the present invention has heat resistance, heat cycle resistance, acid resistance, water resistance, moisture resistance, flame retardancy, and the like as compared with a material obtained by curing only an epoxy resin.
Excellent in water repellency. Further, it is excellent in workability, moldability, film formability, and the like, as compared with a material obtained by curing only polycarbosilane.
【0059】[0059]
【実施例】以下に実施例を示し、本発明の特徴とすると
ころをより一層明らかにする。The following examples are provided to further clarify the features of the present invention.
【0060】実施例1 ポリカルボシランとして電極反応により合成したメチル
フェニルポリシラン(平均重合度40)の熱転位(アルゴ
ン雰囲気下、450℃)により得たポリカルボシラン0.2g
とエポキシ化合物としてビスフェノールA型エポキシ樹
脂(旭チバ(株)製:アラルダイトAER260)0.8gとの混合
物をステンレス製円筒容器に入れ、アルゴン雰囲気下、
室温から300℃まで10℃/分の速度で昇温させ、300℃に
達した後、室温まで冷却してペレットを得た。Example 1 0.2 g of polycarbosilane obtained by thermal rearrangement (at 450 ° C. in an argon atmosphere) of methylphenylpolysilane (average degree of polymerization: 40) synthesized by an electrode reaction as polycarbosilane.
A mixture of 0.8 g of a bisphenol A-type epoxy resin (manufactured by Asahi Ciba Co., Ltd .: Araldite AER260) as an epoxy compound was placed in a stainless steel cylindrical container, and placed under an argon atmosphere.
The temperature was raised from room temperature to 300 ° C. at a rate of 10 ° C./min. After reaching 300 ° C., the mixture was cooled to room temperature to obtain a pellet.
【0061】得られたペレット(以下試料ということが
ある)の構造について、NMR分析を行った。29Si-NMR分
析の結果から、0ppmにピークがみられた。また、13C-NM
R分析の結果から、0ppmにピークがみられた。An NMR analysis was performed on the structure of the obtained pellet (hereinafter sometimes referred to as a sample). From the result of 29 Si-NMR analysis, a peak was observed at 0 ppm. Also, 13 C-NM
From the result of the R analysis, a peak was observed at 0 ppm.
【0062】得られた試料を用いて、耐熱性試験、耐酸
性試験、耐アルカリ性試験、耐ヒートサイクル性試験お
よび燃焼性試験を行った。Using the obtained samples, a heat resistance test, an acid resistance test, an alkali resistance test, a heat cycle resistance test and a flammability test were performed.
【0063】耐熱性試験においては、600℃の電気炉中
に空気雰囲気下で試料を1時間放置した後、その表面状
態を目視と電子顕微鏡(SEM)により観察したところ、
クラックの発生は認められず、耐熱性は良好であった。In the heat resistance test, after the sample was left in an air atmosphere at 600 ° C. in an air atmosphere for 1 hour, the surface state was visually observed and observed with an electron microscope (SEM).
No crack was observed, and the heat resistance was good.
【0064】耐酸性試験においては、5%硝酸水溶液に
試料を2時間浸漬した後、その表面状態を目視観察した
ところ、クラックの発生は認められず、耐酸性は良好で
あった。In the acid resistance test, the sample was immersed in a 5% nitric acid aqueous solution for 2 hours, and the surface state was visually observed. As a result, no crack was observed and the acid resistance was good.
【0065】耐アルカリ性試験においては、5%NaOH水
溶液に試料を2時間浸漬した後、その表面状態を目視観
察したところ、クラックの発生は認められず、耐アルカ
リ性は良好であった。In the alkali resistance test, the sample was immersed in a 5% NaOH aqueous solution for 2 hours, and the surface state was visually observed. As a result, no crack was observed and the alkali resistance was good.
【0066】耐ヒートサイクル性試験においては、「試
料を設定温度(500℃)で2時間保持した後、室温で2時
間保持する」サイクルを10回繰り返して、試料に熱衝撃
を与えた。試験後、試料の表面状態を目視観察したとこ
ろ、クラックの発生は認められず、耐ヒートサイクル性
は良好であった。In the heat cycle resistance test, the cycle of “holding the sample at the set temperature (500 ° C.) for 2 hours and then holding at room temperature for 2 hours” was repeated 10 times, and the sample was subjected to thermal shock. After the test, when the surface state of the sample was visually observed, no crack was observed, and the heat cycle resistance was good.
【0067】燃焼性試験においては、試料をブンゼンバ
ーナーの火炎中に1分間放置し、試料の燃焼の有無を目
視観察した。その結果、燃焼は認められず、本発明によ
る樹脂組成物が高度の難燃性材料であることが確認され
た。In the flammability test, the sample was left in a Bunsen burner flame for 1 minute, and the presence or absence of burning of the sample was visually observed. As a result, no burning was observed, and it was confirmed that the resin composition according to the present invention was a highly flame-retardant material.
【0068】実施例2 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度40)の熱転位(アルゴン雰囲気下、450℃)に
より得たポリカルボシラン0.5gとエポキシ化合物として
ビスフェノールA型エポキシ樹脂(旭チバ(株)製;アラ
ルダイトAER260)0.5gとをテトラヒドロフラン10ml中に
室温下で溶解・混合させた。得られた混合物を予めサン
ドペーパー(#500)にて研磨したステンレス鋼板(SUS
-304)にフローコーティングした。Example 2 0.5 g of polycarbosilane obtained by thermal rearrangement (at 450 ° C. in an argon atmosphere) of methylphenylpolysilane (average degree of polymerization: 40) as polycarbosilane and bisphenol A type epoxy resin (Asahi Chiba) as an epoxy compound 0.5 g of Araldite AER260) was dissolved and mixed in 10 ml of tetrahydrofuran at room temperature. The resulting mixture was previously polished with sandpaper (# 500) to a stainless steel plate (SUS
-304).
【0069】コーティングしたステンレス鋼板をアルゴ
ン雰囲気下、室温から300℃まで10℃/分の速度で昇温さ
せた後、300℃に達した時点で室温中へ取り出して硬化
塗膜を備えた試料を得た。得られた塗膜の膜厚は20μm
であった。After the coated stainless steel plate was heated from room temperature to 300 ° C. at a rate of 10 ° C./min under an argon atmosphere, when the temperature reached 300 ° C., the sample was taken out into room temperature and a sample having a cured coating film was removed. Obtained. The thickness of the obtained coating film is 20 μm
Met.
【0070】得られた試料塗膜について、耐熱性試験、
耐酸性試験、耐アルカリ性試験、耐ヒートサイクル性試
験および燃焼性試験を行った。The obtained sample coating film was subjected to a heat resistance test,
An acid resistance test, an alkali resistance test, a heat cycle resistance test and a flammability test were performed.
【0071】耐熱性試験においては、600℃の電気炉中
で空気雰囲気下に試料を1時間放置した後、塗膜の表面
状態を目視と電子顕微鏡(SEM)にて観察したところ、
クラック、ボイド、剥離などは認められず、耐熱性は良
好であった。In the heat resistance test, the sample was allowed to stand in an air atmosphere at 600 ° C. in an air atmosphere for 1 hour, and then the surface state of the coating film was visually observed and observed with an electron microscope (SEM).
No cracks, voids, peeling, etc. were observed, and the heat resistance was good.
【0072】耐酸性試験においては、5%硝酸水溶液に
試料を2時間浸漬した後、塗膜の表面状態を目視観察し
たところ、クラック、ボイド、剥離などは認められず、
耐酸性は良好であった。In the acid resistance test, after the sample was immersed in a 5% nitric acid aqueous solution for 2 hours, the surface state of the coating film was visually observed. As a result, no cracks, voids or peeling were observed.
The acid resistance was good.
【0073】耐アルカリ性試験においては、5%NaOH水
溶液に試料を2時間浸漬した後、塗膜の表面状態を目視
観察したところ、クラック、ボイド、剥離などは認めら
れず、耐アルカリ性は良好であった。In the alkali resistance test, after immersing the sample in a 5% NaOH aqueous solution for 2 hours, the surface state of the coating film was visually observed. As a result, no cracks, voids or peeling were observed, and the alkali resistance was good. Was.
【0074】耐ヒートサイクル性試験においては、「塗
膜温度が設定温度(500℃)に到達した状態で試料を2時
間保持した後、試料を室温で2時間保持する」サイクル
を10回繰り返して、塗膜に熱衝撃を与えた。試験終了
後、試料の表面状態を目視観察したところ、クラック、
ボイド、剥離などの発生は認められず、耐ヒートサイク
ル性は良好であった。In the heat cycle resistance test, a cycle of “holding the sample for 2 hours with the coating film temperature reaching the set temperature (500 ° C.) and then holding the sample at room temperature for 2 hours” is repeated 10 times. The coating film was subjected to a thermal shock. After the test was completed, the surface condition of the sample was visually observed.
No occurrence of voids or peeling was observed, and the heat cycle resistance was good.
【0075】燃焼性試験においては、試料の塗膜部分を
ブンゼンバーナーの火炎中に1分間放置し、その燃焼の
有無を目視観察した。その結果、燃焼は認められず、本
発明による樹脂組成物が高度の難燃性材料であることが
確認された。In the flammability test, the coating film portion of the sample was left in a Bunsen burner flame for 1 minute, and the presence or absence of combustion was visually observed. As a result, no burning was observed, and it was confirmed that the resin composition according to the present invention was a highly flame-retardant material.
【0076】実施例3 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度40)の熱転位(アルゴン雰囲気下、450℃)に
より得たポリカルボシラン0.8gを使用し、エポキシ樹脂
としてビスフェノールA型エポキシ樹脂(旭チバ(株)
製;アラルダイトAER260)0.2gを使用する以外は実施例
2と同様にして、ステンレス鋼上に硬化塗膜を形成した
試料を得た後、耐熱性試験、耐酸性試験、耐アルカリ性
試験および耐ヒートサイクル性試験を行った。Example 3 0.8 g of polycarbosilane obtained by thermal rearrangement (at 450 ° C. in an argon atmosphere) of methylphenylpolysilane (average degree of polymerization: 40) was used as the polycarbosilane, and bisphenol A type epoxy resin was used as the epoxy resin. (Asahi Ciba Co., Ltd.)
(Araldite AER260) Except for using 0.2 g, a sample having a cured coating film formed on stainless steel was obtained in the same manner as in Example 2 and then subjected to a heat resistance test, an acid resistance test, an alkali resistance test, and a heat resistance test. A cycle test was performed.
【0077】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0078】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0079】実施例4 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度40)の熱転位(アルゴン雰囲気下、450℃)に
より得たポリカルボシラン0.2gを使用し、エポキシ化合
物としてビスフェノールA型エポキシ樹脂(旭チバ(株)
製;アラルダイトAER260)0.8gを使用する以外は実施例
2と同様にして、ステンレス鋼上に硬化塗膜を形成した
試料を得た後、耐熱性試験、耐酸性試験、耐アルカリ性
試験および耐ヒートサイクル性試験を行った。Example 4 As polycarbosilane, 0.2 g of polycarbosilane obtained by thermal rearrangement of methylphenyl polysilane (average degree of polymerization: 40) (at 450 ° C. in an argon atmosphere) was used, and bisphenol A type epoxy resin was used as an epoxy compound. (Asahi Ciba Co., Ltd.)
(Araldite AER260) was prepared in the same manner as in Example 2 except that 0.8 g of a hardened coating film was formed on stainless steel. Then, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat resistance test were performed. A cycle test was performed.
【0080】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0081】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition of the present invention was a flame-retardant material.
【0082】実施例5 ステンレス鋼板に形成された混合物塗膜の熱処理温度を
250℃とする以外は実施例2と同様にして、ステンレス
鋼上に硬化塗膜を形成した試料を得た後、耐熱性試験、
耐酸性試験、耐アルカリ性試験および耐ヒートサイクル
性試験を行った。Example 5 The heat treatment temperature of the mixture coating film formed on the stainless steel plate was
A sample having a cured coating film formed on stainless steel was obtained in the same manner as in Example 2 except that the temperature was set to 250 ° C.
An acid resistance test, an alkali resistance test and a heat cycle resistance test were performed.
【0083】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0084】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0085】実施例6 エポキシ樹脂としてビスフェノールA型エポキシ樹脂0.5
gに代えてノボラック型エポキシ樹脂(旭チバ(株)製;E
PN1180)0.2gを使用し、且つポリカルボシランとしてメ
チルフェニルポリシラン(平均重合度40)の熱転位(ア
ルゴン雰囲気下、450℃)により得たポリカルボシラン
0.8gを使用する以外は実施例2と同様にして、ステンレ
ス鋼上に硬化塗膜を形成した試料を得た後、耐熱性試
験、耐酸性試験、耐アルカリ性試験および耐ヒートサイ
クル性試験を行った。Example 6 As an epoxy resin, bisphenol A type epoxy resin 0.5
g in place of novolak epoxy resin (manufactured by Asahi Ciba Co .; E
Polycarbosilane using 0.2 g of PN1180) and obtained by thermal rearrangement (450 ° C under argon atmosphere) of methylphenyl polysilane (average degree of polymerization 40) as polycarbosilane
A heat resistant test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed after obtaining a sample having a cured coating film formed on stainless steel in the same manner as in Example 2 except that 0.8 g was used. Was.
【0086】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0087】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test performed in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0088】実施例7 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度40)の熱転位(アルゴン雰囲気下、450℃)に
より得たポリカルボシラン0.5gとエポキシ化合物として
ノボラック型エポキシ樹脂(旭チバ(株)製;EPN1180)
0.5gとを使用する以外は実施例2と同様にして、ステン
レス鋼上に硬化塗膜を形成した試料を得た後、耐熱性試
験、耐酸性試験、耐アルカリ性試験および耐ヒートサイ
クル性試験を行った。Example 7 0.5 g of polycarbosilane obtained by thermal rearrangement (at 450 ° C. in an argon atmosphere) of methylphenylpolysilane (average degree of polymerization: 40) as polycarbosilane, and a novolak-type epoxy resin (Asahi Chiba (Asahi Chiba)) as an epoxy compound Co., Ltd .; EPN1180)
After obtaining a sample in which a cured coating film was formed on stainless steel in the same manner as in Example 2 except that 0.5 g was used, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed. went.
【0089】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0090】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0091】実施例8 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度40)の熱転位(アルゴン雰囲気下、450℃)に
より得たポリカルボシラン0.2gとエポキシ化合物として
ノボラック型エポキシ樹脂(旭チバ(株)製;EPN1180)
0.8gとを使用する以外は実施例2と同様にして、ステン
レス鋼上に硬化塗膜を形成した試料を得た後、耐熱性試
験、耐酸性試験、耐アルカリ性試験および耐ヒートサイ
クル性試験を行った。Example 8 0.2 g of polycarbosilane obtained by thermal rearrangement (at 450 ° C. in an argon atmosphere) of methylphenylpolysilane (average degree of polymerization: 40) as polycarbosilane, and a novolak-type epoxy resin (Asahi Ciba Co., Ltd .; EPN1180)
After obtaining a sample in which a cured coating film was formed on stainless steel in the same manner as in Example 2 except that 0.8 g was used, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed. went.
【0092】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0093】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0094】実施例9 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度200)の熱転位(アルゴン雰囲気下、450℃)に
より得たポリカルボシランを使用する以外は実施例2と
同様にして、ステンレス鋼上に硬化塗膜を形成した試料
を得た後、耐熱性試験、耐酸性試験、耐アルカリ性試験
および耐ヒートサイクル性試験を行った。Example 9 A stainless steel was prepared in the same manner as in Example 2 except that polycarbosilane obtained by thermal rearrangement of methylphenyl polysilane (average degree of polymerization: 200) (at 450 ° C. in an argon atmosphere) was used as the polycarbosilane. After obtaining a sample in which a cured coating film was formed on steel, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed.
【0095】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0096】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0097】実施例10 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度5)の熱転位(アルゴン雰囲気下、450℃)によ
り得たポリカルボシランを使用する以外は実施例2と同
様にして、ステンレス鋼上に硬化塗膜を形成した試料を
得た後、耐熱性試験、耐酸性試験、耐アルカリ性試験お
よび耐ヒートサイクル性試験を行った。Example 10 A stainless steel was obtained in the same manner as in Example 2 except that polycarbosilane obtained by thermal rearrangement of methylphenyl polysilane (average degree of polymerization: 5) (at 450 ° C. in an argon atmosphere) was used as the polycarbosilane. After obtaining a sample in which a cured coating film was formed on steel, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed.
【0098】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0099】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0100】実施例11 ポリカルボシランとして環状のメチルフェニルポリシラ
ン(平均重合度6)の熱転位(アルゴン雰囲気下、450
℃)により得たポリカルボシランを使用する以外は実施
例2と同様にして、ステンレス鋼上に硬化塗膜を形成し
た試料を得た後、耐熱性試験、耐酸性試験、耐アルカリ
性試験および耐ヒートサイクル性試験を行った。Example 11 As polycarbosilane, cyclic methylphenylpolysilane (average degree of polymerization: 6) was subjected to thermal rearrangement (450 under argon atmosphere).
C)), a sample having a cured coating film formed on stainless steel was obtained in the same manner as in Example 2 except that the polycarbosilane obtained by the above method was used. A heat cycle test was performed.
【0101】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After the completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0102】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test performed in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0103】実施例12 ポリカルボシランとして、メチル-n-ヘキシルポリシラ
ン(平均重合度40)の熱転位(アルゴン雰囲気下、450
℃)により得たポリカルボシランを使用する以外は実施
例2と同様にして、ステンレス鋼上に硬化塗膜を形成し
た試料を得た後、耐熱性試験、耐酸性試験、耐アルカリ
性試験および耐ヒートサイクル性試験を行った。Example 12 As polycarbosilane, methyl-n-hexylpolysilane (average degree of polymerization: 40) was subjected to thermal rearrangement (450 under an argon atmosphere).
C), a sample having a cured coating film formed on stainless steel was obtained in the same manner as in Example 2 except that the polycarbosilane obtained in Example 1 was used, and then a heat resistance test, an acid resistance test, an alkali resistance test and a resistance test were performed. A heat cycle test was performed.
【0104】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After the completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0105】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In the flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0106】実施例13 ポリカルボシランとして、ジメチルポリシランの熱転位
(アルゴン雰囲気下、450℃)により得たポリカルボシ
ラン(平均重合度40)を使用する以外は実施例2と同様に
して、ステンレス鋼上に硬化塗膜を形成した試料を得た
後、耐熱性試験、耐酸性試験、耐アルカリ性試験および
耐ヒートサイクル性試験を行った。Example 13 A stainless steel was prepared in the same manner as in Example 2 except that polycarbosilane (average degree of polymerization: 40) obtained by thermal rearrangement of dimethylpolysilane (at 450 ° C. in an argon atmosphere) was used as polycarbosilane. After obtaining a sample in which a cured coating film was formed on steel, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed.
【0107】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0108】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In the flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition of the present invention was a flame-retardant material.
【0109】実施例14 ポリカルボシランとして、メチルフェニルシランとジメ
チルシランとの共重合体(平均重合度40、重合比1/1)
の熱転位(アルゴン雰囲気下、450℃)により得たポリ
カルボシランを使用する以外は実施例2と同様にして、
ステンレス鋼上に硬化塗膜を形成した試料を得た後、耐
熱性試験、耐酸性試験、耐アルカリ性試験および耐ヒー
トサイクル性試験を行った。Example 14 As polycarbosilane, a copolymer of methylphenylsilane and dimethylsilane (average degree of polymerization: 40, polymerization ratio: 1/1)
In the same manner as in Example 2 except that polycarbosilane obtained by thermal rearrangement (450 ° C. in an argon atmosphere) was used,
After obtaining a sample in which a cured coating film was formed on stainless steel, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed.
【0110】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0111】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition of the present invention was a flame-retardant material.
【0112】実施例15 ポリカルボシランとして、メチルネットワークポリシラ
ン(平均重合度40)の熱転位(アルゴン雰囲気下、450
℃)により得たポリカルボシランを使用する以外は実施
例2と同様にして、ステンレス鋼上に硬化塗膜を形成し
た試料を得た後、耐熱性試験、耐酸性試験、耐アルカリ
性試験および耐ヒートサイクル性試験を行った。Example 15 As polycarbosilane, thermal rearrangement of methyl network polysilane (average degree of polymerization: 40) (450 ° C. in an argon atmosphere)
C)), a sample having a cured coating film formed on stainless steel was obtained in the same manner as in Example 2 except that the polycarbosilane obtained by the above method was used. A heat cycle test was performed.
【0113】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0114】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test performed in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0115】実施例16 ポリカルボシランとして、メチルフェニルポリシラン
(平均重合度40)とメチルネットワークポリシラン(平
均重合度40)との混合物(重量比1/1)の熱転位(アルゴ
ン雰囲気下、450℃)により得たポリカルボシランを使
用する以外は実施例2と同様にして、ステンレス鋼上に
硬化塗膜を形成した試料を得た後、耐熱性試験、耐酸性
試験、耐アルカリ性試験および耐ヒートサイクル性試験
を行った。Example 16 As a polycarbosilane, a mixture of methylphenyl polysilane (average degree of polymerization 40) and methyl network polysilane (average degree of polymerization 40) (weight ratio 1/1) was subjected to thermal rearrangement (450 ° C. in an argon atmosphere). )), A sample having a cured coating film formed on stainless steel was obtained in the same manner as in Example 2 except that the polycarbosilane obtained in (2) was used, and then a heat resistance test, an acid resistance test, an alkali resistance test, and a heat resistance test were performed. A cycle test was performed.
【0116】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After the completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0117】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0118】実施例17 エポキシ化合物としてクレゾールノボラック型エポキシ
樹脂(旭チバ(株)製;ECN1299)を使用する以外は実施
例2と同様にして、ステンレス鋼上に硬化塗膜を形成し
た試料を得た後、耐熱性試験、耐酸性試験、耐アルカリ
性試験および耐ヒートサイクル性試験を行った。Example 17 A sample having a cured coating film formed on stainless steel was obtained in the same manner as in Example 2 except that a cresol novolak type epoxy resin (ECN1299, manufactured by Asahi Ciba Co., Ltd.) was used as the epoxy compound. After that, a heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test were performed.
【0119】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0120】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0121】実施例18 エポキシ化合物としてエポキシ変性シリコーン樹脂(東
芝シリコーン(株)製;XF42-B2249)0.5gを使用する以外
は実施例2と同様にして、ステンレス鋼上に硬化塗膜を
形成した試料を得た後、耐熱性試験、耐酸性試験、耐ア
ルカリ性試験および耐ヒートサイクル性試験を行った。Example 18 A cured coating film was formed on stainless steel in the same manner as in Example 2, except that 0.5 g of an epoxy-modified silicone resin (XF42-B2249, manufactured by Toshiba Silicone Co., Ltd.) was used as the epoxy compound. After obtaining the sample, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed.
【0122】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0123】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In the flammability test performed in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition of the present invention was a flame-retardant material.
【0124】実施例19 ポリカルボシランとビスフェノールA型エポキシ樹脂と
の混合物を加熱処理するに際し、その雰囲気を空気中と
した以外は実施例1と同様にしてペレットを得た後、ペ
レットの構造について、IR分析およびNMR分析を行っ
た。Example 19 Pellets were obtained in the same manner as in Example 1 except that the mixture of polycarbosilane and bisphenol A type epoxy resin was subjected to heat treatment, except that the atmosphere was air. , IR analysis and NMR analysis were performed.
【0125】IR分析の結果から、加熱処理後にSi-Oに帰
属される1100cm-1の大きな吸収が観測された。As a result of IR analysis, a large absorption at 1100 cm -1 attributed to Si-O was observed after the heat treatment.
【0126】また、29Si-NMR分析の結果から、0ppmにピ
ークがみられた。また、13C-NMR分析の結果から、加熱
処理後に0ppmに新たなピークがみられた。From the result of 29 Si-NMR analysis, a peak was observed at 0 ppm. From the result of 13 C-NMR analysis, a new peak was observed at 0 ppm after the heat treatment.
【0127】また、得られたペレットについて実施例1
と同様にして耐熱性試験、耐酸性試験、耐アルカリ性試
験および耐ヒートサイクル性試験を行った。The obtained pellets were prepared in Example 1
A heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed in the same manner as described above.
【0128】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After the completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0129】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。Further, in the flammability test performed in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0130】実施例20 ポリカルボシランとビスフェノールA型エポキシ樹脂と
の混合物をステンレス鋼板に塗布した後、形成された塗
膜を加熱処理するに際し、その雰囲気を空気中とした以
外は実施例2と同様にして試料を得た後、硬化塗膜の構
造について、IR分析およびNMR分析を行った。Example 20 After a mixture of polycarbosilane and bisphenol A type epoxy resin was applied to a stainless steel plate, the coating film formed was subjected to a heat treatment, except that the atmosphere was air. After similarly obtaining a sample, the structure of the cured coating film was subjected to IR analysis and NMR analysis.
【0131】IR分析の結果から、硬化塗膜にSi-Oに帰属
される1100cm-1の大きな吸収が観測された。As a result of IR analysis, a large absorption at 1100 cm -1 attributed to Si-O was observed in the cured coating film.
【0132】また、29Si-NMR分析の結果から、0ppmにピ
ークがみられた。また、13C-NMR分析の結果から、加熱
処理後に0ppmに新たなピークがみられた。From the result of 29 Si-NMR analysis, a peak was observed at 0 ppm. From the result of 13 C-NMR analysis, a new peak was observed at 0 ppm after the heat treatment.
【0133】また、得られた試料を用い、実施例1と同
様にして耐熱性試験、耐酸性試験、耐アルカリ性試験お
よび耐ヒートサイクル性試験を行った。Using the obtained sample, a heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test were performed in the same manner as in Example 1.
【0134】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0135】また、実施例2と同様にして行った燃焼性
試験においては、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In a flammability test performed in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0136】実施例21〜32 実施例7〜18における混合物加熱時の雰囲気を空気中
とする以外はそれぞれ実施例2と同様にして、ステンレ
ス鋼板上に硬化塗膜を有する試料を得た後、耐熱性試
験、耐酸性試験、耐アルカリ性試験および耐ヒートサイ
クル性試験を行った。Examples 21 to 32 Samples having a cured coating film on a stainless steel plate were obtained in the same manner as in Example 2 except that the atmosphere during heating the mixture in Examples 7 to 18 was air. A heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test were performed.
【0137】各試験終了後に、塗膜の表面状態を目視観
察したところ、いずれの場合にも、クラック、ボイド、
剥離などの発生は認められず、良好な結果が得られた。After completion of each test, the surface condition of the coating film was visually observed. In each case, cracks, voids,
No occurrence of peeling or the like was observed, and good results were obtained.
【0138】また、実施例2と同様にして行った燃焼性
試験においても、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In the flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0139】実施例33 ポリカルボシランとして、メチルフェニルポリシランと
メチルネットワークポリシランとの共重合体(平均重合
度40、重合比1/1)の熱転位(アルゴン雰囲気下、450
℃)により得たポリカルボシランを使用するとともに、
混合物の加熱時の雰囲気を空気中とする以外は実施例2
と同様にして、ステンレス鋼板上に硬化塗膜を有する試
料を得た後、実施例2と同様にして硬化塗膜の耐熱性試
験、耐酸性試験、耐アルカリ性試験および耐ヒートサイ
クル性試験を行った。Example 33 As polycarbosilane, a thermal rearrangement (450 g under an argon atmosphere) of a copolymer of methylphenyl polysilane and methyl network polysilane (average degree of polymerization: 40, polymerization ratio: 1/1)
° C) using the obtained polycarbosilane,
Example 2 except that the atmosphere during heating of the mixture was air.
After obtaining a sample having a cured coating on a stainless steel plate in the same manner as in Example 2, a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test of the cured coating were performed in the same manner as in Example 2. Was.
【0140】試験終了後に、塗膜の表面状態を目視観察
したところ、いずれの場合にも、クラック、ボイド、剥
離などの発生は認められず、良好な結果が得られた。After the test was completed, the surface condition of the coating film was visually observed. In each case, no cracks, voids, peeling, etc. were observed, and good results were obtained.
【0141】また、実施例2と同様にして行った燃焼性
試験においても、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In the flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0142】実施例34 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度40)の熱転位(アルゴン雰囲気下、450℃)に
より得たポリカルボシラン0.5gとエポキシ化合物として
ビスフェノールA型エポキシ樹脂(旭チバ(株)製;アラ
ルダイトAER260)0.5gとからなる混合物にベンゾイルパ
ーオキサイド0.02gを配合し、且つ混合物をコーティン
グした鋼板の加熱温度を200℃とする以外は実施例2と
同様にして、ステンレス鋼板上に硬化塗膜を有する試料
を得た後、実施例2と同様にして硬化塗膜の耐熱性試
験、耐酸性試験、耐アルカリ性試験および耐ヒートサイ
クル性試験を行った。Example 34 As a polycarbosilane, 0.5 g of polycarbosilane obtained by thermal rearrangement (at 450 ° C. in an argon atmosphere) of methylphenyl polysilane (average degree of polymerization: 40) and a bisphenol A type epoxy resin (Asahi Chiba) as an epoxy compound (Araldite AER260) 0.5 g of a mixture of benzoyl peroxide, and a stainless steel sheet in the same manner as in Example 2 except that the heating temperature of the steel sheet coated with the mixture was 200 ° C. After obtaining a sample having a cured coating film thereon, the cured coating film was subjected to a heat resistance test, an acid resistance test, an alkali resistance test, and a heat cycle resistance test in the same manner as in Example 2.
【0143】試験終了後に、塗膜の表面状態を目視観察
したところ、いずれの場合にも、クラック、ボイド、剥
離などの発生は認められず、良好な結果が得られた。After completion of the test, the surface condition of the coating film was visually observed. In each case, no cracks, voids, peeling, etc. were observed, and good results were obtained.
【0144】また、実施例2と同様にして行った燃焼性
試験においても、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。Also, in the flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0145】実施例35 ポリカルボシランとしてメチルフェニルポリシラン(平
均重合度40)の熱転移(アルゴン雰囲気下、450℃)に
より得たポリカルボシラン0.5gとエポキシ化合物として
ビスフェノールA型エポキシ樹脂(旭チバ(株)製;アラ
ルダイトAER260)0.5gとN-エトキシ-2-メチルピリジニ
ウム-ヘキサフルオロフォスフェート0.035gとをテトラ
ヒドロフラン10ml中に室温下に溶解・混合させた。Example 35 As a polycarbosilane, 0.5 g of polycarbosilane obtained by thermal transition (450 ° C. in an argon atmosphere) of methylphenyl polysilane (average degree of polymerization: 40) and a bisphenol A type epoxy resin (Asahi Chiba) as an epoxy compound 0.5 g of N-ethoxy-2-methylpyridinium-hexafluorophosphate (0.035 g of Araldite AER260, manufactured by K.K.) was dissolved and mixed in 10 ml of tetrahydrofuran at room temperature.
【0146】次いで、得られた混合物を鋼板(SUS-304)
にコーティングし、アルゴン雰囲気中50℃で100Wの高圧
水銀ランプを用いて5分間光照射して、ステンレス鋼板
上に硬化塗膜を有する試料を得た後、実施例2と同様に
して硬化塗膜の耐熱性試験、耐酸性試験、耐アルカリ性
試験および耐ヒートサイクル性試験を行った。Next, the obtained mixture was applied to a steel plate (SUS-304).
And then irradiating it with a high-pressure mercury lamp of 100 W at 50 ° C. for 5 minutes in an argon atmosphere to obtain a sample having a cured coating on a stainless steel plate. Were subjected to a heat resistance test, an acid resistance test, an alkali resistance test and a heat cycle resistance test.
【0147】試験終了後に、塗膜の表面状態を目視観察
したところ、いずれの場合にも、クラック、ボイド、剥
離などの発生は認められず、良好な結果が得られた。After completion of the test, the surface state of the coating film was visually observed. In each case, no cracks, voids, peeling, etc. were observed, and good results were obtained.
【0148】また、実施例2と同様にして行った燃焼性
試験においても、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In the flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0149】実施例36 光照射時の雰囲気を空気中とする以外は実施例35と同
様にして、ステンレス鋼板上に硬化塗膜を有する試料を
得た後、実施例2と同様にして硬化塗膜の耐熱性試験、
耐酸性試験、耐アルカリ性試験および耐ヒートサイクル
性試験を行った。Example 36 A sample having a cured coating on a stainless steel plate was obtained in the same manner as in Example 35 except that the atmosphere during light irradiation was air. Heat resistance test of membrane,
An acid resistance test, an alkali resistance test and a heat cycle resistance test were performed.
【0150】試験終了後に、塗膜の表面状態を目視観察
したところ、いずれの場合にも、クラック、ボイド、剥
離などの発生は認められず、良好な結果が得られた。After completion of the test, the surface condition of the coating film was visually observed. In each case, no cracks, voids, peeling, etc. were observed, and good results were obtained.
【0151】また、実施例2と同様にして行った燃焼性
試験においても、試料塗膜の燃焼は認められず、本発明
による樹脂組成物が難燃性材料であることが確認され
た。In the flammability test conducted in the same manner as in Example 2, no burning of the sample coating film was observed, and it was confirmed that the resin composition according to the present invention was a flame-retardant material.
【0152】比較例1 ビスフェノールA型エポキシ樹脂(旭チバ(株)製;アラ
ルダイトAER260)0.2gのみをテトラヒドロフラン5ml中
に室温下で溶解させた後、予めサンドペーパー(#50
0)により研磨しておいたステンレス鋼板(SUS-304)に
この溶液をフローコーティングした。Comparative Example 1 Only 0.2 g of a bisphenol A type epoxy resin (manufactured by Asahi Ciba Co., Ltd .; Araldite AER260) was dissolved in 5 ml of tetrahydrofuran at room temperature, and sandpaper (# 50) was previously prepared.
This solution was flow coated on a stainless steel plate (SUS-304) polished according to 0).
【0153】次いで、コーティングされたステンレス鋼
板を室温から300℃まで10℃/分の速度で昇温させ、300
℃に達した時点で室温中へ取り出したところ、塗膜は形
成されなかった。Next, the coated stainless steel plate was heated from room temperature to 300 ° C. at a rate of 10 ° C./min.
When the temperature reached ° C, the film was taken out into room temperature, and no coating film was formed.
【0154】比較例2 ジメチルポリシランの熱転移(アルゴン雰囲気下、450
℃)により得たポリカルボシラン1.0gのみをテトラヒド
ロフラン5ml中に室温下で溶解させた後、予めサンドペ
ーパー(#500)により研磨しておいたステンレス鋼板
(SUS-304)にこの溶液をフローコーティングした。Comparative Example 2 Thermal transition of dimethylpolysilane (450 under argon atmosphere)
C)), only 1.0 g of the polycarbosilane obtained in the above method is dissolved in 5 ml of tetrahydrofuran at room temperature, and then this solution is flow-coated on a stainless steel plate (SUS-304) that has been polished in advance with sandpaper (# 500). did.
【0155】次いで、コーティングされたステンレス鋼
板を室温から300℃まで10℃/分の速度で昇温させ、300
℃に達した時点で室温中へ取り出したところ、塗膜には
クラックが発生しており、また塗膜の一部に剥離がみら
れた。Next, the temperature of the coated stainless steel plate was increased from room temperature to 300 ° C. at a rate of 10 ° C./min.
When the temperature reached ° C, the film was taken out into room temperature. As a result, cracks were generated in the coating film, and peeling was observed in a part of the coating film.
【0156】比較例3 ビスフェノールA型エポキシ樹脂(旭チバ(株)製;アラ
ルダイトAER260)0.5gとジエチレントリアミン0.14gと
をテトラヒドロフラン5ml中に室温下で溶解させた後、
予めサンドペーパー(#500)により研磨しておいたス
テンレス鋼板(SUS-304)にこの溶液をフローコーティ
ングした。Comparative Example 3 0.5 g of bisphenol A epoxy resin (manufactured by Asahi Ciba Co., Ltd .; Araldite AER260) and 0.14 g of diethylenetriamine were dissolved in 5 ml of tetrahydrofuran at room temperature.
This solution was flow coated on a stainless steel plate (SUS-304) that had been polished with sandpaper (# 500) in advance.
【0157】次いで、コーティングされたステンレス鋼
板を空気中100℃で30分加熱処理して、膜厚20μmの硬化
塗膜を形成させた。Next, the coated stainless steel plate was heated in air at 100 ° C. for 30 minutes to form a cured coating film having a thickness of 20 μm.
【0158】得られた試料を450℃の電気炉中において
空気雰囲気下1時間放置するした後、塗膜の表面状態を
目視とSEMとにより観察したところ、塗膜表面にクラッ
クが生じており、また塗膜の一部がステンレス鋼板から
剥離していた。After leaving the obtained sample in an electric furnace at 450 ° C. for 1 hour in an air atmosphere, the surface state of the coating film was observed visually and by SEM. Further, a part of the coating film was peeled off from the stainless steel plate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 西田 亮一 大阪府大阪市中央区平野町四丁目1番2号 大阪瓦斯株式会社内 (72)発明者 酒井 史郎 京都府京都市下京区中堂寺南町17 株式会 社関西新技術研究所内 (72)発明者 在間 弘朗 京都府京都市下京区中堂寺南町17 株式会 社関西新技術研究所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Ryoichi Nishida, Inventor Osaka Gas Co., Ltd. 4-1-2 Hirano-cho, Chuo-ku, Osaka-shi Inside Kansai New Technology Research Institute Co., Ltd.
Claims (10)
有する混合物に対し、加熱処理および光照射処理の少な
くとも1種の処理を行うことにより得られる樹脂組成
物。1. A resin composition obtained by subjecting a mixture containing polycarbosilane and an epoxy compound to at least one kind of heat treatment and light irradiation treatment.
有する混合物を不活性ガス雰囲気中で光照射および/ま
たは加熱することにより得られ、ポリカルボシラン由来
のSi-C結合を含み、かつポリカルボシラン成分とエポキ
シ化合物成分とがそれぞれ変性した部分が、Si-C結合お
よび/またはSi-O結合を介して結合している請求項1に
記載の樹脂組成物。2. A mixture containing a polycarbosilane and an epoxy compound, which is obtained by irradiating light and / or heating in an inert gas atmosphere to contain a polycarbosilane-derived Si--C bond, and The resin composition according to claim 1, wherein the modified portions of the silane component and the epoxy compound component are bonded via a Si-C bond and / or a Si-O bond.
有する混合物を酸素含有ガス雰囲気中で光照射および/
または加熱することにより得られ、ポリカルボシラン由
来のSi-C結合を含み、かつポリカルボシラン成分とエポ
キシ化合物成分とがそれぞれ変性した部分が、Si-C結合
および/またSi-O結合および/または雰囲気中の酸素が
挿入されたSi-O-C結合を介して結合している請求項1に
記載の樹脂組成物。3. A method comprising irradiating a mixture containing polycarbosilane and an epoxy compound with light in an oxygen-containing gas atmosphere and / or
Or a portion obtained by heating and containing a Si-C bond derived from polycarbosilane, and in which the polycarbosilane component and the epoxy compound component are respectively modified, the Si-C bond and / or the Si-O bond and / or 2. The resin composition according to claim 1, wherein oxygen in the atmosphere is bonded via an inserted Si-OC bond.
するカルボシランである請求項1、2および3のいずれ
かに記載の樹脂組成物。4. The resin composition according to claim 1, wherein the polycarbosilane is a carbosilane having a Si—H bond in a side chain.
合し、得られた混合物に対し、加熱処理および光照射処
理の少なくとも1種の処理を行うことを特徴とする樹脂
組成物の製造方法。5. A method for producing a resin composition, comprising mixing an epoxy compound and polycarbosilane, and subjecting the resulting mixture to at least one kind of heat treatment and light irradiation treatment.
ボシランとエポキシ化合物からなる樹脂組成物の成形
体。6. A molded article of a resin composition comprising the polycarbosilane according to claim 1 and an epoxy compound.
載の成形体。7. The molded article according to claim 6, wherein the form of the molded article is a coating film.
有する混合物を基材表面に塗布した後、加熱処理および
光照射処理の少なくとも1種の処理を行うことにより、
塗膜を硬化させることを特徴とする製品乃至物品の製造
方法。8. A method comprising applying a mixture containing polycarbosilane and an epoxy compound to the surface of a substrate, and performing at least one kind of heat treatment and light irradiation treatment.
A method for producing a product or article, comprising curing a coating film.
塗膜を有する製品乃至物品。9. A product or article having a cured coating film obtained by the method according to claim 8.
性表面保護膜である請求項9に記載の製品乃至物品。10. The product or article according to claim 9, wherein the cured coating film is a heat-resistant, corrosion-resistant and flame-retardant surface protective film.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7609498A JPH11124436A (en) | 1997-03-27 | 1998-03-24 | Resin composition and its production and molded product |
| PCT/JP1998/001373 WO1998044018A1 (en) | 1997-03-27 | 1998-03-27 | Epoxy resin composition and moldings |
| KR1019997008676A KR20010005611A (en) | 1997-03-27 | 1998-03-27 | Epoxy resin composition and moldings |
| CN98803711A CN1251598A (en) | 1997-03-27 | 1998-03-27 | Epoxy resin composing and moldings |
| EP98911041A EP0970981A1 (en) | 1997-03-27 | 1998-03-27 | Epoxy resin composition and moldings |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7609697 | 1997-03-27 | ||
| JP22405297 | 1997-08-20 | ||
| JP9-76096 | 1997-08-20 | ||
| JP9-224052 | 1997-08-20 | ||
| JP7609498A JPH11124436A (en) | 1997-03-27 | 1998-03-24 | Resin composition and its production and molded product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11124436A true JPH11124436A (en) | 1999-05-11 |
Family
ID=27302052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7609498A Pending JPH11124436A (en) | 1997-03-27 | 1998-03-24 | Resin composition and its production and molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11124436A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002105284A (en) * | 2000-10-02 | 2002-04-10 | Teijin Chem Ltd | Flame-retardant epoxy resin composition and laminate using the same |
| JP2002284998A (en) * | 2001-03-23 | 2002-10-03 | Fujitsu Ltd | Silicon-based composition, low dielectric constant film, semiconductor device, and method for manufacturing low dielectric constant film |
| JP2014227516A (en) * | 2013-05-24 | 2014-12-08 | 富士通株式会社 | Polycarbosilane-based resin, circuit board, semiconductor device, method for producing polycarbosilane-based resin, and method for manufacturing circuit board |
| JP2016120704A (en) * | 2014-12-25 | 2016-07-07 | トヨタ自動車株式会社 | Slide member and method for producing the same |
| CN119177058A (en) * | 2024-10-22 | 2024-12-24 | 江西信达航科新材料科技有限公司 | Preparation method of polycarbosilane composite coating for radome |
-
1998
- 1998-03-24 JP JP7609498A patent/JPH11124436A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002105284A (en) * | 2000-10-02 | 2002-04-10 | Teijin Chem Ltd | Flame-retardant epoxy resin composition and laminate using the same |
| JP2002284998A (en) * | 2001-03-23 | 2002-10-03 | Fujitsu Ltd | Silicon-based composition, low dielectric constant film, semiconductor device, and method for manufacturing low dielectric constant film |
| JP2014227516A (en) * | 2013-05-24 | 2014-12-08 | 富士通株式会社 | Polycarbosilane-based resin, circuit board, semiconductor device, method for producing polycarbosilane-based resin, and method for manufacturing circuit board |
| JP2016120704A (en) * | 2014-12-25 | 2016-07-07 | トヨタ自動車株式会社 | Slide member and method for producing the same |
| CN119177058A (en) * | 2024-10-22 | 2024-12-24 | 江西信达航科新材料科技有限公司 | Preparation method of polycarbosilane composite coating for radome |
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